CN105112003A - Double-component low-modulus organosilicon sealant for LED (light-emitting diode) packaging and preparation method thereof - Google Patents
Double-component low-modulus organosilicon sealant for LED (light-emitting diode) packaging and preparation method thereof Download PDFInfo
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- CN105112003A CN105112003A CN201510568571.XA CN201510568571A CN105112003A CN 105112003 A CN105112003 A CN 105112003A CN 201510568571 A CN201510568571 A CN 201510568571A CN 105112003 A CN105112003 A CN 105112003A
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Abstract
The invention relates to a double-component low-modulus organosilicon sealant for LED (light-emitting diode) packaging and a preparation method thereof, belonging to the technical field of organosilicon sealants. The sealant comprises a component A and a component B. The component A comprises the following raw materials in parts by weight: 95-100 parts of 107-base adhesive, 5-8 parts of crosslinking agent propyl silicate, 20-25 parts of fumed silica and 2-9 parts of coupling agent KH-550. The component B comprises the following raw materials in parts by weight: 2.5-5.5 parts of catalyst, 10-20 parts of diluter and 5-25 parts of chain extender. By selecting and using the molecular weight of the hydroxyl-terminated dimethyl siloxane and the multiple chain extenders and adding the other assistants, the prepared double-component low-modulus tough organosilicon packaging material is suitable for LED packaging.
Description
Technical field
The present invention relates to a kind of organosilicon sealant and preparation method thereof, more particularly, the present invention relates to a kind of LED two component low modulus organosilicon sealant and preparation method thereof, belong to organosilicon sealant technical field.
Background technology
The seams such as Highrise buildings, large-sized concrete facility, motorway and airfield runway, to the particular requirement of sealing material, need low modulus, high-elongation novel organosilicon sealing material product.In addition, in the production process of LED product, the special silicone potting material of low modulus, tool toughness is also needed.According to Polymer Synthesizing molecular designing, by adding chainextender, make organosilicon sealing material while being cross-linked, the linear lengthening of base polymer molecular chain, network structure middle crosslink density reduces, make prepared silicon rubber sealing material have low modulus and higher elongation, realize high resistance displacement deformation ability, thus obtain the silicon rubber potting compound with low modulus, high tenacity.
It is CN103436216A that State Intellectual Property Office discloses a publication number in 2013.12.11, name is called the invention of " organosilicon sealant of a kind of dealcoholizing-type low modulus high elongation rate and preparation method thereof ", this invention is by base polymer 100 parts, softening agent 5-30 part, filler 5-150 part, linking agent 1-15 part, thixotropic agent 1-5 part, stablizer 0.2-3 part, catalyzer 0.5-3 part, coupling agent 0.5-3 part forms, during preparation, above-mentioned raw materials is joined in high velocity dispersators in vacuum tightness 0.06-0.095MPa, rotating speed 20-600rpm carries out obtaining for chemical reaction 60-180 minute, the present invention has low modulus and high elongation rate, elastic restoration ratio is good, good ageing-resistant performance and high temperature performance.
Low modulus machine silicone sealant of the prior art does not have two component product, and toughness is poor, is not suitable for LED.
Summary of the invention
The present invention is intended to solve low modulus machine silicone sealant of the prior art does not have two component product, and toughness is poor, be not suitable for the problem of LED, provide a kind of LED two component low modulus organosilicon sealant, sealing glue is two component product, and toughness is strong.
In order to realize foregoing invention object, its concrete technical scheme is as follows:
The two component low modulus organosilicon sealant of a kind of LED, is characterized in that: comprise the following raw material according to weight parts:
Component A:
107 base glue 95-100 parts
Linking agent positive silicic acid propyl ester 5-8 part
Thermal silica 20-25 part
Coupling agent KH-5502-9 part
B component:
Catalyzer 2.5-5.5 part
Thinner 10-20 part
Chainextender 5-25 part.
The viscosity of 107 base glue of the present invention is 10000-20000mPa.S at 25 DEG C.
Catalyzer of the present invention is dioctyl tin cinnamic acid tin.
Thinner of the present invention is dimethyl silicone oil.
Chainextender of the present invention is methyl ethylene diethylamide base silane.
A LED preparation method for two component low modulus organosilicon sealant, is characterized in that: comprise following processing step:
A, take 107 base glue, the positive silicic acid propyl ester of linking agent, thermal silica and coupling agent KH-550; Under agitation above-mentioned raw materials is fully mixed; Moisture is removed and deaeration simultaneously under vacuum decompression; Cooling, discharging, to pack, obtain component A;
B, take catalyzer, thinner, chainextender; Under agitation above-mentioned component is fully mixed; Moisture is removed and deaeration simultaneously under vacuum decompression; Cooling, discharging, to pack, obtain B component.
