CN105094449B

CN105094449B - A kind of pressure-sensing input module

Info

Publication number: CN105094449B
Application number: CN201510555223.9A
Authority: CN
Inventors: 李裕文; 蒋承忠; 陈风
Original assignee: 宸鸿科技(厦门)有限公司
Priority date: 2015-09-01
Filing date: 2015-09-01
Publication date: 2018-09-28
Also published as: CN105094449A

Abstract

The present invention provides a kind of pressure-sensing input module, it includes the first pressure sensitivity unit and the second pressure sensitivity unit that lower surface on the substrate is arranged, the first pressure sensitivity unit is arranged in a one-to-one correspondence with the second pressure sensitivity unit and material identical, at least one first pressure sensitivity unit and the second pressure sensitivity unit of corresponding setting, Wheatstone bridge is constituted with two reference resistances of peripheral hardware, by adjusting the Young's modulus and thickness of substrate and laminating layer, and it is equipped with the adjustment of the pattern form and its arrangement mode of the first pressure sensitivity unit and the second pressure sensitivity unit, to obtain to temperature-insensitive and have the pressure-sensing input module of elevated pressures sensing sensitivity.

Description

A kind of pressure-sensing input module

【Technical field】

The present invention relates to pressure sensing arts more particularly to a kind of pressure-sensing input modules.

【Background technology】

As touch-control input technology is constantly updated in recent years, plane touch panel has become the preferred production of input equipment Product.In the recent period, a kind of pressure-sensing device bringing completely new touch experience has caused one upsurge in touch input equipment field, The change in resistance size of pressure sensing cells after this pressure-sensing device can be pressed by detecting, and judge pressing dynamics Size can be applied individually to any only the touch input equipment field for needing detecting pressure size, can also be with conventional planar touch-control Panel in conjunction with and take into account two-dimensional coordinate and the three-dimensional detection for pressing dynamics.

But due to the limitation of pressure-sensing electrode material, inevitably by finger temperature shadow in existing material It rings, generates the variation of certain resistance value, and the change in resistance caused by temperature change greatly affected to pressing dynamics size Detection, or even there is likely to be the change in resistance generated by temperature to be much larger than the change in resistance that is generated by pressing dynamics size Amount, and cause the detection of pressure change in resistance not accurate or even can not detect.

【Invention content】

A kind of pressure-sensing input module with temperature compensation function is provided in the present invention.

In order to solve the above technical problems, the present invention provides technical solution：A kind of pressure-sensing input module, passes through fitting Layer it is Nian Jie with each module comprising a substrate and be separately positioned on one first pressure sensitivity layer of the substrate upper and lower surface, one second press Feel layer, the first pressure sensitivity layer includes at least one first pressure sensitivity unit, and the second pressure sensitivity layer includes at least one second pressure Feel unit, the first pressure sensitivity unit is arranged in a one-to-one correspondence with the second pressure sensitivity unit and material identical, at least one first pressure The the second pressure sensitivity unit for feeling the corresponding setting of unit constitutes the two of which resistance of Wheatstone bridge, is used to detect a pressing Strength, while compensating pressure-sensing input module resistance change caused by temperature；Wherein, the laminating layer It is arranged between the first pressure sensitivity layer, the second pressure sensitivity layer and other modules, the thickness of the laminating layer is 25-125 μm, described The thickness of substrate is 50-450 μm.

Preferably, the pressure-sensing input module further comprises the first reference resistance and the second reference resistance, with institute It states at least one first pressure sensitivity unit and the second pressure sensitivity unit being correspondingly arranged constitutes Wheatstone bridge.

Preferably, the mode for constituting Wheatstone bridge is the first pressure sensitivity unit and the first reference resistance string Connection, the second pressure sensitivity unit being correspondingly arranged are connected with second reference resistance.

Preferably, the mode for constituting Wheatstone bridge is the first pressure sensitivity unit and second be correspondingly arranged Pressure sensitivity unit is connected, and first reference resistance is connected with second reference resistance.

Preferably, the first pressure sensitivity cell array is set to the upper surface of base plate, the second pressure sensitivity unit and institute It states the first pressure sensitivity unit and is correspondingly arranged in the base lower surface, then the pressure-sensing input module can detect three-dimensional letter simultaneously Number.

Preferably, the first pressure sensitivity unit and the second pressure sensitivity unit by a pressure drag material in the form of a conducting wire It bends.

Preferably, the shape of the first pressure sensitivity unit and the second pressure sensitivity unit is non-rotational symmetry figure.

Preferably, the design of the first pressure sensitivity unit and/or the second pressure sensitivity unit is leading towards a direction Line total length is maximum, and the direction is the directions a of the first pressure sensitivity unit and/or the second pressure sensitivity unit, first pressure The conducting wire total length of the pattern of sense unit and the second pressure sensitivity unit towards a direction is minimum, and the direction is the directions b, wherein institute It is vertical with the directions b to state the directions a.

Preferably, the pattern form of the first pressure sensitivity unit and the second pressure sensitivity unit includes oval around linear, folding Threadiness, curve-like, isometric multi-stage series are linear, Length discrepancy multi-stage series are linear or the one of which or its group of Back Word molded line shape It closes.

Preferably, the shape of the first pressure sensitivity unit and the second pressure sensitivity unit being correspondingly arranged differs.

Compared with prior art, pressure-sensing input module or pressure-sensing input unit provided by the present invention at least have Have the advantages that as follows：

1, the present invention provides a kind of pressure-sensing input modules with temperature compensation function comprising is arranged in substrate The the first pressure sensitivity unit and the second pressure sensitivity unit of upper and lower surface, the first pressure sensitivity unit and the second pressure sensitivity unit is correspondingly arranged and material It is identical, the second pressure sensitivity unit of at least one first pressure sensitivity unit and corresponding setting, two reference resistance (resistance with peripheral hardware Ra and resistance Rb) constitute Wheatstone bridge.

Pressing force value is detected using Wheatstone bridge in the present invention, circuit structure is simple, and control accuracy is high.By In the material identical for constituting the first pressure sensitivity unit and the second pressure sensitivity unit, therefore, the first pressure sensitivity unit and the second pressure sensitivity unit Since the variation of resistance value caused by temperature change meets (RF0+ Δ RF0)/(RC0+ Δ RC0)=RF0/RC0, it is seen then that by It is same material in the first pressure sensitivity unit and the second pressure sensitivity unit and collectively forms Wheatstone bridge, in the measurement process of resistance value In, the resistance value influences of temperature pair the first pressure sensitivity unit and the second pressure sensitivity unit can be ignored, therefore pressure provided by the present invention The resistance change caused by temperature can be fully compensated in power sensing input module.

2, in pressure-sensing input unit provided by the present invention, Young's modulus, the thickness effect pressure of substrate and laminating layer The neutral surface of power sensing input device is disposed on the substrate the first pressure sensitivity list of bottom major surface when neutral surface is located in substrate Strain differential between member and the second pressure sensitivity unit can reach maximum value.Therefore, the Young's modulus of substrate is set greater than patch Under the premise of at least one order of magnitude of Young's modulus for closing layer：(1) Young's modulus of laminating layer is controlled to the range in 0-3000MPa Inside be conducive to increase above-mentioned strain differential Δ ε；(2) when by the thickness limit of laminating layer in 25-125 μ ms, strain differential Δ ε will It is in increase tendency with the reduction of the thickness of laminating layer；(3) when by the thickness limit of substrate in 50-450 μ ms, strain Poor Δ ε will be in increase tendency with the increase of substrate thickness.Therefore, by adjusting the substrate and patch of pressure-sensing input unit Close the Young's modulus and its thickness of layer, you can the strain difference for increasing the pressure sensitivity unit of substrate upper and lower surface, to keep pressure big Small detection is more accurate, and pressing dynamics detection is sensitiveer.

3, in pressure-sensing input module provided by the present invention, the first pressure sensitivity unit and the second pressure sensitivity unit are with length Axis direction and short-axis direction, and the bus length of long axis direction is more than the design of total line length of short-axis direction.In the present invention Also further to the pattern form of the first pressure sensitivity unit and the second pressure sensitivity unit include it is oval around threadiness, polyline shaped, curve-like, etc. One kind of shapes such as long multi-stage series threadiness, Length discrepancy multi-stage series threadiness, Back Word molded line shape or combinations thereof.When finger presses When (point pressing) causes the first pressure sensitivity unit or the second pressure sensitivity unit to generate deformation, the first pressure sensitivity unit or the second pressure sensitivity unit by Total length in the directions a is different from the total length in the directions b, and the directions a and the strain in the directions b are also different, therefore can effectively increase Big resistance change effect further makes the first pressure sensitivity layer or the second pressure sensitivity layer more precisely sensitiveer to the response of pressure.

