CN105128098A - Core plate, manufacturing method for core plate, parquet and manufacturing method for parquet - Google Patents
Core plate, manufacturing method for core plate, parquet and manufacturing method for parquet Download PDFInfo
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- CN105128098A CN105128098A CN201510405755.4A CN201510405755A CN105128098A CN 105128098 A CN105128098 A CN 105128098A CN 201510405755 A CN201510405755 A CN 201510405755A CN 105128098 A CN105128098 A CN 105128098A
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Abstract
The invention relates to a manufacturing method for a core plate and the core plate manufactured with the method. The method includes the steps that a core plate material is dipped with a nano-silver solution, wherein the nano-silver dipping amount ranges from 20% to 150%. In addition, the invention further relates to a method for manufacturing parquet and the parquet manufactured with the method. Compared with a same-class floor manufactured with an existing method, the parquet manufactured with the method has the better hardness and the better heat conduction efficiency; and in particular, the impact resistance of the parquet is as high as 4.0 mm to 7.5 mm, and the heat conduction efficiency is as high as 13 DEG C/h to 18 DEG C/h.
Description
Technical field
The present invention relates to a kind of method preparing central layer, and central layer prepared by the method, also relate to a kind of method preparing solid wooden compound floor, and solid wooden compound floor prepared by the method.
Background technology
In recent years, due to geothermal heating technology there is environment-protecting clean, thermal effect is high, heat endurance is strong, save the advantage such as space, be widely applied in China, and the underground heat wood floors adapted with it become the first-selection of underground heat pavement material, be subject to the favor of consumers in general.Due to the particularity of geothermal heating, require very strict, need adapt to the variations in temperature of moment, have certain heat-conductive characteristic floor, floor density also wants large simultaneously, and then avoids floor in use to occur the problems such as cracking, distortion.Ground heating three-layer wood composite flooring is owing to structurally adopting three-layer real-wood complex technique, panel layer, core layer and backplane level are longitudinal and transverse according to grain of wood direction, vertical to be staggered, therefore its thermal stability, anti-deformation are better than single-layer solid wood floor, and the hard broad-leaved wood of high-quality such as Manchurian ash, birch, walnut of its panel material many employings beautiful texture, this makes it have solid wooden floor board natural look, comfortable foot feeling, the advantage such as warm.But, three-layer wood composite flooring core layer and backplane level more options artificial forest fast growing wood, because fast-growing base material hardness is low, impact resistance is poor, this may cause floor to be subject to impacting the embrittlement because base material subsides of rear paint film, and then affects decorative effect, shortens floor service life, in addition, also there is the defect of heat conduction efficiency difference in existing three-layer wood composite flooring.
Therefore, the solid wooden compound floor that a kind of hardness and heat conduction efficiency significantly improve is badly in need of now.
Summary of the invention
The object of the invention is to overcome the low defect of three-layer wood composite flooring hardness and heat conduction efficiency in prior art, a kind of method preparing central layer is provided, and central layer prepared by the method, a kind of method preparing solid wooden compound floor, and solid wooden compound floor prepared by the method.
The present inventor finds under study for action, with Nano silver solution impregnation process central layer sheet material, the pickup of Nano Silver is 20 ~ 150%, can improve hardness and the heat conduction efficiency of central layer sheet material, and then improves hardness and the heat conduction efficiency of the solid wooden compound floor that central layer is made.
Therefore, to achieve these goals, on the one hand, the invention provides a kind of method preparing central layer, the method comprises: with Nano silver solution impregnation process central layer sheet material, the pickup of Nano Silver is 20 ~ 150%.
On the other hand, present invention also offers central layer prepared by said method.
The third aspect, present invention also offers a kind of method preparing solid wooden compound floor, the method comprises: the base plate being coated with the panel of adhesive, central layer and being coated with adhesive is carried out longitudinal direction, transverse direction according to the grain of wood, to be longitudinally staggered assembly, then hot pressing, health, wherein, described central layer is above-mentioned central layer.
Fourth aspect, present invention also offers solid wooden compound floor prepared by said method.
Such floor that the solid wooden compound floor that method of the present invention obtains obtains than existing methods has better hardness, impact resistance can reach 4.0 ~ 7.5mm, and, because central layer Nano silver solution floods, also can improve the heat conduction efficiency of solid wooden compound floor, make heat conduction efficiency up to 13 ~ 18 DEG C/h.
