CN105154961A - Height adjustable electroplating apparatus - Google Patents
Height adjustable electroplating apparatus Download PDFInfo
- Publication number
- CN105154961A CN105154961A CN201510638704.6A CN201510638704A CN105154961A CN 105154961 A CN105154961 A CN 105154961A CN 201510638704 A CN201510638704 A CN 201510638704A CN 105154961 A CN105154961 A CN 105154961A
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- China
- Prior art keywords
- electroplating
- electroplating machine
- machine
- seat body
- slide seat
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Abstract
The invention discloses a height adjustable electroplating apparatus. The electroplating apparatus comprises a rack plating line track frame and an electroplating device, wherein the rack plating line track frame is provided with a slide base; the electroplating device is mounted on the lower end of the slide base; extendable rods are mounted on the two ends of the electroplating device; an electroplating machine is arranged on the lower end of the electroplating device; an electroplating roller head is mounted on the bottom of the electroplating machine; an elastic extension device is mounted between the electroplating machine and the slide base; an electroplating liquid guide pipe is mounted in the elastic extension device; an electroplating machine spray storage device is mounted on the upper end of the slide base; one end of the electroplating liquid guide pipe is connected with the electroplating machine spray storage device; and the other end of the electroplating liquid guide pipe is connected with the electroplating machine. The height of the electroplating device can be adjusted, according to the thickness of plates, to a proper height for electroplating treatment, thereby preventing poor electroplating effect caused by over high height of the electroplating machine or over close distance between the electroplating machine and the sheet, and thus further improving the electroplating quality.
Description
Technical field
The present invention relates to field of electroplating, particularly relate to a kind of Height Adjustable electroplating device.
Background technology
Plating is the process plating other metal or alloy of skim on some metallic surface, be utilize electrolytic action to make the technique of the surface attachment layer of metal film of metal or other material thus play to prevent burning, improve the effects such as wear resistance, electroconductibility, reflective, erosion resistance and having improved aesthetic appearance.The skin of many coins is also plating.But traditional electroplating device does not possess the function of altitude mixture control, the height of self can not be regulated to reach best effect according to the thickness of material, if electroplating device from plated material too close or too away from all well can not carry out electroplating operations, and traditional electroplating device can not self regulate, need to regulate machine in addition, greatly reduce working efficiency.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of Height Adjustable electroplating device, according to sheet metal thickness, electroplanting device can be carried out altitude mixture control, suitably highly electroplates processing to be adjusted to.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of Height Adjustable electroplating device, comprise Automatic-rack Line rail bracket and electroplanting device, described Automatic-rack Line rail bracket is provided with a slide seat body, described electroplanting device is installed on described slide seat body lower end, described electroplanting device two ends are provided with expansion link, described electroplanting device lower end is provided with electroplating machine, install bottom described electroplating machine and be provided with plating roller head, elastic telescoping device is installed between described electroplating machine and described slide seat body, in described elastic telescoping device, electroplate liquid catheter is installed, described slide seat body upper end is provided with electroplating machine spray reservoir, described electroplate liquid catheter one end is connected on described electroplating machine spray reservoir, the described electroplate liquid catheter the other end is connected on described electroplating machine.
In a preferred embodiment of the present invention, described slide seat body is slidably connected on described Automatic-rack Line rail bracket, and described electroplanting device is moved on described Automatic-rack Line rail bracket by described slide seat body.
In a preferred embodiment of the present invention, described electroplate liquid catheter is vertically installed and is built in described elastic telescoping device central authorities, described electroplate liquid catheter one end is communicated on described electroplating machine spray reservoir, and the described electroplate liquid catheter the other end imports in described electroplating machine and is connected on described plating roller head.
In a preferred embodiment of the present invention, described expansion link one end is fixed on bottom described slide seat body, and the described expansion link the other end is fixed on described electroplating machine upper end face.
In a preferred embodiment of the present invention, described elastic telescoping device installation is located on the electroplanting device between described expansion link, and described elastic telescoping device is coil tension spring body.
In a preferred embodiment of the present invention, described plating roller head transverse horizontal is installed in described electroplating machine bottom faces.
