CN105163217A - Headphone and headphone adjustment method - Google Patents

Headphone and headphone adjustment method Download PDF

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Publication number
CN105163217A
CN105163217A CN201510543196.3A CN201510543196A CN105163217A CN 105163217 A CN105163217 A CN 105163217A CN 201510543196 A CN201510543196 A CN 201510543196A CN 105163217 A CN105163217 A CN 105163217A
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China
Prior art keywords
headphone
ear
head
stress data
impetus
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Granted
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CN201510543196.3A
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Chinese (zh)
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CN105163217B (en
Inventor
何桂晓
宋亚楠
吴海全
师瑞文
彭久高
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Shenzhen Grandsun Electronics Co Ltd
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Shenzhen Grandsun Electronics Co Ltd
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Priority to CN201510543196.3A priority Critical patent/CN105163217B/en
Publication of CN105163217A publication Critical patent/CN105163217A/en
Application granted granted Critical
Publication of CN105163217B publication Critical patent/CN105163217B/en
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Abstract

The invention is applicable to a headphone field, and provides a headphone and a headphone adjustment method. The headphone comprises a headphone body; the headphone further comprises a first pressure sensor configured at an inner side of a head beam and used for acquiring head force data; a second pressure sensor configured beside an earmuff and used for acquiring ear force data; an earphone adjustment module connected with the first pressure sensor and the second pressure sensor and used for adjusting a head acting point worn by the headphone body according to the head force data, or adjusting an ear acting point worn by the headphone body according to the ear force data. The headphone and the headphone adjustment method provided by the invention solve the problem that a force-bearing point of the headphone needs to be adjusted manually when the headphone is worn for a long time; besides, the invention has the following beneficial effects that on one hand, the wearing comfort of the headphone body is improved, and on the other hand, an acting point adjustment mode is expanded and an intelligent degree of the headphone is enhanced.