Other features and advantages of the present invention are described in detail in detailed description of the invention part subsequently.
Detailed description of the invention
Below the specific embodiment of the present invention is described in detail.Should be understood that, detailed description of the invention described herein, only for instruction and explanation of the present invention, is not limited to the present invention.
On the one hand, the invention provides a kind of method preparing central layer, the method comprises: with Nano silver solution impregnation process central layer sheet material, the pickup of Nano Silver is 20 ~ 150%.
Preferably, the pickup of Nano Silver is 20 ~ 100%, can improve hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains further.
In the present invention, the concentration of Nano silver solution can need to determine according to actual product, and such as, the concentration of Nano silver solution can be 60 ~ 200ppm, be preferably 60-150ppm, thus hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains can be improved further.
In the present invention, the quality of the central layer sheet material after pickup refers to dipping Nano silver solution with do not flood the difference of quality of central layer sheet material of Nano silver solution divided by the quality of central layer sheet material of not flooding Nano silver solution.
According to the method preparing central layer of the present invention, wherein, as long as with Nano silver solution impregnation process central layer sheet material, the pickup of Nano Silver is 20 ~ 150%, can improve hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains.But in order to improve hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains further, preferably, the mode of described impregnation process is the one in full-cell process, open cell process and normal pressure dipping, is more preferably full-cell process.
More preferably, full-cell process comprises: central layer sheet material is placed in high pressure resistant sealed treating tank by (1), vacuumizes; (2) under vacuum conditions, fill high pressure resistant sealed treating tank with Nano silver solution, and pressurize; (3) pressure relief, discharges Nano silver solution, and then vacuumizes; Wherein, the concentration of described Nano silver solution is 60 ~ 200ppm, is preferably 60-150ppm, thus further can improves hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains.
Under above-mentioned optimum condition, further preferably, in step (2), the condition of pressurization comprises: pressure is 0.1 ~ 0.9MPa, and the time is 0.5 ~ 6h, thus further can improve hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains.
Further preferably, in step (1) and step (3), described vacuum state is the negative pressure state of-0.1 ~-0.08MPa, thus further can improve hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains.
In a preferred embodiment, full-cell process comprises: the central layer sheet material of moisture content below 20% is placed in high pressure resistant sealed treating tank by (1), vacuumizes, and makes described high pressure resistant sealed treating tank be in vacuum state, keeps 20 ~ 60min; (2) under vacuum conditions, fill high pressure resistant sealed treating tank with Nano silver solution, apply pressure 0.1 ~ 0.9MPa to tank body, keep 0.5 ~ 6h; (3) pressure relief, Nano silver solution in high pressure resistant sealed treating tank is discharged, and then vacuumize, high pressure resistant sealed treating tank is made to be in vacuum state, keep 30 ~ 60min, wherein, the concentration of described Nano silver solution is 60-150ppm, and described vacuum state is the negative pressure state of-0.1 ~-0.08MPa.
In the present invention, open cell process and Soaking can be this area conventional method, and such as, open cell process can comprise: first central layer sheet material moisture content is dried to less than 20%; Central layer sheet material is placed in high pressure resistant closed processes tank body, Nano silver solution is injected and is full of tank body; Apply pressure 0.1 ~ 1.0MPa to tank body again, keep 0.5 ~ 6.0h, make Nano silver solution inject central layer sheet material; Pressure relief, will remain Nano silver solution and discharge, then vacuumize tank body, make the negative pressure state for-0.1 ~-0.08MPa in tank body, will keep 30 ~ 60min, remove the treatment fluid that central layer plate surface is unnecessary, discharge liquid after removing tank body vacuum.In addition, Soaking can comprise: first central layer sheet material moisture content is dried to less than 20%; Flood central layer being put into the tank that Nano silver solution is housed, put weight and be all immersed in treatment fluid to make central layer sheet material on central layer sheet material, process 1-4 days, takes out afterwards.
In the present invention, central layer sheet material can be the central layer sheet material of this area routine, such as, can be at least one in poplar, China fir and pinus sylvestris var. mongolica.When central layer sheet material is poplar, Nano silver solution can be flooded better, thus strengthen hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains further.
Those skilled in the art knows, and central layer sheet material prepared by the present invention needs to carry out kiln drying, makes its moisture content in 4 ~ 6.5% scopes for the solid wooden compound floor that preparation is not easy to crack.Wherein, the method for kiln drying is the kiln drying method of this area routine, does not repeat them here.
