CN105096785A - Array substrate mother board and manufacturing method thereof, display panel and mother board - Google Patents
Array substrate mother board and manufacturing method thereof, display panel and mother board Download PDFInfo
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- CN105096785A CN105096785A CN201510501980.8A CN201510501980A CN105096785A CN 105096785 A CN105096785 A CN 105096785A CN 201510501980 A CN201510501980 A CN 201510501980A CN 105096785 A CN105096785 A CN 105096785A
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Abstract
The invention provides an array substrate mother board and a manufacturing method thereof, a display panel and a mother board. The array substrate mother board comprises a plurality of display panel areas, and a transistor circuit is arranged in each display area; corresponding to any external detection signal, the array substrate mother board is provided with an input terminal, and the input terminal is connected with a connection terminal for receiving the external detection signal in the transistor circuit of each display panel area through at least one one-way conducting circuit; and the one-way conducting circuit is used for transmitting the external detection signal. The invention can solve the problem that normal detection cannot be implemented because all display panels on the display mother board simultaneously produce the same abnormal phenomenon due to failure in a display panel in the detection process of an array substrate.
Description
Technical field
The present invention relates to display technique field, be specifically related to a kind of array base palte motherboard and manufacture method, display panel and motherboard.
Background technology
In prior art, the display panel of small size (such as less than 18.5 inches) usually can on the larger-size substrate of same batch making, then form independent product from making the display master blank obtained by techniques such as cuttings.In manufacturing process, usually can carry out in a batch the electric circuit inspection of array base palte in display panel.Specifically, for the display master blank comprising several display panels, corresponding transmission line can be coordinated the detection signal from outside to be transferred to the input end of the detection signal of each display panel by total input port of the detection signal arranged on display master blank, thus the detection of all display panels can be completed by the loading of one-time detection signal, save a large amount of detection time.
But in above-mentioned testing process, the input end that all display panels correspond to same detection signal is all interconnected, therefore when in arbitrary display panel, generation can affect detection signal level bad, other display panels also can produce identical abnormal occurrence under the impact of this detection signal, and detection will be caused normally to carry out.In this case, the display panel of all generation abnormal occurrencies can only all be judged to, containing this badness, not only to cause the loss on product yield, go back the manpower and materials that extra consumption is a large amount of, have impact on the detection efficiency of whole testing process by prior art.
Summary of the invention
For defect of the prior art, the invention provides a kind of array base palte motherboard and manufacture method, display panel and motherboard, the bad meeting occurred in display panel in the testing process of array base palte can be solved and cause all display panels on display master blank to produce identical abnormal occurrence simultaneously and normally cannot carry out the problem that detects.
First aspect, the invention provides a kind of array base palte motherboard, comprises several display panel areas, be provided with transistor circuit in each viewing area; Corresponding to arbitrary external detection signal, described array base palte motherboard is provided with an input terminal, and this input terminal is connected for the terminals receiving this external detection signal with the transistor circuit in each display panel areas respectively through at least one one-way conduction circuit; Described one-way conduction circuit is for transmitting described external detection signal.
Alternatively, described one-way conduction circuit comprises at least one grid and is connected with source electrode or grid and the thin film transistor (TFT) that is connected of draining.
Alternatively, described thin film transistor (TFT) comprise gate metal layer, cover the first insulation course of described gate metal layer, be formed on described first insulation course described gate metal layer corresponding region in active layer and the source metal connected with described active layer respectively on described first insulation course and drain metal layer.
Alternatively, described thin film transistor (TFT) also comprises the second insulation course covered on described first insulation course, described active layer and described source metal and described drain metal layer, is formed with source electrode connection via hole and is connected via hole with drain electrode in described second insulation course.
Alternatively, described one-way conduction circuit comprises the first transistor and transistor seconds; The grid of described the first transistor is connected with the grid of described transistor seconds, the source electrode of described the first film transistor is connected with the source electrode of described second thin film transistor (TFT), the drain electrode of described the first film transistor is connected with the drain electrode of described second thin film transistor (TFT), and the source electrode of described the first film transistor is connected with the grid of described the first film transistor.
Alternatively, an one-way conduction circuit is provided with in each display panel areas.