4, in pressure-sensing input module provided by the present invention, in order to reach the strain of above-mentioned first pressure sensitivity unit and the Difference between the strain of two pressure sensitivity units can reach higher value, to improve the pressure detection spirit of pressure-sensing input module Sensitivity can also be by adjusting the first pressure sensitivity except through the first pressure sensitivity unit of adjustment and the pattern form of the second pressure sensitivity unit The arrangement mode of unit and the second pressure sensitivity unit, to increase or reduce the strain of the first pressure sensitivity unit and the second pressure sensitivity unit Amount.Wherein, when the strain of the first pressure sensitivity unit and the second pressure sensitivity unit be one it is positive one it is negative when, the angle model of angle а 1 and angle a2 It is 0 ° -45 ° to enclose, and when strain is all negative strain, angle a1 is 0 ° -45 °, and angle a2 is 45 ° -90 °, or when strain is all just When strain, angle a1 is 45 ° -90 °, and angle a2 is 0 ° -45 °.In addition, in order to make the first pressure sensitivity unit and the second pressure sensitivity unit Between strain differential Δ ε it is larger, can also be carried out by the pattern form relationship to the first pressure sensitivity unit and the second pressure sensitivity unit It limits.The limitation of above-mentioned condition can all make the strain variation value of the first pressure sensitivity unit and the second pressure sensitivity unit maximum.First pressure sensitivity Unit is more than in the dependent variable towards on the directions a towards the dependent variable on the directions b, in this way, being conducive to after depressed active force Strain caused by the pressing force being applied on the first pressure sensitivity unit and the second pressure sensitivity unit can concentrate upper body in one direction It is existing, it, can be with when the direction that this strain is concentrated is consistent due to the maximum strain direction for pressing active force and generating with the region Make the strain differential Δ ε of the first pressure sensitivity unit and the second pressure sensitivity unit more, to more accurately embody the size of pressing dynamics, carry The sensitivity of high pressure force detection.

5, it is sensed using resistive pressure in pressure-sensing input module in the present invention, passes through the shape inside pressure sensitivity unit Shape change causes corresponding change in resistance, to judge press points according to the size of the position of change in resistance generation and variable quantity Position and pressing strength size had not only carried out position detection (planar) using same pressure sensitivity unit but also had carried out strength detection (the Three dimensionality) calculating, realize three dimensionality while detect.

【Description of the drawings】

Figure 1A is the layer structure schematic diagram in first embodiment of the invention pressure-sensing input module.

Figure 1B is that pressure signal detects schematic diagram in Figure 1A.

Fig. 1 C are another pressure signal detecting schematic diagrams in Figure 1A.

Fig. 2A is the layer structure schematic diagram of second embodiment of the invention pressure-sensing input module.

Fig. 2 B are the structural schematic diagrams deformed after the depressed power of pressure-sensing input module shown in Fig. 2A.

Fig. 2 C are the trend graphs of each ply strain amount after the depressed power of pressure-sensing input module shown in Fig. 2 B.

Fig. 3 A are the strain differential and laminating layer of the first pressure sensitivity unit and the second pressure sensitivity unit in second embodiment of the invention The relation schematic diagram of Young's modulus.

Fig. 3 B are the strain differential and laminating layer of the first pressure sensitivity unit and the second pressure sensitivity unit in second embodiment of the invention Another relation schematic diagram of Young's modulus.

Fig. 3 C are the strain differential and laminating layer of the first pressure sensitivity unit and the second pressure sensitivity unit in second embodiment of the invention The relation schematic diagram of thickness.

Fig. 3 D are the thickness of the strain differential and substrate of the first pressure sensitivity unit and the second pressure sensitivity unit in second embodiment of the invention The relation schematic diagram of degree.

Fig. 4 is the planar structure schematic diagram of the first pressure sensitivity layer of fourth embodiment of the invention pressure-sensing input module.

Fig. 5 A are the first pressure sensitivity layer of fourth embodiment of the invention pressure-sensing input module and its plane of pressing area Schematic diagram.

Fig. 5 B-5E are the schematic illustration of strain of pressing area at A-D in Fig. 5 A.

Fig. 6 A are the planar structure schematic diagrams of single first pressure sensitivity unit in Fig. 4.

Fig. 6 B are the directions a and the length in the directions b and the schematic diagram of long axis direction of the first pressure sensitivity unit in Fig. 6 A.

Fig. 6 C-6G are the variant embodiment structural schematic diagrams of single first pressure sensitivity unit in Fig. 4.

Fig. 7 A are the first pressure sensitivity layer in fifth embodiment of the invention pressure-sensing input module, substrate, the second pressure sensitivity layer Cross-sectional view.

Fig. 7 B are strain-thickness relationship figures of structure shown in Fig. 7 A.

Fig. 8 A are the long axis direction schematic diagrames of the first pressure sensitivity unit of pressure-sensing input module shown in Fig. 6 A.

Fig. 8 B are the long axis direction schematic diagrames for the second pressure sensitivity unit being correspondingly arranged with the first pressure sensitivity unit shown in Fig. 8 A.

【Specific implementation mode】

In order to make the purpose of the present invention, technical solution and advantage be more clearly understood, below in conjunction with attached drawing and embodiment, The present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, It is not intended to limit the present invention.

A is please referred to Fig.1, a pressure-sensing input module 10 is provided in first embodiment of the invention comprising a substrate 11 And it is located at about 11 substrate (in the present invention, upper and lower position word is only used for limiting the relative position in given view) surface First pressure sensitivity layer 12 and the second pressure sensitivity layer 13.At least one first pressure sensitivity unit 121, the second pressure are provided on first pressure sensitivity layer 12 At least one second pressure sensitivity unit 131 is provided on sense layer 13, at least one first pressure sensitivity unit 121 is pressed at least one second Sense unit 131 is to be arranged in a one-to-one correspondence, wherein the one-to-one correspondence in the present invention refers to each first pressure sensitivity unit 121 and each second Pressure sensitivity unit 131 quantity of lower surface and the one-to-one correspondence on distributing position on the substrate 11, and each first pressure sensitivity unit 121 and The pattern form of each second pressure sensitivity unit 131 is then unrestricted.When substrate 11 is depressed, at the press points it is corresponding at least One the first pressure sensitivity unit 121 will be under pressure at least one second pressure sensitivity unit 131.

First pressure sensitivity unit 121 and the second pressure sensitivity unit 131 cause the strains such as deformation, deflection or shearing because being pressed Property reaction, change so as to cause at least one electrical property, particularly, when the first pressure sensitivity unit 121 and the second pressure sensitivity unit 131 are bent by a pressure drag material in the form of a conducting wire, and the first pressure sensitivity unit 121 of corresponding region is caused after pressing It changes with the conductor length of the second pressure sensitivity unit 131, and then influences the first pressure sensitivity unit 121 and the second pressure sensitivity unit 131 Resistance value.

The material of first pressure sensitivity unit 121 and the second pressure sensitivity unit 131 includes such as silver, copper, aluminium, gold metal and its conjunction Gold or tin indium oxide (Indium Tin Oxide, ITO), tin-antiomony oxide (Antimony Doped Tin Oxid e, ATO), The metalloids oxygen such as indium zinc oxide (Indium Zinc Oxide, IZO), zinc oxide aluminum (Aluminum Zinc Oxide, AZO) It is one or more in compound or graphene, metal grill, nano-silver thread or carbon nanotube etc..

Substrate 11 may include but be not only restricted to：Rigid substrates, such as glass, strengthened glass, sapphire glass etc.；Can also be Flexible base board, such as PEEK (polyetheretherketone, polyether-ether-ketone), PI (Polyimide, polyimides), PET (polycarbonate, makrolon are poly- by (polyethylene terephthalate, polyethylene terephthalate), PC Carbonic ester), PES (polyethylene glycol succinate, polyethylene glycol succinate), PMMA (polymethylmethacrylate, polymethyl methacrylate), PVC (Polyvinyl chloride, polyvinyl chloride), PP The materials such as (Polypropylene, polypropylene) and its compound of arbitrary the two.

Each first pressure sensitivity unit, 121 corresponding internal resistance in the pressure-sensing input module 10 that first embodiment of the invention provides For RF0, RF1, RF2RFn, when receiving pressing force, the internal resistance RF0 corresponding to each first pressure sensitivity unit 121, RF1, RF2RFn resistance value can change；Each second pressure sensitivity unit 131 is right in pressure-sensing input module 10 The internal resistance answered is RC0, RC1, RC2RCn, and respectively with RF0, RF1, RF2RFn mono- are a pair of It should be arranged in 11 both sides of substrate, when receiving pressing force, internal resistance RC0, RC1 corresponding to each second pressure sensitivity unit 131, RC2RCn resistance values can also change.Wherein, each first pressure sensitivity unit 121 and each second pressure sensitivity unit 131 It is arranged in a one-to-one correspondence and is expressed as the quantity of lower surface and the one-to-one correspondence on distributing position on the substrate 11, and each first pressure sensitivity list The pattern form of member 121 and each second pressure sensitivity unit 131 is then unrestricted.

