CN105161597A - Led filament - Google Patents
Led filament Download PDFInfo
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- CN105161597A CN105161597A CN201410235681.XA CN201410235681A CN105161597A CN 105161597 A CN105161597 A CN 105161597A CN 201410235681 A CN201410235681 A CN 201410235681A CN 105161597 A CN105161597 A CN 105161597A
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- substrate
- described substrate
- led silk
- protuberance
- adhesive layer
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Abstract
An LED filament comprises a long bar-shaped substrate, multiple light-emitting units arranged on the same surface of the substrate and distributed in the extension direction of the substrate, and light-permeable fluorescent glue layers covering the substrate and the light-emitting units. At least one side edge of the substrate is equipped with multiple protruding parts, and the protruding parts are distributed in the extension direction of the substrate. The fluorescent glue layers also cover the protruding parts and an area between every two adjacent protruding parts. The adoption of the protruding parts enables light sources emitted by the light-emitting units to be emitted toward one side, of the substrate, opposite to the side covered in the fluorescent glue layers, so the light-emitting angle of the LED filament is increased.
Description
Technical field
The present invention relates to LED technology field, particularly relate to a kind of LED silk.
Background technology
LED, as a kind of new light source, because of its advantage such as good energy-conserving effect, long-life, has been widely used in various lighting installation.White light LEDs is described as the forth generation lighting source of alternative fluorescent lamp and incandescent lamp.LED changes the luminous principle with the luminescence of fluorescent lamp tricolor powder of incandescent lamp tungsten filament, utilizes electroluminescence, has that light efficiency is high, radiationless, the life-span long, an advantage of low-power consumption and environmental protection.
Traditional LED support is generally small size bowl cup-shaped, and the lighting angle of the LED silk be packaged into by it is less, cannot reach the illumination effect thread with incandescent lamps.Although there is barcode LED filament in the market, its lighting angle still cannot reach the illumination effect thread with incandescent lamps very well.
Summary of the invention
Based on this, be necessary the LED silk providing a kind of lighting angle larger.
A kind of LED silk, comprise: the substrate of strip, be arranged on described substrate front and along multiple luminescence units of described substrate bearing of trend distribution, and the fluorescent adhesive layer covered on the front of described substrate, at least one side of described substrate is provided with multiple protuberance, and described protuberance distributes along the bearing of trend of described substrate;
A part for the light excited through described fluorescent adhesive layer that described luminescence unit sends penetrates to described substrate back direction by between adjacent described protuberance.
In one of them embodiment, two phase backsides of described substrate are respectively equipped with multiple described protuberance.
In one of them embodiment, the multiple described protuberance being positioned at the same side of described substrate equidistantly arranges.
In one of them embodiment, multiple described protuberance forms wavy or laciniation at the side of described substrate.
In one of them embodiment, the orthographic projection of described fluorescent adhesive layer in the front of described substrate covers and is greater than the front of described substrate.
In one of them embodiment, the cross sectional shape that described fluorescent adhesive layer is vertical with described substrate bearing of trend is semicircle, half elliptic or rectangle.
In one of them embodiment, the width of described fluorescent adhesive layer is more than or equal to the most wide degree of described substrate.
In one of them embodiment, described LED silk also comprises pin and connects the insulated connecting piece of described pin and described substrate.
In one of them embodiment, two phase backside symmetries of described substrate be provided with multiple described protuberance, the narrowest width of described substrate is 60% ~ 80% of the most wide degree.
Above-mentioned LED silk, the light source that the arranging of protuberance makes luminescence unit send can cover the opposite side injection of fluorescent adhesive layer side to substrate, thus increases the lighting angle of LED silk.
In addition, protuberance make fluorescent adhesive layer more stable be attached on substrate, will because of narrow with the coverage rate of substrate, thus make fluorescent adhesive layer come off.Because substrate is that metal heat-conducting material is made, and substrate side covers fluorescent adhesive layer, makes the radiating effect of substrate better, thus solution LED silk can not the problem such as big current, high cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED silk of a preferred embodiment of the present invention;
Fig. 2 is the end view of the LED silk shown in Fig. 1.
Embodiment
As shown in Figure 1, it is the structural representation of the LED silk 10 of a preferred embodiment of the present invention.
