CN105131882A - Conductive silver adhesive doped with conductive polymers - Google Patents
Conductive silver adhesive doped with conductive polymers Download PDFInfo
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- CN105131882A CN105131882A CN201510646977.5A CN201510646977A CN105131882A CN 105131882 A CN105131882 A CN 105131882A CN 201510646977 A CN201510646977 A CN 201510646977A CN 105131882 A CN105131882 A CN 105131882A
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Abstract
The invention discloses a conductive silver adhesive doped with conductive polymers. The conductive silver adhesive doped with the conductive polymers is prepared from 0-2% of silver nanowires, 13%-30% of flake silver powder, 13%-55.3% of the conductive polymers, 20%-30% of bisphenol A epoxy resin, 5%-10% of rapid medium and normal temperature curing agents, 0.5%-1% of rapid medium and normal temperature curing accelerant, 1%-3% of thinning agents, 1%-3% of K-570 or K-550, 0.5%-1% of terephthalic acid, 0.5%-1% of nano-silicon dioxide and 0.1%-0.5% of antifoaming agents. The conductive silver adhesive is low in cost, capable of being rapidly cured at lower temperature, good in electrical conductivity, excellent in impact resistance and suitable for being used on multiple occasions.
Description
Technical field
The invention belongs to conductive resin field, be specifically related to the conductive silver glue of a kind of conducting polymer doping.
Background technology
Conductive resin is a kind of sizing agent be made up of the material such as matrix resin and conductive filler material.After its solidification, there is certain electroconductibility, conductive path can be formed between two objects.Because of it, to prepare operation simple and can significantly improving product performance and production efficiency, so be that replacement can produce the lead-tin soldering of heavy metal contamination and realize the ideal chose of conductive communication, is all widely used in a lot of field.According to the difference of conductive filler material, conductive resin can be divided into silver conductive adhesive, copper conductive adhesive etc.Wherein, reason that silver is best with its electrical and thermal conductivity performance, oxidation-resistance is better etc. and become conductive filler material with the most use in conductive resin.Its huge market makes people continue to increase the research dynamics of conductive silver glue.
Patent CN104017529A, CN104449455A, CN103642420A describe modal conductive silver glue, the conductive silver glue of intermediate temperature setting and quick-setting conductive silver glue respectively.But the silver content of these conductive silver glues is up to 60-70%, and the more expensive price of silver makes the price of these conductive silver glues also higher.For this reason, finding low-cost electro-conductive material, to carry out Some substitute ag material be the effective way reduced costs.But it's a pity, this respect work is also very rare.Further, current conductive silver glue is difficult to realize conductivity excellence, lesser temps solidification and fast setting simultaneously, causes its application to be restricted.
For this reason, exploitation can quick-setting low cost conductive silver glue be the problem that solution is needed in conductive resin field badly at a lower temperature.
Summary of the invention
The invention reside in the conductive silver glue providing a kind of conducting polymer to adulterate, to solve current conductive silver glue high cost, more difficult quick-setting problem at a lower temperature.Conductive silver glue prepared by the present invention is with low cost, conductivity is excellent, solidification value lower than 100 DEG C, that set time is less than half an hour, storage time is long, can be widely used in numerous areas.The formula of this conductive silver glue is:
Nano silver wire, 0-2%;
Flake silver powder, 13-30%;
Conducting polymer, 13-55.3%;
Bisphenol A epoxide resin, 20-30%;
Solidifying agent, 5-10%;
Promotor, 0.5-1%;
Thinner, 2-10%;
K-570 or K-550,1-3%;
Terephthalic acid, 0.5-1%;
Nano silicon, 0.5-1%;
Defoamer, 0.1-0.5%;
ICAM8401 or 8402,0.1-0.5%;
The length of the present invention's nano silver wire used is 30-50 μm, and diameter is 30-50nm.Flake silver powder used is 10 μm of silver powder.Wherein, nano silver wire is not essential;
The present invention's conducting polymer used is polyacetylene, polyaniline, Polythiophene, polypyrrole, poly-to the mixing of one or more in benzene, polyparaphenylene, poly p phenylene sulfide, TCNQ load transfer complex polymer, PEDOT:PSS;
The present invention's bisphenol A epoxide resin used is the mixing of one or more in the epoxy resin such as common E44, E51;
The present invention's solidifying agent used is the mixing of one or more in the solidifying agent such as T31 solidifying agent, thiocarbamide-polyamine condensation thing, multi-thioalcohol compound, 2-ethyl-4-methylimidazole, polymeric amide, fatty ether amine, trimellitic anhydride;