Description

A kind of headphone and headphone method of adjustment
Technical field
The invention belongs to headphone field, particularly relate to a kind of headphone and headphone method of adjustment.
Background technology
Headphone, the earphone be namely worn on the head.Because headphone has, sound field is good, the feature such as be unpleasant to the ear, welcomed by the people, is widely used in the life of people.
But in the prior art, wear headphone for a long time, needs manually adjust the stress point of headphone and regulated efficiency is low.Its reason is, after headphone wear time has been grown, the stress point between headphone and user remains unchanged always, wearing can be uncomfortable, and in addition, when user wears, the poor direction of oneself adjustment is true, also can cause wearing uncomfortable, occur experiencing not good situation.
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of headphone, is intended to solve in the prior art, wears headphone for a long time, needs the stress point of manually adjustment headphone and the low problem of regulated efficiency.
The embodiment of the present invention is achieved in that a kind of headphone, comprises headphone body, and described headphone also comprises:
Be opened in inside a beam, gather the first pressure sensor of head stress data;
Be opened in by earmuff, gather the second pressure sensor of ear's stress data;
Connect the earphone adjusting module of described first pressure sensor and described second pressure sensor, for according to described head stress data, adjust the head impetus that described headphone body is worn, or, for according to described ear stress data, adjust ear's impetus that described headphone body is worn.
Further, in described headphone, described headphone offers the switch starting earphone and wear on shell.
Further, in described headphone, described switch is touch switch.
Further, in described headphone, described earphone adjusting module is specifically for generating the head contact dynamics between the crown and headphone body according to described head stress data, according to described head contact dynamics, the head impetus utilizing built-in earphone adjustment component to adjust described headphone body to wear.
Further, in described headphone, described earphone adjusting module contacts dynamics specifically for generating earmuff according to described ear stress data with the ear between ear, according to described ear contact dynamics, the ear's impetus utilizing built-in earphone adjustment component to adjust described headphone body to wear.
Further, in described headphone, described earphone adjusting module, also for judging whether described head contact dynamics is in the head contact dynamics of setting, if so, stops the head impetus utilizing built-in earphone adjustment component to adjust described headphone body to wear.
Further, in described headphone, described earphone adjusting module is also for judging whether described ear contact dynamics is in ear's contact dynamics of setting, if so, stops the ear's impetus utilizing built-in earphone adjustment component to adjust described headphone body to wear.
Further, in described headphone, described earphone adjusting module, specifically for adopting default head impetus database, adjusts the head impetus that described headphone body is worn.
Further, in described headphone, described earphone adjusting module, specifically for adopting default ear's impetus database, adjusts ear's impetus that described headphone body is worn.
Another object of the present invention is to provide a kind of headphone method of adjustment based on above-mentioned headphone, and described headphone method of adjustment comprises:
Described first pressure sensor gathers head stress data, sends described head stress data to described earphone adjusting module;
Described second pressure sensor gathers ear's stress data, sends described ear stress data to described earphone adjusting module;
Described earphone adjusting module receives described head stress data, and according to described head stress data, adjust the head impetus that described headphone body is worn, or, receive described ear stress data, and according to described ear stress data, adjust ear's impetus that described headphone body is worn.
In the present invention, according to head stress data, adjust the head impetus that described headphone body is worn, or, for according to described ear stress data, adjust ear's impetus that described headphone body is worn, solve in the prior art, wear headphone for a long time, need the stress point of manually adjustment headphone and the low problem of regulated efficiency.Its beneficial effect is two aspects, improves the comfort level that headphone body is worn on the one hand, extends impetus adjustment modes on the other hand, enhances the intelligence degree of headphone.
Accompanying drawing explanation
Fig. 1 is the structured flowchart of the headphone that the embodiment of the present invention provides;
Fig. 2 is the implementing procedure figure of the headphone method of adjustment that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
embodiment one
Fig. 1 is the structured flowchart of the headphone that the embodiment of the present invention provides, and details are as follows:
Be opened in inside a beam, gather the first pressure sensor 1 of head stress data;
Be opened in by earmuff, gather the second pressure sensor 2 of ear's stress data;
Connect the earphone adjusting module 3 of described first pressure sensor 1 and described second pressure sensor 2, for according to described head stress data, adjust the head impetus that described headphone body is worn, or, for according to described ear stress data, adjust ear's impetus that described headphone body is worn.
Wherein, according to described head stress data, adjust the head impetus that described headphone body is worn, be specially:
According to described head stress data, out-feed head adjustment signal and described head adjust duty ratio corresponding to signal;
According to described head adjustment signal and described duty ratio, adjust the head impetus that described headphone body is worn gradually.
Wherein, according to described ear stress data, adjust ear's impetus that described ear-wearing type earphone body is worn, be specially:
According to described ear stress data, output ear adjustment signal and described ear adjust duty ratio corresponding to signal;
According to described ear adjustment signal and described duty ratio, adjust ear's impetus that described ear-wearing type earphone body is worn gradually.
Wherein, described ear adjustment signal and head adjustment signal are different adjustment signals.
Wherein, the duty ratio that described head adjustment signal is corresponding is different from the duty ratio that described ear adjusts signal corresponding.
Wherein, described first pressure sensor 1 and described second pressure sensor 2 are identical or different pressure sensor.
Wherein, described earphone adjusting module also for judging whether described head contact dynamics is in the head contact dynamics of setting, if not, the head impetus continuing to utilize built-in earphone adjustment component to adjust described headphone body and wear.
Wherein, described earphone adjusting module also for judging whether described ear contact dynamics is in ear's contact dynamics of setting, if not, the ear's impetus continuing to utilize built-in earphone adjustment component to adjust described headphone body and wear.
In the present invention, according to head stress data, adjust the head impetus that described headphone body is worn, or, for according to described ear stress data, adjust ear's impetus that described headphone body is worn.Beneficial effect is two aspects, improves the comfort level that headphone body is worn on the one hand, extends impetus adjustment modes on the other hand, enhances the intelligence degree of headphone.
embodiment two
Fig. 2 is the implementing procedure figure of the headphone method of adjustment that the embodiment of the present invention provides, and details are as follows:
S201, described first pressure sensor 1 gathers head stress data, sends described head stress data to described earphone adjusting module 3;
S202, described second pressure sensor 2 gathers ear's stress data, sends described ear stress data to described earphone adjusting module 3;
S203, described earphone adjusting module 3 receives described head stress data, and according to described head stress data, adjust the head impetus that described headphone body is worn, or, receive described ear stress data, and according to described ear stress data, adjust ear's impetus that described headphone body is worn.
In the present invention, adjust described headphone body, the intelligence degree enhancing headphone and the comfort level worn.
Through the above description of the embodiments, those skilled in the art can be well understood to the mode that the present invention can add required common hardware by software and realizes.Described program can be stored in read/write memory medium, described storage medium, as random asccess memory, flash memory, read-only memory, programmable read only memory, electrically erasable programmable memory, register etc.This storage medium is positioned at memory, and processor reads the information in memory, performs the method described in each embodiment of the present invention in conjunction with its hardware.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.

Claims (10)