In the present invention, the both ends of 121 conducting wire of the first pressure sensitivity unit be respectively and electrically connected to a signal processing center (figure not Show), the both ends of 131 conducting wire of the second pressure sensitivity unit are respectively and electrically connected to identical signal processing center (not shown), the signal Processing center further comprises the first reference resistance Ra, the second reference resistance Rb and a multiplexer.Pass through multiplexer Control, sequentially make each first pressure sensitivity unit, 121 resistance RFn (wherein, n=0,1,2 ... n), the second pressure of setting of being corresponding to it Feeling cell resistance 131RCn, (wherein, n=0,1,2 ... n) constitutes Wheatstone bridge with resistance Ra, resistance Rb.

As shown in Figure 1B and Fig. 1 C, the connection of resistance RFn, resistance RCn, the first reference resistance Ra, the second reference resistance Rb Mode can there are two types of.As shown in Figure 1B, one end of resistance RFn is electrically connected at a power positive end VEX+, the other end and One reference resistance Ra series connection；One end of resistance RCn is electrically connected at same power positive end VEX+, the other end and the second reference Resistance Rb series connection；First reference resistance Ra, the second reference resistance Rb other ends are electrically connected at power cathode end VEX- and (or connect Ground), a potentiometer is used to measure the potential difference signal U0 of resistance RFn, resistance RCn.Or as shown in Figure 1 C, one end of resistance RFn It is electrically connected at a power positive end VEX+, the other end is connected with resistance RCn；One end of first reference resistance Ra is electrically connected at Same power positive end VEX+, the other end are connected with the second reference resistance Rb；Resistance RCn, the second reference resistance Rb it is another End is electrically connected at power cathode end VEX- (or ground connection) potentiometer and is used to measuring resistance RFn, the first reference resistance Ra Potential difference signal U0.

When without pressing force effect, each Wheatstone bridge is in equilibrium state.When depressed force effect, corresponding position The first pressure sensitivity of one or more unit 121 at place and 131 resistance value of the second pressure sensitivity unit being correspondingly arranged change, and Wheatstone bridge is flat Weighing apparatus is broken and causes output potential difference signal U0 that must change, and different pressure corresponds to the change of different resistance values, accordingly Also different potential difference signals is will produce, therefore, it is calculated and is handled by the potential difference signal U0 to Wheatstone bridge To obtain corresponding pressure value.

As shown in fig. 1b, resistance RF0, resistance RC0, resistance Ra and resistance Rb resistances constitute Wheatstone bridge, and relationship can It is expressed as：

As is shown in fig. 1C, resistance RF0, resistance RC0, resistance Ra and resistance Rb resistances constitute Wheatstone bridge, and relationship can It is expressed as：

In first embodiment of the invention in pressure-sensing input module, the relationship of resistance and temperature change can be by following public Formula is derived by：The calculation formula of the resistance R of object is：

R=ρ L/S (1)；

Wherein, ρ be expressed as composition the first pressure sensitivity unit 121, the second pressure sensitivity unit 131 material resistivity, L be this hair The length of first pressure sensitivity unit 121, the second pressure sensitivity unit 131 in bright, S are the first pressure sensitivity unit 121, the second pressure sensitivity unit 131 The cross-sectional area of current direction.

The first pressure sensitivity unit 121 is formed in the present invention, the electricalresistivityρ of material of the second pressure sensitivity unit 131 varies with temperature Formula be：

ρ_T=ρ (1+ α T) (2)；

Wherein, ρ be form the first pressure sensitivity unit 121, the second pressure sensitivity unit 131 material resistivity, α be resistance temperature Coefficient is spent, T is temperature.

In conjunction with above-mentioned formula (1) and formula (2)：

When environment temperature is T₀When (such as T=0) when, the resistance value of object is：

R_T0=ρ L/S (3)；

When environment temperature is T₁When, the resistance value of object is：

R_T1=ρ L/S (1+ α (T₁-T₀)) (4)；

The Δ R that material resistance value is affected by temperature can be derived by above-mentioned formula (1)-formula (4)_TIt is represented by such as following formula (5)：

ΔR_T=R_T1-R_T0

=ρ L/S (1+ α (T₁-T₀))-ρL/S

=α Δs T (ρ L/S)

=Δ T α R (5)；

Wherein, Δ T indicates temperature variation.

In the pressure-sensing input module 10 that first embodiment of the invention is provided, in Wheatstone bridge RF0, RC0, Ra with The relationship of Rb indicates as above to state shown in formula (Q) and formula (P).

By taking formula (Q) as an example, when temperature change (temperature variation is expressed as Δ T), the first pressure sensitivity unit 121 and its position The resistance change for the second pressure sensitivity unit 131 being correspondingly arranged is respectively as shown in formula (6) and formula (7)：

Δ RF0=Δ T α × RF0 (6)；

Δ RC0=Δ T α × RC0 (7)；

By above-mentioned formula (1)-formula (8), it can be deduced that the second pressure sensitivity list that the first pressure sensitivity unit 121 is correspondingly arranged with its position The resistance variations of member 131 are indicated as shown in formula (8)：

(8)；

The first pressure sensitivity unit 121 is made of with the second pressure sensitivity unit 131 same material it can be seen from formula (9), identical Temperature variation, formula (8) can also from which further follow that formula (9)：

From above-mentioned formula (9) as can be seen that from the point of view of according to the characteristic of temperature conduction, identical material is in identical temperature variation Under the influence of Δ T, temperature coefficient α is identical, when the first pressure sensitivity unit 121 is identical with the use of the second pressure sensitivity unit 131 Material, during resistance measurement, the variation of 131 resistance value of the first pressure sensitivity of temperature pair unit 121 and the second pressure sensitivity unit Amount Δ RF0 and Δ RC0 can be cancelled out each other by mode shown in formula (9), and therefore, temperature is to pressure-sensing input module 10 Influence is zero.

By taking formula (P) as an example, with formula (Q) temperature variation be Δ T when difference lies in：

Wherein, the specific derivation process of formula (10) is identical as formula (8) and formula (9), therefore, details are not described herein.

From the result of above-mentioned formula (9) and formula (10) it is found that Figure 1B makes temperature with wheatstone bridge configuration shown in Fig. 1 C Degree is zero to the resistance value influences of the second pressure sensitivity unit 131 of the first pressure sensitivity unit 121 and corresponding setting, to realize Full temperature compensation.

In addition, from the point of view of according to the characteristic of power conduction, since the first pressure sensitivity unit 121 and the second pressure sensitivity unit 131 set up separately The upper and lower surface of substrate 11, since substrate 11 has certain thickness, its levels after depressed active force of substrate 11 Deformation difference is had, and then makes to be disposed thereon between the first pressure sensitivity unit 121 of lower surface and the second pressure sensitivity unit 131 and also can Generate deformation difference.Further, different pressing power, the levels of caused substrate 11 and the first pressure sensitivity unit 121 It is also differed with the deformation difference of the second pressure sensitivity unit 131.

When without pressing force effect, Wheatstone bridge is in equilibrium state shown in Figure 1B and Fig. 1 C.When by by When pressure acts on, one or more resistance values of the first pressure sensitivity unit 121 and/or the second pressure sensitivity unit 131 change, in this way, favour this Logical bridge balance is broken and causes output electric signal U0 that must change：The power such as pressed is larger, then the first pressure sensitivity list Member 121 and 131 resistance value of the second pressure sensitivity unit have larger variable quantity；On the contrary, if the power pressed is smaller, the first pressure The resistance value for feeling unit 121 and the second pressure sensitivity unit 131 has small change amount.The change of different resistance values corresponds to different pressures Force value, therefore, it is calculated and is handled by the output signal U 0 to Wheatstone bridge, you can to obtain corresponding pressure value.

In the present invention, when each first pressure sensitivity unit 121 and each second pressure sensitivity unit 131 are to be set to substrate 11 in array When upper and lower surface, pressure-sensing input module can be not limited in the size of detection pressing strength, can be also used for synchronous detection The signal of pressing position (planar) and pressing strength (third dimension) this three dimensionality.After pressing, the first pressure sensitivity unit 121 and Shape change inside second pressure sensitivity unit 131 causes corresponding change in resistance, the position that can be generated according to change in resistance is calculated It sets and judges press points position and pressing strength size with the size of variable quantity, utilize the first pressure sensitivity unit being correspondingly arranged up and down 121 and second pressure sensitivity unit 131 not only carried out position detection (planar) but also carry out strength detection (third dimension) calculating, from And it is detected while realizing three dimensionality.