The present invention's curing catalyst used is the mixing of one or more in the promotor such as 2,4,6-, tri--(dimethylamino methyl)-phenol, phenylcarbinol modified imidazole class curing catalyst, isopropylcarbinol modified imidazole class curing catalyst;
The present invention's thinner used is the mixing of one or more in propyl carbinol, ethanol, Virahol, Terpineol 350, ethylene glycol diacetate, diethylene glycol monobutyl ether, phenylcarbinol, 2-Butoxyethyl acetate, ethylene glycol, acetone, dimethyl phthalate, diethyl phthalate, phenylcarbinol, vinylbenzene and pimelinketone equal solvent;
The present invention's defoamer used is the mixing of one or more in the materials such as higher alcohols, polypropylene glycerol aether, tributyl phosphate, silicone based defoamer;
The present invention K-570 or K-550 used is silane coupling agent, and terephthalic acid is conductivity accelerator, and nano silicon is thixotropic agent, and ICAM8401 or 8402 is stablizer;
Conductive silver glue process for preparation of the present invention is: join in epoxy resin by nano silver wire and silver powder, stir.Then add other auxiliary agent, stir deaeration when vacuum suction and mix to various material the conductive silver glue that gets product;
The feature 1 of conductive silver glue of the present invention is: allowed neutral gear between nano silver wire, and thus much less wanted by its amount ratio silver powder.The present invention adds nano silver wire, greatly reduces the usage quantity of ag material.Meanwhile, than also reduce further elargol cost the adding of conducting polymer of ag material considerably cheaper.Conducting polymer is also filled with the neutral gear between silver-colored line.When electric charge is by silver-colored line, make conductive polymer by charge injection Doping Mechanism, thus greatly promote the electroconductibility of elargol product.Finally, the superior quality such as shock resistance, plasticity adding imparting product macromolecular material of conducting polymer;
The feature 2 of conductive silver glue of the present invention is: some epoxy resin and solidifying agent that to have selected ambient cure easily the resin that the present invention provides from lot of documents and patent and solidifying agent, makes final conductive silver glue can even ambient cure below 100 DEG C.Meanwhile, pick several efficient curing catalyst, set time is shortened greatly.But the greatest problem that middle ambient cure conductive silver glue faces is solidification value, and namely the low conductive silver glue that causes starts slowly to solidify at normal temperature, causes its stably stored time short.For this problem, present invention adds stablizer ICAM8401 or 8402 and the elargol of preparation is kept between-10-0 DEG C, the storage time of elargol of the present invention is promoted greatly;
The feature 3 of conductive silver glue of the present invention is: present invention adds thixotropic agent, defoamer and coupling agent, considerably increases the coating effect of elargol, improves conduction homogeneity;
The invention has the advantages that: (1) product cost is more much lower than the cost of current elargol product; (2) product coating property is excellent, cohesiveness is strong, electroconductibility is high, impact resistance is good, storge quality is good; (3) products solidifying temperature is low, set time is short, is conducive to its practical application.
Specific embodiment
Embodiment:
Select the silver powder of the nano silver wire of long 40 μm, diameter about 35nm and 10 μm as conductive filler material, conductive polyaniline (polyaniline and organic proton acid) is conducting polymer, E51 epoxy resin is resin, T31 is solidifying agent, 2,4,6-tri--(dimethylamino methyl)-phenol is curing catalyst, Terpineol 350 is thinner, K550 is coupling agent, and terephthalic acid is conductivity accelerator, and nano silicon is thixotropic agent, tributyl phosphate is defoamer, and ICAM8401 is stablizer.The concrete formula of slurry is:
Nano silver wire, 1%;
Flake silver powder, 24%;
Conductive polyaniline, 39%;
E51 epoxy resin, 20%;
T31，5％；
2,4,6-, tri--(dimethylamino methyl)-phenol, 0.5%;
Propyl carbinol, 6%;
K-550，2％；
Terephthalic acid, 1%;
Nano silicon, 1%;
Tributyl phosphate, 0.2%;
ICAM8401，0.3％；
According to 1 kilogram of elargol amount, calculate the amount of required auxiliary agent, as E51 epoxy resin 200g.Take all substances, for subsequent use.Nano silver wire, silver powder and conducting polymer being joined is equipped with in the still of epoxy resin, stirs.Then add other auxiliary agent, stir deaeration when vacuum suction and mix to various material the conductive silver glue that gets product;
This conductive silver glue solidifies and completes solidification in 20 minutes at 80 DEG C, and recording its volume specific resistance is 9 × 10
-4Ω cm, thermal conductivity 3W/ (m.k).
