CN105081165B - A kind of method that Metal Substrate Electronic Packaging thin-walled parts order loads die-forging forming - Google Patents
A kind of method that Metal Substrate Electronic Packaging thin-walled parts order loads die-forging forming Download PDFInfo
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Abstract
A kind of method that Metal Substrate Electronic Packaging thin-walled parts order loads die-forging forming, it is related to a kind of loading die-forging forming method.Existing have complex steps using the method that the high metal-base composites strengthening phase content produces thin-walled parts, and machining is difficult, cannot realize near-net-shape, and existing method leads to percent defective height, the high problem of machining cost simultaneously.Step one in the present invention：Prepare the metal-base composites blank strengthening phase content；Step 2：Metal-base composites blank is heated, until this metal-base composites blank softens；Step 3：It is made to be deformed forming multiple raised and multiple lower convexity metal-base composites blank pressure using multiple main briquettings；Step 4：Again metal-base composites blank is pressurizeed, make metal-base composites blank form electronic packing part；Step 5：Unloading pressure takes out electronic packing part.The present invention is used for preparing Metal Substrate Electronic Packaging thin-walled parts.
Description
Technical field
The present invention relates to a kind of method that Metal Substrate Electronic Packaging thin-walled parts order loads die-forging forming.
Background technology
In recent years, prepare the high Metal Substrate based composites strengthening phase content and attract material worker in worldwide
Note.Compared with traditional metal and alloy, the high Metal Substrate based composites strengthening phase content have high specific strength, compare bullet
Property modulus, low bulk, high heat conduction, less than the l/10 of tungsten-copper alloy, not and its 1/5, and performance can not yet for weight for the prices of raw materials
The series of advantages such as arbitrarily cut out.For example it can have high elastic modulus (can exceed 20OGPa, suitable with steel) simultaneously, surpass
High specific modulus (close to aluminium alloy, 3 times of titanium alloy) and very high thermal conductivity, extremely low thermal coefficient of expansion (can be with ceramic phase
When).Therefore, the SiC/Al metal-base composites of high body point rate has become as the representative of the Electronic Packaging third generation at present.
The high research and development through more than ten years for the Metal Substrate based composites electronic package material strengthening phase content abroad
Have begun to step into the practical stage from experimental stage, be mainly used in military electronic product, including military hybrid circuit (HIC),
The carrier of microwave tube, heat sink and super high power module (IGBT) the encapsulation of multi-chip group (MCM) all obtain preferable effect.?
After being encapsulated using SiCp/Al composite in the phased-array radar of high performance airplane, the volume and weight of circuit significantly reduces,
And improve reliability.In multiple military engineerings, particularly in Aero-Space, scale uses this SiC/Al to be combined for the U.S.
Material, such as, on F-22 " bird of prey " fighter plane, adopt in a large number this material as printed circuit board (PCB) plate core, electronic equipment pedestal and
Shell.In addition, applying the advanced aerospace vehicle of this material also to include F-19 " hornet " fighter plane, EA-6B " ranger " electricity
Son war aircraft, and the space telescope as reflecting mirror and its framework etc..Because the aluminum matrix composite collection of high SiC content is excellent
The anti-resonance vibration function of different bearing function, remarkable thermal control function or even uniqueness, therefore has pole in aerospace field
Big application potential.For example, it is used for Aero-Space photodetection structure with this material substitution aluminium alloy or titanium alloy, can significantly carry
Precision stability under power, thermic load effect for the high platform；Substitute tungsten copper, aluminum bronze special encapsulation alloy is used for Aero-Space electronics
Components and parts, achievable respective element loss of weight 70～80%, whole electronics loss of weight is up to hundred feather weight.
The Metal Substrate based composites of the phase content of the high enhancing of production at present method main taking SiC/Al composite as a example
There are powder metallurgic method, spray deposition, stirring casting method, pressure infiltration method etc., pressureless penetration method.
