CN105094449B - A pressure sensing input module - Google Patents

Abstract

The present invention provides a pressure sensing input module types, comprising a first pressure sensing means disposed in the upper and lower surfaces of the substrate and the second pressure sensing means, said first pressure sensing means and the second pressure sensing means disposed corresponding to the same material, and , at least a first pressure sensitive means and its corresponding second pressure sensing unit provided with two peripheral reference resistors constituting a Wheatstone bridge, by adjusting the Young's modulus and thickness of the substrate and the bonding layer, and with the first adjusting the shape and arrangement pattern of the pressure sensing means and the way the second pressure sensing means to obtain a temperature-insensitive and has high sensitivity pressure sensing pressure sensing input module.

Description

A pressure sensing input module FIELD

[0001] The present invention relates to pressure sensing, and in particular relates to a pressure sensing input module. 【Background technique】

[0002] With the recent touch input technology constantly updated, flat-panel touch input has become the device of choice. Recently to a pressure sensing device to bring a new touch experience sparked a boom in the field of touch input devices, such pressure sensing device can detect the change in resistance after the press pressure sensing unit size, and determining the size of the pressing strength, which can be applied individually to detect only the field of pressure touch input device, while taking into account the three-dimensional and two-dimensional coordinate detection of the contact pressure may also be combined with conventional flat touch panel.

[0003] However, due to the pressure sensing electrode material, the conventional material inevitably affected by temperature fingers, generating a certain change in resistance, the resistance change caused by the temperature changes greatly influenced on detecting intensity of the size of the pressing, there may be even generated due to temperature change in resistance is much greater than the resistance change amount due to the size of the pressing strength is generated, resulting in inaccurate detection of pressure change in the resistance or even can not be detected. [SUMMARY]

[0004] The present invention provides a pressure sensing input module having a temperature compensation function.

[0005] To solve the above problems, the present invention provides a technical solution: A pressure sensing input module by module with the bonding adhesive layer, which comprises a substrate and respectively disposed on a top and bottom surface of the substrate a pressure sensitive layer, a second pressure sensitive layer, the first pressure sensitive layer comprises at least a first pressure sensing means, the second pressure sensitive layer comprises at least one second pressure sensing means, said first pressure sensing means disposed one correspondence with the second pressure sensing means and the same material, the second pressure sensing means at least a first pressure sensing means disposed corresponding to a Wheatstone bridge configuration in which two resistors, for detecting a pressing the size of the intensity, while compensating the pressure sensing module due to the input resistance due to temperature change value; wherein, said adhesive layer disposed between the first pressure sensitive layer, a second layer and another pressure-sensing modules, the said bonding layer has a thickness 25_125μπι, the thickness of the substrate is 50_450μπι.

[0006] Preferably, the pressure sensing input module further comprises a first reference resistor and a second reference resistor, a second pressure sensing means and said at least one first pressure sensing means and arranged corresponding to a Wheatstone bridge configuration.

[0007] Preferably, the Wheatstone bridge configuration of a first embodiment of the pressure sensing unit and the first reference resistor connected in series, said second set corresponding to the pressure sensing unit and the second reference resistor in series .

[0008] Preferably, the Wheatstone bridge configuration of a first embodiment of the pressure sensing means disposed corresponding to the second pressure sensing means connected in series, the first reference resistor and the second reference resistor in series .

[0009] Preferably, the first pressure sensing cell array disposed on said substrate surface, said second pressure sensing unit and the first pressure sensing means disposed corresponding to the lower surface of said substrate, said pressure sensing input module can simultaneously detect three-dimensional signal.

[0010] Preferably, the first pressure sensing unit and the second unit by a pressure sensing piezoresistive material formed in the form of a bent wire.

[0011] Preferably, the first pressure sensing means and the shape of the second pressure sensing means is a non-rotationally symmetrical pattern.

[0012] Preferably, the pattern and / or the second pressure sensing means sensing the first pressure unit designed for the maximum total length of wire in one direction, the direction of the first pressure sensing means and / or said a second sensing unit pressing direction, and the pattern of the second pressure sensing means sensing said first pressure means in one direction of the minimum total length of the wire, the direction is a direction b, wherein a direction of the b the vertical direction.

Pattern shape [0013] Preferably, the first pressure sensing unit and the second pressure sensing means comprises a wire-shaped oval, polygonal line, a curved shape, length and other multistage series linear, unequal multistage series linear or a combination thereof, or wherein the linear shaped return.

[0014] Preferably, the shape of the first pressure sensing means disposed corresponding to the second pressure sensing means are not the same.

[0015] Compared with the prior art, the present invention provides a pressure sensing input module or input pressure sensing means having at least the following advantages:

[0016] 1, the present invention provides a pressure sensing input module having a temperature compensation function, comprising a first pressure sensing means disposed in the second pressure sensing means and the upper and lower surfaces of the substrate, the first and second pressure sensing means and pressure sensing means disposed corresponding to the same material, at least a first pressure sensing means and the corresponding second pressure sensing unit provided with two peripheral reference resistor (resistor Ra and the resistor Rb) constituting the Wheatstone bridge.

[0017] The present invention is employed in a Wheatstone bridge to detect the pressing force value, a simple circuit structure, high control precision. Since the pressure-sensing unit constituting the first and the second pressure-sensing cells in the same material, therefore, the first pressure sensing means and the second pressure sensing means due to variations in the resistance value of the temperature changes satisfies brought (RF0 + △ RFO) ARCO + △ RCO) = RF0 / RC0, visible, since the first pressure sensing means and the second pressure sensing means is of the same material and constitute a Wheatstone bridge, the resistance value during the measurement, the temperature of the first and second pressure sensing means affect the resistance value of two pressure sensing elements can be ignored, the pressure sensing input module of the present invention may be provided fully compensate temperature induced resistance change due.

When the [0018] 2, the pressure sensing input device provided in the present invention, the substrate and a Young's modulus of the adhesive layer, the thickness of the influence of the pressure sensing means input neutral plane, the neutral plane of the substrate, the disposed strain sensing the pressure difference between the first major surface of the substrate unit and the second upper and lower pressure sensitive unit may reach a maximum value. Thus, the Young's modulus of the substrate is set to be larger than the Young's modulus of the adhesive layer is at least one order of magnitude under the conditions: (1) Young's modulus of the bonding layer is controlled within a range conducive to increasing the 0_3000MPa the strain difference △ ε; (2) the bonding layer has a thickness within the defined range 25_125μπι, the strain difference △ ε attached decrease as the thickness of the seal layer tended to increase; (3) defined in the thickness of the substrate when the range 50-450μπι, the difference in strain a ε with increasing thickness of the substrate tended to increase. Therefore, by adjusting the pressure sensing substrate and the Young's modulus of the adhesive layer and the thickness measurement of the input device, to increase the pressure differential strain sensing unit of the upper and lower surfaces of the substrate, so that more accurate detection of pressure, pressing strength detected more sensitive.

[0019] 3, a pressure sensing input module of the present invention provides in a first and second pressure sensing means is a pressure sensing means having a major axis and a minor axis direction and major axis direction of the bus is longer than the minor axis direction long bus designs. In the present invention, further to the shape of the first pattern unit and the second pressure sensing means comprises a pressure sensing winding elliptical shape, a polygonal line, a curved shape, length and other multistage series linear, unequal multistage linear series, back to the word type linear shape or the like or a combination thereof. When the finger is pressed (the pressing point) causes the first pressure-sensing unit or the second pressure sensing means is deformed, the first pressure or the second pressure sensing means sensing unit since the total length of the total length b and a direction different from a direction that a strain direction different from the direction b, it is possible to effectively increase the effect of change in resistance value, the first further layer of pressure sensitive or responsive to a second pressure sensitive layer is more accurate and more sensitive to pressure.