More than describe preferred embodiment of the present invention in detail.Should be appreciated that those of ordinary skill in the art just design according to the present invention can make many modifications and variations without the need to creative work.All technician in the art, all should by the determined protection domain of claims under this invention's idea on the basis of existing technology by the available experiment of logical analysis, reasoning, or a limited experiment and technical scheme.
Claims (10)
1. a conductive silver glue for conducting polymer doping, it is characterized in that, its formula comprises:
Nano silver wire, 0-2%;
Flake silver powder, 13-30%;
Conducting polymer, 13-55.3%;
Bisphenol A epoxide resin, 20-30%;
Solidifying agent, 5-10%;
Promotor, 0.5-1%;
Thinner, 2-10%;
K-570 or K-550,1-3%;
Terephthalic acid, 0.5-1%;
Nano silicon, 0.5-1%;
Defoamer, 0.1-0.5%;
ICAM8401 or 8402,0.1-0.5%.
2. conductive silver glue according to claim 1, is characterized in that: the present invention's nano silver wire length used is 30-50 μm, and diameter is 30-50nm; Flake silver powder used is 10 μm of silver powder; Wherein, silver-colored line can with also can.
3. conductive silver glue according to claim 1, is characterized in that: the present invention's conducting polymer used is polyacetylene, polyaniline, Polythiophene, polypyrrole, poly-to the mixing of one or more in benzene, polyparaphenylene, poly p phenylene sulfide, TCNQ load transfer complex polymer, PEDOT:PSS.
4. conductive silver glue according to claim 1, is characterized in that: the present invention's bisphenol A epoxide resin used is the mixing of one or more in the epoxy resin such as common E44, E51.
5. conductive silver glue according to claim 1, is characterized in that: the present invention's solidifying agent used is the mixing of one or more in the solidifying agent such as T31 solidifying agent, thiocarbamide-polyamine condensation thing, multi-thioalcohol compound, 2-ethyl-4-methylimidazole, polymeric amide, fatty ether amine, trimellitic anhydride.
6. conductive silver glue according to claim 1, it is characterized in that: the present invention's curing catalyst used is 2, the mixing of one or more in the promotor such as 4,6-, tri--(dimethylamino methyl)-phenol, phenylcarbinol modified imidazole class curing catalyst, isopropylcarbinol modified imidazole class curing catalyst.
7. conductive silver glue according to claim 1, is characterized in that: the present invention's thinner used is the mixing of one or more in propyl carbinol, ethanol, Virahol, Terpineol 350, ethylene glycol diacetate, diethylene glycol monobutyl ether, phenylcarbinol, 2-Butoxyethyl acetate, ethylene glycol, acetone, dimethyl phthalate, diethyl phthalate, phenylcarbinol, vinylbenzene and pimelinketone equal solvent.
8. conductive silver glue according to claim 1, is characterized in that: the present invention's defoamer used is the mixing of one or more in the materials such as higher alcohols, polypropylene glycerol aether, tributyl phosphate, silicone based defoamer.
9. conductive silver glue according to claim 1, is characterized in that: the present invention K-570 or K-550 used is silane coupling agent, and terephthalic acid is conductivity accelerator, and nano silicon is thixotropic agent, and ICAM8401 or 8402 is stablizer.