The invention has the beneficial effects as follows: electroplanting device can be carried out altitude mixture control according to sheet metal thickness by the present invention, suitably highly electroplate processing to be adjusted to, avoid electroplating machine from sheet material too high or too close to and the not good situation of electroplating effect occurs, improve electroplating quality.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of Height Adjustable electroplating device one preferred embodiment of the present invention;
In accompanying drawing, the mark of each parts is as follows: 1, Automatic-rack Line rail bracket; 2, electroplanting device; 3, slide seat body; 4, expansion link; 5, electroplating machine; 6, roller head is electroplated; 7, elastic telescoping device; 8, electroplate liquid catheter; 9, electroplating machine spray reservoir.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the embodiment of the present invention comprises:
A kind of Height Adjustable electroplating device, comprise Automatic-rack Line rail bracket 1 and electroplanting device 2, described Automatic-rack Line rail bracket 1 is provided with a slide seat body 3, described electroplanting device 2 is installed on described slide seat body 3 lower end, described electroplanting device 2 two ends are provided with expansion link 4, described electroplanting device 2 lower end is provided with electroplating machine 5, install bottom described electroplating machine 5 and be provided with plating roller head 6, between described electroplating machine 5 and described slide seat body 3, elastic telescoping device 7 is installed, in described elastic telescoping device 7, electroplate liquid catheter 8 is installed, described slide seat body 3 upper end is provided with electroplating machine spray reservoir 9, described electroplate liquid catheter 8 one end is connected on described electroplating machine spray reservoir 9, described electroplate liquid catheter 8 the other end is connected on described electroplating machine 5.
In addition, described slide seat body 3 is slidably connected on described Automatic-rack Line rail bracket 1, and described electroplanting device 2 is moved on described Automatic-rack Line rail bracket 1 by described slide seat body 3.
In addition, described electroplate liquid catheter 8 is vertically installed and is built in described elastic telescoping device 7 central authorities, described electroplate liquid catheter 8 one end is communicated on described electroplating machine spray reservoir 9, and described electroplate liquid catheter 8 the other end imports in described electroplating machine 5 and is connected on described plating roller head 6.
In addition, described expansion link 4 one end is fixed on bottom described slide seat body 3, and described expansion link 4 the other end is fixed on described electroplating machine 5 upper end face.
In addition, described elastic telescoping device 7 installation is located on the electroplanting device between described expansion link 4, and described elastic telescoping device 7 is coil tension spring body.
In addition, described plating roller head 6 transverse horizontal is installed in described electroplating machine 5 bottom faces.
Principle of work of the present invention is that Automatic-rack Line rail bracket 1 is provided with a slide seat body 3, electroplanting device 2 is installed on slide seat body 3 lower end, slide seat body 3 is slidably connected on Automatic-rack Line rail bracket 1, electroplanting device 2 is moved on Automatic-rack Line rail bracket 1 by slide seat body 3, electroplanting device 2 two ends are provided with expansion link 4, expansion link 4 one end is fixed on bottom slide seat body 3, expansion link 4 the other end is fixed on electroplating machine 5 upper end face, electroplanting device 2 lower end is provided with electroplating machine 5, install bottom electroplating machine 5 and be provided with plating roller head 6, plating roller head 6 transverse horizontal is installed in electroplating machine 5 bottom faces, elastic telescoping device 7 is installed between electroplating machine 5 and slide seat body 3, elastic telescoping device 7 installation is located on the electroplanting device between expansion link 4, elastic telescoping device 7 is coil tension spring body, electroplate liquid catheter 8 is installed in elastic telescoping device 7, slide seat body 3 upper end is provided with electroplating machine spray reservoir 9, electroplate liquid catheter 8 one end is connected on electroplating machine spray reservoir 9, electroplate liquid catheter 8 the other end is connected on electroplating machine 5, electroplate liquid catheter 8 is vertically installed and is built in elastic telescoping device 7 central authorities, electroplate liquid catheter 8 one end is communicated on electroplating machine spray reservoir 9, electroplate liquid catheter 8 the other end imports in electroplating machine 5 and is connected on plating roller head 6, electroplating machine 5 can upwards or downwards regulate height according to the thickness of plated material by expansion link 4, to reach the height meeting plating and require, then electroplate liquid sprayed on the plating roller head 6 that electroplate liquid catheter 8 flows into bottom electroplating machine 5 by electroplating machine spray reservoir 9, electroplating processes is carried out by plating roller head 6 pairs of plated materials.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. a Height Adjustable electroplating device, comprise Automatic-rack Line rail bracket and electroplanting device, it is characterized in that, described Automatic-rack Line rail bracket is provided with a slide seat body, described electroplanting device is installed on described slide seat body lower end, described electroplanting device two ends are provided with expansion link, described electroplanting device lower end is provided with electroplating machine, install bottom described electroplating machine and be provided with plating roller head, elastic telescoping device is installed between described electroplating machine and described slide seat body, in described elastic telescoping device, electroplate liquid catheter is installed, described slide seat body upper end is provided with electroplating machine spray reservoir, described electroplate liquid catheter one end is connected on described electroplating machine spray reservoir, the described electroplate liquid catheter the other end is connected on described electroplating machine.
