CN105138183B - A kind of electronic equipment with pressure detecting function - Google Patents
A kind of electronic equipment with pressure detecting function Download PDFInfo
- Publication number
- CN105138183B CN105138183B CN201510624378.3A CN201510624378A CN105138183B CN 105138183 B CN105138183 B CN 105138183B CN 201510624378 A CN201510624378 A CN 201510624378A CN 105138183 B CN105138183 B CN 105138183B
- Authority
- CN
- China
- Prior art keywords
- pressure detecting
- pressure
- electronic equipment
- display module
- mainboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a kind of electronic equipment, which includes: the display module being oppositely arranged and mainboard；There is the air gap of setting thickness between the display module and the mainboard；Pressure detecting assembly between the display module and the mainboard is set；Wherein, pressure sensing capacitance is formed between the pressure detecting assembly and the mainboard or the display module.The electronic equipment integrates the pressure detecting assembly between the air gap of the display module and the mainboard, does not increase the thickness of the electronic equipment.It is multiplexed the display module or the mainboard forms the pressure sensing capacitance, reduce the cost of pressure detecting.
Description
Technical field
The present invention relates to technical field of pressure detection, more specifically, being related to a kind of electronics with pressure detecting function
Equipment.
Background technique
Present mobile communication electronic equipment is widely used in daily life and work, is people's
Daily life and work bring huge convenience, become the indispensable important tool of current people.
With the development of mobile communication, user is to mobile communication electronic equipment, such as mobile phone, plate etc., it is desirable that and it is higher and higher,
Therefore pressure sensitive function becomes the measure for further increasing user experience.After realizing pressure detecting, pressure dimension can use
Information carry out terminal related application function exploitation.
Existing pressure detecting implementation is mainly based upon pressure sensor, needs to put at the electronic equipments such as mobile phone edge
Multiple pressure sensors are set, when the pressure is exerted, the material properties of pressure sensor can change, to detect the change of pressure
Change.But the embodiment that pressure sensor is arranged in electronic equipment is at high cost, and electronic equipment thickness is caused to increase.
Summary of the invention
To solve the above problems, may be implemented to press the present invention provides a kind of electronic equipment with pressure detecting function
Power detection function, and do not increase electronic equipment thickness, it is at low cost.
To achieve the goals above, the invention provides the following technical scheme:
A kind of electronic equipment with pressure detecting function, the electronic equipment include:
The display module and mainboard being oppositely arranged；There is the sky of setting thickness between the display module and the mainboard
Gas gap；
Pressure detecting assembly between the display module and the mainboard is set；
Wherein, pressure sensing capacitance is formed between the pressure detecting assembly and the mainboard or the display module.
Preferably, in above-mentioned electronic equipment, pressure detecting assembly setting is in the display module towards the master
One side surface of plate；
The thickness of the pressure detecting assembly is less than the thickness of the air gap, the pressure detecting assembly and the master
The pressure sensing capacitance is formed between plate.
Preferably, in above-mentioned electronic equipment, pressure detecting assembly setting is in the mainboard towards the display mould
One side surface of group；
The thickness of the pressure detecting assembly is less than the thickness of the air gap, and the pressure detecting assembly is shown with described
Show and forms the pressure sensing capacitance between mould group.
Preferably, in above-mentioned electronic equipment, the pressure detecting assembly include the laminating layer being successively laid with, substrate and
Pressure detecting electrode layer；
The laminating layer be used for by the pressure detecting assembly be fitted in the display module surface or the mainboard
Surface.
Preferably, in above-mentioned electronic equipment, the pressure detecting electrode layer includes: multiple pressure detecting electrodes；It is described
Pressure detecting electrode is in array distribution.
Preferably, in above-mentioned electronic equipment, the pressure detecting electrode layer includes: multiple pressure detecting electrodes；
The substrate is rectangle, and four angular zones of the substrate are respectively arranged with the pressure detecting electrode；
The central area of the substrate is provided with the pressure detecting electrode of multiple array arrangements.