1 powder metallurgic method
Powder metallurgic method preparation SiC/Al composite is first by SiC, compressing after aluminium powder and plasticizer mixing, passes through
Defat, sinter finished product into.The great advantage of powder metallurgic method is the degree of freedom width of composition, and this method can control well
The composition of composite, is theoretically can arbitrary proportioning；Because forming temperature is less than the fusing point of matrix alloy, metal
Matrix is few with the interfacial reaction of reinforcement, decreases the adverse effect to material property for the interfacial reaction；To SiC/Al composite
For, it is less prone to segregation or segregation phenomena, the requirement of reinforcing material and the mutual moistening of matrix can be reduced.But Chinese scholars
Prepare the few of SiC/A1 composite with powder metallurgic method.Its reason is that sintering process is wayward, causes material mesopore
Gap is many, and is not easy to eliminate in subsequent processes, and industrialization is relatively costly.In addition, the addition to SiC for the powder metallurgic method
Also there is certain restriction, be usually no more than the low aluminum matrix composite of 55%volSiC content and be difficult to meet wanting of Electronic Packaging
Ask；Powder metallurgic method is difficult to the near-net-shape of complex component simultaneously；But powder metallurgic method produces SiC/A1 composite
Prospect is very wide, very worth exploration.
2 spray depositions
Spray deposition is a kind of side preparing metal-base composites that the eighties in 20th century is developed by ospray company
Method.This technique is to open an aperture in crucible bottom, after motlten metal aluminium liquid flows out, particulates reinforcements is added in liquor stream,
Then with high velocity inert gas, matrix and granule mixture being dispersed into small droplet makes it be atomized, and granule and atomized flow are ejected into base
Co-deposited one-tenth metallic composite on bottom.Due to reinforcement particle under air-flow promotion high rapid fire people's melt, so to interface
Wettability less demanding, the harmful structures such as size segregation can also be eliminated " and strengthen short for time of contact with matrix liquation,
Therefore therebetween reaction is easily controllable, and is applied to the composite of various reinforced phase deposition, and relative density reaches 95%-
98%, secondary operations need to be carried out to realize complete densification.Due to dust and Material cladding one step complete, technological process is short, work
Sequence is simple, and efficiency high is advantageously implemented industrialized production.Shortcoming is relatively costly, and deposition velocity is slower.
3 infiltration methods
Whether infiltration method is a main technique of SiC/Al electronic packaging composite material preparation, apply according to during infiltration
Pressure is divided into pressure infiltration and pressureless infiltration.
First SiC is made prefabricated section, allow aluminum or aluminum alloy liquid penetrate under pressure in prefabricated section make compound
Material.Put into after SiC is thoroughly mixed with water and binding agent and in mould, be forced into 5MPa, subsequently dry in 80 DEG C of calorstats
48h depanning, obtains the prefabricated section with certain porosity.Compression mod and prefabricated section are preheated to 500 DEG C, and aluminium liquid is heated to 800 DEG C
Cast, pressurization immediately after makes aluminium liquid penetrate into prefabricated section, pressurize 3min under the pressure of 125MPa, removes pressure and treats that it is naturally cold
But depanning after.Another kind of method is the Si to 800 DEG C of addition in 750 DEG C of moulds of preheating, after C granule, under the pressure of 50MPa
Protect and turn round 30s, so that aluminium liquid is penetrated into, then be calcined 4h at 1100 DEG C, prepared SiC volume fraction is the aluminum matrix composite of 50%-71%.
This technique preparation composite technology difficulty is relatively large, mainly prepares that SiC powder preform briquet is relatively difficult, and intensity is not
Height, prefabricated section easily collapses during pressure is oozed.The preheating temperature of prefabricated component in this technique, the infiltration temperature of aluminum alloy melt, pressure
Size, rate of cooling are key process parameters.This method applies pressure can be larger, and the production time is short, and infiltration can be in a few minutes
Inside complete, the good stability of technique.Shortcoming is exactly to need the high voltage bearing mould of high pressure equipment and good seal, so produce taking
With higher, producing complex-shaped part, particularly little thin-walled Electronic Packaging component aspect limits very big.
