CN105088272A - Copper electrolytic negative plate with mark prevention structure - Google Patents
Copper electrolytic negative plate with mark prevention structure Download PDFInfo
- Publication number
- CN105088272A CN105088272A CN201510562341.2A CN201510562341A CN105088272A CN 105088272 A CN105088272 A CN 105088272A CN 201510562341 A CN201510562341 A CN 201510562341A CN 105088272 A CN105088272 A CN 105088272A
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- China
- Prior art keywords
- copper
- negative plate
- conductive
- mother plate
- plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Electrolytic Production Of Metals (AREA)
Abstract
The invention discloses a copper electrolytic negative plate with a mark prevention structure. The copper electrolytic negative plate comprises a steel conductive beam and a conductive mother plate, wherein the steel conductive beam is arranged on the upper portion, the conductive mother plate is arranged on the lower portion, and the conductive mother plate and the steel conductive beam are welded together. The two sides of the conductive mother plate are provided with edge clamping strips made of engineering plastics respectively. The lower end of each edge clamping strip is provided with a sealing part which is 8-12 mm away from the bottom edge of the conductive mother plate. According to the copper electrolytic negative plate, the two sides of the conductive mother plate are provided with the edge clamping strips made of the engineering plastics, so electrolytic copper formed on the two sides of the mother plate after electrolysis is completed cannot fuse together and can be stripped off from the mother plate easily; besides, the lower ends of the edge clamping strips are provided with the sealing parts, so no electrolyte can drip or leak downwards when the negative plate is lifted up, and no mark can be formed on the appearances of other copper plates.
Description
Technical field
The present invention relates to a kind of the copper negative plate for electrolysis with anti-scratches structure.
Background technology
Positive plate is made up of blister copper (copper content is about 99%), and when electrolytic copper, the blister copper on positive plate is dissolved into cupric ion to movable cathode, obtains electronics and separate out fine copper at negative electrode after arriving negative electrode, forms negative plate.And existing the copper negative plate for electrolysis after electrolysis, the copper being adsorbed on conduction motherboard both sides can be merged by the side of motherboard, causes the copper being adsorbed on motherboard both sides to be difficult to peel off like this.Further, when negative plate is sling, have electrolytic solution and drip along motherboard side, so just cause on other copper coins and be easily printed on scratches, affect copper coin visual appearance.
Summary of the invention
The defect that the present invention seeks to exist for prior art provides a kind of the copper negative plate for electrolysis with anti-scratches structure.
The present invention for achieving the above object, adopts following technical scheme: a kind of the copper negative plate for electrolysis with anti-scratches structure, comprises the steel Conductive beam being arranged on top, and is arranged on the conduction motherboard that bottom and described steel Conductive beam weld together; The both sides of described conduction motherboard are respectively arranged with the contained side bar be made up of engineering plastics, and the lower end of described contained side bar is provided with the mouth-sealed portion of the base 8-12mm apart from described conduction motherboard.
Beneficial effect of the present invention: the present invention is provided with the contained side bar be made up of engineering plastics in the both sides of motherboard, the copper coin being formed in motherboard both sides after making electrolysis can not merge, and easily strips down from motherboard; In addition, the lower end of contained side bar is provided with mouth-sealed portion, electrolytic solution down water clock would not be had when negative plate is lifted like this, other copper coin outward appearance scratches can not be caused.
Accompanying drawing explanation
Fig. 1 one-piece construction schematic diagram of the present invention.
The scheme of installation of Fig. 2 conduction motherboard of the present invention and contained side bar.
Embodiment
Shown in Fig. 1, Fig. 2, provide a kind of the copper negative plate for electrolysis with anti-scratches structure, comprise the steel Conductive beam 1 being arranged on top, and be arranged on the conduction motherboard 2 that bottom and described steel Conductive beam 1 weld together; The both sides of described conduction motherboard 2 are respectively arranged with the contained side bar 3 be made up of engineering plastics, and the lower end of described contained side bar 3 is provided with mouth-sealed portion 4, and described mouth-sealed portion 4 is apart from the base 8-12mm of described conduction motherboard 2.During use, owing to being provided with in the both sides of conduction motherboard 2 the contained side bar 3 be made up of engineering plastics, the copper coin being formed in conduction motherboard 2 both sides after making electrolysis can not merge, and has stripped down like this with regard to easy from conduction motherboard 2.In addition, owing to being provided with mouth-sealed portion 4 in the lower end of contained side bar 3, electrolytic solution down water clock would not be had when negative plate is lifted like this, the outward appearance of other copper coins can not be caused to produce scratches.
