CN105062065A - Method for preparing wave-transparent composite material - Google Patents
Method for preparing wave-transparent composite material Download PDFInfo
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- CN105062065A CN105062065A CN201510542815.7A CN201510542815A CN105062065A CN 105062065 A CN105062065 A CN 105062065A CN 201510542815 A CN201510542815 A CN 201510542815A CN 105062065 A CN105062065 A CN 105062065A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
Abstract
The invention relates to a method for preparing a wave-transparent composite material. The method comprises the following steps: preparing packing by utilizing ytterbium nitrate, silicon nitride and formic acid; preparing resin prepolymer by utilizing diphenylmethane bismaleimide, bisphenol-A cyanate ester, imide-contained dibasic acid, phthalic anhydride and bisphenol-A epoxy resin; dissolving the resin prepolymer in butanone to obtain resin liquid; dissolving polyarylether phenyl quinoxaline in tetrachloroethane and then adding tetrachloroethane to the resin liquid; sequentially adding poly-methyl silsesquioxane and the packing into the resin liquid, performing stirring for 10 min at 120 DEG C, obtaining a composite system; pouring the composite system in a die coated with a release agent, removing bubbles on the conditions of vacuum, placing the composite system in an oven to perform heating and curing, finally shutting down an oven power supply to naturally cool a poured body; and performing demolding to obtain the wave-transparent composite material. The wave-transparent composite material has excellent mechanical property and heat resistance, and the development and application of the wave-transparent composite material are met.
Description
Technical field
The invention belongs to advanced composite material technical field, be specifically related to a kind of preparation method of wave-penetrating composite material, the product obtained can be used for aerospace field.
Background technology
Specific inductivity and dissipation factor weigh two important indicators of electromagnetic wave transparent material wave transparent ability, according to the environment for use of electromagnetic wave transparent material, also need to consider other performance except wave transmission rate, as long resistance to elevated temperatures, high rigidity, dimensional stabilizing, fire-retardant, toughness, chemical corrosion, wear-resisting, self-lubricating, ageing-resistant etc.For ensureing radar or the normal use of antenna in various complex environment, radome or radome matrix material must possess the performances such as specific tenacity is high, wave transmission rate is high, also need in design to consider good vibration proof and resistance of aging simultaneously.
High temperature wave-transparent material to refer to wavelength in 1 ~ 1000mm, frequency at the material of the hertzian wave transmitance >70% at sufficiently high temperature of 0.3 ~ 300GHz.Generally, in this range of frequency, electromagnetic wave transparent material is suitable for that ε is 1 ~ 4, tg δ is 0.1 ~ 0.01, could obtain desirable wave penetrate capability and less insertion loss like this.Structure electromagnetic wave transparent material system mainly contains electromagnetic wave transparent material that is high temperature resistant and normal temperature application, and the Typical Representative of this bi-material system is respectively ceramic wave-transmitting material and polymer matrix composite.
Matrix material is by two or more material of different nature, by the method for physics or chemistry, has the material of new capability at the upper composition of macroscopic view (microcosmic).Various material makes up for each other's deficiencies and learn from each other in performance, produces synergistic effect, makes the over-all properties of matrix material be better than former composition material and meet various different requirement.With the macromolecular material of different performance for matrix, by means such as filling, blended microwave ceramics medium and conjugated fibres, while ensureing that material has and well bears mechanical force and other performance, regulate specific inductivity and the dissipation factor of material, obtain the matrix material that wave transmission rate can meet our service requirements.Meta Materials is " artificial composite structure or the matrix material with the extraordinary physical properties not available for natural materials ", this is a kind of sandwich, by the structure design of microcosmic, optics and the electromagnetic property of beyond tradition material is realized, unidirectional wave transparent and selection frequency wave transparent according to the miniature cycle aperture unit of calculated permutations distribution.In practice, while ensureing that material has and well bears mechanical force and other performance, regulate specific inductivity and the dissipation factor of material, obtain the matrix material that wave transmission rate can meet our service requirements.
Summary of the invention
The object of this invention is to provide a kind of preparation method of wave-penetrating composite material, the wave-penetrating composite material of preparation has low specific inductivity, excellent thermotolerance, can be used as aerospace material application.
To achieve the above object of the invention, the technical solution used in the present invention is: a kind of preparation method of wave-penetrating composite material, comprises the following steps:
(1) add in the silicon nitride aqueous solution by the ytterbium nitrate aqueous solution, stir, so add formic acid, in 150 DEG C of reactions 3 hours, naturally cooling, obtained solid after centrifugal; Within 80 minutes, filler is obtained again in 900 DEG C of process;
(2) mix diphenyl methane dimaleimide and bisphenol A cyanate, 120 DEG C of stirrings added imine biatomic acid after 45 minutes, continued stirring 10 minutes; Then add phthalic anhydride, bisphenol A epoxide resin, continue stirring 78 minutes; Obtain resin prepolymer;
(3) resin prepolymer is dissolved in butanone, obtains resin liquid; Add in resin liquid after polyarylether Ben based quinoxaline is dissolved in tetrachloroethane; Then successively poly methyl silsesquioxane, filler are added in resin liquid, stir 10 minutes in 120 DEG C, obtain compound system; Then being poured into by compound system scribbles in the mould of releasing agent, sloughs bubble under vacuum, puts into baking oven elevated cure, finally closes baking oven power supply, makes pour mass naturally cooling; Namely the demoulding obtains wave-penetrating composite material.