Pressureless penetration method is a kind of effective ways of the electronic packaging composite material material that production has high-volume fractional, should
Technique is a kind of advanced composite material (ACM) moulding process developed by Lanxide company of the U.S. at the beginning of the nineties at the end of the eighties.With
The continuous development of technique, oneself enables the net molding of high-volume fractional MMC.The matrix alloy that this technique uses is Al-Mg
Alloy, when being used SiC as reinforcement toward contact plus a certain amount of Si of people to reduce the interfacial reaction between Al/SiC.One
Determine at temperature (>800 DEG C), the slow volatilization of the Mg in matrix alloy diffuses in biscuit of ceramics, with the nitrogen as protective atmosphere
React, and the Surface Creation magnesium nitride in powder body, liquid aluminium is contacted with the magnesium nitride on surface, by a series of chemistry
Reaction promotes the infiltration of aluminium liquid, and finally achieves pressure-free impregnation.Its production process is：First matrix alloy ingot casting is put into pre-
Above product, it is passed through the controlled atmosphere containing N2, heating penetrates in prefabricated component until alloy melting is spontaneous.Due to this technique no
Need special vacuum or press device, process is simple, with low cost, ceramic enhancement phase volume fraction is high, and composite property is excellent
Good, and near-net-shape is processed the features such as, extensively paid attention to by both at home and abroad in recent years.
From the situation of research both at home and abroad above can be seen that at present both at home and abroad with regard to Electronic Packaging research mainly for electricity
The research of sub- encapsulating material, main operation:1st, prepare satisfactory electronic package material；2nd, this electronic package material is entered
Row machining, prepares the part of composite part dimensional structure shape；3rd, the electronic packing part after will be machined and lid
Panel material is welded.But, problems with easily occurs during this：Machining difficulty is it is impossible to realize near-net-shape.By
It is usually the metal-base composites containing the more 50vol% of pottery magnetic granule in electronic packing part, the spy of this kind of material
Point is that more brittle and hard degree is high, anti-wear performance is high, so being difficult to into the electronic packing part of labyrinth, and part is some
Position is relatively thin, and thickness only has 1mm, so machining cost is high.So be directed to thin-walled position either directly pass through above-mentioned which
It is all very difficult for planting technique, the method that can only adopt machining.But for so thin part, even if by machinery
Processing industry is difficult to process, thus cost is very high.
Content of the invention
It is an object of the invention to provide a kind of method that Metal Substrate Electronic Packaging thin-walled parts order loads die-forging forming, with
Solution is existing to have complex steps using the method that the high metal-base composites strengthening phase content produces thin-walled parts, and machinery adds
Work is difficult, cannot realize near-net-shape, and existing method leads to percent defective height, the high problem of machining cost simultaneously.
The present invention is to solve above-mentioned technical problem to adopt the technical scheme that：
A kind of method that Metal Substrate Electronic Packaging thin-walled parts order loads die-forging forming, methods described includes following step
Suddenly：
Step one：Prepare the metal-base composites blank strengthening phase content first；
Step 2：Secondly the metal-base composites blank prepared step one is placed in the die cavity in particular manufacturing craft,
So that this metal-base composites blank is on the multiple core rods in die cavity, this metal-base composites blank heated,
Between 450 DEG C～650 DEG C, this metal-base composites blank softens at it temperature controlling this metal-base composites blank
In the die cavity being located；
Step 3：Again the mould that closes of the group in particular manufacturing craft is placed in die cavity and and between metal-base composites blank
Gap is arranged, and multiple main briquetting group being closed in mould applies precompression, so that multiple main briquettings is all declined until being adjacent in Metal Substrate
On composite blank, pressure F is applied simultaneously to multiple main briquettings1, so that metal-base composites blank is deformed, metal
The upper surface of based composites blank is extruded into becoming owner of in the gap between briquetting and secondary briquetting and forms multiple upper projections, simultaneously
The lower surface of metal-base composites blank is pressed into the multiple lower convexity of formation in the gap between die cavity and core rod；
Step 4：Then multiple pair briquettings group being closed in mould apply pressure F simultaneously2, multiple pair briquettings decline until
In the same plane with main briquetting, so that projection in each of metal-base composites blank upper surface is extruded up under each
Till projection is filled in the gap between die cavity and core rod, metal-base composites blank is made to form electronic packing part；
Step 5：Finally the pressure on unloading particular manufacturing craft, takes out electronic packing part from particular manufacturing craft.
The invention has the advantages that：
1st, operating procedure of the present invention is rationally simple, prepares the Metal Substrate electronic seal with thin-walled by once-forming die forging
Dress part, without later stage machining or few machining, thus realize near-net-shape；Processing cost is only to provide and specifically counts
According to, it is to avoid the high cost of complicated machining.
2nd, the present invention is a kind of method of die-forging forming under stress, forms the microcosmic of electronic packing part by the present invention
The consistency of tissue, more than 98%, effectively reduces voids content, contributes to the raising of this materials thermophysics performance.
3rd, the present invention realizes the shaping under lower temperature, it is to avoid strengthen the interfacial reaction mutually and matrix between, contributes to sealing
The raising of package material thermophysical property.
4th, the present invention realizes the Forming under Pressure at thin-walled parts, not only can realize shaping at thin-walled, and can be real
Now lack voids content.
Brief description
Fig. 1 is the main structure diagram of metal-base composites blank 1；
Fig. 2 is the annexation schematic diagram of metal-base composites blank 1 and particular manufacturing craft；
Fig. 3 is that in the present invention, multiple main briquetting 4-1 all decline the operation until being adjacent on metal-base composites blank 1
Schematic diagram；
Fig. 4 is the operation chart of step 3 in the present invention；
Fig. 5 is the operation chart of step 4 in the present invention；
Fig. 6 is the operation chart of step 5 in the present invention.
Specific embodiment
Specific embodiment one：In conjunction with Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 and Fig. 6, present embodiment, present embodiment are described
The method comprising the steps of：
Step one：Prepare the metal-base composites blank 1 strengthening phase content first；
Step 2：Secondly the metal-base composites blank 1 prepared step one is placed in the die cavity 2 in particular manufacturing craft
Interior, so that this metal-base composites blank 1 is on the multiple core rods 3 in die cavity 2, this metal-base composites blank 1 is entered
Row heating, the temperature controlling this metal-base composites blank 1 between 450 DEG C～650 DEG C, this metal-base composites blank
1 softens in the die cavity 2 being located at it；
Step 3：Again by the group in particular manufacturing craft close mould 4 be placed in die cavity 2 and with metal-base composites blank
1 gap setting, multiple main briquetting 4-1 group being closed in mould 4 applies precompression, so that multiple main briquetting 4-1 is all declined until pasting
Tightly on metal-base composites blank 1, pressure F is applied simultaneously to multiple main briquetting 4-11, make metal-base composites blank 1
It is deformed, between the upper surface of metal-base composites blank 1 is extruded into becoming owner of between briquetting 4-1 and secondary briquetting 4-2
Form multiple upper projections, the lower surface of metal-base composites blank 1 is pressed between die cavity 2 and core rod 3 simultaneously in gap
Gap in formed multiple lower convexity；
Step 4：Then multiple pair briquetting 4-2 group being closed in mould 4 apply pressure F simultaneously2, under multiple pair briquetting 4-2
Fall, up in the same plane with main briquetting 4-1, makes projection in each of metal-base composites blank 1 upper surface be extruded
Till each lower convexity is filled in the gap between die cavity 2 and core rod 3, metal-base composites blank 1 is made to form electricity
Sub- encapsulating parts 8；
Step 5：Finally the pressure on unloading particular manufacturing craft, takes out electronic packing part 8 from particular manufacturing craft.
The metal-base composites blank 1 strengthening phase content in the step one of present embodiment is by powder metallurgy, stirs
Mix the preparation of the methods such as casting to draw.Mode of heating in step 2 have multiple, can be first by metal-base composites blank 1 and die cavity
2 are heated separately to 600 DEG C about, then by metal-base composites blank 1 being placed in die cavity 2, make metal-base composites
Blank 1 can realize the filling of die cavity 2 at this temperature, or by metal-base composites blank 1 be placed in die cavity 2 together plus
Heat to 550 DEG C about so that metal-base composites blank 1 can realize the filling of die cavity 2.Metal-based compound in step 4
Material blank 1 multiple pair briquetting 4-2 suppressing action under deform, when multiple pair briquetting 4-2 decline until with main briquetting 4-1 at
When on same plane, the upper surface of metal-base composites blank 1 is also plane.
Particular manufacturing craft in present embodiment includes external mold, group is closed mould 4 and multiple core rod 3, described external mold is rectangle
Framework, its upper end is opening end, and the die wall of external mold being uniformly machined with inside multiple bottoming holes, external mold is die cavity 2, multiple core rods
3 are arranged on die cavity 2 bottom, and the gap between the inwall of core rod 3 and die cavity 2 is the first gap 5, the gap between multiple core rods 3
For the second gap 6, the width in the first gap 5 and the second gap 6 is equal, and the group mould 4 that closes includes multiple main briquetting 4-1 and multiple pair
Briquetting 4-2, main briquetting 4-1 and secondary briquetting 4-2 are arranged alternately, and secondary briquetting 4-2 is adjacent to the inwall phase of die cavity 2, when multiple main pressures
When block 4-1 synchronously falls, between secondary briquetting 4-2 and main briquetting 4-1, form multiple third spaces 7, the width of third space 7 and the
One gap 5, the second gap 6 all equal, each first gap 5 is to should have a third space 7 and this first gap 5 is right with it
The third space 7 answered is on same straight line, each second gap 6 to should have a third space 7 and this second gap 6 and its
Corresponding third space 7 is on same straight line.
Metal-base composites blank 1 forms electronic packing part 8 by the present invention, prepares the Electronic Packaging of different-thickness
Part 8 needs various sizes of particular manufacturing craft, the width of the width in the first gap 5, the width in the second gap 6 and third space 7
It is the key element determining electronic packing part 8 thickness.
Specific embodiment two：In conjunction with Fig. 4, present embodiment is described, in present embodiment to multiple main briquetting 4-1 simultaneously
Apply pressure F1It is ensured that F1Pressure value reach 400～450MPa.Draw F by many experiments1Optimum.Other structures and
Annexation is identical with specific embodiment one.
Specific embodiment three：In conjunction with Fig. 5, present embodiment is described, to multiple pair briquettings in step 4 in present embodiment
4-2 applies pressure F simultaneously2It is ensured that F2Pressure value reach 400～500MPa.Draw F by many experiments2Optimum.Its
His structure and annexation are identical with specific embodiment one or two.
Effective effect explanation following examples in conjunction with Figure of description and the present invention：
Embodiment one：The operation of the present embodiment is as follows：
Step one：Using liquid metal infiltration process by SiC powder and pore creating material 55：45 ratio mixing, steel mold pressing,
The operations such as defat, sintering prepare the SiC parent containing 45vol% hole, then at 800 DEG C, by liquid aluminium metal infiltration
To in the hole of SiC parent thus preparing 55vol%SiC/Al metal-base composites blank 1；
Step 2：By electromagnetic induction heater or resistance-heated furnace, above-mentioned 55vol%SiC/Al Metal Substrate is multiple
Condensation material blank 1 is heated to 600 DEG C；
Step 3：Blank after above-mentioned heating is placed in 450 DEG C of die cavity；Or composite prepared by step one
It is placed in die cavity and is heated to 550 DEG C together in company with mould, step 2 can be saved；
Step 4：Carry out pressurizeing for the first time F to mould on above-mentioned die cavity1, F1Pressure value be 400MPa, now Metal Substrate is multiple
Condensation material blank 1 is squeezed and forms multiple upper and lower projections, and multiple upper and lower projections are filled in the gap of particular manufacturing craft, multiple
On convex to form completely raised and be filled in one by one between secondary briquetting 4-2 and main briquetting 4-1, multiple lower convexity are not entirely filled with
In first gap 5 and the second gap 6, leave space, pass through secondary briquetting 4-2 pressurization F immediately2, its pressure value is 450MPa, multiple
Secondary briquetting 4-2 declines until in the same plane with main briquetting 4-1；And pressurize 30S；
Step 5：Unloading pressure, takes out part, thus obtain electronic packing part 8, i.e. now electronic packing part 8
Wall thickness is 2 millimeters.
Embodiment two：The operation of the present embodiment is as follows：
Step one：Using spray deposition technology, liquid metal aluminium is sprayed by nozzle, simultaneously by 55vol%SiC granule
Add in liquor stream, and last deposition on depositor, thus preparing 55vol%SiC/Al metal-base composites blank 1；
Step 2：By electromagnetic induction heater or resistance-heated furnace, above-mentioned 55vol%SiC/Al Metal Substrate is multiple
Condensation material blank 1 is heated to 600 DEG C；
Step 3：Blank after above-mentioned heating is placed in 450 DEG C of die cavity；Or composite prepared by step one
It is placed in die cavity and is heated to 550 DEG C together in company with mould, step 2 can be saved；
Step 4：Carry out pressurizeing for the first time F to mould on above-mentioned die cavity1, F1Pressure value be 400MPa, now Metal Substrate is multiple
Condensation material blank 1 is squeezed and forms multiple upper and lower projections, and multiple upper and lower projections are filled in the gap of particular manufacturing craft, multiple
On convex to form completely raised and be filled in one by one between secondary briquetting 4-2 and main briquetting 4-1, multiple lower convexity are not entirely filled with
In first gap 5 and the second gap 6, leave space, pass through secondary briquetting 4-2 pressurization F immediately2, and the F that pressurizes2, its pressure value is
450MPa, multiple pair briquetting 4-2 decline until in the same plane with main briquetting 4-1；And pressurize 30S；
Step 5：Unloading pressure, takes out part, thus obtain electronic packing part 8, i.e. now electronic packing part 8
Wall thickness is 1 millimeter.
Embodiment three：The operation of the present embodiment is as follows：
Step one：Using powder metallurgical technique by SiC powder and Al powder according to 55：45 ratio mixing, punching block cold compaction,
550 DEG C of punching block hot pressing process prepare 55vol%SiC/Al metal-base composites blank 1；
Step 2：By electromagnetic induction heater or resistance-heated furnace, above-mentioned 55vol%SiC/Al Metal Substrate is multiple
Condensation material blank 1 is heated to 600 DEG C；
Step 3：Blank after above-mentioned heating is placed in 450 DEG C of die cavity；Or composite prepared by step one
It is placed in die cavity and is heated to 550 DEG C together in company with mould, step 2 can be saved；
Step 4：Carry out pressurizeing for the first time F to mould on above-mentioned die cavity1, F1Pressure value be 450MPa, now Metal Substrate is multiple
Condensation material blank 1 is squeezed and forms multiple upper and lower projections, and multiple upper and lower projections are filled in the gap of particular manufacturing craft, multiple
On convex to form completely raised and be filled in one by one between secondary briquetting 4-2 and main briquetting 4-1, multiple lower convexity are not entirely filled with
In first gap 5 and the second gap 6, leave space；Pass through secondary briquetting 4-2 pressurization F with it2, its pressure value is 500MPa, multiple
Secondary briquetting 4-2 declines until in the same plane with main briquetting 4-1；And pressurize 30S；Obtain the electricity that wall thickness is 0.9 millimeter
Sub- encapsulating parts 8.
Claims (3)
1. a kind of Metal Substrate Electronic Packaging thin-walled parts order load die-forging forming method it is characterised in that：Methods described bag
Include following steps：
Step one：Prepare the metal-base composites blank (1) strengthening phase content first；
Step 2：Secondly the metal-base composites blank (1) prepared step one is placed in the die cavity (2) in particular manufacturing craft
Interior, so that this metal-base composites blank (1) is on the multiple core rods (3) in die cavity (2), by this metal-base composites base
Material (1) is heated, and, between 450 DEG C～650 DEG C, this Metal Substrate is multiple for the temperature controlling this metal-base composites blank (1)
Condensation material blank (1) softens in the die cavity (2) being located at it；
Step 3：Again by the group in particular manufacturing craft close mould (4) be placed in die cavity (2) and with metal-base composites blank
(1) gap setting, multiple main briquetting (4-1) in mould (4) that group is closed applies precompression, make multiple main briquettings (4-1) all under
Fall, until being adjacent on metal-base composites blank (1), applies pressure F to multiple main briquettings (4-1) simultaneously1, make Metal Substrate
Composite blank (1) is deformed, and the upper surface of metal-base composites blank (1) is extruded into becoming owner of briquetting (4-1)
Form multiple upper projections, the lower surface of metal-base composites blank (1) is squeezed simultaneously in gap and secondary briquetting (4-2) between
It is pressed into the multiple lower convexity of formation in the gap between die cavity (2) and core rod (3)；
Step 4：Then multiple pairs briquetting (4-2) group closed in mould (4) apply pressure F simultaneously2, multiple pairs briquetting (4-2)
Decline up in the same plane with main briquetting (4-1), make raised in each of metal-base composites blank (1) upper surface
It is extruded till each lower convexity is filled in the gap between die cavity (2) and core rod (3), make metal-base composites base
Material (1) forms electronic packing part (8)；
Step 5：Finally the pressure on unloading particular manufacturing craft, takes out electronic packing part (8) from particular manufacturing craft.
2. the method that a kind of Metal Substrate Electronic Packaging thin-walled parts order according to claim 1 loads die-forging forming, its
It is characterised by：In step 3, pressure F is applied simultaneously to multiple main briquettings (4-1)1It is ensured that F1Pressure value reach 400～
450MPa.
3. the method that a kind of Metal Substrate Electronic Packaging thin-walled parts order according to claim 1 and 2 loads die-forging forming,
It is characterized in that：In step 4, pressure F is applied simultaneously to multiple pairs briquetting (4-2)2It is ensured that F2Pressure value reach 400～
500MPa.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4996863A (en) * | 1989-09-28 | 1991-03-05 | Aluminum Precision Products, Inc. | Radially convergent hot forging apparatus and method |
| JPH105895A (en) * | 1996-06-13 | 1998-01-13 | Sanken Electric Co Ltd | Production of metal supporting plate of resin seal type electronic part |
| CN102626821A (en) * | 2012-04-27 | 2012-08-08 | 哈尔滨工业大学 | Method for connecting semi-solid materials into whole |
| CN103551851A (en) * | 2013-10-10 | 2014-02-05 | 湘潭大学 | Method and die for combined forming of parts of metal plate with protrusion structure at bottom |
| CN203972720U (en) * | 2014-07-29 | 2014-12-03 | 谢良 | Cross axle forges processing compound Die Forging device |
-
2015
- 2015-09-21 CN CN201510603994.0A patent/CN105081165B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4996863A (en) * | 1989-09-28 | 1991-03-05 | Aluminum Precision Products, Inc. | Radially convergent hot forging apparatus and method |
| JPH105895A (en) * | 1996-06-13 | 1998-01-13 | Sanken Electric Co Ltd | Production of metal supporting plate of resin seal type electronic part |
| CN102626821A (en) * | 2012-04-27 | 2012-08-08 | 哈尔滨工业大学 | Method for connecting semi-solid materials into whole |
| CN103551851A (en) * | 2013-10-10 | 2014-02-05 | 湘潭大学 | Method and die for combined forming of parts of metal plate with protrusion structure at bottom |
| CN203972720U (en) * | 2014-07-29 | 2014-12-03 | 谢良 | Cross axle forges processing compound Die Forging device |
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