Second aspect, present invention also offers a kind of display panel motherboard, comprises the first substrate and second substrate that are oppositely arranged, and described first substrate is any one array base palte motherboard above-mentioned.
The third aspect, present invention also offers a kind of display panel, it is characterized in that, this display panel is formed along the edge cuts of described display panel areas by any one display panel motherboard above-mentioned.
Fourth aspect, present invention also offers a kind of manufacture method of any one array base palte motherboard above-mentioned, comprising:
Form described transistor circuit;
Form described one-way conduction circuit;
Wherein, described transistor circuit and described one-way conduction circuit are formed simultaneously.
As shown from the above technical solution, the present invention arranges an one-way conduction circuit by the detection signal input position place at each display panel, can the internal circuit of display panel be avoided to affect the level of detection signal conversely while guarantee detection signal normal transmission, thus can solve the bad meeting occurred in display panel in the testing process of array base palte and cause all display panels on display master blank to produce identical abnormal occurrence simultaneously and normally cannot carry out the problem that detects.
Based on this, because the present invention can avoid the mutual interference in testing process on same display master blank between different display panel, therefore contribute to the raising of detection efficiency; Meanwhile, because the present invention can be realized by the circuit structure improved on array base palte motherboard, thus can be dissolved into simply in the middle of existing manufacture craft, there is very high practical value.
In instructions of the present invention, describe a large amount of detail.But can understand, embodiments of the invention can be put into practice when not having these details.In some instances, be not shown specifically known method, structure and technology, so that not fuzzy understanding of this description.
Similarly, be to be understood that, to disclose and to help to understand in each inventive aspect one or more to simplify the present invention, in the description above to exemplary embodiment of the present invention, each feature of the present invention is grouped together in single embodiment, figure or the description to it sometimes.But, the method for the disclosure should not explained the following intention in reflection: namely the present invention for required protection requires feature more more than the feature clearly recorded in each claim.Or rather, as the following claims reflect, all features of inventive aspect disclosed single embodiment before being to be less than.Therefore, the claims following embodiment are incorporated to this embodiment thus clearly, and wherein each claim itself is as independent embodiment of the present invention.
The present invention will be described instead of limit the invention to it should be noted above-described embodiment, and those skilled in the art can design alternative embodiment when not departing from the scope of claims.In the claims, any reference symbol between bracket should be configured to limitations on claims.Word " comprises " not to be got rid of existence and does not arrange element in the claims or step.Word "a" or "an" before being positioned at element is not got rid of and be there is multiple such element.The present invention can by means of including the hardware of some different elements and realizing by means of the computing machine of suitably programming.In the unit claim listing some devices, several in these devices can be carry out imbody by same hardware branch.Word first, second and third-class use do not represent any order.Can be title by these word explanations.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme, it all should be encompassed in the middle of the scope of claim of the present invention and instructions.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, simply introduce doing one to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the surface structure schematic diagram of a kind of array base palte motherboard in one embodiment of the invention;
Fig. 2 is the electrical block diagram of a kind of one-way conduction circuit in one embodiment of the invention;
Fig. 3 is the entity structure schematic diagram of a kind of one-way conduction circuit in one embodiment of the invention.
Embodiment
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Fig. 1 is the surface structure schematic diagram of a kind of array base palte motherboard in one embodiment of the invention.See Fig. 1, this array base palte motherboard comprises several display panel areas 11a, is provided with transistor circuit 12 in each viewing area 11a.It should be understood that this array base palte motherboard can comprise the base plate 11 being provided with several display panel areas 11a.Depending on the needs of embody rule scene, the display panel areas 11a on base plate 11 can be more than one any number, and in Fig. 1 specifically with 8 display panel areas 11a exemplarily.And in each display panel areas 11a of base plate 11, be all formed with above-mentioned transistor circuit 12.Be understandable that, transistor circuit 12 can comprise the part necessary circuitry structure for the formation of display, data line and sweep trace, several transistor devices be connected with sweep trace, the pixel electrode be connected with data line or the luminescent device of such as cross arrangement, and the scan drive circuit that is connected with sweep trace of the marginal position place in display panel areas 11a etc.Generally speaking, the structure of above-mentioned transistor circuit 12 can be arranged with reference to the circuit structure on array base palte in existing display panel (Array substrate), and the present invention does not limit this.