In order to constitute the pressure-sensing input unit that can be used for touch-control input, need to be carried in the first embodiment of the invention Other modules are added on the basis of the pressure-sensing input module 10 of confession.Further, since pressing force and its generated deformation are special Property, when pressure-sensing input module 10 is overlapped with other modules, laminating layer and pressure-sensing for being bonded each module It is sensitive to the sensing of pressure value size that the parameters such as thickness, the Young's modulus of input module 10 will influence pressure-sensing input module 10 Degree and accuracy.

Fig. 2A-Fig. 2 B are please referred to, second embodiment of the invention provides a kind of pressure-sensing input unit 20, includes successively One cover board 24, one first laminating layer 221, a pressure-sensing input module 21, one second laminating layer 222 and a supporting layer 25.Pressure It is similar to the pressure-sensing input module that first embodiment provides that power senses input module 21 comprising a substrate 201 and setting Include at least one the on the first pressure sensitivity layer 202 and the second pressure sensitivity layer 203 of 201 upper and lower surface of substrate, the first pressure sensitivity layer 202 One pressure sensitivity unit 211 includes at least one second pressure sensitivity unit 212, related first pressure sensitivity unit 211 on second pressure sensitivity layer 203 It is identical as first embodiment of the invention as the concrete structure of the second pressure sensitivity unit 212, it omits repeat no more herein.

The material of cover board 24 can be hard cover board, such as glass, strengthened glass, sapphire glass；It can also be soft Cover board, such as PEEK (polyetheretherketone polyether-ether-ketones), PI (Polyimide polyimides), PET (polyethyleneterephthalate polyethylene terephthalates), PC (makrolon makrolon), PES (poly- fourths The compound of naphthalate, PMMA (polymethyl methacrylate polymethylmethacrylate) and its arbitrary the two Equal materials.

First laminating layer 221 and the second laminating layer 222 can select OCA (Optical transparent adhesive, Optical Clear ) or LOCA (Liquid optical clear adhesive, Liquid Optical Clear Adhesive) Adhesive.

In a further embodiment, supporting layer 25 may further be display layer, and display layer may include liquid crystal display (LCD) Element, Organic Light Emitting Diode (OLED) element, electroluminescent display (ELD) etc..

Fig. 2 B are please referred to, when finger presses cover clamp 24, power is from top to bottom successively transferred to branch caused by finger pressing Support layer 25.During finger presses, strain is related with thickness, the material of each layer in decomposition pressure sensing input device 20. In one of present invention embodiment, the thickness of pressure-sensing input unit 20 is about 950 μm, and finger press pressure sensing is defeated After entering device 20, the zero of thickness is expressed as with the upper surface of pressure-sensing input unit 20, and from top to bottom to pressure-sensing The strain of input unit 20 measures, and the thickness of pressure-sensing input unit 20 and its corresponding dependent variable have been carried out pair Than, and draw strain (Elastic the Strain)-thickness relationship figure obtained as shown in FIG. 2 C.

Wherein, dependent variable-thickness relationship figure is closely related with the whole stepped construction of pressure-sensing input unit 20, In the present embodiment, pressure-sensing input unit 20 includes cover board 24, the first laminating layer 221, pressure-sensing input module 21, and the Two laminating layers 222 and supporting layer 25, the variation of the parameters such as any of the above-described layer of thickness, Young's modulus all can be to dependent variable-thickness The form of curve impacts in relational graph, and therefore, dependent variable-thickness relationship figure as shown in FIG. 2 C is merely represented in specific item The substantially trend graph of similar structures under part.

Pressure-sensing input unit 20 includes at least one neutral surface (not shown), and neutral surface is object by force effect The plane that lower shape becomes zero, in should becoming zero for neutral surface, i.e., strain value is zero.As shown in Z in Fig. 2 C, it is directed toward at Z The strain value that pressure-sensing input unit 20 corresponds to layer thickness is five of corresponding pressure-sensing input unit 20 at zero, Z Neutral surface is located at cover board 24, the first laminating layer 221, pressure-sensing input module 21, the second laminating layer 222 and supporting layer 25 It is interior.Using neutral surface as interface in pressure-sensing input unit 20, strain value can be divided into normal strain and negative strain (herein and below Normal strain, negative strain indicate respectively its deformed state be stretch, compression).

In conjunction with Fig. 2 B and Fig. 2 C it is found that when finger presses, corresponding 20 upper surface (cover board of pressure-sensing input unit 24 upper surface) strain be 1.7225e-5；

In cover board 24, strain gradually increases, and is changed by negative strain-zero strain-normal strain；

The corresponding strain value in the places I is the strain value on 221 joint surface of cover board 24 and the first laminating layer, the strain on the joint surface Reach peak 1.6478e-5；

In the first laminating layer 221, strain is gradually reduced, and variation tendency is normal strain-zero strain-negative strain；

The corresponding strain value in II place is the strain of the first laminating layer 221 and the joint surface of pressure-sensing input module 21 Value, the strain on the joint surface are that negative direction strains and close to zero；

In pressure-sensing input module 21, strain incrementally increases, and after reaching certain value (about 5e-5), and strain size is not Increase with the increase of thickness；

The corresponding strain value in III place is the strain value on the joint surface of pressure-sensing input module 21 and the second laminating layer 23, Strain is about 5e-5 accordingly on the joint surface；

In the second laminating layer 222, strain is gradually reduced, and variation tendency is normal strain-zero strain-negative strain；

The corresponding strain value in IV place is the strain value of the second laminating layer 222 and the joint surface of supporting layer 25, the joint surface Corresponding strain is about -9.7e-6；

In supporting layer 25, strain is gradually increasing, and variation tendency is negative strain-zero strain-normal strain.

As it can be seen that in pressure-sensing input unit 20, the first laminating layer 22 with cover board 24 and with pressure-sensing input module 21 joint, the second laminating layer 23 and pressure-sensing input module 21 and the joint with supporting layer 25, the variation of strain become Gesture changes, and so that strain is just being changed by the negative variation of forward direction or by negative sense, it is seen then that the first laminating layer 22 and the second laminating layer 23 Setting, so that the strain of pressure-sensing input unit 20 is declined, due to the first laminating layer 22, the second laminating layer 23 and pressure-sensing Input module 21 engages, and therefore, the first laminating layer 22 and the second laminating layer 23 are to the strain reduction of pressure-sensing input module 21 It influences smaller, the strain value of pressure-sensing input module 21 can be made bigger.

It is arranged in a one-to-one correspondence in several the first pressure sensitivity units 211 of 201 upper and lower surface of substrate and the second pressure sensitivity unit 212 Depressed power before and after strain difference it is bigger, then its corresponding resistance value difference is bigger, to obtain it is big to pressing dynamics Sluggishness preferably pressure-sensing input unit 20.

In practical application level, the aforementioned five-layer structure of pressure-sensing input unit 20, because of the first laminating layer 221, Two laminating layers 222 are engaged with the first pressure sensitivity unit 211 and the second pressure sensitivity elementary layer 212, the first pressure sensitivity unit 211 and the second pressure sensitivity The upper and lower surface in substrate 201, and the material of the first laminating layer 221, the second laminating layer 222 and substrate 201 is arranged in elementary layer 212 Alternative at most, thus only mainly the material selection situation of this three is introduced in the present invention.

Fig. 3 A are please referred to, in the first deformation of the pressure-sensing input unit 20 that second embodiment of the invention is provided, base The Young's modulus E of plate 201₁Thickness for 73.3GPa, substrate 201 is preferably 100 μm.(it includes the first laminating layer to laminating layer 22 221 and/or second laminating layer 222) thickness be 50 μm, the Young's modulus E of laminating layer 22₂Ranging from 100-3000MPa, base The Young's modulus E of plate 201₁Than the Young's modulus E of laminating layer₂It is more than big at least one order of magnitude, i.e. E₁/E₂>10；In this deformation In embodiment：

E₁/E₂>=24.4；

The Young's modulus of laminating layer 22 is very small compared to the Young's modulus of substrate 201, it is seen then that laminating layer 22 and substrate 201 different from those is larger, the strain size of the first pressure sensitivity unit 211 and the second pressure sensitivity unit 212 that are arranged on substrate 201 It is easier to embody the variation of substrate 201, strain is in increase tendency, thus, it is possible to obtain the strain differential Δ ε of bigger.First pressure Strain differential Δ ε between sense unit 211 and the second pressure sensitivity unit 212 rises with the decline of the Young's modulus of laminating layer 22, Wherein, when the Young's modulus of laminating layer 22 be 100-1000MPa when, strain differential Δ ε with the Young's modulus of laminating layer 22 drop It is low and dramatically increase.