LED silk 10, comprising: the substrate 100 of strip, be arranged on substrate 100 front and along multiple luminescence units 200 of substrate 100 bearing of trend distribution, the fluorescent adhesive layer 300 (scheme depending on) of front and the light-permeable on luminescence unit 200 covering substrate 100, pin 400 and the insulated connecting piece 500 being connected pin 400 and substrate 100.At least one side of substrate 100 is provided with multiple protuberance 110, and protuberance 110 distributes along the bearing of trend of substrate 100.Fluorescent adhesive layer 300 also covers the region between protuberance 110 and adjacent two protuberances 110.
Substrate 100 and protuberance 110 are copper.Two phase backsides of substrate 100 are respectively equipped with multiple protuberance 110.Multiple protuberance 110 is symmetrical arranged, and the narrowest width of substrate 100 is 60% ~ 80% of the most wide degree.The multiple protuberances 110 being positioned at substrate 100 same side equidistantly arrange.Multiple protuberance 110 forms wavy or zigzag at the side of substrate 100, and both the edge of substrate 100 was wavy or zigzag.
According to actual conditions, substrate 100 can be other conductive radiator materials and makes, as iron etc.Protuberance 110 also can be positioned at the side of substrate 100.Interval between protuberance 110 also can be unequal.In addition, the protuberance 110 of substrate 100 both sides can be staggered, both the protuberance 110 of substrate 100 side, between adjacent two protuberances 110 of substrate 100 opposite side.Protuberance 110 can be rectangular-shaped etc. equally, and when protuberance 110 is rectangle, the edge of substrate 100 is odontoid.It is pointed out that the length of substrate 100 is 30mm, thickness is 0.4mm, and substrate 100 the widest part is 1mm, and the narrowest place is 0.7mm, and the every side 10mm of substrate 100 has 8 protuberances 110.Substrate 100 also can be other specifications.In addition, substrate 100 the widest part also can be other numerical value with the ratio at the narrowest place.
Luminescence unit 200 is multiple.Multiple luminescence unit 200 is arranged on substrate 100 at equal intervals along the bearing of trend of substrate 100.Multiple luminescence unit 200 forms a line, and multiple luminescence unit 200 is equal to two back gauges that substrate 100 is relative.Multiple luminescence unit 200 is electrically connected in series.A part for the light excited through fluorescent adhesive layer 300 that luminescence unit 200 sends penetrates to direction, substrate 100 back side by between adjacent protuberance 110.According to actual conditions, luminescence unit 200 can be 20, also can be other quantity.Luminescence unit 200 can adopt blue-light LED chip.
See also Fig. 2, it is the end view of the LED silk 10 shown in Fig. 1.
Fluorescent adhesive layer 300 comprises fluorescent material and viscose glue, and fluorescent material is evenly positioned at viscose glue.Fluorescent material is YAG bloom.The surface of fluorescent adhesive layer 300 is cambered surface, and the cross sectional shape that both fluorescent adhesive layer 300 is vertical with substrate 100 bearing of trend is semicircle or half elliptic.The face width that fluorescent adhesive layer 300 is connected with substrate 100 equals the Breadth Maximum of substrate 100 and protuberance 110 entirety, and also can be understood as, the width of fluorescent adhesive layer 300 is more than or equal to the most wide degree of substrate 100.The orthographic projection of fluorescent adhesive layer 300 in the front of substrate 100 covers and is greater than the front of substrate 100.The width of fluorescent adhesive layer 300 can be 1.2mm.According to actual conditions, the width of fluorescent adhesive layer 300 can be also other numerical value, as 1.3mm etc.In addition, the cross sectional shape that fluorescent adhesive layer 300 is vertical with substrate 100 bearing of trend also can be other shapes such as rectangle.
Above-mentioned LED silk 10, it is outside that the light source that luminescence unit 200 sends is refracted to fluorescent adhesive layer 300 by fluorescent adhesive layer 300.Due to the setting of protuberance 110, make light source by the narrowest place of substrate 100, the opposite side injection of fluorescent adhesive layer 300 side can be covered to substrate 100.The light source that luminescence unit 200 sends, send the longer gold-tinted of wavelength by fluorescent adhesive layer 300 absorption portion blue light, gold-tinted and remaining blue light mix the different colour temperature of rear synthesis according to a certain percentage, are shown as white light.