Be understandable that, no matter which kind of circuit structure is transistor circuit 12 have, in actual fabrication process, always inevitably there is the circuit defect such as short circuit or open circuit, thus need to add electrical testing to confirm that transistor circuit 12 can normally work to it before product export.Such as, after utilizing array base palte motherboard formation display panel motherboard, can some roads external detection signal be inputed in transistor circuit 12, and make each display panel areas all show default picture by the testing circuit be set in advance in transistor circuit 12 with coordinating of external detection signal, thus by confirming whether transistor circuit 12 can normally work with the comparison of standard picture.
In the embodiment of the present invention, detect with identical external detection signal with the transistor circuit 12 in display panel areas 11a all on array basal plate motherboard all simultaneously.See Fig. 1, corresponding to arbitrary external detection signal, above-mentioned array base palte motherboard is equipped with an input terminal 13 () in Fig. 1 only with an input terminal exemplarily, and this input terminal 13 is connected for the terminals receiving this external detection signal with the transistor circuit 12 in each display panel areas 11a respectively through at least one one-way conduction circuit 14.Wherein, above-mentioned one-way conduction circuit 14 is for said external detection signal.Particularly, the unidirectional current that arbitrary above-mentioned one-way conduction circuit 14 can flow to corresponding above-mentioned transistor circuit 12 by generation by input terminal 13 carrys out transmit outer detection signal.
It should be understood that, according to concrete detection needs, the quantity of input terminal 13 can be arranged arbitrarily, when having more than one input terminal 13, array base palte motherboard also can comprise several one-way conduction circuits 14 that set-up mode is identical with Fig. 1.For example, when the quantity of input terminal 13 is 5, and when in array base palte motherboard, the quantity of display panel areas 11a is 8, the total quantity of one-way conduction circuit 14 is then 40, and wherein any one one-way conduction circuit 14 is all connected between an input terminal 13 and the terminals of a transistor circuit 12.
It is also to be understood that, the unidirectional current that above-mentioned one-way conduction circuit 14 can flow to arbitrary above-mentioned transistor circuit 12 by generation by input terminal 13 transmits said external detection signal, thus can hinder the generation of inverse current, avoid the level of the defect of transistor circuit 12 to outside detection signal to impact.It should be noted that, for realizing above-mentioned functions, one-way conduction circuit 14 can comprise diode or have the electron device with diode identical characteristics, and the present invention does not limit this.
Can find out, the embodiment of the present invention can solve the bad meeting occurred in display panel in the testing process of array base palte and causes all display panels on display master blank to produce identical abnormal occurrence simultaneously and normally cannot carry out the problem that detects.Based on this, because the embodiment of the present invention can avoid the mutual interference in testing process on same display master blank between different display panel, therefore contribute to the raising of detection efficiency; Meanwhile, because the embodiment of the present invention can be realized by the circuit structure improved on array base palte motherboard, thus can be dissolved into simply in the middle of existing manufacture craft, there is very high practical value.
It should be noted that, one-way conduction circuit 14 in Fig. 1 has been arranged within above-mentioned display panel areas 11a, thus can be formed as the circuit structure in display panel areas 11a and above-mentioned transistor circuit 12 simultaneously, simplify manufacture craft, the array base palte that the cutting of each block still can also be made after array base palte motherboard is cut to be formed all possesses corresponding function.But one-way conduction circuit 14 also can be arranged on outside display panel areas 11a or be arranged on the edge of display panel areas 11a, or arranges separately, and the present invention does not limit this.
Also it should be noted that, polylith above-mentioned array base palte motherboard can comprise same base plate 11, and that is polylith array base palte motherboard can make formation on same base plate, then carries out electric circuit inspection independently at the every array basal plate motherboard of detection-phase.Especially, the above-mentioned array base palte motherboard in the embodiment of the present invention can be specially a standard test panel (Q-panel).
Further, described one-way conduction circuit comprises at least one grid and is connected with source electrode or grid and the thin film transistor (TFT) that is connected of draining.