10. conductive silver glue according to claim 1, is characterized in that: conductive silver glue process for preparation of the present invention is: join in epoxy resin by nano silver wire and silver powder, stir; Then add other auxiliary agent, stir deaeration when vacuum suction and mix to various material the conductive silver glue that gets product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510646977.5A CN105131882A (en) | 2015-10-09 | 2015-10-09 | Conductive silver adhesive doped with conductive polymers |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510646977.5A CN105131882A (en) | 2015-10-09 | 2015-10-09 | Conductive silver adhesive doped with conductive polymers |
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| CN105131882A true CN105131882A (en) | 2015-12-09 |
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| CN201510646977.5A Pending CN105131882A (en) | 2015-10-09 | 2015-10-09 | Conductive silver adhesive doped with conductive polymers |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106047259A (en) * | 2016-08-18 | 2016-10-26 | 覃树强 | Heat-resistant electric-conductive glue and preparation method thereof |
| CN106098147A (en) * | 2016-07-08 | 2016-11-09 | 合肥微晶材料科技有限公司 | A kind of oiliness conductive silver paste and preparation method thereof |
| CN106229036A (en) * | 2016-07-26 | 2016-12-14 | 珠海纳金科技有限公司 | A kind of transparent conductive film and preparation method thereof |
| CN112961624A (en) * | 2021-01-29 | 2021-06-15 | 天津市捷威动力工业有限公司 | Conductive welding adhesive, conductive double-sided adhesive tape and application |
| CN114702909A (en) * | 2022-05-05 | 2022-07-05 | 上海本诺电子材料有限公司 | UV-thermal dual-curing adhesive and preparation method thereof |
| CN115260957A (en) * | 2022-08-10 | 2022-11-01 | 深圳市计量质量检测研究院 | Low-temperature curing bi-component silver conductive adhesive containing conductive auxiliary agent and preparation method thereof |
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| CN101629057A (en) * | 2009-08-22 | 2010-01-20 | 漳立冰 | Nano conductive adhesive and preparation method thereof |
| CN102676102A (en) * | 2011-03-16 | 2012-09-19 | 上海富信新能源科技有限公司 | Silver nanowire doped conductive silver colloid and preparation method thereof |
| CN103468159A (en) * | 2013-03-11 | 2013-12-25 | 苏州牛剑新材料有限公司 | Silver coated nickel powder conductive adhesive and preparation method thereof |
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2015
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Patent Citations (3)
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| CN101629057A (en) * | 2009-08-22 | 2010-01-20 | 漳立冰 | Nano conductive adhesive and preparation method thereof |
| CN102676102A (en) * | 2011-03-16 | 2012-09-19 | 上海富信新能源科技有限公司 | Silver nanowire doped conductive silver colloid and preparation method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098147A (en) * | 2016-07-08 | 2016-11-09 | 合肥微晶材料科技有限公司 | A kind of oiliness conductive silver paste and preparation method thereof |
| CN106098147B (en) * | 2016-07-08 | 2018-04-10 | 合肥微晶材料科技有限公司 | A kind of oiliness conductive silver paste and preparation method thereof |
| CN106229036A (en) * | 2016-07-26 | 2016-12-14 | 珠海纳金科技有限公司 | A kind of transparent conductive film and preparation method thereof |
| CN106047259A (en) * | 2016-08-18 | 2016-10-26 | 覃树强 | Heat-resistant electric-conductive glue and preparation method thereof |
| CN112961624A (en) * | 2021-01-29 | 2021-06-15 | 天津市捷威动力工业有限公司 | Conductive welding adhesive, conductive double-sided adhesive tape and application |
| CN114702909A (en) * | 2022-05-05 | 2022-07-05 | 上海本诺电子材料有限公司 | UV-thermal dual-curing adhesive and preparation method thereof |
| CN114702909B (en) * | 2022-05-05 | 2023-09-15 | 上海本诺电子材料有限公司 | UV-thermal dual-curing adhesive and preparation method thereof |
| CN115260957A (en) * | 2022-08-10 | 2022-11-01 | 深圳市计量质量检测研究院 | Low-temperature curing bi-component silver conductive adhesive containing conductive auxiliary agent and preparation method thereof |
| CN115260957B (en) * | 2022-08-10 | 2024-01-09 | 深圳市计量质量检测研究院 | Low-temperature-curing bi-component silver conductive adhesive containing conductive auxiliary agent and preparation method thereof |
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