Preferably, in above-mentioned electronic equipment, the pressure detecting assembly further include: be arranged in the pressure detecting electrode
Layer deviates from the insulating protective layer on the one side of substrate surface.
Preferably, in above-mentioned electronic equipment, the pressure detecting electrode is silver electrode, ITO electrode or copper electrode.
Preferably, in above-mentioned electronic equipment, the pressure detecting assembly further include: be located at the laminating layer and the lining
Planarization layer between bottom.
Preferably, in above-mentioned electronic equipment, the planarization layer is conductive layer.
Preferably, in above-mentioned electronic equipment, it is corresponding that at least partly described pressure detecting assembly is located at the display module
Visible area.
Preferably, in above-mentioned electronic equipment, the display module is LCD mould group or AMOLED mould group.
As can be seen from the above description, electronic equipment provided by the invention includes: the display module being oppositely arranged and mainboard；
There is the air gap of setting thickness between the display module and the mainboard；It is arranged in the display module and the mainboard
Between pressure detecting assembly；Wherein, pressure is formed between the pressure detecting assembly and the mainboard or the display module
Power detects capacitor.The electronic equipment integrates the pressure inspection between the air gap of the display module and the mainboard
Component is surveyed, does not increase the thickness of the electronic equipment.It is multiplexed the display module or the mainboard forms the pressure detecting
Capacitor reduces the cost of pressure detecting.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the schematic illustration that conventional electronic device realizes pressure detecting；
Fig. 2 a is a kind of structural schematic diagram of the electronic equipment with pressure detecting function provided by the embodiments of the present application；
Fig. 2 b is the structural schematic diagram after electronic equipment deformation shown in Fig. 2 a；
Fig. 2 c is the equivalent circuit diagram of electronic equipment pressure detecting shown in Fig. 2 a；
Fig. 3 a is the structural schematic diagram of another electronic equipment with pressure detecting function provided by the embodiments of the present application；
Fig. 3 b is the structural schematic diagram after electronic equipment deformation shown in Fig. 3 a；
Fig. 3 c is the equivalent circuit diagram of electronic equipment pressure detecting shown in Fig. 3 a；
Fig. 4 is a kind of structural schematic diagram of pressure detecting assembly provided by the embodiments of the present application；
Fig. 5 is a kind of electrode structure schematic diagram of pressure detecting electrode layer provided by the embodiments of the present application；
Fig. 6 is the electrode structure schematic diagram of another pressure detecting electrode layer provided by the embodiments of the present application；
Fig. 7 is the electrode structure schematic diagram of another pressure detecting electrode layer provided by the embodiments of the present application.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
With reference to Fig. 1, Fig. 1 is the schematic illustration that conventional electronic device realizes pressure detecting, need first substrate 11 with
And multiple pressure sensors are set between the second substrate 12, to realize pressure detecting function.As described in the background art, Fig. 1
The embodiment that pressure sensor is arranged in illustrated embodiment in electronic equipment is at high cost, and electronic equipment thickness is caused to increase
Add.
Inventor the study found that with touch display function electronic equipment in, electronic equipment need to be arranged mainboard and
Rear cover.One function of mainboard structure is to be used to support the display module of side, another function is to install the other side for accommodating
The elements such as battery, control circuit.Rear cover constitutes the shell of electronic equipment for accommodating display module and mainboard.It considers
Reliability, stability and the assembling tolerance of electronic equipment, need reserved the air gap between display module and mainboard.
The embodiment of the present application provides a kind of electronic equipment with pressure detecting function, in the electronic equipment own backlash
Middle setting pressure detecting assembly, the structural member and the pressure detecting assembly of concurrent multiplexing electronic equipment itself form pressure detecting
Capacitor can obtain the pressure value being applied on the electronic equipment by the variation of the pressure sensing capacitance.
Electronic equipment described in the embodiment of the present application includes: the display module being oppositely arranged and mainboard；The display module
There is the air gap of setting thickness between the mainboard；Pressure inspection between the display module and the mainboard is set
Survey component.Wherein, pressure sensing capacitance is formed between the pressure detecting assembly and the mainboard or the display module.