By repeatedly studying, it was therefore concluded that as follows：The Young's modulus of substrate 22 is for a fixed value and at least more than laminating layer When at least one order of magnitude of 22 Young's modulus, strain differential Δ ε and the Young's modulus of laminating layer 22 are negatively correlated.

In a further embodiment, E₁/E₂Value it is more excellent for more than or equal to 100.

Please refer to Fig. 3 B, the second variation of the pressure-sensing input unit 20 that second embodiment of the invention is provided, Difference lies in the Young's modulus of substrate 201 it is only 6000MPa compared with above-mentioned first variant embodiment, when the poplar of laminating layer 22 When family name's modulus is 1000-3000MPa, the Young's modulus E of substrate 201₁With the Young's modulus E of laminating layer 22₂Ratio be 2-6, E₁/E₂Value is less than 10.The strain size of the first pressure sensitivity unit 211 and the second pressure sensitivity unit 212 that are arranged on substrate 201 and patch It closes layer 22 and substrate 201 is related, since the Young's modulus of laminating layer 22 differs smaller with the Young's modulus of substrate 201, work as patch It closes layer 22 and the performance (such as elastic property) of substrate 201 is similar, answered between the first pressure sensitivity unit 211 and the second pressure sensitivity unit 212 The variation that is deteriorated is irregular, it is seen then that as the Young's modulus E of substrate 201₁For smaller value, and the Young's modulus E of itself and laminating layer 22₂'s When ratio is less than 10, the Young's modulus of laminating layer 22 is not notable to the effect for increasing strain differential Δ ε.

Please refer to Fig. 3 C, the third variation for the pressure-sensing input unit 20 that second embodiment of the invention is provided, Compared with above-mentioned first variant embodiment difference lies in the thickness range of laminating layer 22 be 25-125 μm when, the first pressure sensitivity unit 211 are inversely proportional with the strain differential Δ ε of the second pressure sensitivity unit 212 and the variation size of the thickness of laminating layer 22.Due to laminating layer 22 The first pressure sensitivity unit 211 and the strain value of the second pressure sensitivity elementary layer 212 of corresponding setting can be made to become smaller, therefore, laminating layer 22 is thinner, and the influence to the first pressure sensitivity unit 211 and the second pressure sensitivity unit 212 becomes smaller, so as to keep strain differential Δ ε bigger, But influence of the thickness change of laminating layer 22 to strain differential Δ ε is much smaller than the Young's modulus of laminating layer 22 to strain differential Δ ε's It influences.When 22 thickness range of laminating layer is less than 25 μm, since 22 thickness of laminating layer is excessively thin, will be unable to play the work of fitting With, make to engage between each layer structure in pressure-sensing input unit 20 not closely, and reduce the production of pressure-sensing input unit 20 Quality；And when the thickness range of laminating layer 22 is more than 125 μm, since the thickness of laminating layer 22 is excessive so that pressure-sensing Input unit 20 is in depressed active force, the second pressure sensitivity elementary layer 212 of the first pressure sensitivity unit 211 and corresponding setting Strain value become smaller, since the two numerical value becomes smaller, the difference (i.e. strain differential Δ ε) of the two also can accordingly become smaller.

Please refer to Fig. 3 D, the 4th variation of the pressure-sensing input unit 20 that second embodiment of the invention is provided, Compared with above-mentioned first variant embodiment difference lies in the thickness range of substrate 201 be 50-450 μm when, the first pressure sensitivity unit 211 directly proportional to the strain differential Δ ε of the second pressure sensitivity unit 212 to the variation size of the thickness of substrate 201.Due to substrate 201 Thickness is bigger, be arranged 201 upper and lower surface of substrate the first pressure sensitivity unit 211 and the second pressure sensitivity unit 212 strain differential Δ ε with The strain value positive correlation of substrate 201, thickness is bigger, and the strain of substrate 201 is bigger, then strain differential Δ ε is also bigger.But substrate The 201 too thick temperature-compensatings that can be influenced between the first pressure sensitivity unit 211 of 201 upper and lower surface of substrate and the second pressure sensitivity unit 212 The integral thickness of effect and equipment, therefore, when the thickness range of substrate 201 is 50-450 μm, strain differential Δ ε and substrate 201 Thickness positive correlation.

When the thickness of substrate 201 is less than 50 μm, since pressure-sensing input unit 20 is excessively thin so that be arranged in substrate Strain differential Δ ε values between the first pressure sensitivity unit 211 and the second pressure sensitivity unit 212 of 201 upper and lower major surfaces are smaller, can not be effective Sense the size of pressing dynamics；And when the thickness of substrate is more than 450 μm, it can not only make the entirety of pressure-sensing input unit 20 Thickness is excessive, can also make the temperature variation between the first pressure sensitivity unit 211 and the second pressure sensitivity unit 212 different, from And influence the effect of temperature-compensating.

Third embodiment of the invention provides a kind of pressure-sensing input unit, and the difference with above-mentioned second embodiment exists It can be by adjusting the thickness and its Young's modulus of each layer structure of pressure-sensing input unit, to make pressure in the present embodiment One of integrally-built at least one neutral surface of sensing input device is the mechanics neutral surface positioned at the substrate, In, neutral surface is the plane that pressure-sensing input module planted agent becomes zero, in this way, being disposed on the substrate the first pressure of bottom major surface The strain for feeling unit (not shown) and the second pressure sensitivity unit (not shown) is one positive one negative, therefore, under identical pressing force effect, The strain differential Δ ε of first pressure sensitivity unit and the second pressure sensitivity unit will be greater than its strain and be all just or be all negative situation, has and increases The advantages of strain differential Δ ε of big first pressure sensitivity unit and the second pressure sensitivity unit.

Further, preferred plan is by the design of each layer thickness and Young's modulus overall structure to be had uniquely Neutral surface, and be the mechanics neutral surface positioned at the substrate.I.e. integrally-built mechanics symmetrical centre is located at the mechanics of the substrate Neutral surface, in this way, can make under identical pressing force effect, the strain differential Δ ε of the first pressure sensitivity unit and the second pressure sensitivity unit is maximum The advantages of.So as to effectively improve the pressure-sensing sensitivity of pressure-sensing input module.

Each first pressure sensitivity unit and the second pressure sensitivity unit (figure being arranged in a one-to-one correspondence with it in pressure-sensing input module Do not show) stress difference size in addition to the position of neutral surface and substrate, the thickness of laminating layer and Young's modulus it is related other than, also There are the first pressure sensitivity unit and the second pressure sensitivity unit pattern shape and arrangement mode related.

Referring to Fig. 4, fourth embodiment of the invention provides a kind of pressure-sensing input module 40, with first embodiment Difference lies in the first pressure sensitivity unit 421 for being provided with array distribution on the first pressure sensitivity layer 42, only × 9 row arrays are arranged with 5 in Fig. 4 The first pressure sensitivity unit 421 for illustrate, actual quantity is not restricted.Because pressure-sensing input module 40 is rectangular (non-circular) is influenced by its shape so that different region in the plane of the first pressure sensitivity layer 42, in depressed active force Afterwards, in all directions deformation degree simultaneously differs, and has largest deformation degree along some direction, and has in another direction There is minimum deformation degree.Wherein, the size of deformation degree is related with the pattern form of pressure sensitivity unit.In addition, for adherence pressure The sensitivity of sensing, preferably design are to make the pattern of the first pressure sensitivity unit 421 (maximum is answered along the direction of largest deformation degree Change direction) on have maximum length.

Particularly, Fig. 5 A are please referred to, after finger press pressure senses input module 40, the first pressure sensitivity layer 42 is by power Effect, will produce certain deformation.Since common pressure-sensing input module 40 is rectangular, (non-circular, circle has rotation Turn invariance), do not have rotational invariance, influenced by its shape so that in 42 plane of the first pressure sensitivity layer each point by by Degree of strain in all directions is not fully identical after pressing active force, may have maximum strain along a direction, and with Vertical other direction have minimum strain, the degree of strain in other directions is therebetween.Wherein, it is defined on a certain area The maximum direction of deformation degree is the maximum strain direction in the region in domain, and the direction of deformation degree minimum in this region For the minimum strain direction in the region, wherein maximum strain direction is mutually perpendicular to minimum strain direction.

In the pressure-sensing input module 40 without rotational invariance, different zones in 42 plane of the first pressure sensitivity layer Maximum strain direction is also not necessarily identical, and concrete example is as follows：The stress area for choosing pressing respectively is located at the first pressure sensitivity At the center of layer 42 (as shown in A in Fig. 5 A), diagonal angle (as shown in B in Fig. 5 A), long side midpoint be (in such as Fig. 5 A at C It is shown), short side midpoint (as shown in D in Fig. 5 A).

