CN105117071A - 一种基板、显示装置 - Google Patents

一种基板、显示装置 Download PDF

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CN105117071A
CN105117071A CN201510618189.5A CN201510618189A CN105117071A CN 105117071 A CN105117071 A CN 105117071A CN 201510618189 A CN201510618189 A CN 201510618189A CN 105117071 A CN105117071 A CN 105117071A
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substrate
signal lead
ground wire
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范文金
张雷
胡明
赖育辉
王庆浦
李君�
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Priority to US15/159,236 priority patent/US10304822B2/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0288—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0292—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using a specific configuration of the conducting means connecting the protective devices, e.g. ESD buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge

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Abstract

本发明提供一种基板及显示装置，用于解决现有技术中的基板中每条信号通道和与其连接的信号走线在静电释放时不能顺利导出的问题。本发明提供的基板及显示装置，由于基板内部的每条信号通道在静电释放时都能与接电线选择导通，因此可以实现内部区域的每个信号通道和与其相连的信号走线的防静电释放。

Description

一种基板、显示装置
技术领域
本发明涉及显示技术领域，具体地，涉及一种基板、显示装置。
背景技术
目前触控、显示面板已成为很普遍的电子产品。一般来说，触控(显示)面板均包含内部触控(显示)区域和周边区域。其中，周边区域包括多种信号走线，用于为触控(显示)区域提供控制信号，也就是信号走线的一端连接触控(显示)区域，另一端连接各种驱动控制信号。
在触控、显示面板的生产、使用过程中，都有可能产生、接触ESD(静电释放)，当ESD不能快速、有效排出面板外时，即有可能对产品造成ESD击伤。
如图1和图2所示，现有技术中的触控面板包括触控区域1和周边区域2，其中，周边区域2包括与触控区域1内的信号通道3连接的信号走线4，用于控制信号的输入或导出，信号走线4的另一端连接各种驱动控制器(图中没有示出)；周边区域2还包括围绕周边区域2的接地线5，上述的防静电设置只能在触控区域1的信号通道3及信号走线4上以热量的形式进行消散，无法顺利导出；相邻信号通道3间无防静电释放结构，无法对整个触控区域1的信号通道3进行防静电释放；通常当ESD>2KV时，就可能对触控区域内信号通道3及信号走线4造成损伤。
发明内容
解决上述问题所采用的技术方案是一种柔性基底及其制备方法、显示装置。
本发明提供一种基板，包括内部区域和围绕所述内部区域周边的周边区域，所述周边区域包括多个信号走线和至少一个接地线；所述多个信号走线一端与所述内部区域的信号通道连接，另一端与驱动电路连接；所述信号走线与相邻的信号走线或接地线通过选择导通结构连接；所述选择导通结构能在静电释放时进行导通。
优选的，所述选择导通结构包括两个相对间隔预定距离设置的尖端部。
优选的，所述预定距离为5-10um。
优选的，所述预定距离为6-8um。
优选的，所述尖端部沿所述预定距离的中线对称设置。
优选的，所述尖端部为等腰三角形；所述等腰三角形的顶角相对设置。
优选的，所述顶角的角度范围为15-60°。
优选的，所述周边区域包括多个信号走线和一个接地线；
所述多个信号走线和一个接地线从所述周边区域的内侧向外侧依次排布。
优选的，基板包括触控基板或阵列基板。
本发明的另一个目的在于提供一种显示装置，包括上述的基板。
本发明提供的基板及显示装置，由于基板内部的每条信号通道在静电释放时都能与接电线选择导通，因此可以实现内部区域的每个信号通道和与其相连的信号走线的防静电释放。
附图说明
图1为现有技术中触控基板的结构示意图；
图2为现有技术中触控基板的布线结构示意图；
图3为本发明实施例1中触控基板的布线结构示意图；
图4为本发明实施例1中触控基板的静电释放过程示意图；
图5为本发明实施例1中选择导通结构的结构示意图；
其中，1.触控区域；2.周边区域；3.信号通道；4.信号走线；5.接地线；6.选择导通结构；61.尖端部；
α：尖端部的顶角；
d:两相对尖端部之间的预定距离。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明作进一步详细描述。
实施例1：
如图3所示，本实施例提供一种基板，包括内部区域和围绕所述内部区域周边的周边区域2，所述周边区域2包括多个信号走线4和至少一个接地线5；所述多个信号走线4一端与所述内部区域的信号通道3连接，另一端与驱动电路连接；
所述信号走线4与相邻的信号走线4或接地线5通过选择导通结构6连接；所述选择导通结构6能在静电释放时进行导通。
本实施例提供的基板，由于基板内部的每条信号通道3在静电释放时都能与接电线选择导通，因此可以实现内部区域的每个信号通道3和与其相连的信号走线4的防静电释放。
下面介绍一下上述的基板的静电释放的过程：
如图4所示，当基板为触控基板时，触控区域1内的任何一个信号通道3产生了静电释放(ESD)，该静电通过与其连接的信号走线4上的选择导通结构6传递到相邻的信号走线4上，最终传递到接地线5上将静电导出；这样实现了触控区域1和周边区域2的所有通道的静电导出。
如图5所示,所述选择导通结构6包括两个相对间隔预定距离设置的尖端部61。
这样具有相对间隔预定距离d设置的尖端部61的选择导通结构6，只有在静电释放时才会将相邻的信号走线4或接地线5导通，其它时刻并不导通，保证各信号通道3与信号走线4能够各自正常工作。
可选的，所述预定距离d为5-10um。
这样的范围内既不会由于尖端部61之间的预定距离d过近导致信号走线4在传递正常工作信号时产生导通相互影响；也不会由于尖端部61之间的预定距离d过远导致信号走线4在发生静电释放时无法进行静电导出。
可选的，所述预定距离d为6-8um。这样的范围内能够使一般触控基板或显示基板产生的静电顺利导出。
可选的，所述尖端部61沿所述预定距离d的中线对称设置。应当理解的是，上述这样能够更好的利用尖端放电效应，有利于静电的传导。
可选的，所述尖端部61为等腰三角形；所述等腰三角形的顶角相对设置。
应当理解的是，从实际产生的静电传导的效果和制作的方便，可以通常将相对设置的尖端部61设计为等腰三角形，此时等腰三角形的顶角α相对设置，等腰三角形的底边用于与信号走线4或接地线5连接。
可选的，所述顶角α的角度范围为15-60°。这样能更好的利用尖端放电效应，有利于静电的传导。
如图4所示，所述周边区域2包括多个信号走线4和一个接地线5；
所述多个信号走线4和一个接地线5从所述周边区域2的内侧向外侧依次排布。
应当理解的是，上述的接地线5也可以为多条；且信号走线4可以从触控基板的周侧的任意一侧或几侧引出，在此不作具体限定。
应当理解的是，所述基板包括触控基板或阵列基板。本实施例是触控基板为例介绍的，对阵列基板也是适用的，只是通道信号有所变化而已。
实施例2
本实施例提供一种显示装置，包括上述的基板。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (10)