When the electronic equipment is by pressure deformation, the variation of the pressure sensing capacitance will lead to, and then can pass through
The variation of the pressure sensing capacitance detects the pressure value.The structure of the electronic equipment can be as shown in Fig. 2 a- Fig. 2 c.
It is a kind of electronic equipment with pressure detecting function provided by the embodiments of the present application with reference to Fig. 2 a- Fig. 2 c, Fig. 2 a
Structural schematic diagram, Fig. 2 b is the structural schematic diagram shown in Fig. 2 a after electronic equipment deformation, and Fig. 2 c is electronic equipment shown in Fig. 2 a
The equivalent circuit diagram of pressure detecting.
The electronic equipment includes: the display module 21 being oppositely arranged and mainboard 22；The display module 21 and the master
There is the air gap 23 of setting thickness between plate 22；Pressure inspection between the display module 21 and the mainboard 22 is set
Survey component 24.
The electronic equipment further includes the cover board 25 that the display module 21 is arranged in and deviates from 22 1 side surface of mainboard
And the rear cover 26 that the mainboard 22 deviates from 21 1 side surface of display module is set.
In Fig. 2 a illustrated embodiment, the pressure detecting assembly 24 setting is in the mainboard 22 towards the display mould
One side surface of group 21.The thickness of the pressure detecting assembly 24 is less than the thickness of the air gap 23, the pressure detecting
The pressure sensing capacitance is formed between component 24 and the display module 21.Since the thickness of the pressure detecting assembly 24 is small
Thickness in the air gap 23, therefore between capacitor between the pressure detecting assembly 24 and the display module 21
Gap forms the pressure sensing capacitance.
As shown in Figure 2 b, when the electronic equipment is pressed, the display module 21 since deformation occurs for pressure, thus
The capacitance gap width between the pressure detecting assembly 24 and the display module 21 is caused to change, so as to cause described
The size of pressure sensing capacitance between pressure detecting assembly 24 and the display module 21 changes.The capacitance changes
Change is matched with the size of the pressure, and the size of the available pressure of variation by detecting the capacitance realizes pressure
Power detection.
The structure of electronic equipment described in the embodiment of the present application can also be as shown in Fig. 3 a- Fig. 3 c.
It is that another electronics with pressure detecting function provided by the embodiments of the present application is set with reference to Fig. 3 a- Fig. 3 c, Fig. 3 a
Standby structural schematic diagram, Fig. 3 b are the structural schematic diagram after electronic equipment deformation shown in Fig. 3 a, and Fig. 3 c is that electronics shown in Fig. 3 a is set
The equivalent circuit diagram of standby pressure detecting.
The electronic equipment includes: the display module 31 being oppositely arranged and mainboard 32；The display module 31 and the master
There is the air gap 33 of setting thickness between plate 32；Pressure inspection between the display module 31 and the mainboard 32 is set
Survey component 34.
The electronic equipment further includes the cover board 35 that the display module 31 is arranged in and deviates from 32 1 side surface of mainboard
And the rear cover 36 that the mainboard 32 deviates from 31 1 side surface of display module is set.
In Fig. 3 a illustrated embodiment, the pressure detecting assembly 34 setting is in the display module 31 towards the master
One side surface of plate 31.
The thickness of the pressure detecting assembly 34 is less than the thickness of the air gap 33, the pressure detecting assembly 34 with
The pressure sensing capacitance is formed between the mainboard 32.Since the thickness of the pressure detecting assembly 34 is less than between the air
The thickness of gap 33, therefore there is capacitance gap between the pressure detecting assembly 34 and the mainboard 32, form the pressure inspection
Survey capacitor.
As shown in Figure 3b, when the electronic equipment is pressed, the display module 31 is since deformation occurs for pressure, fitting
Also with the display module 31, deformation occurs for pressure detecting assembly 34 on 31 surface of display module, so as to cause the pressure
Capacitance gap width between power detection components 34 and the mainboard 32 changes, so as to cause the pressure detecting assembly 34
The size of pressure sensing capacitance between the mainboard 32 changes.The change and the size of the pressure of the capacitance
Matching, the size of the available pressure of variation by detecting the capacitance, realizes pressure detecting.