1. a headphone, comprises headphone body, it is characterized in that, described headphone also comprises:
Be opened in inside a beam, gather the first pressure sensor of head stress data;
Be opened in by earmuff, gather the second pressure sensor of ear's stress data;
Connect the earphone adjusting module of described first pressure sensor and described second pressure sensor, for according to described head stress data, adjust the head impetus that described headphone body is worn, or, for according to described ear stress data, adjust ear's impetus that described headphone body is worn.
2. headphone as claimed in claim 1, is characterized in that, described headphone offers the switch starting earphone and wear on shell.
3. headphone as claimed in claim 1, it is characterized in that, described switch is touch switch.
4. headphone as claimed in claim 1, it is characterized in that, described earphone adjusting module is specifically for generating the head contact dynamics between the crown and headphone body according to described head stress data, according to described head contact dynamics, the head impetus utilizing built-in earphone adjustment component to adjust described headphone body to wear.
5. headphone as claimed in claim 1, it is characterized in that, described earphone adjusting module contacts dynamics specifically for generating earmuff according to described ear stress data with the ear between ear, according to described ear contact dynamics, the ear's impetus utilizing built-in earphone adjustment component to adjust described headphone body to wear.
6. headphone as claimed in claim 1, it is characterized in that, described earphone adjusting module is also for judging whether described head contact dynamics is in the head contact dynamics of setting, if so, the head impetus utilizing built-in earphone adjustment component to adjust described headphone body to wear is stopped.
7. headphone as claimed in claim 1, it is characterized in that, described earphone adjusting module is also for judging whether described ear contact dynamics is in ear's contact dynamics of setting, if so, the ear's impetus utilizing built-in earphone adjustment component to adjust described headphone body to wear is stopped.
8. headphone as claimed in claim 5, it is characterized in that, described earphone adjusting module, specifically for adopting default head impetus database, adjusts the head impetus that described headphone body is worn.
9. headphone as claimed in claim 5, it is characterized in that, described earphone adjusting module, specifically for adopting default ear's impetus database, adjusts ear's impetus that described headphone body is worn.
10. based on a headphone method of adjustment for headphone described in claim 1, it is characterized in that, described headphone method of adjustment comprises:
Described first pressure sensor gathers head stress data, sends described head stress data to described earphone adjusting module;
Described second pressure sensor gathers ear's stress data, sends described ear stress data to described earphone adjusting module;
Described earphone adjusting module receives described head stress data, and according to described head stress data, adjust the head impetus that described headphone body is worn, or, receive described ear stress data, and according to described ear stress data, adjust ear's impetus that described headphone body is worn.
CN201510543196.3A 2015-08-28 2015-08-28 A kind of headphone and headphone method of adjustment Active CN105163217B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105708472A (en) * 2016-04-07 2016-06-29 佛山博智医疗科技有限公司 Hood-type audiometric device
CN107147968A (en) * 2017-07-14 2017-09-08 歌尔科技有限公司 A kind of headphone

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101330766A (en) * 2007-09-07 2008-12-24 沙静明 Earphone microphone capable of adjusting clamping force
CN101662711A (en) * 2008-08-28 2010-03-03 Akg声学有限公司 Headphone
US20100189303A1 (en) * 2008-02-20 2010-07-29 Logitech Europe S.A. Personal Audio Set With Adjustable Force Mechanisms
US20110144779A1 (en) * 2006-03-24 2011-06-16 Koninklijke Philips Electronics N.V. Data processing for a wearable apparatus
CN103297890A (en) * 2013-06-09 2013-09-11 青岛歌尔声学科技有限公司 Earphone capable of adjusting and displaying hand band clamping force
CN203289618U (en) * 2013-06-09 2013-11-13 青岛歌尔声学科技有限公司 Earphone capable of adjusting and displaying headband clamping force
CN203352762U (en) * 2013-07-10 2013-12-18 潘军习 Headphone with adjustable clamping force
CN203399290U (en) * 2013-08-30 2014-01-15 国恒电子(惠州)有限公司 Tester for earphone clamp forces
US20140064500A1 (en) * 2012-08-30 2014-03-06 Monster Automatic Power Adjusting Headphones
WO2015022765A1 (en) * 2013-08-13 2015-02-19 ソニー株式会社 Headphone-type acoustic device and method for controlling same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110144779A1 (en) * 2006-03-24 2011-06-16 Koninklijke Philips Electronics N.V. Data processing for a wearable apparatus
CN101330766A (en) * 2007-09-07 2008-12-24 沙静明 Earphone microphone capable of adjusting clamping force
US20100189303A1 (en) * 2008-02-20 2010-07-29 Logitech Europe S.A. Personal Audio Set With Adjustable Force Mechanisms
CN101662711A (en) * 2008-08-28 2010-03-03 Akg声学有限公司 Headphone
US20140064500A1 (en) * 2012-08-30 2014-03-06 Monster Automatic Power Adjusting Headphones
CN103297890A (en) * 2013-06-09 2013-09-11 青岛歌尔声学科技有限公司 Earphone capable of adjusting and displaying hand band clamping force
CN203289618U (en) * 2013-06-09 2013-11-13 青岛歌尔声学科技有限公司 Earphone capable of adjusting and displaying headband clamping force
CN203352762U (en) * 2013-07-10 2013-12-18 潘军习 Headphone with adjustable clamping force
WO2015022765A1 (en) * 2013-08-13 2015-02-19 ソニー株式会社 Headphone-type acoustic device and method for controlling same
CN203399290U (en) * 2013-08-30 2014-01-15 国恒电子(惠州)有限公司 Tester for earphone clamp forces

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105708472A (en) * 2016-04-07 2016-06-29 佛山博智医疗科技有限公司 Hood-type audiometric device
CN107147968A (en) * 2017-07-14 2017-09-08 歌尔科技有限公司 A kind of headphone
CN107147968B (en) * 2017-07-14 2023-11-24 歌尔科技有限公司 Headset

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Address after: Longgang District of Shenzhen City, Guangdong province 518116 Ping Street Takahashi Industrial Park East Area

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