When the stress area of pressing is located at the center of the first pressure sensitivity layer 42, the maximum strain direction at the center is as schemed Direction S in 5B_InIt is shown, maximum strain direction S_InIt is parallel with the long side direction of the first pressure sensitivity layer 42；

When the stress area of pressing is located at the pair of horns of the first pressure sensitivity layer 42, the maximum strain direction of the diagonal angle is such as Direction S in Fig. 5 C_AngleIt is shown, maximum strain direction S_AngleIt is vertical with through the diagonal line diagonally connecting；

When the stress area of pressing is located at the long side midpoint of the first pressure sensitivity layer 42, the maximum strain direction at this is such as Direction S in Fig. 5 D_{It is long}It is shown, maximum strain direction S_{It is long}It is vertical with the long side direction of the first pressure sensitivity layer 42；

When the stress area of pressing is located at the short side midpoint of the first pressure sensitivity layer 42, the maximum strain direction at this is as schemed Direction S in 5E_{It is short}It is shown, maximum strain direction S_{It is short}It is parallel with the long side direction of the first pressure sensitivity layer 42.

The stress area pressed in fourth embodiment of the invention only at center shown in Fig. 5 B- Fig. 5 E, diagonal angle, length Side midpoint and short side midpoint carry out the explanation of direction of maximal stress, and the stress area actually pressed is not restricted, In a further embodiment, multiple spot pressing operation simultaneously is can also be achieved, direction of maximal stress is implemented in combination with the present invention the 4th Content obtains shown in example.

The explanation in the above-mentioned maximum strain direction about the first pressure sensitivity layer 42 is applied equally to the second pressure sensitivity layer, and (figure is not Show), according to the specific stepped construction of pressure-sensing input module 40, when by identical pressing force, the first pressure sensitivity layer 42 and second The maximum strain direction in the corresponding region of pressure sensitivity layer is usually identical.

The shape of the first pressure sensitivity unit 421 and the second pressure sensitivity unit (not shown) is non-rotation in the present embodiment Turn symmetry figure.

Please refer to Fig. 6 A-6B, the first pressure sensitivity unit 421 is ellipse around threadiness in fourth embodiment of the invention, wherein first The long axis direction of pressure sensitivity unit 421 is the directions a (i.e. total length L a of the first pressure sensitivity unit 421 along the directions a is maximum), short-axis direction For the directions b (i.e. total length L b of the first pressure sensitivity unit 421 along the directions b is minimum), in one embodiment, the directions a are hung down with the directions b Directly.

With above-mentioned oval maximum towards the total length on the directions a around the first linear pressure sensitivity unit 421, and towards on the directions b Total length it is minimum, in pressing, be more than towards the dependent variable on the directions b, in this way, being conducive to apply in the dependent variable towards on the directions a Strain caused by the pressing force being added on the first pressure sensitivity unit 421 can concentrate upper embodiment in one direction, to make first The deformation bigger of pressure sensitivity unit 421.Since the first pressure sensitivity unit 421 concentration deforms upon in a single direction, can make The resistance value RFn of first pressure sensitivity unit 421 is compared to the variation bigger that original state occurs, to more accurately embody pressing dynamics Size.

Further, since the first pressure sensitivity unit 421 be ellipse around threadiness, in a unit area, the first pressure sensitivity unit 421 Pattern density compared to single strip threadiness pattern density bigger, therefore, when being pressed by finger, the first pressure sensitivity unit 421 deformation bigger, therefore the first pressure sensitivity unit 421 is to the sensitivity higher of pressure detection.

Fig. 6 C are please referred to, the first pressure sensitivity unit has other variant embodiment：A wherein variant embodiment and above-mentioned the One variant embodiment is polyline shaped difference lies in the first pressure sensitivity unit 421c, and the first pressure sensitivity unit 421c polyline shapeds pattern is towards one The total length in direction is maximum, and the direction is the directions a, and the total length of the first pressure sensitivity unit 421c polyline shapeds pattern towards a direction is most Small, the direction is the directions b, wherein the directions a are vertical with the directions b.The directions a of first pressure sensitivity unit 421c are the first pressure sensitivity list The long axis direction of first 421c, the directions b of the first pressure sensitivity unit 421c are the short-axis direction of the first pressure sensitivity unit 421c.

First pressure sensitivity unit 421c is more than in the dependent variable towards on the directions a towards on the directions b after depressed active force Dependent variable, in this way, one can be concentrated on by being conducive to strain caused by the pressing force being applied on the first pressure sensitivity unit 421c It is embodied on a direction, to make the deformation bigger of the first pressure sensitivity unit 421c, to more accurately embody the size of pressing dynamics.

In the deformation of above-mentioned pressure sensitivity unit, ellipse around threadiness because conducting wire major part section is circular arc, in processing procedure compared with It is easy to manufacture, and less easy damaged, there is stronger practicability.

The shape of first pressure sensitivity unit 421 can also be other threadiness such as：Curve-like (the first pressure sensitivity unit in such as Fig. 6 D 421d), isometric multi-stage series linear (the first pressure sensitivity unit 421e in such as Fig. 6 E), Length discrepancy multi-stage series threadiness (such as Fig. 6 F In the first pressure sensitivity unit 421f) or Back Word molded line shape (the first pressure sensitivity unit 421g in such as Fig. 6 G) shape.Above-mentioned first The deformation of the pattern form of pressure sensitivity unit 421 can equally be well applied to the other embodiment in the present invention.It is above-mentioned to be directed to the first pressure sensitivity The various restrictions and its deformation of 421 pattern form of unit are suitable for the second pressure sensitivity unit (not shown).

In first to fourth above-mentioned embodiment of the present invention, when the stepped construction of a complete pressure-sensing input unit And after the material of each layer determines, the strain value of each layer structure and pressure-sensing input unit are whole in pressure-sensing input unit What the thickness relationship of structure was also to determine, i.e. the quantity of the integrally-built neutral surface of pressure-sensing input unit and its specific position It sets and is equally to determine, such as the laminating layer and base by adjusting pressure-sensing input unit in second, third embodiment of the invention The Young's modulus and thickness of plate, so as to so that neutral surface is located at or is not located in substrate.

Fig. 7 A are please referred to, fifth embodiment of the invention pressure-sensing input module 50 includes a substrate 51, the first pressure sensitivity Layer 52 is arranged in the upper surface of substrate 51, and the lower surface of substrate 51 is equipped with the second pressure sensitivity of setting corresponding with the first pressure sensitivity layer 52 Layer 53, wherein the integral thickness of the first pressure sensitivity layer 52, substrate 51 and the second pressure sensitivity layer 53 is T.First pressure sensitivity layer 52 and second is pressed Sense layer 53 respectively includes at least one first pressure sensitivity unit 521 and at least one second pressure sensitivity unit 531, the first pressure sensitivity unit 521 and second pressure sensitivity unit 531 it is same as the previously described embodiments, details are not described herein.

Please refer to Fig. 7 B, each layer structure of complete pressure-sensing input unit residing for the pressure-sensing input module 50 with After material determines, when depressed active force, each layer structure of pressure-sensing input unit and its corresponding strain trend relationship It is just to determine, only chooses the strain-of pressure-sensing input module 50 (thickness value that the abscissa of thickness is n-m is T) herein Thickness relationship line, wherein corresponding first pressure sensitivity layer 52 is located at the thickness position in pressure-sensing input module 50 at n, then right at m Answer the thickness position that the second pressure sensitivity layer 53 is located in pressure-sensing input module 50 (because of the first pressure sensitivity layer 52 and the second pressure sensitivity layer 53 Thickness relative to substrate is smaller, is only indicated herein with a point).

It is fifth embodiment of the invention pressure-sensing input module as shown in VI of strain-thickness relationship line in Fig. 7 B 50 the first variant embodiment：When a neutral surface of pressure-sensing input module 50 is located in substrate 51, the first pressure sensitivity list The strain of member 521 is negative strain (being compressive state), and the strain of the second pressure sensitivity unit 531 is that normal strain (as stretches shape State).In order to make the strain differential Δ ε biggers between the first pressure sensitivity unit 521 and the second pressure sensitivity unit 531, preferably make the first pressure The dependent variable absolute value of the dependent variable absolute value and the second pressure sensitivity unit 531 of feeling unit 521 is maximum.

In order to improve the first pressure sensitivity unit 521 dependent variable and the second pressure sensitivity unit 531 dependent variable, can be by adjusting The long axis direction maximum strain side with its region respectively of the long axis direction of one pressure sensitivity unit 521, the second pressure sensitivity unit 531 To parallel or only at the angle of a very little, to realize the strain differential Δ ε between the first pressure sensitivity unit and the second pressure sensitivity unit It is worth the adjustment of size.