In the electronic equipment with display module, there is intrinsic interstitial gap between display module and mainboard.This Shen
Please electronic equipment described in embodiment using the air gap, the pressure detecting assembly is set, it is thick without individually increasing electronic equipment
Pressure detecting can be realized in degree.And the display module or mainboard and pressure detecting assembly formation pressure of multiplexing electronic equipment
Capacitor is detected to realize pressure detecting, is reduced the production cost.
The structure of the pressure detecting assembly can be as shown in Figure 4.
With reference to Fig. 4, Fig. 4 is a kind of structural schematic diagram of pressure detecting assembly provided by the embodiments of the present application, pressure inspection
Surveying component includes the laminating layer 45 being successively laid with, substrate 43, pressure detecting electrode layer 42 and insulating protective layer 41.
The laminating layer 45 be used for by the pressure detecting assembly be fitted in the display module surface or the master
The surface of plate.
The substrate 43 can be existing common film, and such as PET film, cost is relatively low.The manufacture craft of pressure detecting assembly
The complexity of technique can not will increase such as sensor film technique based on existing touch control electrode preparation process, it is at low cost,
Production is simple.
When the laminating layer 45 is fitted in the display module surface, the pressure detecting electrode layer 42 and the mainboard
Form the pressure sensing capacitance.When the laminating layer is fitted in the mainboard table, the pressure detecting electrode layer 42 and institute
It states display module and forms the pressure sensing capacitance.
The pressure detecting assembly further include: the planarization layer 44 between the laminating layer 45 and the substrate 43.
The planarization layer 44 guarantees the flatness of the substrate 43 for providing stable signal reference planes, convenient in institute
It states 43 surface of substrate and forms the pressure detecting electrode layer 42.
It is described flat when the laminating layer 45 is used to the pressure detecting assembly being fitted in the surface of the display module
Smoothization layer 44 can be simultaneously also conductive layer to play electrostatic screen function.At this point, the pressure detecting electrode layer 43 and the master
Plate forms the pressure sensing capacitance, and 44 one side of planarization layer can completely cut off the electromagnetic signal of the display module to inspection
It surveys in the pressure sensing capacitance and detects the interference of signal, on the other hand, when can also completely cut off the detection pressure sensing capacitance
Interference to signal in the display module.It can be seen that the planarization layer 44 can guarantee the accuracy of pressure detecting while avoid
Interference of the pressure detecting signal to electronic equipment.
The planarization layer 44 can be simultaneously also conductive layer to play electrostatic screen function.The laminating layer as described in including
When pressure detecting assembly is fitted in the mainboard surface, the pressure detecting electrode layer 43 forms the pressure with the display module
Power detects capacitor.The planarization layer 44 is multiplexed with shielded layer, for completely cutting off the electromagnetic signal of main board system to pressure detecting electricity
The interference of signal is detected in appearance, while avoiding the detection signal in pressure sensing capacitance to the electromagnetic interference of main board system.Work as pressure
When power detection components are fitted in the display module surface, also reusable is shielded layer to planarization layer 44.
Optionally, in the embodiment of the present application, at least partly described pressure detecting assembly is set and is located at the display module
Corresponding visible area.Deformation by a relatively large margin can occur for the position that the display module corresponds to the visible area, in this way when to institute
When stating electronic equipment application pressure, it can make the pressure sensing capacitance that the change in larger Chengdu occur, be convenient for pressure
Detection.So that visible area is also had pressure detecting function simultaneously, enrich properties of product, promotes user experience.
The pressure detecting electrode layer 43 includes: multiple pressure detecting electrodes.The electrode of the pressure detecting electrode layer 43
Structure can be as shown in Figure 5-Figure 7.The electrode structure of the pressure detecting electrode layer 43 includes but is not limited to shown in Fig. 5-Fig. 7
Structure.
