CN105140405A - Environmental-protection substrate for flexible photoelectronic device - Google Patents
Environmental-protection substrate for flexible photoelectronic device Download PDFInfo
- Publication number
- CN105140405A CN105140405A CN201510450762.6A CN201510450762A CN105140405A CN 105140405 A CN105140405 A CN 105140405A CN 201510450762 A CN201510450762 A CN 201510450762A CN 105140405 A CN105140405 A CN 105140405A
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- ball
- powder
- substrate
- protection substrate
- improved silica
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention discloses an environmental-protection substrate for a flexible photoelectronic device. The environmental-protection substrate is characterized by comprising the following constituents by mass percent: 0.02-0.04% of graphene nanoplatelets, 2-6% of modified silicon dioxide and the balance being a substrate. The water and oxygen resistant ability of the substrate is improved by adding two inorganic non-metallic materials such as the nano silicon dioxide and the graphene nanoplatelets, and meanwhile, the substrate is easy to be combined with a conductive layer.
Description
Technical field
The present invention relates to photoelectron technical field, be specifically related to a kind of flexible optoelectronic part environmental protection substrate.
Background technology
In the preparation technology of flexible optoelectronic part, the selection of substrate is most important, and it is that therefore every industry or trade, research institution launch the research work of flexible substrate material all one after another for the key point of flexible device bend performance.For the backing material of flexible optoelectronic part, usually possesses following characteristics: compactness is good, planarization is high, toughness is strong and light transmission rate is high.Polymer plastic, flexible glass, sheet metal is mainly contained at present for the flexible substrate material studied.And in recent years, because garbage emission result in the biological environment constantly worsened, thus the idea of preserving the ecological environment is rooted in the hearts of the people.Therefore, in field of optoelectronic devices, also new requirement-environmental protection, recyclable, degradable are proposed to the material used.
Although polymer plastic flexibility is better, lightweight, most of plastics have certain toxicity and non-degradable, and excessive to the permeability of steam and oxygen, easily cause the significantly decay in opto-electronic device life-span; And although flexible glass and sheet metal have certain pliability, the phenomenon that still can rupture, be out of shape under larger mechanicals efforts, and these two kinds of backing material non-degradables, have certain destruction to environment.Therefore, biodegradable flexible substrate material is adopted to be the developing direction in flexible optoelectronic field.But also there is many restrictions in the preparation of flexible device, still have many underlying issues and process difficulties urgently to be resolved hurrily.Such as, its surface smoothness is poor, not as good as glass substrate.Meanwhile, before to mention the water oxygen obstructing capacity of flexible substrate most important, otherwise the electrode material of device and organic material are easy to be etched, and cause device performance to reduce.
Summary of the invention
It is good that technical problem to be solved by this invention is to improve a kind of surface smoothness, the flexible optoelectronic part environmental protection substrate that adhesion is strong.
Technical problem to be solved by this invention realizes by the following technical solutions:
A kind of flexible optoelectronic part environmental protection substrate, is characterized in that, be made up of the component of following mass percent:
Graphene microchip 0.02-0.04%
Improved silica 2-6%
Surplus is substrate; Improving the water oxygen obstructing capacity of substrate by adding improved silica and these two kinds of Inorganic Non-metallic Materials of graphene microchip, making substrate be easy to same conductive layer simultaneously and combining.
Described substrate is made up of the component of following mass percent:
Above-mentioned graphene microchip is with the long brilliant generation graphitic carbon crystal of the cellular fashion of solid, and four of each carbon atom valence electrons formed covalent bond in bond live, the electron stream of displacement can not be formed, so just can not conduct electricity, after generating, graphitic carbon crystal utilizes the nano-milled mode of wet type, with single direction grinding, generation thickness is nanometer, and area is micronized graphene microchip; Add the obstructing capacity that graphene microchip can promote substrate greatly in the substrate, and there is extraordinary cracking resistance.
The preparation method of above-mentioned improved silica is as follows:
1) ratio of 1-3:1-5 takes hum silicon dioxide Si powder and Neon SiC powder in mass ratio;
2) be decentralized medium to the silicon dioxide taken and sic powder with absolute ethyl alcohol, wherein the mass ratio of powder and alcohol is 1:30, ultrasonic disperse 1 hour on supersonic cleaning machine;
3) compound through ultrasonic disperse being put into nylon ball grinder, take agate ball as abrading-ball, and ball material mass ratio is 7:1, is under the condition of 150 revs/min at rotating speed, continuous ball milling 2 hours in planetary ball mill;
4) powder complete for ball milling is poured in powder dish together with agate abrading-ball, dry at 80 DEG C;
5) powder of drying is sieved, take out agate abrading-ball, then mixed powder is ground, until without till larger reunion, so far, obtain improved silica.