1.一种基板，包括内部区域和围绕所述内部区域周边的周边区域，所述周边区域包括多个信号走线和至少一个接地线；所述多个信号走线一端与所述内部区域的信号通道连接，另一端与驱动电路连接；其特征在于，所述信号走线与相邻的信号走线或接地线通过选择导通结构连接；所述选择导通结构能在静电释放时进行导通。
2.如权利要求1所述的基板，其特征在于，所述选择导通结构包括两个相对间隔预定距离设置的尖端部。
3.如权利要求1所述的基板，其特征在于，所述预定距离为5-10um。
4.如权利要求3所述的基板，其特征在于，所述预定距离为6-8um。
5.如权利要求1所述的基板，其特征在于，所述尖端部沿所述预定距离的中线对称设置。
6.如权利要求5所述的基板，其特征在于，所述尖端部为等腰三角形；所述等腰三角形的顶角相对设置。
7.如权利要求6所述的基板，其特征在于，所述顶角的角度范围为15-60°。
8.如权利要求1所述的基板，其特征在于，所述周边区域包括多个信号走线和一个接地线；
所述多个信号走线和一个接地线从所述周边区域的内侧向外侧依次排布。
9.如权利要求1-8任一项所述的基板，其特征在于，基板包括触控基板或阵列基板。
10.一种显示装置，其特征在于，包括如权利要求1-8任一项所述的基板。
CN201510618189.5A 2015-09-24 2015-09-24 一种基板、显示装置 Pending CN105117071A (zh)

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CN107450769A (zh) * 2017-07-06 2017-12-08 深圳市骏达光电股份有限公司 一种触摸屏及触摸屏终端设备
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WO2018001033A1 (zh) * 2016-06-30 2018-01-04 京东方科技集团股份有限公司 触控基板及其制作方法、触控屏
US10795512B2 (en) 2016-06-30 2020-10-06 Boe Technology Group Co., Ltd. Touch substrate having conductive lines and ground conductive pattern between adjacent conductive lines, method for manufacturing the same, and touch panel
CN106055167A (zh) * 2016-07-19 2016-10-26 深圳市骏达光电股份有限公司 导电膜线路结构及具有该结构的触摸屏
CN107450769A (zh) * 2017-07-06 2017-12-08 深圳市骏达光电股份有限公司 一种触摸屏及触摸屏终端设备
CN107450769B (zh) * 2017-07-06 2020-10-02 深圳市骏达光电股份有限公司 一种触摸屏及触摸屏终端设备
CN109164936A (zh) * 2018-08-29 2019-01-08 科大讯飞股份有限公司 柔性触控面板及智能终端
CN109164936B (zh) * 2018-08-29 2021-12-03 科大讯飞股份有限公司 柔性触控面板及智能终端

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