The multiple pressure detecting electrode can be distributed in array distribution or non-array.The pressure detecting electrode is positive
Serrate regular polygon is arranged for polygon or rectangle or round or ellipse or edge or edge setting is serrate
Serrate ellipse is arranged in rectangle or the serrate round or edge of edge setting.
With reference to Fig. 5, Fig. 5 is a kind of electrode structure schematic diagram of pressure detecting electrode layer provided by the embodiments of the present application, should
In embodiment, multiple pressure detecting electrodes 51 are in array distribution on substrate 52.Pressure detecting electrode 51 is rectangle.
With reference to Fig. 6, Fig. 6 is the electrode structure schematic diagram of another pressure detecting electrode layer provided by the embodiments of the present application,
In the embodiment, multiple pressure detecting electrodes 61 are in array distribution on substrate 62.Pressure detecting electrode 61 is rectangle, and should
Rectangular edges are provided with broached-tooth design.
With reference to Fig. 7, Fig. 7 is the electrode structure schematic diagram of another pressure detecting electrode layer provided by the embodiments of the present application,
In the embodiment, substrate 72 is rectangle, and four angular zones of the substrate 72 are respectively arranged with the pressure detecting electrode
71.The pressure detecting electrode 71 is rectangle.The central area of the substrate 72 is provided with the pressure of multiple array arrangements
Detecting electrode 71.
Pressure detecting electrode number and arrangement mode can be evenly distributed on pressure according to practical adjustment, pressure detecting electrode
In power detection components.It can also be in different location distribution pressure detecting electrode, to apply pressure and multiple spot application pressure in single-point
In the case of, the induction amount size of pressure sensitive electrode is different with distribution, is carried out according to the induction amount of pressure sensitive electrode and distribution
It calculates, may be implemented to distinguish multiple spot application pressure and single-point applies pressure, and calculate corresponding pressure value and position.
In the electronic equipment described in the embodiment of the present application, the pressure detecting electrode can be silver electrode, ITO electrode or
Copper electrode.Electronic equipment is mobile phone tablet computer or wearable device.The display module can for LCD mould group or
AMOLED mould group.
In the pressure detecting electrode layer, the number of the pressure detecting electrode can be according to the specification of electronic equipment
It is adjusted, the distribution mode of pressure detecting electrode can be uniformly distributed for dot matrix, can also be according to electronic specifications ruler
The corresponding adjustment of little progress row.Position distribution by the way that pressure detecting electrode is arranged realizes more finger pressure detections.
In the electronic equipment, pressure detecting assembly is made of multilayered structure, and integral thickness is smaller, be can be set and is being shown
In the air gap between mould group and mainboard, the thickness of electronic equipment is not increased.It is with reference to ground that display module, which can be multiplexed,
Plate or multiplexing mainboard are to form pressure sensing capacitance, and then realize pressure detecting with reference to grade slab.
In electronic equipment described in the embodiment of the present application, since pressure detecting electrode layer has multiple pressure detecting electrodes, because
Multipoint pressure detection may be implemented in this, the pressure operation of two finger difference dynamics can be identified simultaneously, by Force Touch skill
Art is advanced to the multiple spot epoch.Test result shows that the electronic equipment can precisely identify two fingers simultaneously with different dynamics
Pressure touch is carried out, such as " finger dubs " adds " one refers to pressing ".Since pressure detecting assembly is that basis should in the electronic equipment
The pressure sensing capacitance formed between pressure detecting electrode layer and display module or mainboard carries out pressure detecting, by electronic equipment
As pressure sensing capacitance signal source, examined by the corresponding pressure of different pressures detecting electrode in detection pressure detecting assembly
The measurement that capacitor realizes different pressures position pressure and size is surveyed, the pressure detecting of no piezoelectric membrane is realized, relative to adopting
With piezoelectric material, reduces and process costs and technology difficulty is made.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (9)
1. a kind of electronic equipment with pressure detecting function characterized by comprising
The display module and mainboard being oppositely arranged；Between the air between the display module and the mainboard with setting thickness
Gap；
Pressure detecting assembly between the display module and the mainboard is set；
Wherein, pressure sensing capacitance is formed between the pressure detecting assembly and the mainboard or the display module；
The pressure detecting assembly includes the laminating layer being successively laid with, substrate and pressure detecting electrode layer；The laminating layer is used
In the surface on the surface or the mainboard that the pressure detecting assembly is fitted in the display module；The pressure detecting
Component further include: the planarization layer between the laminating layer and the substrate；
The planarization layer is conductive layer, and the planarization layer is used to provide stable signal reference planes and guarantees the lining
The flatness at bottom, the planarization layer are multiplexed with shielded layer；When the pressure detecting assembly and the mainboard form the pressure
When detecting capacitor, the planarization layer is used to shield the mutual electromagnetic interference between display module and the pressure sensing capacitance；
When the pressure detecting assembly and the display module form the pressure sensing capacitance, the planarization layer is for shielding institute
State the mutual electromagnetic interference between mainboard and the pressure sensing capacitance.