[0020] 4, a pressure sensing input module of the present invention is provided in order to achieve the first pressure-sensing strain cell and a second pressure difference between the strain sensing unit may reach a larger value, thereby increasing the pressure sensing pressure sensing module input detection sensitivity, in addition to the pattern by adjusting the shape of the first pressure sensing means and the second pressure sensing means may also be adjusted by arranging the first pressure-sensing means and the second pressure sensing means, thereby increasing or decreasing the strain sensing unit is a first pressure and the second pressure sensing means. Wherein, when the strain first pressure sensing means and the second pressure sensing means is a positive and negative, angle and angular range of angles al and a2 is 0 ° -45 °, a negative strain when the strain is the same, the angle al is 0 when ° -45 °, while the angle a2 is 45 ° -90 °, or normal strain when the strain is the same, the angle al is 45 ° -90 °, while the angle a2 is 0 ° -45 °. Further, in order to make the first pressure and the second pressure sensing means sensing a difference in strain between the units A ε is large, the shape may be defined by a relationship between the first unit and the second pressure sensing means sensing the pressure pattern. The above conditions may limit the strain variation value of the first pressure sensing means and the second pressure sensing unit maximum. A first pressure sensing means is pressed after a force, toward a strain in the direction is larger than the strain in the direction of B, thus, it facilitates the application of the first pressure sensing means and the second pressure sensing unit pressing force the resulting strain can be concentrated on a reflected direction, when the concentration of strain in the direction coincides with the direction of maximum strain in the region of the pressing force is generated, the strain may be a first and a second pressure sensing means sensing the pressure difference between the unit a ε is more, thereby more accurately reflect the size of the pressing strength, increasing the pressure detection sensitivity.

[0021] 5, the present invention, the pressure sensing module input pressure sensing a resistance which changes by a change in resistance causes a corresponding shape of the internal pressure sensing means, whereby the position and the size change amount of the resistance change is generated in accordance with to determine the pressing position and the pressing force level, both by the same pressure sensitive means for detecting the position (two-dimensional plane) and for detecting the power (the third dimension) is calculated, the simultaneous detection of three-dimensional. BRIEF DESCRIPTION

[0022] FIG IA is a schematic view of a layered configuration example of a pressure sensing input module first embodiment of the present invention.

[0023] FIG IB is a diagram illustrating the principle of detecting a pressure signal IA in FIG.

[0024] FIG IA is a diagram illustrating another IC pressure signal detected diagram.

[0025] FIG 2Α is a schematic view a second embodiment of a layered pressure sensing input module of the invention.

[0026] FIG 2Β is shown in FIG pressure sensing structure diagram of the input module by the pressing force after deformation 2Α.

[0027] As shown in FIG. 2C is a pressure sensing input module for each layer by Chart strain of the pressure 2Β.

[0028] FIG 3Α is a schematic view of a second embodiment of the present invention, the relationship between the first sensing unit and the pressure difference between the strain and the modulus of Young of the second adhesive layer pressure sensitive unit.

[0029] FIG 3Β is another schematic view of a second embodiment of the present invention, the relationship between the first sensing unit and the pressure difference between the strain and the modulus of Young of the second adhesive layer pressure sensitive unit.

[0030] FIG 3C is a second embodiment of the present invention, a first differential pressure sensing unit strain relationship with the thickness of the second adhesive layer and the pressure sensitive unit is not intended.

[0031] FIG 3D is a difference in the relationship between the strain and the thickness of the substrate of the second embodiment of the present invention in a first embodiment of the pressure sensing unit and the second pressure sensing unit is not intended.

[0032] FIG. 4 is a schematic planar structure of the present invention the pressure sensing input of the first module of the fourth embodiment of the pressure sensitive layer.

[0033] FIG 5Α is a plan view of the first embodiment of the pressure sensing layer pressure sensing input module of a fourth embodiment of the present invention and the pressing region.

[0034] FIG 5Β-5Ε strain is a schematic drawing area AD of the 5Α pressed.

[0035] FIG 6Α is a schematic view of a first planar structures single pressure sensing element 4 in FIG.

[0036] FIG 6Β is a schematic longitudinal direction and a longitudinal direction of the b direction in FIG 6Α first pressure sensing unit.

[0037] FIGS. 6C-6G are schematic structural modification of the first single pressure sensing unit of FIG. 4 embodiment.

[0038] FIG. 7A is a first pressure sensitive layer, the substrate, a schematic cross-sectional structure of the second layer of pressure sensitive fifth embodiment of a pressure sensing input module of the present invention.

[0039] FIG 7A FIG 7B is a strained structure shown - Thickness in FIG.

[0040] FIG. 8A is a schematic view of a major axis direction of the first pressure sensing means sensing a pressure input module shown in FIG. 6A.

[0041] FIG 8B is a schematic view of a major axis direction of the second pressure sensing means and the first pressure sensing unit disposed corresponding to FIG 8A. 【Detailed ways】

[0042] To make the objectives, technical solutions and advantages of the present invention will become more apparent, the following embodiments in conjunction with the accompanying drawings and examples, the present invention will be further described in detail. It should be understood that the specific embodiments described herein are only intended to illustrate the present invention and are not intended to limit the present invention.

[0043] Referring to FIG IA, a first embodiment of the present invention to provide a pressure sensing input module 10, which comprises a substrate and the upper and lower substrate 11 are positioned (in the present invention, the vertical position of the defining word to specify only the view 11 relative position) of the first surface of the pressure sensitive layer 12 and the second layer 13 of pressure sensitive. A first pressure sensitive layer 12 having at least a first pressure sensitive unit 121, is provided on the second pressure-sensitive layer 13 has at least one second pressure sensing unit 131, at least one first pressure-sensing unit 121 and at least a second pressure one correspondence sensing unit 131 is provided, wherein, in the present invention refers to a one to one each of the first pressure-sensing unit 121 and each of the second pressure sensing unit 131 correspond in number 11, and the upper and lower surface of the substrate on the distribution of positions and each of the first pressure-sensing unit 121 and each of the second pressure sensing unit 131 is a pattern shape is not limited. When the substrate 11 is pressed, the corresponding point at which the at least one first pressing unit 121 and the pressure sensing at least one second pressure-sensing unit 131 under pressure.

[0044] The first pressure-sensing unit 121 and the second pressure sensing unit 131, and the like due to deformation caused by pressing, shear strain or deflection response, thereby causing the at least one electrical properties changed, especially when the first pressure sensitive unit 121 and the second pressure sensing unit 131 formed by a piezoresistive material in the form of a bent wire, when pressed causes the first pressure-sensing unit 121 and a second region corresponding to the pressure sensing unit 131 changes the length of the wire , thereby affecting the resistance value of the first pressure-sensing unit 121 and the second pressure sensing unit 131.

Materials [0045] The first pressure-sensing unit 121 and the second sensing unit 131 includes a pressure such as silver, copper, wrong, gold and other metals and alloys, or indium tin oxide (Indium Tin 0xide, IT0), tin oxide shop (Antimony doped Tin Oxid e, AT0), indium zinc oxide (indium zinc 0xide, IZ0), zinc oxide wrong (Aluminum zinc 0xide, AZ0) and the like metal oxide, or graphene, meshes, silver nanowires or carbon nanotubes one or more of the like.

[0046] The substrate 11 may include, but are not limited to: a rigid substrate, such as glass, tempered glass, sapphire glass and the like; may be a flexible substrate, such as PEEK (polyetheretherketone, polyether ether ketone), PI (Polyimide, polyimide amine), PET (polyethylene terephthalate, polyethylene terephthalate), PC (polycarbonate, polycarbonate polycarbonate), PES (polyethylene glycol succinate, polyethylene succinate), PMMA (polymethylmethacrylate material, polymethylmethacrylate), PVC (Polyvinyl chloride, polyvinyl chloride), PP (polypropylene, polypropylene) and a composite of any two.

[0047] Pressure sensing input module 10 provided in each of the first pressure-sensing unit 121 corresponding to the internal resistance of a first embodiment of the present invention is RF0, RF1, RF2 ...... RFn, when receiving the pressing force, each a first pressure-sensing unit 121 corresponding to the internal resistance RF0, RF1, RF2 ...... RFn resistance vary; 131 corresponding to the internal resistance of the pressure sensing input of each module 10 is a second pressure sensing means RC0, RC1, RC2 ...... 1? 〇1 respectively with 1 ^ 0,1 ^ 1,1 ^ 2 ...... RFn-- disposed corresponding to both sides of the substrate 11, when receiving the pressing force , each of the second pressure-sensing unit 131 corresponding to the internal resistance RCO, RC1, RC2 ...... RCn resistance also changes. Wherein each of the first pressure-sensing unit 121 and each of the second pressure-sensing unit 131 is provided one-to-one correspondence to the number 11 indicates the upper and lower surfaces of the substrate and the distribution of positions, and each of the first pressure-sensing unit 121 and each of the pattern shape of two pressure-sensing unit 131 is not restricted.

[0048] In the present invention, the first ends of the wires 121 are pressure-sensing unit is electrically connected to a central signal processing (not shown), the wire ends 131 of the second pressure sensing means are electrically connected to the same signal processing center (not shown), which further comprises a first signal processing center reference resistor Ra, Rb and a second reference resistance multiplexer. By controlling the multiplexer, sequentially each of the first pressure-sensing resistor unit 121 RFn (where, n = 0,1,2 ··· η), a second pressure-sensing resistor means disposed corresponding 131RCn ( where, n = 0,1,2 ··· η) and the resistance Ra, Rb resistors constituting a Wheatstone bridge.

[0049] As shown in FIG IB and IC, the resistance RFn, RCn resistance, a first reference resistor Ra, a second reference resistor Rb is connected in two ways. As shown in FIG IB, one end of the resistor is connected to RFn a positive power supply terminal VEX +, and the other end of the first reference resistor Ra in series; RCn end of the resistor connected to the same positive power supply terminal VEX +, and the other end of the second reference resistor Rb connected in series; a first reference resistor Ra, and the other end is electrically connected to the second reference resistor Rb to the negative power supply terminal VEX- (or ground), a voltage meter for measuring the potential difference signal U0 RFn resistance, resistance to RCn. Or as shown in FIG IC, one end of the resistor is connected to RFn a positive power supply terminal VEX +, and the other end in series with the resistor RCn; One end of the first reference resistor Ra is connected to the same positive power supply terminal VEX +, and the other end of the first second reference resistor Rb connected in series; resistance RCn, the other terminal of the second reference resistance Rb is connected to the negative power supply terminal VEX- (or ground) voltage is used to measure a resistance RFn, a potential difference signal U0 of the first reference resistor Ra.

[0050] In the absence of the pressing force, each of the Wheatstone bridge is in equilibrium. When subjected to pressing force, the second pressure-sensing unit 131 changes the resistance of one or more first pressure sensing unit 121 at the corresponding positions and the corresponding set Wheatstone bridge balance is disturbed resulting in a potential difference output signal must occur UO changes, corresponding to different pressure changes of different resistance, also have respective different potential difference signal, therefore, by the potential difference signal UO Wheatstone bridge is calculated and process which can draw the appropriate pressure value.

[0051] As shown in FIG IB, the resistance of the RFO, the RCO resistor, the resistor Ra and resistor Rb resistive Wheatstone bridge, which relationship may be expressed as:

[0053] As shown in FIG IC, the resistance of the RFO, the RCO resistor, the resistor Ra and resistor Rb resistive Wheatstone bridge, which relationship may be expressed as:

[0055] In a first embodiment of the present invention, a pressure sensing input module, changes the relationship between resistance and temperature can be derived by the following equation: resistance R of the object is calculated as:

[0056] R = pL / S (1);

[0057] wherein, P represents a first composition as a pressure sensitive unit 121, the resistivity of the material of the second pressure sensing unit 131, L of the present invention, the first pressure-sensing unit 121, a length of the second pressure sensing unit 131, S a first pressure sensing unit 121, the cross sectional area of ​​the second pressure-sensing unit 131 of the current direction.

[0058] The composition of the present invention, the first pressure-sensing unit 121, temperature-dependent resistivity of the material of second pressure-sensing unit 131 P formula:

[0059] Pt = P (1 + αΤ) (2);

[0060] wherein, P is composed of a first pressure-sensing unit 121, the resistivity of the material of the second pressure sensing unit 131, [alpha] is the temperature coefficient of resistance, T is the temperature.

[0061] The combination of the above formula and the formula ⑴ ⑵:

[0062] When the resistance value when the ambient temperature is To (e.g., T = O), the object:

[0063] RT〇 = pL / S (3);

[0064] When the ambient temperature of a \, the resistance value of the object:

[0065] RT1 = PL / S (l + α (Ti-To)) ⑷;

[0066] by the aforementioned formula (I) - Formula (4) may be derived △ Rt materials affected by temperature resistance value can be expressed as the following formula (5):

[0071] where, △ T represents the temperature change.

[0072] Pressure sensing input module according to a first embodiment provided by the present invention 10, the Wheatstone bridge RFO, RCO, the relationship between Ra and Rb as represented by the formula ([Phi] and Formula (P) shown in FIG.

[0073] In the formula ([Phi], for example, when the resistance change amount of the second pressure sensing unit temperature change (temperature variation is represented as Δ T), a first pressure-sensing unit 121 provided thereto corresponding to positions 131, respectively of formula (6 ) and (7) shown in:

[0074] A RFO = Δ Τα X RFO (6);

[0075] ARCO = ATaXRCO (7);

[0076] by the above formula (1) - shown in the formula (8), the resistance change can be obtained a second pressure sensing unit of the first pressure-sensing unit 121 provided thereto position corresponding to 131 as represented by the formula (8):

[0078] ⑶ can be seen from the formula, the first pressure-sensing unit 121 of the second pressure-sensing unit 131 is constituted by the same material, the same amount of change in temperature, can be further derived formula ⑶ formula (9):

[0080] As can be seen from the above formula ⑶, the characteristics of temperature conductivity of view, the same material under the influence of the temperature change AT the same, which is a temperature coefficient of the same, when the first pressure-sensing unit 121 and the second the pressure sensing unit 131 using the same material, the resistance values ​​measured in the process, the temperature variation of the resistance value of the first 131 pressure sensing unit 121 and the second pressure sensing means and Δ RFO △ RCO be shown by the formula ⑶ cancel each other, and therefore, the effect of temperature on the pressure sensing module 10 is input to zero.

[0081] In the formula (P) as an example, with the formula ([Phi] is the amount of change in the temperature difference △ T is the time that:

DETAILED derivation [0082] wherein formula (10) and the formula ⑶ formula (9) the same, therefore, are not repeated here.

[0083] From the results of the above-described formula (9) and (10), and FIG. IB Wheatstone bridge configuration shown in FIG IC and the second pressure are the temperature of the first pressure-sensing unit 121 and its corresponding set of Effect of value zero resistance sensing unit 131, in order to achieve temperature compensation.

[0084] Further, according to the characteristics of the force transmitting point of view, since the first pressure-sensing unit 121 and the second pressure sensing unit 131 is divided into upper and lower surfaces of the substrate 11, the substrate 11 having a certain thickness, and therefore, the substrate 11 is subjected to pressing action after the deformation force which will lower the difference, and further provided that the deformation will produce a difference between a first pressure-sensing unit 121 and the second upper and lower surfaces of the pressure sensing unit 131. Further, the pressing force of the different channels, it causes the underlying substrate 11 and a first pressure difference sensing unit 121 and the second pressure deformation sensing unit 131 is not the same.

[0085] When no pressing force, and FIG. IB Wheatstone bridge shown in FIG IC in equilibrium. When subjected to pressing force, a first pressure-sensing unit 121 and / or the second pressure sensing unit 131 or a plurality of resistance changes, so that the Wheatstone bridge balance is disturbed resulting in output electrical signals must vary UO: the strength of the large contact pressure, the first pressure-sensing unit 121 having a large amount of change in the pressure sensing unit 131 and the second resistance; conversely, if the force of contact pressure is small, then the first sensing unit 121 and the pressure the second pressure sensing unit 131 has a smaller resistance value variation amount. Changing different resistance values ​​corresponding to different pressures, so that, by the output signals UO Wheatstone bridge is calculated and processed, i.e., the corresponding pressure value can be derived.

When [0086] In the present invention, when each of the first pressure-sensing unit 121 and each of the second pressure-sensing unit 131 is disposed in an array on the upper and lower surfaces of the substrate 11, the pressure sensing module may be input is not limited to the size of the pressing force detected, it may also be a signal for synchronous detection of the three-dimensional position of the pressing (two-dimensional plane) and the pressing force (the third dimension). After pressing, the shape of the internal pressure of the first sensing unit 121 and the second pressure-sensing unit 131 changes cause a corresponding change in the resistance, the pressing position can be determined and the size of the pressing force according to the size and the position change amount calculating resistance change generated detected by the first pressure-sensing unit 121 and the vertically disposed corresponding to the second pressure-sensing unit 131 detects both the position (two-dimensional plane) and for detecting the power (the third dimension) is calculated to achieve the three dimensions simultaneously.

[0087] In order to constitute an input means for sensing a pressure touch input, the pressure sensing input module requires in the first embodiment of the present invention is provided by adding other modules on the basis of 10. Further, since the pressing force and the deformation characteristics generated when the pressure sensing module 10 is input stack with other modules, each module for the thickness of the adhesive layer is bonded with the pressure sensing input module 10, Yang 's modulus and other parameters will affect the sensing sensitivity and accuracy pressure sensing module 10 is input magnitude pressure value.

[0088] Referring to FIGS. 2A- 2B, a second embodiment of the present invention provides a pressure sensing input device 20, which in turn includes a cover 24, a first adhesive layer 221, a pressure sensing input module 21 a second bonding layer 222 and a support layer 25. A pressure sensing input pressure sensing module 21 providing the input module like the first embodiment, includes a substrate 201 and a pressure sensitive layer disposed on the first substrate 201 and lower surfaces 202 and the second pressure sensitive layer 203, a first pressure comprising at least one first pressure-sensing unit 211 on the sensitive layer 202, the second pressure-sensing layer 203 comprises at least one second pressure sensing unit 212, a first pressure-sensing unit 211 and the second pressure sensing means related to this specific configuration 212 the same as the first embodiment the invention, is omitted here omitted.

[0089] The cover material 24 may be a hard cover, such as glass, tempered glass, sapphire glass and the like; may also be a soft cover, such as PEEK (polyetheretherketone polyether ether ketone), PI (Polyimide Polyimide ), PET (polyethyleneterephthalate polyethylene terephthalate), PC (polycarbonate polycarbonate), PES (polyethylene succinate, PMMA (polymethylmethacrylate polymethylmethacrylate) and any two complex materials thereof and the like.

[0090] The first bonding layer 221 and the second bonding layer 222 can use the OCA (optically clear adhesive, Optical Clear Adhesive) or the LOCA (liquid optical clear adhesive, Liquid Optical Clear Adhesive).

[0091] In further embodiments, the support layer 25 may further be a display layer, the display layer may include a liquid crystal display (LCD) device, an organic light emitting diode (OLED) device, an electroluminescent display (ELD) and the like.

[0092] Please refer to Figure 2B, is transmitted to the support layer 25 when the pressing force of the finger plate 24, the finger pressing the resulting layer by layer from top to bottom. Finger pressing process, the thickness and composition of the strain sensing device 20 within the respective layers of the input pressure sensation, relating to the material. In the present invention in which one embodiment, the thickness of the pressure sensing input device 20 is about 950μπι, finger pressing pressure sensing input device after 20, a pressure sensing input device on the surface 20 is represented as a zero thickness, and from while the pressure measured at the input device 20 sense the strain were measured, and the thickness of the corresponding pressure sensing strain input device 20 are compared, and the strain plotted as shown in FIG. 2C is obtained in (Elastic strain) - thickness FIG.

[0093] wherein the strain - the relationship between the thickness of the entire diagram is closely related to the structure of a laminated pressure sensing means sense input 20, in this embodiment, the pressure sensing means 20 includes an input plate 24, a first adhesive layer 221 , pressure sensing change parameter input module 21, the thickness of the second bonding layer 222 and support layer 25, any of the above layer, the Young's modulus, the corresponding variables are - the thickness of a graph diagram form impact, and therefore , should be variable as shown in Figure 2C - shows only the thickness of the graph charts is substantially similar to the structure under certain conditions.

[0094] Pressure sensing input device 20 includes at least one neutral surface (not shown), the neutral plane of the planar object the deformation under action of the force is zero, the strain is zero at the neutral plane, i.e., strain values zero. 2C shown at Z in Fig, 20 corresponding to the layer thickness strain pressure sensing point input means premises Z are zero, the neutral plane five pressure sensing input means corresponding to Z 20 are located at the cover plate 24 the first bonding layer 221, a pressure sensing input module 21, the second bonding layer 222 and support layer 25. The pressure sensing means 20 to input the neutral plane of the interface, the value of the strain can be divided into positive and negative strain strain (herein below and normal strain, which represent the negative strain deformed state of tension, compression).

[0095] FIG 2B in conjunction with FIG 2C shows that the strain on the surface (the upper surface of the cover 24) sensing a pressure input means when the finger is pressed, the corresponding 20 1.7225e-5;

[0096] in the cover 24, the strain is gradually increased by the negative strain - zero strain - positive strain variation;

[0097] I herein corresponding strain plate 24 is bonded to the first bonding layer 221 strain, and the strain reached the maximum bonding surface 1.6478e-5;

[0098] In the first bonding layer 221, the strain is gradually decreased, the trend is positive strain - zero strain - negative strain;

[0099] Π spaces 221 and the pressure sensing strain value of the strain value corresponding to a first bonding layer bonding the measured input module 21, the strain of the strained bonding negative direction and is close to zero;

After the [0100] pressure sensing within the input module 21, the strain is gradually increased and reaches a certain value (about 5e_5), with increasing magnitude of the strain without increase of the thickness;

[0101] m corresponding to the strain used herein is a pressure sensing input module 21 with the corresponding strain in the second bonding layer 23 bonding strain value, the bonding surface of about 5e-5;

[0102] In the second bonding layer 222, the strain is gradually decreased, the trend is positive strain - zero strain - negative strain;

[0103] IV premises bonding strain value of the second bonding layer 222 and the support layer 25 corresponding to the strain, the strain of the corresponding bonding surface of about -9.7e-6;

[0104] 25 within the support layer, the strain is gradually increased, the change trend is negative strain - zero strain - positive strain.

[0105] visible, pressure sensing input device 20, the first bonding layer 22 and the cover plate 24 and the junction with the pressure sensing input module 21, a second bonding layer 23 and a pressure sensing module 21 and the input the bonding of the support layer 25, the trend of change of strain occurred, the strain changes from positive to negative or from negative to positive changes, visible, a first bonding layer 22 and a second bonding layer 23, the pressure strain sensing input device 20 decreases, since the first bonding layer 22, a second bonding layer 23 is engaged with the pressure sensing input module 21, therefore, the first bonding layer 22 and the second bonding layer 23 is a pressure sensing Effects of strain sensing input module 21 is reduced smaller, the pressure can enter the sensing module 21 is larger strain values.

[0106] - a plurality of first pressure-sensing unit 201 is provided to a corresponding upper and lower surfaces of the substrate 211 and the second pressure sensing unit 212 by pressing the larger pressure difference before and after the strain, the greater the difference in the resistance values ​​corresponding to pressure sensing means to obtain an input size of the pressing strength superior sensitivity 20.

[0107] In practical application level, the five-layer structure of the pressure sensing input device 20, by the first bonding layer 221, the second bonding layer 222 and the first pressure-sensing unit 211 and the second cell layer 212 of pressure sensitive engaging the first pressure-sensing unit 211 and the second layer of pressure sensitive unit 212 is provided on the upper and lower surfaces of the substrate 201, and the first bonding layer 221, the second bonding layer 222 and the substrate material optionally up to 201, and thus where these selected three main material to be introduced only in the present invention.

[0108] Please refer to Figure 3A, a first modification of the second pressure sensing input apparatus embodiment of the present invention provides 20, Young's modulus E1 of the substrate 201 is 73.3GPa, a thickness of the substrate 201 is preferably 100μm. Bonding layer 22 (which includes a first bonding layer 221 and / or the second bonding layer 222) thickness is 50μπι, the Young's modulus range paste bonding layer 22 is 100-3000MPa, Young's modulus of the substrate 201 E2 ratio of the Young's modulus Ei large bonding layer is at least an order of magnitude, i.e. Ei / E2> 10; modification in the present embodiment:

[0109] Ei / E2> = 24.4;

Young's modulus [0110] The bonding layer 22 compared to the Young's modulus of the substrate 201 is very small, visible, layer 22 is bonded to the substrate 201 and the characteristic difference between the larger, first pressure sensitive disposed on the substrate 201 the pressure sensing unit 211 and the second magnitude of the strain unit 212 is easier to reflect changes in the substrate 201, a strain which tended to increase, therefore, possible to obtain a larger difference in strain Δε. A first pressure sensing means is a strain difference between the pressure sensing unit 211 and the second stick 212 Δε decrease as the Young's modulus of the bonding layer 22 is raised, wherein, when the Young's modulus of the bonding layer 22 is IOO- IOOOMPa, the difference in strain Δε paste with reduced Young's modulus of the bonding layer 22 is significantly increased.

[0111] After much research and concluded as follows: Young's modulus of the substrate 22 is at least greater than a fixed value and Young's modulus of bonding paste layer 22 is at least one order of magnitude, the difference △ ε and strain bonding layer 22 Young's modulus of the negative correlation.

[0112] In a further embodiment, the value of EVE2 more preferably greater than or equal to 100.

[0113] Referring to FIG 3ss, a second modification of the pressure sensing embodiment of the input device of the second embodiment of the present invention provides 20, which is the difference between the above-described embodiment compared to the first modification in that the Young's modulus of the substrate 201 only as 6000MPa, when the Young's modulus of the adhesive layer 22 is 1000_3000MPa, Young's modulus of the substrate 201 and the Young's modulus E1 bonding layer 22 is 2-6, EVE2 value of less than 10. A first pressure sensing means disposed on the substrate 201 a 211 a second pressure sensing unit 212 are associated with the magnitude of the strain the adhesive layer 22 and the substrate 201, since the seal layer attached to the Young's modulus Young's modulus of the substrate 22 is 201 the amount of difference is small, when the bonding layer 22 and the substrate 201 properties (e.g., elastic properties) similar, a difference in strain between the irregular variation of the first pressure-sensing unit 212 and the second pressure sensing unit 211, visible, when the substrate 201 YANG E1S's modulus smaller value, and the ratio of Young's modulus of the adhesive layer 22 is less than E2, 10, attached to the Young's modulus of the bonding layer 22 to increase the difference in strain Δε had no significant effect.

[0114] Please refer to Figure 3C, a third modified embodiment of the pressure sensing embodiment of the input device of the second embodiment of the present invention provides 20, which is the difference between the above-described embodiment compared to the first modification in that the adhesive layer thickness in the range of 22 25-125μπι, the first unit 211 and the second pressure sensing unit 212 sensing the pressure difference between the strain variation Δε and the bonding layer 22 is inversely proportional to the thickness. Since the adhesive layer 22 causes the first pressure-sensing unit 211 and a strain value corresponding to a second set of pressure sensitive unit layer 212 becomes small, and therefore, the thinner the adhesive layer 22, which is the first 211 and the second pressure sensing means Effects of two pressure-sensing unit 212 becomes small, thereby allowing greater difference △ strain [epsilon], but the thickness of the adhesive layer 22 corresponding to a change △ deteriorated impact is much smaller than [epsilon] Young's modulus of the adhesive layer 22 is deteriorated corresponding △ the impact of ε. When the adhesive layer thickness in the range of less than 22 25μπι, since the adhesive layer 22 is too thin, will not play a role in the bonding, does not close the engagement between the inner structure of each sensing the input device 20 sense the pressure, the pressure is reduced quality sensing input device 20; and when the adhesive layer thickness in a range greater than 22 125μπι, since the thickness of the seal layer 22 attached is too large, the pressure sensing input device 20 is pressed in a force, the first pressure sensitive unit 211 and a strain value corresponding to a second set of pressure sensitive unit layer 212 are reduced, since both the value becomes smaller, the difference between the two (i.e., difference in strain a ε) becomes smaller accordingly.

[0115] Please refer to Figure 3D, a fourth modification of the pressure sensing embodiment of the input device of the second embodiment of the present invention provides 20, which is the difference between the deformation of the first embodiment in that the thickness range of the substrate as compared to 50- 201 when 450μπι, the first pressure-sensing unit 211 and the second pressure sensing means and the strain difference Δε thickness of the substrate 201 changes in proportional to the size of 212. Due to the greater thickness of the substrate 201, 201 is provided at a first pressure sensitive positive correlation between the substrate unit 211 and the second upper and lower surfaces of the pressure sensitive difference in strain Δε value of the substrate 201 and the strain unit 212, the greater the thickness, the substrate 201 strain the greater should be the greater variation △ ε. However, the substrate 201 is too thick will affect the upper and lower surfaces of the first pressure-sensing unit 211 and the overall thickness of between 212 and the temperature compensation effect device 201 of the second substrate a pressure sensitive means, therefore, when the substrate thickness in the range of 201 50_450μπι, strain difference Δε positive correlation with the thickness of the substrate 201.

[0116] When the thickness of the substrate is less than 201 50μπι, since the pressure sensing input device 20 is too thin, so that the difference in strain Δε is provided between the substrate 212 pressure-sensing unit 201 of the first major surface 211 and the second vertical pressure sensing unit value is small, can not effectively sense the size of the sensing pressing strength; and when the thickness of the substrate is greater than 450μπι, not only will the overall thickness of the pressure sensing means sense input 20 is too large, but also that the first pressure-sensing unit 211 and the second pressure sensing means between the different temperature variation 212, so that the influence of the temperature compensation effect.

[0117] The third embodiment of the present invention provides a pressure sensing input device, which differs from the second embodiment in that the present embodiment can be obtained by adjusting the thickness of each structural device and a pressure sensing input YANG 's modulus, so that the pressure sensing input apparatus overall configuration wherein at least one of a neutral plane situated mechanical neutral plane of the substrate, wherein the neutral plane of the pressure sensing module input zero strain plane, so, the second pressure is provided and a strain sensing unit (not shown) a first pressure sensing unit (not shown) for the upper and lower main surface of the substrate a positive and negative, and therefore, under the same pressing force, strain difference between the first pressure sensing means and the second pressure sensing means is greater than the Δε is a strain with the same positive or negative, having a first pressure increasing unit and a second sensing means sensing the pressure difference in strain a ε advantages .

[0118] Furthermore, the optimum thickness of each program by the Young's modulus of the overall structure of a unique design such that a neutral plane, and is located in the neutral plane of the substrate mechanics. I.e., the overall configuration of the mechanical center of symmetry is located in the neutral mechanical surface of the substrate, thus, can at the same pressing pressure, strain sensing means and the pressure difference between the first pressure sensing means Δε second biggest advantages. Thereby effectively increase the pressure sensing input of the pressure sensing module sensitivity.

[0119] The size of each of the stress differential pressure sensing a first pressure sensing means and the second input module, the pressure sensing unit disposed in correspondence thereto (not shown) in addition to the neutral position and the surface of the substrate, bonding layer For the outside, as well as a first pressure sensing means and the second pressure sensing means and arranged in a pattern shape manner about the thickness and Young's modulus.

[0120] Referring to FIG 4, a fourth embodiment of the present invention provides a pressure sensing input module 40, which differs from the first embodiment in that the pressure sensing layer disposed on the first pressure sensitive array 42 has a first distribution unit 421, in FIG. 4 only the first pressure-sensing means 5 X 9 rows of the array 421 will be described as an example, the actual number is not limited. Input by the pressure sensing module 40 is a rectangular (non-circular), subject to influence of the shape, so that different areas on the plane of the first layer 42 of pressure sensitive, force is pressed in the degree of deformation in each direction is not the same, which has a maximum degree of deformation in one direction, and having a minimum degree of deformation in the other direction. Wherein the degree of deformation of the shape of the pattern and size of the pressure sensitive unit concerned. Further, in order to enhance the sensitivity of the pressure sensed is the preferred design of the first pattern of the pressure sensing unit 421 has a maximum length in a direction along the maximum degree of deformation (the maximum strain direction).

[0121] In particular, see Figure 5a, when a finger presses the pressure sensing input module 40, 42 by the force of the first pressure-sensitive layer, will have some deformation. Since the common pressure sensing input module 40 is a square (non-circular, circular rotation invariance), does not have a rotation invariance, subject to influence of the shape, so that each point on plane 42 by a first layer of pressure sensitive degree of strain after the pressing force in each direction is not exactly the same, which may have a maximum strain in one direction, a direction perpendicular thereto and the other having a minimum strain, the degree of strain between the two other directions. Which defines the maximum degree of deformation in the direction of a region is the region of maximum strain direction, and in the area for minimal deformation in the direction of minimum strain direction of the region in which the maximum and minimum strain strain direction mutually perpendicular directions .

[0122] In the pressure sensing input module 40 without rotational invariance, the plane 42 a first layer of pressure sensitive regions of maximum strain in different directions are not necessarily the same, specifically exemplified as follows: the pressing force in the region were selected are located at the center (shown at a in FIG. 5A) a first pressure sensitive layer 42, the diagonal (shown at B in FIG. 5A), the midpoint of the long side (shown at C in FIG. 5A), at the midpoint of the short side (shown at D in FIG. 5A).

[0123] When the pressing force is positioned at the center region of a first pressure sensitive layer 42, the direction of maximum strain at the center as shown in Figure 5B in the direction S, the maximum strain direction S with the first layer 42 of pressure sensitive parallel to the longitudinal direction;

[0124] When the pressing force of the pair of corner region is located at a first pressure sensitive layer 42, the angle of the direction of maximum strain at 5C in a direction indicated by S in FIG angle, angle of maximum strain direction S by the pair vertical diagonal corner joint;

[0125] When the pressing force region located in the longitudinal midpoint of the first pressure-sensing layer 42, where direction of maximum strain in the direction shown in FIG Sk, Sk direction of maximum strain of the first layer 42 of pressure sensitive perpendicular to the longitudinal direction;

[0126] When the pressing force region located at the midpoint of the short side of the first pressure sensitive layer 42, where direction of maximum strain in the direction shown in FIG. 5E § no, not the direction of maximum strain of the first pressure sensing § parallel to the longitudinal direction of the layer 42.

[0127] the pressing force in the region of the embodiment shown only at the center in FIG. 5B- a fourth embodiment of the present invention, FIG. 5E, on the corner, at the midpoint of the long side and the short side at the midpoint to the maximum stress direction description, the pressing force of the actual area not limitation, in a further embodiment, also multi-point simultaneous pressing operation, the direction of maximum stress a fourth embodiment of the present invention may incorporate what is shown in the embodiment drawn.

[0128] The description of the direction of maximum strain of the first pressure-sensing layer 42 also apply pressure to the second sensing layer (not shown), depending on the pressure sensing laminated structure of the input module 40, when subjected to the same pressing force, 42 corresponding to a second region of the layer of pressure sensitive direction of maximum strain of the first pressure sensitive layer is typically the same.

[0129] Example embodiments of the first pressure-sensing unit 421 and the shape of the second pressure sensing unit (not shown) in a non-rotational symmetry of this pattern.

[0130] Referring to FIG 6A-6B, a first embodiment of the fourth embodiment of the pressure sensing unit 421 of the present invention is an oval-shaped winding, wherein the longitudinal direction of the first pressure-sensing unit 421 is a direction (i.e., the first pressure sensitive unit 421 along a direction of the maximum overall length La), b is the minor axis direction, a direction (i.e., the total length of the first pressure-sensing unit 421 in the direction b minimum Lb), in one embodiment, a direction perpendicular to the direction b.

[0131] The first pressure-sensing unit having the above-described elliptical-shaped bobbin 421 toward a direction of the maximum overall length, total length toward the minimum in the b direction, when pressed towards the strain in the direction is larger than a toward b strain direction, thus, facilitates the application of strain by the pressure generated in the first pressure sensing unit 421 may be embodied in one direction, so that the first pressure-sensing unit 421 of greater deformation. Since the first pressure-sensing unit 421 focused is deformed in a single direction, it is possible that the resistance value of the first pressure-sensing unit 421 RFn larger compared to the initial state changes occur, thereby more accurately reflect the size of the pressing intensity.

A pattern density greater [0132] Further, since the first pressure sensitive unit 421 is oval-shaped winding, in a unit area of ​​the first pressure-sensing unit 421 is compared to the pattern density of a single linear strip, therefore, when pressed by a finger, the first pressure deformation sensing unit 421 is larger, so the higher the pressure sensing unit 421 of the first pressure detection sensitivity.

[0133] Refer to 6C, the first pressure-sensing means having a further modified embodiment: a modification wherein the difference between the above-described first embodiment and the modification of the first embodiment in that the pressure sensing means is a fold line 421c, a first pressure sensing means maximum fold line pattern 421c total length in one direction, this direction is the direction of a first pressure-sensing unit 421c in one direction fold line pattern of the minimum overall length, this direction is the direction b, where, a direction perpendicular to the direction b. A first pressure-sensing unit 421c direction is the long axis direction of the first pressure-sensing unit 421c, b pressing direction of the first sensing unit 421c is a short-axis direction of the first pressure-sensing unit 421c.

[0134] The first pressure sensing unit 421c is pressed after a force, toward a strain in the direction is larger than the strain in the direction b towards, so conducive applied to the first pressure sensitive unit 421c of the pressing force It may be embodied deformable in one direction, so that the first pressure sensing unit 421c larger deformation, thereby more accurately reflect the size of the pressing intensity.

[0135] In the deformation of the pressure sensitive unit, an elliptical shape by winding the wire segments are most arc produced in the manufacturing process easier, and less prone to damage, more applicable.

[0136] shape of the first pressure-sensing unit 421 may also be other linear as: curved (FIG. 6D, a first pressure sensing means 421d), as long as the multistage linear series (a first pressure sensing FIG. 6E unit 421e), unequal multistage linear series (first pressure-sensing unit 421f in FIG. 6F) or return line shaped (FIG. 6G first pressure sensing unit 421g) shape. A first pressure-sensing deformation of the shape of the pattern unit 421 also applicable to other embodiments of the present invention in embodiments. For the above defined a first pressure-sensing unit 421 and the pattern shape modification applies to the second pressure sensing unit (not shown).

[0137] In the first to fourth embodiments of the present invention, when the laminated structure is determined after a complete input of the pressure sensing device and a material of each layer, the strain value of the pressure sensing input device and the structure of layers the thickness of the pressure sensing input relationship is determined the overall configuration of the apparatus, i.e., the specific number and position of the neutral plane of the entire configuration of a pressure sensing input means is also determined, as in the second, the third embodiment of the present invention, by pressure sensing means to adjust the input layer and the substrate bonded Young's modulus and thickness, so that the neutral plane can be located or is not located within the substrate.

[0138] Please refer to FIGS. 7A, in the fifth embodiment of the pressure sensing input module 50 of the present invention comprises a substrate 51 on the upper surface, the lower surface of the first substrate 51 is provided with a substrate 51, a first pressure sensitive layer 52 is provided the second layer of pressure sensitive pressure sensitive layer 52 disposed corresponding to 53, wherein the first pressure sensitive layer 52, the entire thickness of the second substrate 51 and the pressure sensitive layer 53 is T. A first pressure sensitive layer 52 and the second pressure-sensing layer 53 includes at least one first pressure-sensing unit 521 and at least one second pressure-sensing unit 531, a first pressure-sensing unit 521 and the second pressure-sensing unit 531 with the above-described embodiment the same, are not repeated here.

[0139] Referring to FIG. 7B, when the sensed pressure is determined after the input module 50 at which a complete pressure-sensing input device and the structure of each material, when subjected to the pressing force, the structure of each pressure sensing device sensing its corresponding input trends strain relationship is determined, where only selected pressure sensing input module 50 (the abscissa is the thickness T of nm in thickness) strain - thickness line, wherein, [eta] at the corresponding first pressure sensing layer 52 is located position within the thickness of the pressure sensing input module 50, m corresponds to a second pressure at the sensing layer 53 in the pressure sensing position within the thickness of the input module 50 (by the first pressure sensitive layer 52 and the second pressure-sensitive layer 53 to the substrate the smaller thickness, here expressed in only one dot).

[0140] FIG. 7B strain - VI shown at the relationship between the thickness of the line, the pressure sensing embodiment of the present fifth embodiment input module 50 of the first modification of the embodiment of the invention: the input module when the pressure sensing surface 50 is a neutral when positioned within the substrate 51, the first pressure-sensing unit 521 strain is negative strain (i.e. compression), the second pressure-sensing unit 531 strain is positive strain (i.e. stretched state). To the first pressure-sensing strain between the unit 521 and the second pressure sensing unit 531 Delta] [epsilon greater, preferably from the pressure sensing unit 521 of the first strain of the absolute value of the absolute pressure sensing unit 531 and the second strain of values ​​are maximum.

[0141] In order to increase the pressure sensing unit 521 of a first strain and the second pressure sensing unit 531 should be variable by adjusting the long axis direction of the first pressure-sensing unit 521, the major axis direction of the second pressure-sensing unit 531, respectively area maximum strain direction parallel thereto or only to a small angle, in order to achieve the adjustment value a ε strain difference between the size of the first pressure-sensing unit and the second pressure sensing means.

[0142] wherein the angle between the longitudinal direction defining a first pressure-sensing unit 521 is a region where the first pressure-sensing unit 521 in the direction of maximum strain angled al. The angle between the direction of maximum strain in the long axis direction of the second pressure-sensing unit 531 is provided with a first pressure sensing unit 521 corresponding to an angle thereto Area of ​​a2, where the angle a2 is the angle of the angle al free directionality, i.e. it in the range of 0 ° -90 °. In the present embodiment, the angle al and an angle a2 is preferably 0 ° _45 °, may also be 0 ° _20 °, may further be square ° _1〇 °, optimally 0 ° (i.e., the first pressure-sensing unit 521 and major axis direction of the second pressure-sensing unit 531 are disposed in parallel to the direction of maximum strain region located therebetween).

[0143] Further, when the maximum strain of the long axis direction of the first pressure-sensing unit 521 and a first pressure sensitive layer 52 are the same, the first variable can be the largest absolute pressure sensing unit; when the second pressure the direction of maximum strain axis direction sensing unit 531 and the second pressure sensitive layer 53 are the same, the second pressure-sensing unit 531 can make the absolute value of the maximum strain. The strain sensing unit 521 of the first pressure and the second pressure sensing unit 531 is a positive and a negative premise, the difference △ ε strain can first pressure sensing unit 521 and the second pressure sensing unit 531 to obtain a larger value.

When [0144] In a further modified embodiment, when the entire structure of the pressure sensing module 50 which input a pressure sensing device having only one input neutral plane, and located in the center of the mechanical surface of the substrate 51, a first pressure sensing means the strain with the strain sensing unit is a second pressure reaches a maximum absolute value, the difference △ ε between the two maximum strain.

[0145] FIG 7Β strain - Relationship between the thickness of the V and W-curve is as follows: When the (S Jie sensing the pressure within the substrate 51 in the input module 50 is not located in any of a neutral plane strain ε '= 0 and [epsilon] strain "= square plane of the substrate 51 are not in), while the neutral plane is located above the substrate 51 closest to substrate 51 or below, the strain will determine the strain sensing unit 531 and the second pressure to the first pressure sensing unit 521 the same strain or the same negative positive strain.

[0146] FIG 7Β V in the illustrated embodiment the pressure sensing input module 50 of the second modification of the fifth embodiment of the present invention embodiments Example: When a strained first pressure sensing unit 521 and the second pressure sensing unit 531 with negative strain, in order to make the first pressure-sensing strain greater the difference between △ unit 521 and the second pressure sensing unit 531 ε, necessary to make the strain sensing unit is a first large absolute pressure, the second pressure the absolute value of the strain sensing unit is small, thus, the strain difference △ ε between the two larger.

[0147] In order to increase the pressure of the first sensing unit 521 the absolute value of strain, angle of maximum strain in the direction of the long axis direction of the first region of the pressure sensing unit 521 where the angle al therewith optionally 0 ° _45 °, further may be 0 ° -20 °, may further be (Γ-ΐΟ% and optimally 0 ° (longitudinal direction i.e. the direction of maximum strain of the first pressure-sensing unit 521 are disposed in parallel therewith area); in order to reduce a second the pressure sensing unit 531 the absolute value of strain, angle of direction of maximum strain of the longitudinal direction of the second region of the pressure sensing unit 531 where its angle a2 is preferably 45 ° -90 °, 70 ° -90 ° may also be , may further be 80 ° -90 °, and optimally 90 ° (i.e., the major axis direction of the second pressure-sensing unit 531 in the direction of maximum strain of vertically disposed thereto area).

[0148] As shown in FIG. 8A-8B, the embodiment in the present embodiment, the first layer 52 of pressure sensitive graphics arrangement embodiment shown in Figure 8A, the second pressure sensitive layer pattern 53 is arranged in a manner as shown in FIG 8B Fig.

[0149] Since the pressing force under the action of the same, the pressure sensing unit subject to the same stress, strain pressure sensing the actual size of a unit and its pattern shape, material properties, and set the total length of the pattern toward the size a, b direction related. Thus, in addition to adjusting the angle of the major axis direction by the pressure sensing means and the maximum strain direction, it may also be adjusted by the first pressure-sensing unit 521 and its corresponding set of pattern shape of the second pressure-sensing unit 531, as follows:

[0150] The first pressure-sensing unit 521 and the second pressure-sensing unit 531 is set to be different pattern shape, and the shape of the pattern should satisfy the following relation:

[0151] L_ha / Liib> LiWiLTb

[0152] wherein, Lila expressed as a first pressure sensing unit 521 toward a direction of the total length, Lilb b represents the total length towards the direction of the first pressure sensing unit 521, Lfa denoted as a second pressure sensing unit 531 toward the the total length of a direction, Lrb b represents the total length towards the direction of the second pressure sensing unit 531.

[0153] By adjusting between the first and the second pressure-sensing unit 521 sensing the pressure unit 531 toward a relationship between the ratio of the total length of the direction toward the total length of the direction b, so that the first strain of the pressure sensing unit 521 compared a second pressure sensing unit 531 is more concentrated in one direction, so as to obtain a greater strain.

[0154] combination of the two adjustment mode, when the strain sensing unit 521 of the first press and the second press strain sensing unit 531 with the negative strain, the strain can be obtained a larger difference Δ ε.

[0155] As shown at W, according to a third modified embodiment of the pressure sensing input module 50 a fifth embodiment of invention embodiments Example: When a strained first pressure sensing unit 521 and the second pressure sensing unit 531 is the same positive strain, in order to make more strain sensing a first pressure difference △ between the unit 521 and the second pressure sensing unit 531 ε, it is necessary to first pressure-sensing unit 521 is smaller absolute value of strain, the second pressure sensing means 531 is a large absolute value of strain, such strain difference △ ε between the two larger.

[0156] difference between the second embodiment and the modified embodiment of the present modification comprising:

[0157] (-) direction of angle of maximum strain the longitudinal direction of the first pressure-sensing unit 521 thereto al Area angle is preferably 45 ° -90 °, may also be a 70 ° -90 °, may further be 80 ° -90 °, and optimally 90 ° (i.e., the major axis direction of the first pressure-sensing unit 521 is disposed perpendicularly to its direction of the area where the largest strain); and the axial direction of the maximum of the second pressure-sensing unit 531 area of ​​its strain direction angle is an angle a2 is preferably 0 ° -45 °, may also be 0 ° -20 °, may further be (Γ-ΐΟ% and optimally 0 ° (i.e., the pressure sensing unit 531 of the second length maximum strain and the axial direction are disposed parallel thereto area) in the present embodiment, the first layer 52 of pressure sensitive arrangement pattern shown in FIG 8Β embodiment shown, the second pressure sensitive layer pattern 53 is arranged in a manner such as 8Α shown in FIG.

[0158] (b) a first pressure-sensing unit 521 and the second pressure-sensing unit 531 is set to be different pattern shape, and the shape of the pattern should satisfy the following relation:

[0159] Liia / Liib <Ll ^ a / LTb

[0160] wherein, Lila expressed as a first pressure sensing unit 521 toward a direction of the total length, Lilb b represents the total length towards the direction of the first pressure sensing unit 521, Lfa denoted as a second pressure sensing unit 531 toward the the total length of a direction, Lrb b represents the total length towards the direction of the second pressure sensing unit 531.

Same as [0161] Other modified content to the second embodiment, which is not repeated herein. Combination of the two adjustment mode, when the first pressure-sensing unit 521 strain and the strain in the second pressure sensing unit 531 is the same as the normal strain, the strain may be given greater difference Δ ε〇

[0162] Compared with the prior art, a pressure sensing input module of the present invention provides 10 (40 or 50) or pressure sensing means 20 having an input of at least the following advantages:

[0163] 1, the present invention provides a pressure sensing input module having a temperature compensation function 10, which comprises a first pressure sensing means disposed in the upper and lower surfaces 11 of the substrate 121 and the second pressure sensing unit 131, a first pressure sensitive unit 121 and the second pressure-sensing unit 131 is provided corresponding to and the same material, at least a first pressure sensing means 121 and its corresponding set of second pressure sensitive unit 131, and the two peripheral reference resistors (resistor Ra and resistor Rb) Wheatstone bridge.

[0164] The present invention is employed in a Wheatstone bridge to detect the pressing force value, a simple circuit structure, high control precision. Since the pressure-sensing unit constituting the first material 121 and a second identical pressure sensing unit 131, therefore, the first pressure-sensing unit 121 and the second sensing unit 131 due to the pressure change meets a resistance value caused by temperature changes in (RF0 + Δ RFO) ARCO + Δ RCO) = RFO / RC0, visible, since the first pressure-sensing unit 121 and the second pressure sensing unit 131 is the same material and constitute a Wheatstone bridge, the resistance value during the measurement, the temperature of the first affect the resistance value of a pressure sensing unit 121 and the second pressure sensing unit 131 can be ignored, the pressure sensing module of the present invention, the input 10 may be provided fully compensate temperature induced resistance change due.

[0165] 2, the pressure sensing device of the present invention provides an input 20 of the substrate 201, and a Young's modulus of the adhesive layer 22, thickness on the neutral surface of the pressure sensing input device 20, the neutral plane of the substrate 201 when disposed in the first pressure-sensing unit 201 of the upper and lower main surfaces of the substrate 211 and the strain between the second pressure sensing unit 212 can be maximized. Thus, the Young's modulus of the substrate 201 is set larger than the Young's modulus of the adhesive layer 22 is at least one order of magnitude under the conditions: (1) The Young's modulus of the adhesive layer 22 is controlled within a range conducive to increasing the 100_3000MPa big difference between the strain Δ ε; (2) the bonding layer 22 has a thickness in the range defined 25-125μπι, the strain difference △ ε paste as reducing the thickness of the seal layer 22 tended to increase; (3) when the thickness of the substrate 201 is defined in the range 50-450μπι, the difference in strain eight £ 201 increases as the thickness of the substrate tended to increase. Therefore, by adjusting the pressure sensing means sense input 20 of the substrate 201 and the bonding layer 22 has a thickness and Young's modulus is, to increase the pressure differential strain sensing unit 201 of the upper and lower surfaces of the substrate, so that more accurate detection of pressure , pressing strength detected more sensitive.

[0166] 3, the pressure sensing module of the present invention provides an input 40 of the first pressure-sensing unit 421 and the second pressure sensing means having a long axis direction and short axis direction, and the longitudinal direction of the bus is longer than the minor axis bus length direction pattern design. In the present invention, the pattern shape is further press the first sensing unit 421 and the second pressure sensing means comprises a wire-shaped oval, polygonal line, a curved shape, as long as the multistage linear series, unequal multistage linear series, back shaped linear shape. When the finger is pressed (the pressing point) the pressure sensing unit 421 causes the first or the second pressure-sensing unit generates a strain at the first pressure-sensing unit 421 or the second pressure sensing unit since the total length of the major axis to the minor axis direction, a direction b of different overall lengths, which is a direction different from the direction b of strain, and therefore can effectively increase the effect of change in resistance value, the first further layer of pressure sensitive or pressure sensitive layer in response to a second pressure of more accurate and more sensitive.

[0167] 4, a pressure sensing input module of the present invention provided 50, in order to achieve a difference between the first pressure-sensing strain strain unit 521 and the second pressure sensing unit 531 can reach a large value, whereby improved pressure sensing module 50 input detection sensitivity, in addition to the pattern by adjusting the shape of the first pressure-sensing unit 521 and the second pressure sensing unit 531 may also be adjusted by the first pressure-sensing unit 521 and the second pressure-sensing unit 531 the arranging manner, to increase or decrease the pressure of the first sensing unit 521 and the second pressure-sensing unit 531 to be variable. Wherein, when the strain of the first pressure-sensing unit 521 and the second pressure-sensing unit 531 is a positive and negative angle of the angle range of angles al and a2 to 0 ° _45 °, when the same strain is negative strain, as the angle al when 0 ° -45 °, while the angle a2 is 45 ° -90 °, or normal strain when the strain is the same, the angle al is 45 ° -90 °, while the angle a2 is 0 ° -45 °. Further, in order that the first pressure-sensing unit 521 and the strain between the second pressure-sensing unit 531 Delta] [epsilon large, also defined by the relationship between the shape pattern of the first pressure-sensing unit 521 and the second pressure-sensing unit 531 . Limiting the foregoing conditions can make the first pressure-sensing unit 521 strain change value and the second pressure sensing unit 531 is a maximum. A first pressure-sensing unit 521 after being subjected to the pressing force toward a strain in the direction is larger than the strain in the direction of B, thus, it facilitates the application of the first pressure-sensing unit 521 and the second pressure-sensing unit 531 the pressing force generated by the strain can be concentrated on a reflected direction, when the concentration of strain in the direction coincides with the direction of maximum strain in the region of the pressing force is generated, it can be the first pressure-sensing unit 521 and the second pressure-sensing Δε is strain difference unit 531 more, thus more accurately reflect the size of the pressing strength, increasing the pressure detection sensitivity.

[0168] 5, in the present invention, a pressure sensing input modules 10, 40 and 50 and a pressure sensing input device 20, are made of a resistive pressure sensing, the resistance of which causes the corresponding shape of the internal pressure by changing the sensing unit change, thereby determining the position of the pressing point and the pressing force according to the position and size of the size change amount of the resistance changes produced by the same pressure-sensing unit detects both the position (two-dimensional plane) and for detecting the power (the third dimension) is calculated , the simultaneous detection of three-dimensional.

[0169] The above description is only preferred embodiments of the present invention but are not intended to limit the present invention, any modifications made within the principles of the present invention, equivalent substitutions and improvements should be included in the scope of the present invention Inside.

Claims (10)

1. A pressure sensing input module, each module with an adhesive, wherein the bonding layer by: comprising a substrate and a second pressure are provided a first pressure sensitive layer of the upper and lower surfaces of the substrate, sensitive layer, said first layer of pressure sensitive pressure sensitive comprises at least one first unit, the second pressure sensitive layer comprises at least one second pressure sensing means, said first pressure sensing unit and the second pressure sensing means correspondence setting and the same material, at least a second first pressure sensing means sensing the pressure unit provided corresponding Wheatstone bridge in which two resistors, for detecting a size of the pressing strength, while compensating the pressure sensing Since the input module measurement value of the resistance change due to temperature; wherein the bonding layer is disposed on the first pressure sensitive layer, between the second layer and another pressure sensing module, the thickness of the seal layer is attached 25 125μπι, thickness of the substrate is 50-450μπι.

2. The pressure sensing input module according to claim 1, wherein: said pressure sensing input module further comprises a first reference resistor and a second reference resistor, and at least one of said first pressure sensing means and the corresponding the second pressure sensing means disposed constituting the Wheatstone bridge.

3. The pressure sensing input module according to claim 2, wherein: said Wheatstone bridge configuration of a first embodiment of the pressure sensing unit and the first reference resistor connected in series, corresponding to the set the second pressure sensing unit and the second reference resistor in series.

4. The pressure sensing input module according to claim 2, wherein: said Wheatstone bridge configured manner as the first pressure sensing means disposed corresponding to the second pressure sensing means connected in series, the said first reference resistor and the second reference resistor in series.

5. The pressure sensing input module according to claim 1, wherein: said first pressure-sensing cell array provided on the substrate surface, the second pressure sensing means and the first pressure-sensing unit disposed on the substrate corresponding to the lower surface, the pressure sensing modules can simultaneously detect three-dimensional input signal.

6. The pressure sensing input module according to claim 1, wherein: said first pressure sensing unit and the second unit by a pressure sensing piezoresistive material formed in the form of a bent wire.

7. The pressure sensing input module according to claim 6, wherein: said first pressure sensing means and the shape of the second pressure sensing means is a non-rotationally symmetrical pattern.

The direction pattern and / or the second pressure sensing means sensing the first pressure unit designed for the maximum total length of wire in one direction, and: as claimed in pressure sensing input module according to claim 7, characterized in that said first pressure sensing means and / or a direction of the second pressure sensing means, pressure sensing pattern of the first unit and the second pressure sensing means in one direction of the minimum total length of the wire, the direction b direction, wherein the direction of a perpendicular to the b direction.

9. The pressure sensing input module according to claim 8, wherein: said first pressure sensing means and the patterned shape of the second pressure sensing means comprises a wire-shaped oval, polygonal line, curve, etc. long linear multistage series, unequal linear series or multistage linear Hollow wherein one or a combination.

A pressure sensing input module as claimed in claim 9, wherein: shape of the first pressure sensing means disposed corresponding to the second pressure sensing means are not the same.