Second aspect, present invention also offers central layer prepared by said method.
The third aspect, present invention also offers a kind of method preparing solid wooden compound floor, the method comprises: the base plate being coated with the panel of adhesive, central layer and being coated with adhesive is carried out longitudinal direction, transverse direction according to wood grain, to be longitudinally staggered assembly, then hot pressing, health, wherein, described central layer is above-mentioned central layer.
In the present invention, in order to prepare composite floor board not easy to crack, the moisture content of panel, central layer and base plate can control in 4 ~ 6.5% scopes, and panel, central layer and base plate is as far as possible identical containing dose rate.
According to the method preparing solid wooden compound floor of the present invention, wherein, adhesive contains additive, and the addition of additive is 10 ~ 50% of adhesive weight, and additive is aluminium powder and/or copper powder, can the hardness of composite floor board and heat conduction efficiency further.
In the present invention, relative to 1m
2solid wooden compound floor, the glue-spread of the adhesive containing additive is 310 ~ 420g/m
2, wherein, the summation of the glue-spread of base plate and panel is within the scope of this.
According to the method preparing solid wooden compound floor of the present invention, wherein, hot pressing condition can be the hot pressing condition of this area routine, preferably, the condition of described hot pressing comprises: temperature is 90 ~ 110 DEG C, and the time is 5 ~ 8min, and pressure is 0.9 ~ 1.2MPa, what panel, central layer and base plate can be made to combine is tightr, thus improves the hardness of solid wooden compound floor further.
According to the method preparing solid wooden compound floor of the present invention, wherein, health-preserving condition can be the health-preserving condition of this area routine, preferably, the condition of described health comprises: temperature is 20 ~ 30 DEG C, and humidity is 30 ~ 45%, time is more than 2 days, solid wooden compound floor sheet material can be made to discharge stress further, thus combine more closely, improve the hardness of solid wooden compound floor further.
According to the method preparing solid wooden compound floor of the present invention, wherein, in order to obtain solid wooden compound floor finished product, the method carries out slot treatment, paint process successively after can also being included in health, polishing, wherein, slot treatment, paint process, polishing is the method for this area routine.
Fourth aspect, present invention also offers solid wooden compound floor prepared by said method.
Embodiment
Preparation example 1
This preparation example prepares the method for central layer and the central layer of preparation thereof for illustration of the present invention.
Adopt full-cell process, with 150ppm concentration Nano silver solution impregnation process central layer sheet material, (length is 432mm, width is 22mm, thickness is 9.2mm), make the pickup of Nano Silver be 100%, the concrete operation step of full-cell process is: (1) by moisture content be 18% poplar central layer sheet material be placed in high pressure resistant sealed treating tank, vacuumize, make described high pressure resistant sealed treating tank be in vacuum state (pressure is-0.1MPa), keep 20min; (2) under above-mentioned vacuum state, fill high pressure resistant sealed treating tank with 150ppm concentration Nano silver solution, apply pressure 0.9MPa to tank body, keep 6h; (3) pressure relief, discharges Nano silver solution in high pressure resistant sealed treating tank, and then vacuumizes, make high pressure resistant sealed treating tank be in vacuum state (pressure is-0.1MPa), keep 45min, obtained central layer, kiln drying central layer to moisture content is 5%, for subsequent use.
Preparation example 2
This preparation example prepares the method for central layer and the central layer of preparation thereof for illustration of the present invention.
Adopt full-cell process, with 100ppm concentration Nano silver solution impregnation process central layer sheet material, (length is 432mm, width is 22mm, thickness is 9.2mm), make the pickup of Nano Silver be 80%, the concrete operation step of full-cell process is: (1) by moisture content be 19% poplar central layer sheet material be placed in high pressure resistant sealed treating tank, vacuumize, make described high pressure resistant sealed treating tank be in vacuum state (pressure is-0.09MPa), keep 40min; (2) under above-mentioned vacuum state, fill high pressure resistant sealed treating tank with 100ppm concentration Nano silver solution, apply pressure 0.8MPa to tank body, keep 3h; (3) pressure relief, discharges Nano silver solution in high pressure resistant sealed treating tank, and then vacuumizes, make high pressure resistant sealed treating tank be in vacuum state (pressure is-0.1MPa), keep 60min, obtained central layer, kiln drying central layer to moisture content is 5%, for subsequent use.
Preparation example 3
This preparation example prepares the method for central layer and the central layer of preparation thereof for illustration of the present invention.