During use, according to component A: the ratio of B component 10:2 mixes at room temperature or at a certain temperature solidifies.
The Advantageous Effects that the present invention brings:
The invention solves low modulus machine silicone sealant of the prior art and there is no two component product, and toughness is poor, is not suitable for the problem of LED.The present invention, by the choice and utilization to hydroxy-end capped dimethyl siloxane molecular weight and multiple chainextender, at other auxiliary agent of interpolation, has prepared the silicone potting material of a kind of pair of component low modulus, tool toughness, has been suitable for the encapsulation of LED.
Embodiment
embodiment 1
The two component low modulus organosilicon sealant of a kind of LED, comprises the following raw material according to weight parts:
Component A:
107 95 parts, base glue
The positive silicic acid propyl ester of linking agent 5 parts
Thermal silica 20 parts
Coupling agent KH-5502 part
B component:
Catalyzer 2.5 parts
Thinner 10 parts
Chainextender 5 parts.
embodiment 2
The two component low modulus organosilicon sealant of a kind of LED, comprises the following raw material according to weight parts:
Component A:
107 100 parts, base glue
The positive silicic acid propyl ester of linking agent 8 parts
Thermal silica 25 parts
Coupling agent KH-5509 part
B component:
Catalyzer 5.5 parts
Thinner 20 parts
Chainextender 25 parts.
embodiment 3
The two component low modulus organosilicon sealant of a kind of LED, comprises the following raw material according to weight parts:
Component A:
107 97.5 parts, base glue
The positive silicic acid propyl ester of linking agent 6.5 parts
Thermal silica 22.5 parts
Coupling agent KH-5505.5 part
B component:
Catalyzer 4 parts
Thinner 15 parts
Chainextender 15 parts.
embodiment 4
The two component low modulus organosilicon sealant of a kind of LED, comprises the following raw material according to weight parts:
Component A:
107 96 parts, base glue
The positive silicic acid propyl ester of linking agent 7 parts
Thermal silica 21 parts
Coupling agent KH-5508.5 part
B component:
Catalyzer 5 parts
Thinner 16 parts
Chainextender 21 parts.
embodiment 5
On the basis of embodiment 1-4:
Preferably, the viscosity of described 107 base glue is 10000mPa.S at 25 DEG C.
Preferably, described catalyzer is dioctyl tin cinnamic acid tin.
Preferably, described thinner is dimethyl silicone oil.
Preferably, described chainextender is methyl ethylene diethylamide base silane.
embodiment 6
On the basis of embodiment 1-4:
Preferably, the viscosity of described 107 base glue is 20000mPa.S at 25 DEG C.
Preferably, described catalyzer is dioctyl tin cinnamic acid tin.
Preferably, described thinner is dimethyl silicone oil.
Preferably, described chainextender is methyl ethylene diethylamide base silane.
embodiment 7
On the basis of embodiment 1-4:
Preferably, the viscosity of described 107 base glue is 15000mPa.S at 25 DEG C.
Preferably, described catalyzer is dioctyl tin cinnamic acid tin.
Preferably, described thinner is dimethyl silicone oil.
Preferably, described chainextender is methyl ethylene diethylamide base silane.
embodiment 8
On the basis of embodiment 1-4:
Preferably, the viscosity of described 107 base glue is 16000mPa.S at 25 DEG C.
Preferably, described catalyzer is dioctyl tin cinnamic acid tin.
Preferably, described thinner is dimethyl silicone oil.
Preferably, described chainextender is methyl ethylene diethylamide base silane.
embodiment 9
A LED preparation method for two component low modulus organosilicon sealant, comprises following processing step:
A, take 107 base glue, the positive silicic acid propyl ester of linking agent, thermal silica and coupling agent KH-550; Under agitation above-mentioned raw materials is fully mixed; Moisture is removed and deaeration simultaneously under vacuum decompression; Cooling, discharging, to pack, obtain component A;
B, take catalyzer, thinner, chainextender; Under agitation above-mentioned component is fully mixed; Moisture is removed and deaeration simultaneously under vacuum decompression; Cooling, discharging, to pack, obtain B component.
Claims (6)
1. the two component low modulus organosilicon sealant of LED, is characterized in that: comprise the following raw material according to weight parts:
Component A:
107 base glue 95-100 parts
Linking agent positive silicic acid propyl ester 5-8 part
Thermal silica 20-25 part
Coupling agent KH-5502-9 part
B component:
Catalyzer 2.5-5.5 part
Thinner 10-20 part
Chainextender 5-25 part.