2. electronic equipment according to claim 1, which is characterized in that the pressure detecting assembly is arranged in the display mould
Group is towards a side surface of the mainboard；
The thickness of the pressure detecting assembly is less than the thickness of the air gap, the pressure detecting assembly and the mainboard it
Between form the pressure sensing capacitance.
3. electronic equipment according to claim 1, which is characterized in that the pressure detecting assembly is arranged in the mainboard court
To a side surface of the display module；
The thickness of the pressure detecting assembly is less than the thickness of the air gap, the pressure detecting assembly and the display mould
The pressure sensing capacitance is formed between group.
4. electronic equipment according to claim 1, which is characterized in that the pressure detecting electrode layer includes: multiple pressure
Detecting electrode；The pressure detecting electrode is in array distribution.
5. electronic equipment according to claim 1, which is characterized in that the pressure detecting electrode layer includes: multiple pressure
Detecting electrode；
The substrate is rectangle, and four angular zones of the substrate are respectively arranged with the pressure detecting electrode；
The central area of the substrate is provided with the pressure detecting electrode of multiple array arrangements.
6. electronic equipment according to claim 1, which is characterized in that the pressure detecting assembly further include: be arranged in institute
State the insulating protective layer that pressure detecting electrode layer deviates from the one side of substrate surface.
7. electronic equipment according to claim 1, which is characterized in that the pressure detecting electrode is silver electrode, ITO electrode
Or copper electrode.
8. electronic equipment according to claim 1, which is characterized in that at least partly described pressure detecting assembly is located at described
The corresponding visible area of display module.
9. electronic equipment according to claim 1, which is characterized in that the display module is LCD mould group or AMOLED mould
Group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510624378.3A CN105138183B (en) | 2015-09-25 | 2015-09-25 | A kind of electronic equipment with pressure detecting function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510624378.3A CN105138183B (en) | 2015-09-25 | 2015-09-25 | A kind of electronic equipment with pressure detecting function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105138183A CN105138183A (en) | 2015-12-09 |
| CN105138183B true CN105138183B (en) | 2019-05-03 |
Family
ID=54723551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510624378.3A Active CN105138183B (en) | 2015-09-25 | 2015-09-25 | A kind of electronic equipment with pressure detecting function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105138183B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105446538B (en) * | 2015-10-29 | 2017-07-21 | 深圳市汇顶科技股份有限公司 | A kind of pressure detection structure and touch apparatus |
| CN107037624A (en) * | 2015-12-11 | 2017-08-11 | 联咏科技股份有限公司 | Display with pressure sensor |
| CN205302238U (en) * | 2015-12-31 | 2016-06-08 | 深圳市汇顶科技股份有限公司 | Pressure detection structure and touch device |
| CN205384588U (en) * | 2015-12-31 | 2016-07-13 | 深圳市汇顶科技股份有限公司 | Pressure detection structure and touch device |
| CN105549790B (en) * | 2016-01-26 | 2019-08-20 | 宸盛光电有限公司 | A kind of pressure-sensing touch module |
| CN107045216A (en) * | 2016-02-05 | 2017-08-15 | 敦泰电子有限公司 | A kind of electronic equipment with pressure detecting function |
| CN205563517U (en) * | 2016-03-15 | 2016-09-07 | 深圳市汇顶科技股份有限公司 | Pressure detection structure and touch device |