Adopt full-cell process, with 60ppm concentration Nano silver solution impregnation process central layer sheet material, (length is 432mm, width is 22mm, thickness is 9.2mm), make the pickup of Nano Silver be 20%, the concrete operation step of full-cell process is: (1) by moisture content be 17% poplar central layer sheet material be placed in high pressure resistant sealed treating tank, vacuumize, make described high pressure resistant sealed treating tank be in vacuum state (pressure is-0.09MPa), keep 60min; (2) under above-mentioned vacuum state, fill high pressure resistant sealed treating tank with 60ppm concentration Nano silver solution, apply pressure 0.5MPa to tank body, keep 2h; (3) pressure relief, discharges Nano silver solution in high pressure resistant sealed treating tank, and then vacuumizes, make high pressure resistant sealed treating tank be in vacuum state (pressure is-0.08MPa), keep 30min, obtained central layer, kiln drying central layer to moisture content is 5%, for subsequent use.
Preparation example 4
This preparation example prepares the method for central layer and the central layer of preparation thereof for illustration of the present invention.
Central layer is prepared according to the method for preparation example 1, unlike, in step (2), apply pressure 1MPa to tank body, keep 0.2h, obtained central layer, kiln drying central layer to moisture content is 5%, for subsequent use.
Preparation example 5
This preparation example prepares the method for central layer and the central layer of preparation thereof for illustration of the present invention.
Prepare central layer according to the method for preparation example 1, unlike in, step (1) and step (3), vacuum state is the negative pressure state of-0.85MPa, and obtained central layer, kiln drying central layer to moisture content is 5%, for subsequent use.
Preparation example 6
This preparation example prepares the method for central layer and the central layer of preparation thereof for illustration of the present invention.
Central layer is prepared according to the method for preparation example 1, unlike, poplar central layer sheet material is replaced with fir core plate sheet material, and obtained central layer, kiln drying central layer to moisture content is 5%, for subsequent use.
Embodiment 1
The present embodiment prepares the method for solid wooden compound floor and the solid wooden compound floor of preparation thereof for illustration of the present invention.
At 1m
2on panel (moisture content is 4.5%) surface smear, (adhesive contains 140gE to adhesive
1grade urea-formaldehyde resin adhesive, 65g copper powder), at 1m
2adhesive (adhesive contains 140g adhesive, 63g copper powder) on base plate (moisture content is 6%) surface smear, will be coated with panel, the 1m of adhesive
2the central layer that preparation example 1 obtains and the base plate being coated with adhesive carry out longitudinal direction, transverse direction, longitudinal assembly that is staggered according to wood grain, and then carry out hot pressing, the condition of hot pressing is: temperature is 90 DEG C, and the time is 5min, and pressure is 0.9MPa; Carry out health again, the condition of health is: temperature is 20 DEG C, and humidity is 30%, and the time is 2 days; These semi-finished product are finally carried out slot treatment, paint process, polishing, obtained solid wooden compound floor finished product A1 by obtained solid wooden compound floor semi-finished product successively.
Embodiment 2
The present embodiment prepares the method for solid wooden compound floor and the solid wooden compound floor of preparation thereof for illustration of the present invention.
At 1m
2on panel (moisture content is 4.5%) surface smear, (adhesive contains 140gE to adhesive
1grade urea-formaldehyde resin adhesive, 15g aluminium powder), at 1m
2on base plate (moisture content is 6%) surface smear, (adhesive contains 140gE to adhesive
1grade urea-formaldehyde resin adhesive, 15g aluminium powder), will panel, the 1m of adhesive be coated with
2the central layer that preparation example 2 obtains and the base plate being coated with adhesive carry out longitudinal direction, transverse direction, longitudinal assembly that is staggered according to wood grain, and then carry out hot pressing, the condition of hot pressing is: temperature is 100 DEG C, and the time is 6min, and pressure is 1.1MPa; Carry out health again, the condition of health is: temperature is 25 DEG C, and humidity is 40%, and the time is 4 days; These semi-finished product are finally carried out slot treatment, paint process, polishing, obtained solid wooden compound floor finished product A2 by obtained solid wooden compound floor semi-finished product successively.
Embodiment 3
The present embodiment prepares the method for solid wooden compound floor and the solid wooden compound floor of preparation thereof for illustration of the present invention.