Wherein, in order to being fixed together with conduction motherboard 2 of making that contained side bar 3 can be more stable, can the inner side of described contained side bar 3 be fastened on the side of described conduction motherboard 2, be formed with concave part 31 in the outside of described contained side bar 3, in described concave part 31, be provided with compression bar 32.During use, first the inner side of contained side bar 3 is fastened on the side of conduction motherboard 2, then compression bar 32 is embedded in concave part 31, makes concave part 31 that elastic deformation occur, impel the inner side of contained side bar 3 can tightly be fastened on conduction motherboard 2.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (1)
1. there is a copper negative plate for electrolysis for anti-scratches structure, it is characterized in that, comprise the steel Conductive beam being arranged on top, and be arranged on the conduction motherboard that bottom and described steel Conductive beam weld together; The both sides of described conduction motherboard are respectively arranged with the contained side bar be made up of engineering plastics, and the lower end of described contained side bar is provided with the mouth-sealed portion of the base 8-12mm apart from described conduction motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510562341.2A CN105088272A (en) | 2015-09-07 | 2015-09-07 | Copper electrolytic negative plate with mark prevention structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510562341.2A CN105088272A (en) | 2015-09-07 | 2015-09-07 | Copper electrolytic negative plate with mark prevention structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105088272A true CN105088272A (en) | 2015-11-25 |
Family
ID=54569570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510562341.2A Pending CN105088272A (en) | 2015-09-07 | 2015-09-07 | Copper electrolytic negative plate with mark prevention structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105088272A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2490170Y (en) * | 2001-06-07 | 2002-05-08 | 吴小玲 | Pincerlike mother blank edge holding strip |
| CN1357058A (en) * | 1999-06-18 | 2002-07-03 | 精炼铜控股公司 | Edge strip cap |
| WO2004057059A1 (en) * | 2002-12-23 | 2004-07-08 | Icon Plastics Pty Ltd | Electrode edge strip protector |
| CN200940166Y (en) * | 2006-09-08 | 2007-08-29 | 江西铜业集团公司贵冶分公司 | Sealing and insulation edgings for negative plate |
| CN201172694Y (en) * | 2008-04-01 | 2008-12-31 | 昆明理工大学 | Insulation wrapping strip of negative for metallurgical industry |
| CN204265867U (en) * | 2014-11-22 | 2015-04-15 | 广西柳州市丰亚塑胶制品有限公司 | A kind of high-strength electrolytic zinc anode plate |
| CN207330271U (en) * | 2017-07-19 | 2018-05-08 | 中国海洋大学 | Comprehensively utilize the deep ocean water lifting device of wave energy and marine tidal-current energy |
-
2015
- 2015-09-07 CN CN201510562341.2A patent/CN105088272A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357058A (en) * | 1999-06-18 | 2002-07-03 | 精炼铜控股公司 | Edge strip cap |
| CN2490170Y (en) * | 2001-06-07 | 2002-05-08 | 吴小玲 | Pincerlike mother blank edge holding strip |
| WO2004057059A1 (en) * | 2002-12-23 | 2004-07-08 | Icon Plastics Pty Ltd | Electrode edge strip protector |
| CN200940166Y (en) * | 2006-09-08 | 2007-08-29 | 江西铜业集团公司贵冶分公司 | Sealing and insulation edgings for negative plate |
| CN201172694Y (en) * | 2008-04-01 | 2008-12-31 | 昆明理工大学 | Insulation wrapping strip of negative for metallurgical industry |
| CN204265867U (en) * | 2014-11-22 | 2015-04-15 | 广西柳州市丰亚塑胶制品有限公司 | A kind of high-strength electrolytic zinc anode plate |
| CN207330271U (en) * | 2017-07-19 | 2018-05-08 | 中国海洋大学 | Comprehensively utilize the deep ocean water lifting device of wave energy and marine tidal-current energy |
Non-Patent Citations (1)
| Title |
|---|
| 朱祖泽 等主编: "《现代铜冶金学》", 31 January 2003 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |
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| RJ01 | Rejection of invention patent application after publication |