Wherein, the maximum strain of 521 region of long axis direction and the first pressure sensitivity unit of the first pressure sensitivity unit 521 is defined The angled а of the angle in direction 1.The long axis direction for the second pressure sensitivity unit 531 being correspondingly arranged with the first pressure sensitivity unit 521 and its institute The angled а of angle in the maximum strain direction in region 2, wherein the angle of angle а 1 and angle a2 is free of directionality, i.e. its model Enclose is 0 ° -90 °.In the present embodiment, angle a1 and angle а 2 is preferably 0 ° -45 °, can be also 0 ° -20 °, also may further be 0 ° -10 °, it is optimal be 0 ° (i.e. the long axis direction of the first pressure sensitivity unit 521 and the second pressure sensitivity unit 531 respectively with the two location The maximum strain direction in domain is arranged in parallel).

Further, when the maximum strain direction phase of the long axis direction of the first pressure sensitivity unit 521 and the first pressure sensitivity layer 52 Meanwhile the dependent variable maximum absolute value of the first pressure sensitivity unit can be made；When the long axis direction and the second pressure sensitivity of the second pressure sensitivity unit 531 When the maximum strain direction of layer 53 is identical, the dependent variable maximum absolute value of the second pressure sensitivity unit 531 can be made.In the first pressure sensitivity unit 521 and second pressure sensitivity unit 531 strain be one positive one it is negative under the premise of, the first pressure sensitivity unit 521 and the second pressure sensitivity list can be made The strain differential Δ ε of member 531 obtains higher value.

In other variant embodiment, the pressure-sensing input unit residing for pressure-sensing input module 50 is integrally tied Structure have only one neutral surface, and positioned at substrate 51 mechanics median plane when, the dependent variable of the first pressure sensitivity unit with second pressure The dependent variable absolute value of sense unit reaches maximum value, then the strain differential Δ ε of the two is maximum.

As strain-thickness relationship curve in Fig. 7 B V at and shown in VII：Appoint when no in pressure-sensing input module 50 When one neutral surface is located in substrate 51 (plane of strain stress ＇=0 and strain stress ＂=0 is not in substrate 51), and and substrate 51 hithermost neutral surfaces are located on or below substrate 51, will determine strain and the second pressure sensitivity list of the first pressure sensitivity unit 521 The strain of member 531 is all negative strain or is all normal strain.

It is the second variant embodiment of fifth embodiment of the invention pressure-sensing input module 50 as shown in V in Fig. 7 B： When the strain and the strain of the second pressure sensitivity unit 531 of the first pressure sensitivity unit 521 are all negative strain, in order to make the first pressure sensitivity unit 521 and the second strain differential Δ ε biggers between pressure sensitivity unit 531, it needs to keep the dependent variable absolute value of the first pressure sensitivity unit larger, And keep the dependent variable absolute value of the second pressure sensitivity unit smaller, in this way, the strain differential Δ ε of the two is larger.

And in order to improve the dependent variable absolute value of the first pressure sensitivity unit 521, the long axis direction of the first pressure sensitivity unit 521 and its The angle a1 of the angle in the maximum strain direction of region is chosen as 0 ° -45 °, can also be 0 ° -20 °, also may further be 0 ° - It is 10 °, optimal to be 0 ° (i.e. the long axis direction of the first pressure sensitivity unit 521 is parallel with the maximum strain direction of its region respectively sets It sets)；In order to reduce the dependent variable absolute value of the second pressure sensitivity unit 531, long axis direction and its location of the second pressure sensitivity unit 531 The angle a2 of the angle in the maximum strain direction in domain then be preferably 45 ° -90 °, can also be 70 ° -90 °, also may further be 80 ° - 90 °, optimal is 90 ° (i.e. the long axis direction of the second pressure sensitivity unit 531 is vertically arranged with the maximum strain direction of its region).

As shown in Fig. 8 A-8B, in the present embodiment, the figure arrangement mode of the first pressure sensitivity layer 52 is as shown in Figure 8 A, and The figure arrangement mode of second pressure sensitivity layer 53 is as shown in Figure 8 B.

Since under identical pressing force effect, pressure sensitivity unit is by identical stress, and the reality of pressure sensitivity unit is answered The size of change is related towards the total length size in the direction a, b with its pattern form, material character and set pattern.Therefore, it removes It, can also by adjusting the first pressure sensitivity list except the long axis direction of pressure sensitivity unit and the angle in maximum strain direction The pattern form of member 521 and the second pressure sensitivity unit 531 of corresponding setting, it is specific as follows：

The pattern form of first pressure sensitivity unit 521 and the second pressure sensitivity unit 531 is set as differing, and pattern form is answered Meet following relationship：

L_{Upper a}/L_{Upper b}>L_{Lower a}/L_{Lower b}

Wherein, L_{Upper a}It is expressed as the total length towards the directions a of the first pressure sensitivity unit 521, L_{Upper b}It is expressed as the first pressure sensitivity unit 521 total length towards the directions b, L_{Lower a}It is expressed as the total length towards the directions a of the second pressure sensitivity unit 531, L_{Lower b}It is expressed as the second pressure Feel the total length towards the directions b of unit 531.

By adjusting between the first pressure sensitivity unit 521 and the second pressure sensitivity unit 531 towards the total length in the directions a with towards the directions b Total length ratio relationship, to make the strain facies of the first pressure sensitivity unit 521 be focused more on compared with the second pressure sensitivity unit 531 On one direction, to obtain the dependent variable of bigger.

In conjunction with above two adjustment mode, when the strain of the first pressure sensitivity unit 521 is same with the strain of the second pressure sensitivity unit 531 For negative strain when, the strain differential Δ ε of bigger can be obtained.

It is the third variant embodiment of fifth embodiment of the invention pressure-sensing input module 50 as shown in VII：When Strain and the strain of the second pressure sensitivity unit 531 of one pressure sensitivity unit 521 are all normal strain, in order to make the first pressure sensitivity unit 521 with Strain differential Δ ε biggers between second pressure sensitivity unit 531, need to keep the dependent variable absolute value of the first pressure sensitivity unit 521 smaller, and Keep the dependent variable absolute value of the second pressure sensitivity unit 531 larger, in this way, the strain differential Δ ε of the two is larger.

This variant embodiment and above-mentioned second variant embodiment difference lies in：

The angle a1 of the long axis direction of (one) first pressure sensitivity unit 521 and the angle in the maximum strain direction of its region Preferably 45 ° -90 °, it can be also 70 ° -90 °, also may further be 80 ° -90 °, optimal is 90 ° of (i.e. first pressure sensitivity units 521 Long axis direction and the maximum strain direction of its region are vertically arranged)；And the long axis direction of the second pressure sensitivity unit 531 and its institute The maximum strain direction in region angle angle a2 then be preferably 0 ° -45 °, can also be 0 ° -20 °, also may further be 0 ° - It is 10 °, optimal to be 0 ° (i.e. the long axis direction of the second pressure sensitivity unit 531 is parallel with the maximum strain direction of its region respectively sets It sets).In the present embodiment, the figure arrangement mode of the first pressure sensitivity layer 52 is as shown in Figure 8 B, and the figure of the second pressure sensitivity layer 53 is arranged Mode for cloth is as shown in Figure 8 A.

The pattern form of (two) first pressure sensitivity units 521 and the second pressure sensitivity unit 531 is set as differing, and pattern form Following relationship should be met：

L_{Upper a}/L_{Upper b}＜ L_{Lower a}/L_{Lower b}

Other contents are identical as above-mentioned second variant embodiment, and details are not described herein.In conjunction with above two adjustment mode, when When the strain and the strain of the second pressure sensitivity unit 531 of first pressure sensitivity unit 521 are all normal strain, the strain differential of bigger can be obtained Δε。

Compared with prior art, pressure-sensing input module 10 (40 or 50) provided by the present invention or pressure-sensing input Device 20 at least has the following advantages：

1, the present invention provides a kind of pressure-sensing input modules 10 with temperature compensation function comprising is arranged in base The the first pressure sensitivity unit 121 and the second pressure sensitivity unit 131 of 11 upper and lower surface of plate, the first pressure sensitivity unit 121 and the second pressure sensitivity unit 131 are correspondingly arranged and material identical, the second pressure sensitivity unit 131 of at least one first pressure sensitivity unit 121 and corresponding setting, with Two reference resistances (resistance Ra and resistance Rb) of peripheral hardware constitute Wheatstone bridge.