At 1m
2adhesive (adhesive contains the agent of 140g kind conventional adhesive, 30g aluminium powder, 30g copper powder) on panel (moisture content is 4.5%) surface smear, at 1m
2on base plate (moisture content is 6%) surface smear, adhesive (adhesive contains the agent of 140g kind conventional adhesive, 30g aluminium powder, 30g copper powder), will be coated with panel, the 1m of adhesive
2the central layer that preparation example 3 obtains and the base plate being coated with adhesive carry out longitudinal direction, transverse direction, longitudinal assembly that is staggered according to wood grain, and then carry out hot pressing, the condition of hot pressing is: temperature is 110 DEG C, and the time is 8min, and pressure is 1.2MPa; Carry out health again, the condition of health is: temperature is 30 DEG C, and humidity is 45%, and the time is 4 days; These semi-finished product are finally carried out slot treatment, paint process, polishing, obtained solid wooden compound floor finished product A3 by obtained solid wooden compound floor semi-finished product successively.
Embodiment 4
The present embodiment prepares the method for solid wooden compound floor and the solid wooden compound floor of preparation thereof for illustration of the present invention.
Solid wooden compound floor finished product A4 is prepared according to the method for embodiment 1, unlike, the central layer that central layer adopts preparation example 4 obtained, with obtained solid wooden compound floor finished product A4.
Embodiment 5
The present embodiment prepares the method for solid wooden compound floor and the solid wooden compound floor of preparation thereof for illustration of the present invention.
Solid wooden compound floor finished product A5 is prepared according to the method for embodiment 1, unlike, the central layer that central layer adopts preparation example 5 obtained, with obtained solid wooden compound floor finished product A5.
Embodiment 6
The present embodiment prepares the method for solid wooden compound floor and the solid wooden compound floor of preparation thereof for illustration of the present invention.
Solid wooden compound floor finished product A6 is prepared according to the method for embodiment 1, unlike, the central layer that central layer adopts preparation example 6 obtained, with obtained solid wooden compound floor finished product A6.
Embodiment 7
The present embodiment prepares the method for solid wooden compound floor and the solid wooden compound floor of preparation thereof for illustration of the present invention.
Solid wooden compound floor finished product A7 is prepared according to the method for embodiment 1, unlike, the condition bag of hot pressing is: temperature is 80 DEG C, and the time is 3min, and pressure is 0.7MPa, obtained solid wooden compound floor finished product A7.
Embodiment 8
The present embodiment prepares the method for solid wooden compound floor and the solid wooden compound floor of preparation thereof for illustration of the present invention.
Solid wooden compound floor finished product A8 is prepared according to the method for embodiment 1, unlike, not containing copper powder in adhesive, obtained solid wooden compound floor finished product A8.
Test case
Test case 1
Adopt shock resistance detection method in GB/T17657-2013 " test methods of evaluating the properties of wood-based panels and surface decorated wood-based panels " to measure the impact resistance of the solid wooden compound floor finished product A1-A8 that embodiment 1-8 obtains, result is see table 1.
Test case 2
Adopt heat conduction efficiency detection method in forestry industry standard LY/T1700-2007 " ground heating wood floors " to measure the heat conduction efficiency of the solid wooden compound floor finished product A1-A8 that embodiment 1-8 obtains, result is see table 1.
Table 1
| Embodiment | Impact resistance (mm) | Heat conduction efficiency (DEG C/h) |
| Embodiment 1 | 4.0 | 18 |
| Embodiment 2 | 6 | 17 |
| Embodiment 3 | 6.5 | 18 |
| Embodiment 4 | 7.2 | 15 |
| Embodiment 5 | 7.5 | 13 |
| Embodiment 6 | 7.1 | 14 |
| Embodiment 7 | 7.0 | 15 |
| Embodiment 8 | 7.1 | 14 |
Can be found out by the data of table 1, hardness and the heat conduction efficiency of the solid wooden compound floor finished product that embodiment 1-8 obtains are all higher.
Embodiment 1 is compared can be found out with embodiment 4, and in step (2), the condition of pressurization comprises: pressure is 0.1 ~ 0.9MPa, and the time is 0.5 ~ 6h, thus further can improve hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains.
Embodiment 1 is compared can find out with embodiment 5, in step (1) and step (3), described vacuum state is the negative pressure state of-0.1 ~-0.08MPa, thus further can improve hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains.
Embodiment 1 is compared can find out with embodiment 6, when central layer sheet material is poplar material, Nano silver solution can be flooded better, thus strengthen hardness and the heat conduction efficiency of the solid wooden compound floor that central layer obtains further.