As a kind of example, Fig. 2 is the electrical block diagram of a kind of one-way conduction circuit in one embodiment of the invention.See Fig. 2, this one-way conduction circuit 14 comprises the first transistor T1 and transistor seconds T2.In Fig. 2, the grid of the first transistor T1 is connected with the grid of described transistor seconds T2, the source electrode of described the first film transistor T1 is connected with the source electrode of described second thin film transistor (TFT) T2, the drain electrode of described the first film transistor T1 is connected with the drain electrode of described second thin film transistor (TFT) T2, and connect above-mentioned transistor circuit 12, the source electrode of described the first film transistor T1 is connected with the grid of described the first film transistor T1, and connects above-mentioned input terminal 13.It should be noted that, the first transistor T1 and transistor seconds T2 can be any one triode of such as thin film transistor (TFT), can select in the manner described above depending on the different source electrode of concrete kind and the connected mode of drain electrode; Especially, when the source electrode of device and drain electrode are structurally symmetrical, the source electrode of device can exchange mutually with drain electrode.
Based on foregoing circuit structure, when input terminal 13 receives the external detection signal with higher level, T1 and T2 all can be in opening, can realize the transmission of said external detection signal by generating the electric current flowing to transistor circuit 12 by input terminal 13.
But in the prior art, when the inside of the transistor circuit 12 of a certain display panel areas occurs that short circuit or open circuit etc. are bad, such as, in transistor circuit 12 for transmit the first external detection signal S1 circuit and for transmit the first external detection signal S2 circuit between be short-circuited time, the S1 wherein with higher level can may be had more low level S2 and dragged down.Specifically, external detection signal now in whole array base palte motherboard received by all display panel areas all can lower than normal level, cause the transistor circuit 12 in all display panel areas all detect abnormal and the transistor circuit 12 of short circuit occurred inside cannot be found, thus normally cannot carry out electric circuit inspection.
And in embodiments of the present invention, if there is the short circuit between above-mentioned S1 and S2 in a certain transistor circuit 12, in the one-way conduction circuit 14 be then connected with the transistor circuit 12 of short circuit occurred inside in the transmission channel of S2, T1 and T2 can hinder the electric current flowing to 13 from 12, therefore 12 place's current potentials can be kept higher and state that 13 place's current potentials are lower, avoid the transistor circuit 12 of short circuit occurred inside to affect being transferred to the level of other S2 received by transistor circuit 12.Meanwhile, can under the connection of outside detection signal, keep current potential substantially constant with the S1 of S2 short circuit, the level being transferred to other S1 received by transistor circuit 12 can not be affected equally.
Be understandable that, triode grid and source electrode with drain in one be connected time there is the characteristic similar with diode, therefore may be used for forming above-mentioned one-way conduction circuit 14.Similarly, the one way conducting device with first end and the second end may be used for forming above-mentioned one-way conduction circuit 14 equally.In addition, except the form of two one way conducting device composition one-way conduction circuits 14 parallel with one another, single one way conducting device can realize its function too, but the quantity of one way conducting device parallel with one another is more, the equivalent resistance of one-way conduction circuit 14 between input terminal 13 and transistor circuit 12 is less, is more conducive to the transmission of said external detection signal between input terminal 13 and transistor circuit 12.
Corresponding to the circuit structure shown in Fig. 2, Fig. 3 is the entity structure schematic diagram of a kind of one-way conduction circuit in one embodiment of the invention.See Fig. 3, the grid of above-mentioned the first transistor and transistor seconds is formed by same gate metal layer T1g/T2g, and the source electrode of above-mentioned the first transistor and transistor seconds is formed by same source metal T1s/T2s.Certainly, in other embodiments that source electrode is different from drain electrode set-up mode, the drain electrode of above-mentioned the first transistor and transistor seconds also can be formed by same drain metal layer.In addition, the active layer T1a of the first transistor T1 is formed in the corresponding region of gate metal layer T1g/T2g, and contacts at diverse location place with the drain metal layer T1d of the first transistor T1 with above-mentioned source metal T1s/T2s respectively; The active layer T2a of transistor seconds T2 is also formed in the corresponding region of gate metal layer T1g/T2g, and contacts at diverse location place with the drain metal layer T2d of transistor seconds T2 with above-mentioned source metal T1s/T2s respectively.Can find out, the electrode be connected between thin film transistor (TFT) can form to save design space, reduce costs by same metal level.