Described antioxidant is formed by the component system of mixing of following mass percent: DMKO 20%, peanut oil 25%, soybean protein isolate 4%, azelaic acid 2%, isoamyl acetate 4%, anthocyanidin 2%, silicone oil 10%, palm oil 4%, atoleine 3%, the tert-butyl alcohol 4%, surplus are distilled water.
The invention has the beneficial effects as follows:
(1) by graphene-doped microplate, and by after milled processed, graphene microchip is non-conductive, improves the water oxygen obstructing capacity of substrate, and then improves the performance of device.
(2) in substrate, mix appropriate improved silica, thus improve the mechanical strength of flexible substrate.
(3) mix appropriate elasticity pure-acrylic emulsion in substrate, effectively increase conductive layer adhesion on flexible substrates.
Embodiment
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with specific embodiment, setting forth the present invention further.
Embodiment 1
A kind of flexible optoelectronic part environmental protection substrate, be made up of the component of following mass percent:
Graphene microchip 0.03%
Improved silica 3%
Surplus is substrate; Improving the water oxygen obstructing capacity of substrate by adding improved silica and these two kinds of Inorganic Non-metallic Materials of graphene microchip, making substrate be easy to same conductive layer simultaneously and combining.
Described substrate is made up of the component of following mass percent:
Above-mentioned graphene microchip is with the long brilliant generation graphitic carbon crystal of the cellular fashion of solid, and four of each carbon atom valence electrons formed covalent bond in bond live, the electron stream of displacement can not be formed, so just can not conduct electricity, after generating, graphitic carbon crystal utilizes the nano-milled mode of wet type, with single direction grinding, generation thickness is nanometer, and area is micronized graphene microchip; Add the obstructing capacity that graphene microchip can promote substrate greatly in the substrate, and there is extraordinary cracking resistance.
The preparation method of above-mentioned improved silica is as follows:
1) ratio of 2:1.5 takes hum silicon dioxide Si powder and Neon SiC powder in mass ratio;
2) be decentralized medium to the silicon dioxide taken and sic powder with absolute ethyl alcohol, wherein the mass ratio of powder and alcohol is 1:30, ultrasonic disperse 1 hour on supersonic cleaning machine;
3) compound through ultrasonic disperse being put into nylon ball grinder, take agate ball as abrading-ball, and ball material mass ratio is 7:1, is under the condition of 150 revs/min at rotating speed, continuous ball milling 2 hours in planetary ball mill;
4) powder complete for ball milling is poured in powder dish together with agate abrading-ball, dry at 80 DEG C;
5) powder of drying is sieved, take out agate abrading-ball, then mixed powder is ground, until without till larger reunion, so far, obtain improved silica.
Embodiment 2
A kind of flexible optoelectronic part environmental protection substrate, is characterized in that, be made up of the component of following weight:
Graphene microchip 0.02kg
Improved silica 6kg
Substrate 93.98kg;
After being mixed by above-mentioned material, conveniently substrate forming method carries out shaping.Improving the water oxygen obstructing capacity of substrate by adding improved silica and these two kinds of Inorganic Non-metallic Materials of graphene microchip, making substrate be easy to same conductive layer simultaneously and combining.
Described substrate is made up of the component of following weight:
Above-mentioned graphene microchip is with the long brilliant generation graphitic carbon crystal of the cellular fashion of solid, and four of each carbon atom valence electrons formed covalent bond in bond live, the electron stream of displacement can not be formed, so just can not conduct electricity, after generating, graphitic carbon crystal utilizes the nano-milled mode of wet type, with single direction grinding, generation thickness is nanometer, and area is micronized graphene microchip; Add the obstructing capacity that graphene microchip can promote substrate greatly in the substrate, and there is extraordinary cracking resistance.
The preparation method of above-mentioned improved silica is as follows:
1) ratio of 2:2 takes hum silicon dioxide Si powder and Neon SiC powder in mass ratio;
2) be decentralized medium to the silicon dioxide taken and sic powder with absolute ethyl alcohol, wherein the mass ratio of powder and alcohol is 1:30, ultrasonic disperse 1 hour on supersonic cleaning machine;
3) compound through ultrasonic disperse being put into nylon ball grinder, take agate ball as abrading-ball, and ball material mass ratio is 7:1, is under the condition of 150 revs/min at rotating speed, continuous ball milling 2 hours in planetary ball mill;
4) powder complete for ball milling is poured in powder dish together with agate abrading-ball, dry at 80 DEG C;
5) powder of drying is sieved, take out agate abrading-ball, then mixed powder is ground, until without till larger reunion, so far, obtain improved silica.
Described antioxidant is formed by the component system of mixing of following weight: DMKO 20kg, peanut oil 25kg, soybean protein isolate 4kg, azelaic acid 2kg, isoamyl acetate 4kg, anthocyanidin 2kg, silicone oil 10kg, palm oil 4kg, atoleine 3kg, tert-butyl alcohol 4kg, distilled water 22kg.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (3)
1. a flexible optoelectronic part environmental protection substrate, is characterized in that, is made up of the component of following mass percent:
Graphene microchip 0.02-0.04%
Improved silica 2-6%
Surplus is substrate;
Described substrate is made up of the component of following mass percent:
2. flexible optoelectronic part environmental protection substrate according to claim 1, it is characterized in that, the preparation method of above-mentioned improved silica is as follows:
1) ratio of 1-3:1-5 takes hum silicon dioxide Si powder and Neon SiC powder in mass ratio;
2) be decentralized medium to the silicon dioxide taken and sic powder with absolute ethyl alcohol, wherein the mass ratio of powder and alcohol is 1:30, ultrasonic disperse 1 hour on supersonic cleaning machine;
3) compound through ultrasonic disperse being put into nylon ball grinder, take agate ball as abrading-ball, and ball material mass ratio is 7:1, is under the condition of 150 revs/min at rotating speed, continuous ball milling 2 hours in planetary ball mill;
4) powder complete for ball milling is poured in powder dish together with agate abrading-ball, dry at 80 DEG C;
5) powder of drying is sieved, take out agate abrading-ball, then mixed powder is ground, until without till larger reunion, so far, obtain improved silica.
3. flexible optoelectronic part environmental protection substrate according to claim 1, it is characterized in that, described antioxidant is formed by the component system of mixing of following mass percent: DMKO 20%, peanut oil 25%, soybean protein isolate 4%, azelaic acid 2%, isoamyl acetate 4%, anthocyanidin 2%, silicone oil 10%, palm oil 4%, atoleine 3%, the tert-butyl alcohol 4%, surplus are distilled water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510450762.6A CN105140405A (en) | 2015-07-27 | 2015-07-27 | Environmental-protection substrate for flexible photoelectronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510450762.6A CN105140405A (en) | 2015-07-27 | 2015-07-27 | Environmental-protection substrate for flexible photoelectronic device |
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| CN105140405A true CN105140405A (en) | 2015-12-09 |
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| CN201510450762.6A Pending CN105140405A (en) | 2015-07-27 | 2015-07-27 | Environmental-protection substrate for flexible photoelectronic device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009295358A (en) * | 2008-06-04 | 2009-12-17 | National Institute Of Advanced Industrial & Technology | Actuator element using carbon nanotube electrode with oriented liquid crystal compound |
| CN103029355A (en) * | 2012-11-30 | 2013-04-10 | 电子科技大学 | Photoinduced bending flexible electro-conductive baseplate and preparation method thereof |
| CN103302910A (en) * | 2013-06-25 | 2013-09-18 | 电子科技大学 | Biodegradable flexible conductive base plate and preparation method thereof |
| CN104030662A (en) * | 2014-05-20 | 2014-09-10 | 卢斌 | Preparation process of Al2O3-TiC multiphase ceramics |
-
2015
- 2015-07-27 CN CN201510450762.6A patent/CN105140405A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009295358A (en) * | 2008-06-04 | 2009-12-17 | National Institute Of Advanced Industrial & Technology | Actuator element using carbon nanotube electrode with oriented liquid crystal compound |
| CN103029355A (en) * | 2012-11-30 | 2013-04-10 | 电子科技大学 | Photoinduced bending flexible electro-conductive baseplate and preparation method thereof |
| CN103302910A (en) * | 2013-06-25 | 2013-09-18 | 电子科技大学 | Biodegradable flexible conductive base plate and preparation method thereof |
| CN104030662A (en) * | 2014-05-20 | 2014-09-10 | 卢斌 | Preparation process of Al2O3-TiC multiphase ceramics |
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Application publication date: 20151209 |
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