Pressing force value is detected using Wheatstone bridge in the present invention, circuit structure is simple, and control accuracy is high.By In the material identical for constituting the first pressure sensitivity unit 121 and the second pressure sensitivity unit 131, therefore, the first pressure sensitivity unit 121 and second pressure Feel unit 131 since the variation of resistance value caused by temperature change meets (RF0+ Δ RF0)/(RC0+ Δ RC0)=RF0/ RC0, it is seen then that since the first pressure sensitivity unit 121 and the second pressure sensitivity unit 131 for same material and collectively form Wheatstone bridge, In the measurement process of resistance value, the resistance value influences of the first pressure sensitivity of temperature pair unit 121 and the second pressure sensitivity unit 131 can neglect Slightly, therefore the resistance change caused by temperature can be fully compensated in pressure-sensing input module 10 provided by the present invention.

2, in pressure-sensing input unit 20 provided by the present invention, the Young's modulus of substrate 201 and laminating layer 22, thickness The neutral surface for influencing pressure-sensing input unit 20 is arranged when neutral surface is located in substrate 201 in about 201 main table of substrate Strain differential between the first pressure sensitivity unit 211 and the second pressure sensitivity unit 212 in face can reach maximum value.Therefore, by substrate 201 Young's modulus be set greater than under the premise of at least one order of magnitude of Young's modulus of laminating layer 22：(1) by the poplar of laminating layer 22 The control of family name's modulus is conducive to increase above-mentioned strain differential Δ ε in the range of 100-3000MPa；(2) thickness of laminating layer 22 is limited When being scheduled in 25-125 μ ms, strain differential Δ ε will be in increase tendency with the reduction of 22 thickness of laminating layer；(3) by substrate When 201 thickness limit is in 50-450 μ ms, strain differential Δ ε will be in increase tendency with the increase of 201 thickness of substrate. Therefore, by adjusting the Young's modulus and its thickness of the substrate 201 of pressure-sensing input unit 20 and laminating layer 22, you can increase The strain difference of the pressure sensitivity unit of 201 upper and lower surface of substrate, to keep pressure size detection more accurate, pressing dynamics detect more Add sensitive.

3, in pressure-sensing input module 40 provided by the present invention, the first pressure sensitivity unit 421 is with the second pressure sensitivity unit With long axis direction and short-axis direction, and the bus length of long axis direction is more than the design of total line length of short-axis direction.At this In invention also further to the pattern form of the first pressure sensitivity unit 421 and the second pressure sensitivity unit include it is oval around threadiness, polyline shaped, The shapes such as curve-like, isometric multi-stage series threadiness, Length discrepancy multi-stage series threadiness, Back Word molded line shape.When finger pressing (is pressed Pressure) when the first pressure sensitivity unit 421 or the second pressure sensitivity unit being caused to generate deformation, the first pressure sensitivity unit 421 or the second pressure sensitivity unit Since the total length in the directions long axis a is different from the total length in the directions short axle b, the directions a and the strain in the directions b are also different, therefore Resistance change effect can effectively be increased, further make the first pressure sensitivity layer or the second pressure sensitivity layer to the response of pressure more precisely more It is sensitive.

4, in pressure-sensing input module 50 provided by the present invention, in order to reach answering for above-mentioned first pressure sensitivity unit 521 The difference become between the strain of the second pressure sensitivity unit 531 can reach higher value, to improve pressure-sensing input module 50 Pressure detection sensitivity, except through adjustment the first pressure sensitivity unit 521 and the second pressure sensitivity unit 531 pattern form, may be used also With the arrangement mode by adjusting the first pressure sensitivity unit 521 and the second pressure sensitivity unit 531, to increase or reduce the first pressure sensitivity list The dependent variable of member 521 and the second pressure sensitivity unit 531.Wherein, when the strain of the first pressure sensitivity unit 521 and the second pressure sensitivity unit 531 For one it is positive one it is negative when, the angular range of angle а 1 and angle a2 are 0 ° -45 °, when strain is all negative strain, angle a1 is 0 ° - 45 °, and angle a2 is 45 ° -90 °, or when strain is all normal strain, angle a1 is 45 ° -90 °, and angle a2 is 0 ° -45 °. In addition, in order to keep the strain differential Δ ε between the first pressure sensitivity unit 521 and the second pressure sensitivity unit 531 larger, it can also be by first The pattern form relationship of pressure sensitivity unit 521 and the second pressure sensitivity unit 531 is defined.The limitation of above-mentioned condition can all make first The strain variation value of pressure sensitivity unit 521 and the second pressure sensitivity unit 531 is maximum.First pressure sensitivity unit 521 is in depressed active force Later, it is more than towards the dependent variable on the directions b, in this way, being conducive to be applied to the first pressure sensitivity unit in the dependent variable towards on the directions a 521 and the second pressing force on pressure sensitivity unit 531 caused by strain can concentrate upper embodiment in one direction, when this strain When the direction of concentration is consistent with the maximum strain direction that the region is generated due to pressing active force, the first pressure sensitivity unit can be made 521 and second pressure sensitivity unit 531 strain differential Δ ε more, to more accurately embody pressing dynamics size, improve pressure detect The sensitivity of survey.

5, the present invention in pressure-sensing input module 10,40 and 50 and pressure-sensing input unit 20 in, be all made of electricity Resistance pressure senses, and causes corresponding change in resistance by the shape change inside pressure sensitivity unit, to according to change in resistance The position of generation and the size of variable quantity judge press points position and pressing strength size, have both been carried out using same pressure sensitivity unit Position detection (planar) and the calculating for carrying out strength detection (third dimension) detect while realizing three dimensionality.

The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention principle it Any modification made by interior, equivalent replacement and improvement etc. should all be included in the protection scope of the present invention.

Claims

1. a kind of pressure-sensing input module, Nian Jie with each module by laminating layer, it is characterised in that：It include a substrate and It is separately positioned on one first pressure sensitivity layer, the one second pressure sensitivity layer of the substrate upper and lower surface, the first pressure sensitivity layer includes at least one A first pressure sensitivity unit, the second pressure sensitivity layer include at least one second pressure sensitivity unit, the first pressure sensitivity unit with it is described Second pressure sensitivity unit is arranged in a one-to-one correspondence and material identical, at least the second pressure sensitivity list of the one first corresponding setting of pressure sensitivity unit Member constitutes the two of which resistance of Wheatstone bridge, is used to detect a pressing dynamics size, while compensating the pressure-sensing Input module resistance change caused by temperature；Wherein, the laminating layer is arranged in the first pressure sensitivity layer, the second pressure sensitivity Between layer and other modules, the thickness of the laminating layer is 25-125 μm, and the thickness of the substrate is 50-450 μm.

2. pressure-sensing input module as described in claim 1, it is characterised in that：The pressure-sensing input module is further Including the first reference resistance and the second reference resistance, at least one first pressure sensitivity unit and the second pressure sensitivity list being correspondingly arranged Member constitutes Wheatstone bridge.

3. pressure-sensing input module as claimed in claim 2, it is characterised in that：It is described constitute Wheatstone bridge mode be The first pressure sensitivity unit is connected with first reference resistance, and the second pressure sensitivity unit being correspondingly arranged is joined with described second Examine resistance series connection.

4. pressure-sensing input module as claimed in claim 2, it is characterised in that：It is described constitute Wheatstone bridge mode be The first pressure sensitivity unit is connected with the second pressure sensitivity unit being correspondingly arranged, and first reference resistance is joined with described second Examine resistance series connection.

5. pressure-sensing input module as described in claim 1, it is characterised in that：The first pressure sensitivity cell array is set to The upper surface of base plate, the second pressure sensitivity unit are correspondingly arranged in the base lower surface with the first pressure sensitivity unit, then The pressure-sensing input module can detect three dimensional signal simultaneously.

6. pressure-sensing input module as described in claim 1, it is characterised in that：The first pressure sensitivity unit and described second Pressure sensitivity unit is bent by a pressure drag material in the form of a conducting wire.

7. pressure-sensing input module as claimed in claim 6, it is characterised in that：The first pressure sensitivity unit and described second The shape of pressure sensitivity unit is non-rotational symmetry figure.

8. pressure-sensing input module as claimed in claim 7, it is characterised in that：The first pressure sensitivity unit and/or described The design of second pressure sensitivity unit is that conducting wire total length towards a direction is maximum, the direction be the first pressure sensitivity unit and/ Or the directions a of the second pressure sensitivity unit, the pattern of the first pressure sensitivity unit and the second pressure sensitivity unit is towards a direction Conducting wire total length is minimum, and the direction is the directions b, wherein the directions a are vertical with the directions b.

9. pressure-sensing input module as claimed in claim 8, it is characterised in that：The first pressure sensitivity unit and described second The pattern form of pressure sensitivity unit includes oval around threadiness, polyline shaped, curve-like, isometric multi-stage series threadiness, Length discrepancy multistage string The one of which or combinations thereof of on line shape or Back Word molded line shape.

10. pressure-sensing input module as claimed in claim 9, it is characterised in that：The first pressure sensitivity unit with it is described right The shape for the second pressure sensitivity unit that should be arranged differs.