| US20180299972A1 (en) * | 2016-03-29 | 2018-10-18 | Saito Inventive Corp. | Input device and image display system |
| US20170322657A1 (en) * | 2016-05-05 | 2017-11-09 | Himax Technologies Limited | Touch display |
| CN106055150B (en) * | 2016-05-26 | 2020-06-26 | 武汉华星光电技术有限公司 | Pressure touch display device |
| KR102524430B1 (en) * | 2016-06-07 | 2023-04-20 | 엘지디스플레이 주식회사 | Display apparatus |
| CN206388153U (en) * | 2016-09-14 | 2017-08-08 | 深圳市汇顶科技股份有限公司 | Pressure-detecting device and electric terminal |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102053750A (en) * | 2009-11-06 | 2011-05-11 | 索尼公司 | Sensing device and electronic device |
| CN104516595A (en) * | 2013-09-27 | 2015-04-15 | 天津富纳源创科技有限公司 | Touch device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8063886B2 (en) * | 2006-07-18 | 2011-11-22 | Iee International Electronics & Engineering S.A. | Data input device |
| CN104216592B (en) * | 2014-09-17 | 2017-12-26 | 上海天马微电子有限公司 | A kind of touch screen and its driving method |
| CN205015861U (en) * | 2015-09-25 | 2016-02-03 | 敦泰电子有限公司 | Electronic equipment with pressure detection function |
-
2015
- 2015-09-25 CN CN201510624378.3A patent/CN105138183B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102053750A (en) * | 2009-11-06 | 2011-05-11 | 索尼公司 | Sensing device and electronic device |
| CN104516595A (en) * | 2013-09-27 | 2015-04-15 | 天津富纳源创科技有限公司 | Touch device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105138183A (en) | 2015-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105138183B (en) | A kind of electronic equipment with pressure detecting function | |
| US9000780B2 (en) | Position detecting sensor, position detecting device, and position detecting method | |
| US10452215B2 (en) | Mutual capacitive force sensor and touch display device with force sensing function and force sensing method thereof | |
| CN205050119U (en) | A touch input device for detecting electrode slice of pressure reaches including this electrode slice | |
| EP3293617B1 (en) | Touch sensor, touch detection apparatus and detection method, and touch control device | |
| KR101695212B1 (en) | Electrode sheet and touch input device for detecting pressure with temperature compensation | |
| CN108319394B (en) | Touch panel, driving method thereof and touch device | |
| US20100315373A1 (en) | Single or multitouch-capable touchscreens or touchpads comprising an array of pressure sensors and the production of such sensors | |
| US10298231B2 (en) | Input device | |
| US20100231530A1 (en) | Touch pad for multiple sensing | |
| US10664087B2 (en) | In-cell touch type display device | |
| CN106293290A (en) | Contactor control device | |
| CN104254821B (en) | Touch panel of the touch panel with film, using the film and the stylus being used together with the film | |
| KR20160048424A (en) | Touch input device | |
| US20170068376A1 (en) | In-cell touch type display device, touch circuit, display driver, and in-cell touch type display device driving method | |
| TWI394067B (en) | Multi - sensor touchpad | |
| JP2015055896A (en) | Sensor, input device and electronic apparatus | |
| CN104423766A (en) | Sensor device, input device, and electronic apparatus | |
| US10379653B2 (en) | Touch module that detects capacitance caused by pressure at touch position, driving method thereof, and display device | |
| CN105511670A (en) | Touch screen with pressure detection function and electronic equipment | |
| US20190227651A1 (en) | Touch panel member | |
| US20190138125A1 (en) | Differential force sensing referenced to display | |
| CN205015861U (en) | Electronic equipment with pressure detection function | |
| CN205427796U (en) | Electronic equipment with pressure detection function | |
| KR101838570B1 (en) | Electrode sheet and touch input device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |