CN105091412B - A kind of Thermal Performance of Micro Channels device assembly and air-conditioning - Google Patents
A kind of Thermal Performance of Micro Channels device assembly and air-conditioning Download PDFInfo
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- CN105091412B CN105091412B CN201410158093.0A CN201410158093A CN105091412B CN 105091412 B CN105091412 B CN 105091412B CN 201410158093 A CN201410158093 A CN 201410158093A CN 105091412 B CN105091412 B CN 105091412B
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- Prior art keywords
- micro
- heat exchanger
- channel heat
- device assembly
- thermal performance
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention discloses a kind of Thermal Performance of Micro Channels device assembly and air-conditioning, it is related to micro-channel heat exchanger technical field.To make micro-channel heat exchanger preferably match the interior spatial structure of air-conditioning, increase the heat exchange area of micro-channel heat exchanger, improve the heat transfer effect of micro-channel heat exchanger and invent.Thermal Performance of Micro Channels device assembly of the present invention includes the first micro-channel heat exchanger and the second micro-channel heat exchanger, and one end of first micro-channel heat exchanger and the second micro-channel heat exchanger is connected with each other, and the other end is separated from each other, and forms V-structure.Thermal Performance of Micro Channels device assembly of the present invention is used for air-conditioning.
Description
Technical field
The present invention relates to micro-channel heat exchanger technical field, more particularly to a kind of Thermal Performance of Micro Channels device assembly and air-conditioning.
Background technology
With the development of micro-channel heat exchanger technology, each application field requires more next to the heat transfer effect of micro-channel heat exchanger
Higher, micro-channel heat exchanger is as an essential part inside air-conditioning, the structure and face shaping of micro-channel heat exchanger
The inner structure form of air-conditioning is all affected to a certain extent, while affects heat exchange area and the heat exchange of micro-channel heat exchanger
Effect, and then have impact on the performance of air-conditioning.
Structure type inside air-conditioning determines the use space of micro-channel heat exchanger, so as to determine micro-channel heat exchanger
Shape and structure type.Air conditioner internal space structure is preferably matched, while ensures that the performance of air-conditioning meets requirement.
For air-conditioning producer, it need to just consider to design special shape and the micro-channel heat exchanger of structure type.
Micro-channel heat exchanger used in air-conditioning in the prior art, because space limitation generally uses rectangular configuration, so
The heat exchange area of micro-channel heat exchanger, heat exchange amount can be impacted, and because the limitation of wind field can cause heat exchange amount not
, so as to influence the heat transfer effect of micro-channel heat exchanger, and then the performance of air-conditioning is influenceed.
The content of the invention
Embodiments of the invention provide a kind of Thermal Performance of Micro Channels device assembly and air-conditioning, can preferably match the space of air-conditioning
Structure, increase heat exchange area, improve heat transfer effect.
To reach above-mentioned purpose, the embodiment provides a kind of Thermal Performance of Micro Channels device assembly and air-conditioning, including
One micro-channel heat exchanger and the second micro-channel heat exchanger, one end of first micro-channel heat exchanger and the second micro-channel heat exchanger
It is connected with each other, the other end is separated from each other, and forms V-structure.
Further, the angle between first micro-channel heat exchanger and the second micro-channel heat exchanger is 30 degree~60
Degree.
Further, the shape and size all same of first micro-channel heat exchanger and the second micro-channel heat exchanger.
Further, first micro-channel heat exchanger and the second micro-channel heat exchanger are concurrent flow Thermal Performance of Micro Channels
Device.
Further, one end of first micro-channel heat exchanger and the second micro-channel heat exchanger is connected by collector.
Further, the inside of the collector is provided with dividing plate, and the dividing plate is only into two by the inside division of the collector
Vertical space, first micro-channel heat exchanger and the second micro-channel heat exchanger connect with described two separate spaces respectively.
Further, first micro-channel heat exchanger and the second micro-channel heat exchanger are rectangle.
A kind of air-conditioning, including the Thermal Performance of Micro Channels device assembly described in any of the above-described technical scheme.
Compared with prior art, Thermal Performance of Micro Channels device assembly provided in an embodiment of the present invention has the following advantages that：The present invention
One end of the Thermal Performance of Micro Channels device assembly that embodiment provides, the first micro-channel heat exchanger and the second micro-channel heat exchanger mutually interconnects
Connect, the other end is separated from each other, and forms V-structure, the micro-channel heat exchanger of V-structure can just V place use, can also fall V
Place and use, therefore the micro-channel heat exchanger of this V-structure is compared with the micro-channel heat exchanger of existing rectangular configuration, can be with
Preferably it is applied to the space structure of indoor set.Be advantageous to form rational layout, while Thermal Performance of Micro Channels according to space structure
Device can increase heat exchange area using V-structure, so as to improve the heat exchange efficiency of micro-channel heat exchanger.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of Thermal Performance of Micro Channels device assembly of the embodiment of the present invention；
Fig. 2 is the variable angle explanation figure of Thermal Performance of Micro Channels device assembly of the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
In the description of the invention, it is to be understood that term " " center ", " on ", " under ", "front", "rear", " left side ",
The orientation or position relationship of the instruction such as " right side ", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are based on shown in the drawings
Orientation or position relationship, be for only for ease of the description present invention and simplify description, rather than instruction or imply signified device or
Element must have specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Term " first ", " second " be only used for describe purpose, and it is not intended that instruction or imply relative importance or
The implicit quantity for indicating indicated technical characteristic.Thus, " first " is defined, the feature of " second " can be expressed or imply
Ground includes one or more this feature.In the description of the invention, unless otherwise indicated, " multiple " be meant that two or
Two or more.
Fig. 1 is a specific embodiment of Thermal Performance of Micro Channels device assembly of the embodiment of the present invention, and microchannel is changed in the present embodiment
Hot device assembly includes：First micro-channel heat exchanger 1 and the second micro-channel heat exchanger 2, the first micro-channel heat exchanger 1 and second are micro- logical
One end of road heat exchanger 2 is connected with each other, and the other end is separated from each other, and forms V-structure.
Thermal Performance of Micro Channels device assembly provided in an embodiment of the present invention, changed by the first micro-channel heat exchanger 1 and the second microchannel
One end of hot device 2 is interconnected to constitute, and the other end is separated from each other, and forms V-structure.The micro-channel heat exchanger of V-structure can be with
Positive V, which is placed, to be used, can also fall V placements use, therefore the micro-channel heat exchanger of this V-structure can preferably be applied to room
The space structure of interior machine.Be advantageous to form rational layout according to space structure, add the heat exchange area of micro-channel heat exchanger
And heat exchange amount, improve the heat exchange efficiency of micro-channel heat exchanger.
To ensure the heat exchange area and heat exchange amount of micro-channel heat exchanger, the first Thermal Performance of Micro Channels in V-type micro-channel heat exchanger
Angle between device and the second micro-channel heat exchanger can not it is excessive can not be too small, crossing conference causes whole micro-channel heat exchanger
Area reduces, and the heat exchange area that gas flows through micro-channel heat exchanger reduces, and causes heat exchange amount to reduce, as shown in Fig. 2 in width D
Under conditions of certain, angle a is bigger, and L is smaller, and the heat exchange area of whole micro-channel heat exchanger is smaller, can cause heat exchange amount not
Foot；If angle a is too small, it can make it that such air-flow is from bottom to top by micro- close to being disposed vertically for two micro-channel heat exchangers
During channel heat exchanger, air-flow can be caused to be approximately perpendicular to fin and blow over, fin can cause very big windage, can also effectively to change
Hot area reduces, and ultimately results in heat exchange amount reduction.Therefore by between the first micro-channel heat exchanger 1 and the second micro-channel heat exchanger 2
Angle be designed as 30 degree~60 degree, micro-channel heat exchanger can be caused to have bigger heat exchange area and heat exchange amount.
The first micro-channel heat exchanger 1 and the second micro-channel heat exchanger 2 of V-arrangement micro-channel heat exchanger need to be tied according to space
Structure, needs, the size of heat exchange amount and wind field distribution situation are installed to design the size of two micro-channel heat exchangers, with suitable for not
With the demand of occasion.And be to ensure that the heat exchange of two parts micro-channel heat exchanger is uniform, just need the first micro-channel heat exchanger 1 during design
It is identical with the shape and size design of the second micro-channel heat exchanger 2, so that the heat exchange amount of two parts micro-channel heat exchanger is equal,
And then ensureing that the first micro-channel heat exchanger 1 and the second micro-channel heat exchanger 2 exchange heat uniformly, heat transfer effect is more preferable.
Preferably, the first micro-channel heat exchanger 1 and the second micro-channel heat exchanger 2 all select concurrent flow micro-channel heat exchanger.
The air side of concurrent flow micro-channel heat exchanger uses fin, can effectively destroy air flow boundary layer, increase disturbance, strengthen
Heat exchange.Heat exchanger tube is small-sized cross-wise direction windward, can greatly reduce leeward side vortex, so as to reduce air side flow resistance
Power.Heat exchanger tube is smaller compared with fin size, and the surface coefficient of heat transfer of air side is compact-sized based on fin.Concurrent flow
Micro-channel heat exchanger has the characteristics of resistance is small, heat exchange efficiency is high.Therefore preferably, the first micro-channel heat exchanger and second micro-
Channel heat exchanger all selects concurrent flow micro-channel heat exchanger.
Specifically, as shown in figure 1, one end of the first micro-channel heat exchanger 1 and the second micro-channel heat exchanger 2 passes through collector 3
Connection.That is the collector 3 of the first micro-channel heat exchanger 1 and the second micro-channel heat exchanger 2 is combined into one, and is strengthened the first microchannel and is changed
Bonding strength between the hot micro-channel heat exchanger 2 of device 1 and second.The difficulty of assembling is saved simultaneously, reduces material.
To ensure the heat transfer effect of the first micro-channel heat exchanger 1 and the second micro-channel heat exchanger 2, as shown in figure 1, first is micro-
One end of channel heat exchanger 1 and the second micro-channel heat exchanger 2 is by the dividing plate 4 inside collector 3 by the inside division of collector 3 into two
Individual independent space, is connected with described two separate spaces respectively.And then cause the first micro-channel heat exchanger 1 and the second microchannel
Heat exchanger 2 can preferably adjust respective shunting, form respective circulation process, so that heat exchange is more uniform respectively.
Due to present used air conditioner, its internal space for placing micro-channel heat exchanger can not possibly be excessive, so micro-
Channel heat exchanger is also impossible to that too high or wide form can be designed to.Consider the limitation of micro-channel heat exchanger placement space, will
First micro-channel heat exchanger 1 and the second micro-channel heat exchanger 2 are designed to rectangle.And then it can preferably match the inside of air-conditioning
Structure.
A kind of air-conditioning, including the Thermal Performance of Micro Channels device assembly described in any of the above-described embodiment.
It is each due to the Thermal Performance of Micro Channels device assembly that is used in the present embodiment air-conditioning and above-mentioned Thermal Performance of Micro Channels device assembly
The Thermal Performance of Micro Channels device assembly provided in embodiment is identical, therefore the two can solve the problem that identical technical problem, and reaches identical
Expected Results.
Other compositions of air-conditioning on the embodiment of the present invention etc. have been well known to those skilled in the art, herein no longer
Describe in detail.
In the description of this specification, specific features, structure, material or feature can be real in any one or more
Apply and combined in an appropriate manner in example or example.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (6)
- A kind of 1. Thermal Performance of Micro Channels device assembly, it is characterised in that including the first micro-channel heat exchanger and the second micro-channel heat exchanger, One end of first micro-channel heat exchanger and the second micro-channel heat exchanger is connected with each other, and the other end is separated from each other, and forms V-type knot Structure；First micro-channel heat exchanger is connected with one end of second micro-channel heat exchanger by collector；Described first is micro- logical The collector of road heat exchanger and second micro-channel heat exchanger is combined into one；The inside of the collector is provided with dividing plate, the dividing plate by the inside division of the collector into two separate spaces, described One micro-channel heat exchanger and the second micro-channel heat exchanger connect with described two separate spaces respectively.
- 2. Thermal Performance of Micro Channels device assembly according to claim 1, it is characterised in that first micro-channel heat exchanger and Angle between two micro-channel heat exchangers is 30 degree~60 degree.
- 3. Thermal Performance of Micro Channels device assembly according to claim 1 or 2, it is characterised in that first micro-channel heat exchanger With the shape and size all same of the second micro-channel heat exchanger.
- 4. Thermal Performance of Micro Channels device assembly according to claim 1, it is characterised in that first micro-channel heat exchanger and Two micro-channel heat exchangers are concurrent flow micro-channel heat exchanger.
- 5. Thermal Performance of Micro Channels device assembly according to claim 1, it is characterised in that first micro-channel heat exchanger and Two micro-channel heat exchangers are rectangle.
- 6. a kind of air-conditioning, it is characterised in that including Thermal Performance of Micro Channels device assembly according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410158093.0A CN105091412B (en) | 2014-04-19 | 2014-04-19 | A kind of Thermal Performance of Micro Channels device assembly and air-conditioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410158093.0A CN105091412B (en) | 2014-04-19 | 2014-04-19 | A kind of Thermal Performance of Micro Channels device assembly and air-conditioning |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105091412A CN105091412A (en) | 2015-11-25 |
| CN105091412B true CN105091412B (en) | 2018-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410158093.0A Expired - Fee Related CN105091412B (en) | 2014-04-19 | 2014-04-19 | A kind of Thermal Performance of Micro Channels device assembly and air-conditioning |
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| Country | Link |
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| CN (1) | CN105091412B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106152287A (en) * | 2016-08-17 | 2016-11-23 | 广东美的制冷设备有限公司 | The evaporator assemblies of a kind of domestic indoor unit of wall hanging type air conditioner and air-conditioner |
| CN107860254B (en) * | 2017-12-23 | 2024-07-19 | 黄国和 | Combined heat exchanger |
| US11236946B2 (en) | 2019-05-10 | 2022-02-01 | Carrier Corporation | Microchannel heat exchanger |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101806550A (en) * | 2010-03-24 | 2010-08-18 | 三花丹佛斯（杭州）微通道换热器有限公司 | Microchannel heat exchanger |
| CN201652995U (en) * | 2010-05-20 | 2010-11-24 | 三花丹佛斯（杭州）微通道换热器有限公司 | Micro-channel heat exchanger |
| CN102135350A (en) * | 2010-11-18 | 2011-07-27 | 三花丹佛斯（杭州）微通道换热器有限公司 | Heat exchanger |
| EP2594886A2 (en) * | 2011-11-18 | 2013-05-22 | LG Electronics, Inc. | Heat exchanger and method of manufacturing the same |
-
2014
- 2014-04-19 CN CN201410158093.0A patent/CN105091412B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101806550A (en) * | 2010-03-24 | 2010-08-18 | 三花丹佛斯（杭州）微通道换热器有限公司 | Microchannel heat exchanger |
| CN201652995U (en) * | 2010-05-20 | 2010-11-24 | 三花丹佛斯（杭州）微通道换热器有限公司 | Micro-channel heat exchanger |
| CN102135350A (en) * | 2010-11-18 | 2011-07-27 | 三花丹佛斯（杭州）微通道换热器有限公司 | Heat exchanger |
| EP2594886A2 (en) * | 2011-11-18 | 2013-05-22 | LG Electronics, Inc. | Heat exchanger and method of manufacturing the same |
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| Publication number | Publication date |
|---|---|
| CN105091412A (en) | 2015-11-25 |
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Granted publication date: 20180330 Termination date: 20200419 |