2. Height Adjustable electroplating device according to claim 1, is characterized in that, described slide seat body is slidably connected on described Automatic-rack Line rail bracket, and described electroplanting device is moved on described Automatic-rack Line rail bracket by described slide seat body.
3. Height Adjustable electroplating device according to claim 1, it is characterized in that, described electroplate liquid catheter is vertically installed and is built in described elastic telescoping device central authorities, described electroplate liquid catheter one end is communicated on described electroplating machine spray reservoir, and the described electroplate liquid catheter the other end imports in described electroplating machine and is connected on described plating roller head.
4. Height Adjustable electroplating device according to claim 1, is characterized in that, described expansion link one end is fixed on bottom described slide seat body, and the described expansion link the other end is fixed on described electroplating machine upper end face.
5. Height Adjustable electroplating device according to claim 1, is characterized in that, described elastic telescoping device installation is located on the electroplanting device between described expansion link, and described elastic telescoping device is coil tension spring body.
6. Height Adjustable electroplating device according to claim 1, is characterized in that, described plating roller head transverse horizontal is installed in described electroplating machine bottom faces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510638704.6A CN105154961B (en) | 2015-10-08 | 2015-10-08 | Height Adjustable electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510638704.6A CN105154961B (en) | 2015-10-08 | 2015-10-08 | Height Adjustable electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105154961A true CN105154961A (en) | 2015-12-16 |
| CN105154961B CN105154961B (en) | 2017-07-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510638704.6A Expired - Fee Related CN105154961B (en) | 2015-10-08 | 2015-10-08 | Height Adjustable electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105154961B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106119937A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | The special electroplated discs of plating line |
| CN107675242A (en) * | 2017-08-04 | 2018-02-09 | 浙江工贸职业技术学院 | A kind of rack plating arrangement for adjusting height |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1111293A (en) * | 1994-05-06 | 1995-11-08 | 荆瑞年 | Cyanogen-free electroplating machine |
| DE19932785C1 (en) * | 1999-07-14 | 2000-11-16 | Atotech Deutschland Gmbh | Partial electrochemical treatment apparatus, e.g. for electroplating or etching shock-absorber or valve rods, provides masking system vertical tolerance equalization by lowering a rod workpiece and pressing down a membrane holder |
| TW448931U (en) * | 1997-09-09 | 2001-08-01 | Guan Jin Kuen | Continuously vertical electroplating device |
| CA2252923C (en) * | 1996-06-27 | 2005-09-20 | Usinor | Method and installation for the electrolytic coating with a metal layer of the surface of a cylinder for the continuous casting of thin metal strips |
| CN202434860U (en) * | 2011-12-21 | 2012-09-12 | 长沙精达印刷制版有限公司 | Adjustable durable carbon brush bracket |
| CN103290459A (en) * | 2012-03-05 | 2013-09-11 | 无锡宏联电镀设备有限公司 | Up-and-down reciprocating type cathode moving device with vibration function |
| CN205133759U (en) * | 2015-10-08 | 2016-04-06 | 江苏宏联环保科技有限公司 | Electroplating device with adjustable height |
-
2015
- 2015-10-08 CN CN201510638704.6A patent/CN105154961B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1111293A (en) * | 1994-05-06 | 1995-11-08 | 荆瑞年 | Cyanogen-free electroplating machine |
| CA2252923C (en) * | 1996-06-27 | 2005-09-20 | Usinor | Method and installation for the electrolytic coating with a metal layer of the surface of a cylinder for the continuous casting of thin metal strips |
| TW448931U (en) * | 1997-09-09 | 2001-08-01 | Guan Jin Kuen | Continuously vertical electroplating device |
| DE19932785C1 (en) * | 1999-07-14 | 2000-11-16 | Atotech Deutschland Gmbh | Partial electrochemical treatment apparatus, e.g. for electroplating or etching shock-absorber or valve rods, provides masking system vertical tolerance equalization by lowering a rod workpiece and pressing down a membrane holder |
| CN202434860U (en) * | 2011-12-21 | 2012-09-12 | 长沙精达印刷制版有限公司 | Adjustable durable carbon brush bracket |
| CN103290459A (en) * | 2012-03-05 | 2013-09-11 | 无锡宏联电镀设备有限公司 | Up-and-down reciprocating type cathode moving device with vibration function |
| CN205133759U (en) * | 2015-10-08 | 2016-04-06 | 江苏宏联环保科技有限公司 | Electroplating device with adjustable height |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106119937A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | The special electroplated discs of plating line |
| CN107675242A (en) * | 2017-08-04 | 2018-02-09 | 浙江工贸职业技术学院 | A kind of rack plating arrangement for adjusting height |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105154961B (en) | 2017-07-04 |
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Granted publication date: 20170704 Termination date: 20201008 |