Unshownedly in figure 3 be, above-mentioned one-way conduction circuit 14 also comprises the first insulation course covering above-mentioned gate metal layer T1g/T2g, and covers the second insulation course on above-mentioned first insulation course, above-mentioned active layer T1a, T2a and above-mentioned source metal T1s/T2s and above-mentioned drain metal layer T1d, T2d.In order to form electrical connection, source electrode connection via hole can be formed in above-mentioned second insulation course and be connected via hole with drain electrode.Connect via hole 14a for the source electrode in Fig. 3, above-mentioned transistor circuit 12 can connect via hole 14a by the unshowned metal level of Fig. 3 through source electrode for the terminals 12a receiving external detection signal and be connected with above-mentioned source metal T1s/T2s.Be understandable that, under concrete application scenarios, the electrical connection that the setting of via hole and other structures are formed between Rotating fields through via hole is well-known to those skilled in the art, does not repeat them here.
Based on any one array base palte motherboard above-mentioned, the embodiment of the present invention provides a kind of manufacture method of array base palte motherboard.On the basis of the manufacturing process of existing array base palte motherboard, this method can comprise unshowned following step in accompanying drawing:
Step 401: form described transistor circuit;
Step 402: form described one-way conduction circuit;
Wherein, described transistor circuit and described one-way conduction circuit are formed simultaneously.
For example, while said method can form described transistor circuit on described base plate, several one-way conduction circuits described in corresponding with each external input signal with the formation of same manufacture craft.Be understandable that, above-mentioned transistor circuit 12 needs when being formed to form each Rotating fields with Patternized technique.Based on this, the embodiment of the present invention can while forming above-mentioned transistor circuit 12 with Patternized technique, several one-way conduction circuits 14 described in corresponding with each external input signal with the formation of same manufacture craft.For example, gate metal layer T1g/T2g shown in Fig. 3 can gate metal in transistor circuit 12 to be formed with Patternized technique (such as adopting the mode depositing photoetching and wet etching), be equivalent to add the figure corresponding with above-mentioned gate metal layer T1g/T2g in original gate metallic pattern.For another example, above-mentioned first insulation course can cover the gate insulation layer formation of whole by depositing operation, and also forms above-mentioned active layer T1a and active layer T2a with same process when forming the active layer pattern in transistor circuit 12 with dry etching simultaneously.Similarly, with deposition. above-mentioned source metal T1s/T2s and above-mentioned drain metal layer T1d, T2d can be formed with same process when photoetching and wet etching form the source and drain metal pattern in transistor circuit 12 simultaneously; When forming the passivation layer in transistor circuit 12 with chemical vapor deposition, also in the region of above-mentioned one-way conduction circuit 14, also passivation layer can be formed, and as above-mentioned second insulation course; When forming the via hole in transistor circuit 12 with photoetching and dry etching, the via hole of above-mentioned one-way conduction circuit 14 also can be formed by same process.
Can find out, any one the structure of array base palte motherboard above-mentioned can be realized by the circuit structure improved on existing array base palte motherboard, and can be dissolved into simply in the middle of existing manufacture craft, has very high practical value.
Based on same inventive concept, the embodiment of the present invention provides a kind of display panel motherboard, comprises the first substrate and second substrate that are oppositely arranged, and above-mentioned first substrate is any one array base palte motherboard above-mentioned.Such as, based in the display panel motherboard of liquid crystal display, above-mentioned first substrate can be specially the array base palte (Array substrate) being formed with pixel electrode array, and above-mentioned second substrate can be specially color membrane substrates (CF substrate).For another example, based on OLED (OrganicLight-EmittingDiode, Organic Light Emitting Diode) in the display panel motherboard that shows, above-mentioned first substrate can be specially the array base palte (Array substrate) being formed with pixel circuit array, and above-mentioned second substrate can be specially the substrate being formed with organic luminous layer and metal cathode layer.Similarly, the embodiment of the present invention can solve the bad meeting occurred in display panel in the testing process of array base palte and causes all display panels on display master blank to produce identical abnormal occurrence simultaneously and normally cannot carry out the problem that detects, and contributes to the raising of detection efficiency.