2. the two component low modulus organosilicon sealant of a kind of LED according to claim 1, is characterized in that: the viscosity of described 107 base glue is 10000-20000mPa.S at 25 DEG C.
3. the two component low modulus organosilicon sealant of a kind of LED according to claim 1, is characterized in that: described catalyzer is dioctyl tin cinnamic acid tin.
4. the two component low modulus organosilicon sealant of a kind of LED according to claim 1, is characterized in that: described thinner is dimethyl silicone oil.
5. the two component low modulus organosilicon sealant of a kind of LED according to claim 1, is characterized in that: described chainextender is methyl ethylene diethylamide base silane.
6. a kind of LED according to claim 1 preparation method of two component low modulus organosilicon sealant, is characterized in that: comprise following processing step:
A, take 107 base glue, the positive silicic acid propyl ester of linking agent, thermal silica and coupling agent KH-550; Under agitation above-mentioned raw materials is fully mixed; Moisture is removed and deaeration simultaneously under vacuum decompression; Cooling, discharging, to pack, obtain component A;
B, take catalyzer, thinner, chainextender; Under agitation above-mentioned component is fully mixed; Moisture is removed and deaeration simultaneously under vacuum decompression; Cooling, discharging, to pack, obtain B component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510568571.XA CN105112003A (en) | 2015-09-09 | 2015-09-09 | Double-component low-modulus organosilicon sealant for LED (light-emitting diode) packaging and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510568571.XA CN105112003A (en) | 2015-09-09 | 2015-09-09 | Double-component low-modulus organosilicon sealant for LED (light-emitting diode) packaging and preparation method thereof |
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| CN105112003A true CN105112003A (en) | 2015-12-02 |
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| CN201510568571.XA Pending CN105112003A (en) | 2015-09-09 | 2015-09-09 | Double-component low-modulus organosilicon sealant for LED (light-emitting diode) packaging and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111057516A (en) * | 2019-12-05 | 2020-04-24 | 浙江福斯特新材料研究院有限公司 | High-temperature curable silicone structural sealant and application thereof |
| CN111704888A (en) * | 2020-05-15 | 2020-09-25 | 江门市金信恒科技有限公司 | Organic silicon binder resistant to long-term ultraviolet irradiation and preparation method thereof |
| CN113249057A (en) * | 2021-04-15 | 2021-08-13 | 镇江博慎新材料有限公司 | High-flash-point two-component dealcoholized organic silicon sealing material curing agent |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007314627A (en) * | 2006-05-24 | 2007-12-06 | Shin Etsu Chem Co Ltd | Room temperature-curable organopolysiloxane composition |
| CN101544831A (en) * | 2009-04-22 | 2009-09-30 | 武汉理工大学 | Double component room temperature vulcanization silicon rubber sealant material and preparation method thereof |
| CN104017536A (en) * | 2014-06-27 | 2014-09-03 | 上海回天新材料有限公司 | High-transparency high-deep-layer-curing-speed double-component condensed organic silicon potting adhesive |
| CN104531050A (en) * | 2014-12-26 | 2015-04-22 | 江苏天辰新材料有限公司 | Low-modulus high-elongation-percentage room-temperature-vulcanization silicon rubber and preparation method thereof |
-
2015
- 2015-09-09 CN CN201510568571.XA patent/CN105112003A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007314627A (en) * | 2006-05-24 | 2007-12-06 | Shin Etsu Chem Co Ltd | Room temperature-curable organopolysiloxane composition |
| CN101544831A (en) * | 2009-04-22 | 2009-09-30 | 武汉理工大学 | Double component room temperature vulcanization silicon rubber sealant material and preparation method thereof |
| CN104017536A (en) * | 2014-06-27 | 2014-09-03 | 上海回天新材料有限公司 | High-transparency high-deep-layer-curing-speed double-component condensed organic silicon potting adhesive |
| CN104531050A (en) * | 2014-12-26 | 2015-04-22 | 江苏天辰新材料有限公司 | Low-modulus high-elongation-percentage room-temperature-vulcanization silicon rubber and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111057516A (en) * | 2019-12-05 | 2020-04-24 | 浙江福斯特新材料研究院有限公司 | High-temperature curable silicone structural sealant and application thereof |
| CN111704888A (en) * | 2020-05-15 | 2020-09-25 | 江门市金信恒科技有限公司 | Organic silicon binder resistant to long-term ultraviolet irradiation and preparation method thereof |
| CN113249057A (en) * | 2021-04-15 | 2021-08-13 | 镇江博慎新材料有限公司 | High-flash-point two-component dealcoholized organic silicon sealing material curing agent |
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Application publication date: 20151202 |