Above-mentioned LED silk 10, the light source that the arranging of protuberance 110 makes luminescence unit 200 send can cover the opposite side injection of fluorescent adhesive layer 300 side to substrate 100, thus increases the lighting angle of LED silk 10.In addition, protuberance 110 make fluorescent adhesive layer 300 more stable be attached on substrate 100, will because of narrow with the coverage rate of substrate 100, thus make fluorescent adhesive layer 300 come off.Due to substrate 100 for metal heat-conducting material is made, and substrate 100 side covers fluorescent adhesive layer 300, makes the radiating effect of substrate 100 better, thus solution LED silk 10 can not the problem such as big current, high cost.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (9)
1. a LED silk, comprise: the substrate of strip, be arranged on described substrate front and along multiple luminescence units of described substrate bearing of trend distribution, and the fluorescent adhesive layer covered on the front of described substrate, it is characterized in that, at least one side of described substrate is provided with multiple protuberance, and described protuberance distributes along the bearing of trend of described substrate;
A part for the light excited through described fluorescent adhesive layer that described luminescence unit sends penetrates to described substrate back direction by between adjacent described protuberance.
2. LED silk according to claim 1, is characterized in that, two phase backsides of described substrate are respectively equipped with multiple described protuberance.
3. LED silk according to claim 2, is characterized in that, the multiple described protuberance being positioned at the same side of described substrate equidistantly arranges.
4. LED silk according to claim 1, is characterized in that, multiple described protuberance forms wavy or laciniation at the side of described substrate.
5. LED silk according to claim 1, is characterized in that, the orthographic projection of described fluorescent adhesive layer in the front of described substrate covers and be greater than the front of described substrate.
6. LED silk according to claim 1, is characterized in that, the cross sectional shape that described fluorescent adhesive layer is vertical with described substrate bearing of trend is semicircle, half elliptic or rectangle.
7. LED silk according to claim 1, is characterized in that, the width of described fluorescent adhesive layer is more than or equal to the most wide degree of described substrate.
8. LED silk according to claim 1, is characterized in that, described LED silk also comprises pin and connects the insulated connecting piece of described pin and described substrate.
9. LED silk according to claim 1, is characterized in that, two phase backside symmetries of described substrate be provided with multiple described protuberance, the narrowest width of described substrate is 60% ~ 80% of the most wide degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410235681.XA CN105161597A (en) | 2014-05-29 | 2014-05-29 | Led filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410235681.XA CN105161597A (en) | 2014-05-29 | 2014-05-29 | Led filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105161597A true CN105161597A (en) | 2015-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410235681.XA Pending CN105161597A (en) | 2014-05-29 | 2014-05-29 | Led filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105161597A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012059737A (en) * | 2010-09-03 | 2012-03-22 | Panasonic Corp | Light emitting device, backlight unit, liquid crystal display device, and lighting system |
| CN203500873U (en) * | 2013-07-29 | 2014-03-26 | 王振 | All-angle light-emitting straight-strip filament |
| CN203910855U (en) * | 2014-05-29 | 2014-10-29 | 惠州市华瑞光源科技有限公司 | Led filament |
-
2014
- 2014-05-29 CN CN201410235681.XA patent/CN105161597A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012059737A (en) * | 2010-09-03 | 2012-03-22 | Panasonic Corp | Light emitting device, backlight unit, liquid crystal display device, and lighting system |
| CN203500873U (en) * | 2013-07-29 | 2014-03-26 | 王振 | All-angle light-emitting straight-strip filament |
| CN203910855U (en) * | 2014-05-29 | 2014-10-29 | 惠州市华瑞光源科技有限公司 | Led filament |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 516000 No. 72 Huifeng 4th Road, Zhongkai High-tech Zone, Huizhou City, Guangdong Province (Factory Building) Applicant after: TCL Huarui Lighting Technology (Huizhou) Co., Ltd. Applicant after: Huarui photoelectric (Huizhou) Co. Ltd. Address before: 516000 Zhongkai hi tech Development Zone 19, Huizhou, Guangdong Applicant before: HUIZHOU HUARUI LIGHT SOURCE SCIENCE & TECHNOLOGY CO., LTD. Applicant before: Huarui photoelectric (Huizhou) Co. Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151216 |