Based on same inventive concept, the embodiment of the present invention provides a kind of display panel, and this display panel is formed along the edge cuts of above-mentioned display panel areas by any one display panel motherboard above-mentioned.Similarly, the embodiment of the present invention can solve the bad meeting occurred in display panel in the testing process of array base palte and causes all display panels on display master blank to produce identical abnormal occurrence simultaneously and normally cannot carry out the problem that detects, and contributes to the raising of detection efficiency.
It should be noted that in describing the invention, term " on ", the orientation of the instruction such as D score or position relationship be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.Unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
Claims (9)
1. an array base palte motherboard, is characterized in that, comprises several display panel areas, is provided with transistor circuit in each viewing area; Corresponding to arbitrary external detection signal, described array base palte motherboard is provided with an input terminal, and this input terminal is connected for the terminals receiving this external detection signal with the transistor circuit in each display panel areas respectively through at least one one-way conduction circuit; Described one-way conduction circuit is for transmitting described external detection signal.
2. array base palte motherboard according to claim 1, is characterized in that, described one-way conduction circuit comprises at least one grid and is connected with source electrode or grid and the thin film transistor (TFT) that is connected of draining.
3. array base palte motherboard according to claim 2, active layer in the described gate metal layer corresponding region it is characterized in that, described thin film transistor (TFT) comprises gate metal layer, cover the first insulation course of described gate metal layer, being formed on described first insulation course and the source metal connected with described active layer respectively on described first insulation course and drain metal layer.
4. array base palte motherboard according to claim 3, it is characterized in that, described thin film transistor (TFT) also comprises the second insulation course covered on described first insulation course, described active layer and described source metal and described drain metal layer, is formed with source electrode connection via hole and is connected via hole with drain electrode in described second insulation course.
5. array base palte motherboard according to claim 1, is characterized in that, described one-way conduction circuit comprises the first transistor and transistor seconds; The grid of described the first transistor is connected with the grid of described transistor seconds, the source electrode of described the first film transistor is connected with the source electrode of described second thin film transistor (TFT), the drain electrode of described the first film transistor is connected with the drain electrode of described second thin film transistor (TFT), and the source electrode of described the first film transistor is connected with the grid of described the first film transistor.
6. array base palte motherboard as claimed in any of claims 1 to 5, is characterized in that, is provided with an one-way conduction circuit in each display panel areas.
7. a display panel motherboard, comprises the first substrate and second substrate that are oppositely arranged, it is characterized in that, described first substrate is the array base palte motherboard in claim 1 to 6 described in any one.
8. a display panel, is characterized in that, this display panel is formed by the edge cuts of display panel motherboard as claimed in claim 8 along described display panel areas.
9., as a manufacture method for the array base palte motherboard in claim 1 to 6 as described in any one, it is characterized in that, comprising:
Form described transistor circuit;
Form described one-way conduction circuit;
Wherein, described transistor circuit and described one-way conduction circuit are formed simultaneously.
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| CN201510501980.8A CN105096785B (en) | 2015-08-14 | 2015-08-14 | Array substrate mother board and manufacturing method thereof, display panel and mother board |
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| CN105632958B (en) * | 2015-12-31 | 2019-01-04 | 京东方科技集团股份有限公司 | Array substrate motherboard, array substrate and preparation method thereof and display device |
| CN110880300A (en) * | 2018-09-06 | 2020-03-13 | 上海和辉光电有限公司 | Display mother board, display panel and preparation method of display panel |
| CN110880300B (en) * | 2018-09-06 | 2021-03-05 | 上海和辉光电股份有限公司 | Display mother board, display panel and preparation method of display panel |
| US11532684B2 (en) | 2018-09-06 | 2022-12-20 | Everdisplay Optronics (Shanghai) Co., Ltd | Display motherboard, display panel, and fabricating method of display panel |
| CN110930909A (en) * | 2019-11-27 | 2020-03-27 | 深圳市华星光电半导体显示技术有限公司 | Display panel mother board, manufacturing method thereof and display panel |
| CN110930909B (en) * | 2019-11-27 | 2023-10-17 | 深圳市华星光电半导体显示技术有限公司 | Display panel mother board, manufacturing method thereof and display panel |
| WO2023216342A1 (en) * | 2022-05-13 | 2023-11-16 | 武汉华星光电半导体显示技术有限公司 | Display panel motherboard, test method for display panel motherboard, and display panel |
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