Embodiment 1 is compared can find out with embodiment 7, the condition of hot pressing comprises: temperature is 90 ~ 110 DEG C, and the time is 5 ~ 8min, when pressure is 0.9 ~ 1.2MPa, what panel, central layer and base plate can be made to combine is tightr, thus improves the hardness of solid wooden compound floor further.
Embodiment 1 is compared can find out with embodiment 8, additive be aluminium powder and/or copper powder time, hardness and the heat conduction efficiency of solid wooden compound floor can be improved further.
The composite floor board that the solid wooden compound floor that method of the present invention obtains obtains than existing methods has better hardness, impact resistance can reach 4.0 ~ 7.5mm, and, because central layer Nano silver solution floods, also can improve the heat conduction efficiency of composite floor board, make heat conduction efficiency up to 13 ~ 18 DEG C/h.
More than describe the preferred embodiment of the present invention in detail; but the present invention is not limited to the detail in above-mentioned embodiment, within the scope of technical conceive of the present invention; can carry out multiple simple variant to technical scheme of the present invention, these simple variant all belong to protection scope of the present invention.
It should be noted that in addition, each concrete technical characteristic described in above-mentioned detailed description of the invention, in reconcilable situation, can be combined by any suitable mode, in order to avoid unnecessary repetition, the present invention illustrates no longer separately to various possible combination.
In addition, also can be combined between various different embodiment of the present invention, as long as it is without prejudice to thought of the present invention, it should be considered as content disclosed in this invention equally.
Claims (10)
1. prepare a method for central layer, it is characterized in that, the method comprises: with Nano silver solution impregnation process central layer sheet material, the pickup of Nano Silver is 20 ~ 150%.
2. method according to claim 1, wherein, the mode of described impregnation process is the one in full-cell process, open cell process and Soaking, is preferably full-cell process.
3. method according to claim 2, wherein, described full-cell process comprises: central layer sheet material is placed in high pressure resistant sealed treating tank by (1), vacuumizes; (2) under vacuum conditions, fill high pressure resistant sealed treating tank with Nano silver solution, and pressurize; (3) pressure relief, discharges Nano silver solution, and then vacuumizes; Wherein, the concentration of described Nano silver solution is 60 ~ 200ppm, is preferably 60-150ppm.
4. method according to claim 3, wherein, in step (2), the condition of pressurization comprises: pressure is 0.1 ~ 0.9MPa, and the time is 0.5 ~ 6h; In step (1) and step (3), described vacuum state is the negative pressure state of-0.1 ~-0.08MPa.
5. according to the method in claim 1-4 described in any one, wherein, described central layer sheet material is at least one in poplar, China fir and pinus sylvestris var. mongolica, is preferably poplar.
6. a central layer, the central layer that this central layer is prepared for method described in any one in claim 1-5.
7. prepare the method for solid wooden compound floor for one kind, it is characterized in that, the method comprises: the base plate being coated with the panel of adhesive, central layer and being coated with adhesive is carried out longitudinal direction, transverse direction according to wood grain, to be longitudinally staggered assembly, then hot pressing, health, wherein, described central layer is central layer according to claim 6.
8. method according to claim 7, wherein, described adhesive contains additive, and the addition of additive is 10 ~ 50% of adhesive weight, and described additive is aluminium powder and/or copper powder.
9. method according to claim 7, wherein, the condition of described hot pressing comprises: temperature is 90 ~ 110 DEG C, and the time is 5 ~ 8min, and pressure is 0.9 ~ 1.2MPa; The condition of described health comprises: temperature is 20 ~ 30 DEG C, and humidity is 30 ~ 45%, and the time is more than 2 days.
10. a solid wooden compound floor, is characterized in that, the solid wooden compound floor that this solid wooden compound floor is prepared for method described in claim 7-9 any one.
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| CN108115798A (en) * | 2017-12-04 | 2018-06-05 | 杨舜轲 | A kind of process equipment and processing method of floor heating multi-layer solid wood composite floor |
| CN108162115A (en) * | 2017-12-19 | 2018-06-15 | 张嘉宸 | A kind of processing method of floor heating solid wood granule floor |
| CN108999371A (en) * | 2018-06-27 | 2018-12-14 | 嘉善缔嘉装饰材料有限公司 | A kind of manufacturing method of antistatic composite floor board |
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