In the present invention, in step (1), the mass ratio of described ytterbium nitrate, silicon nitride, formic acid is 0.4: 1: 0.04; The median size of described filler is 80nm.
In the present invention, in step (2), the mass ratio of diphenyl methane dimaleimide, bisphenol A cyanate, imine biatomic acid, phthalic anhydride, bisphenol A epoxide resin is 1: 2 ~ 2.5: 0.08 ~ 0.1: 0.15 ~ 0.2: 0.5 ~ 0.6.
In the present invention, in step (3), the mass ratio of resin prepolymer, polyarylether Ben based quinoxaline, poly methyl silsesquioxane, filler is 1: 0.22 ~ 0.25: 0.1 ~ 0.15: 0.18 ~ 0.22.The molecular weight of poly methyl silsesquioxane is 1.8 ~ 2.0 ten thousand; The molecular weight of polyarylether Ben based quinoxaline is 0.8 ~ 1.0 ten thousand.
In the present invention, in step (3), elevated cure technique is: 150 DEG C/1 hour+170 DEG C/1 hour+200 DEG C/3 hours+220 DEG C/1 hour.
In the present invention, organic object is the primary bond composition of resin base compound system, and the Nano filling of rigidity can be evenly dispersed in resin, improves intensity and the thermal level of its cured article; Present invention, avoiding especially between compound interface and occur hole, the formation of polymer interpenetration network can not be hindered, ensure the intensity of solidification composition board.For organic-inorganic dielectric materials, the dispersion of inorganic particulate is extremely important for obtaining compared with the matrix material of low-k; The matrix material that prior art uses the preparation of coupling agent treatment inorganic particulate better dispersed, but coupling agent can reduce thermotolerance and dielectric properties, the mechanical property of system, even can affect the solidification of organic materials, the cyanate to condition of cure sensitivity can be disturbed especially; The present invention, without the need to coupling agent, can improve the consistency between organism and inorganic particulate by compatibility organic system, is conducive to inorganic particulate dispersed better in polymeric matrix, thus improves the over-all properties of electromagnetic wave transparent material.
System of the present invention includes the inorganic supporting structure containing Si, N composition, gives the heat-resisting and mechanical property that hybrid material is good; Connection active reactive group in inorganic materials outside can improve the consistency between inorganic particulate and polymkeric substance, and reactive group can realize the chemical bonding effect between inorganic composition and polymkeric substance, is convenient to molecule assembling.Organic group is connected to the very strong inorganic molecule of thermotolerance, makes polymkeric substance of the present invention under the degradation temperature of general polymerization thing, original state still can be kept constant, thus very stable under the high temperature conditions; Second-order transition temperature is more than 150 DEG C, and make it to have the ability controlling backbone motion because filler has special structure, its introducing will hinder the motion of polymer segment greatly, improves the use temperature of thermosetting polymer simultaneously; Also likely improve toughness.
Electromagnetic wave transparent material of the present invention shows significant delayed combustion characteristic compared with current material, and greatly reduces the combustion heat.Inorganic materials has extraordinary thermotolerance, and the resistates after decomposes is inorganics, and content is very high, also has the ability of good anti-atomic oxygen, atomic oxygen makes its surface conversion be silicon oxide, and the skin of complete oxidation stops Sauerstoffatom to invade further; So flame retardant resistance is very good.
Material structure of the present invention contains uniform nano level hole, avoids conventional fillers and there is the disadvantageous effect of dangling bonds to dielectric properties, have good low-k, can be used as space flight electromagnetic wave transparent material.Less at aviation field dielectric loss, hertzian wave is fewer in the loss of dielectric transmitting energy, and the wave transmission rate of material is higher.Resin of the present invention because of the polar group contained few, cured product cross-linking density is large, and product molecule chain is regular, so the cured article of this resin has good wave penetrate capability, can meet the requirement of advanced radome to dielectric properties completely.
In the present invention, by small molecules, span/epoxy/cyanate ester resin and polyarylether benzene based quinoxaline are combinationally used, the polymer body of excellent in mechanical performance, Good Heat-resistance can be obtained.By adding small molecules, the even density of filler in system, can obtain good mix, becomes the paste-like being easily prepared into and having mobility; Be conducive to polymer polymerization, increase the cross-linking set in system solidification process, obtain interpenetrating polymer structure, ensure the intensity of wave-penetrating composite material.
Because technique scheme is used, the present invention compared with prior art has following advantages:
Preparation method's technique provided by the invention is simply effective, inorganic nanoparticles and hole have uniform dispersity in system, preparation process belongs to chemical process, and the inorganics of formation and the surface bonding power of interlaminar resin are better than the surface bonding power of traditional physical mechanical blending greatly.Rationally, between each component, consistency is good, has prepared wave-penetrating composite material thus, has good mechanical property, resistance toheat, meets the development and application of wave-penetrating composite material for the material system composition that the present invention utilizes; The advantage of comprehensive polymkeric substance, inorganic particulate two component, improves the shortcoming of two components, thus improves the over-all properties obtaining material; Solidification effect is good, crosslinking structure is even, micromolecular compound can as the compatilizer of macromolecule organic, increase the consistency of each component of system on the one hand, avoid on the other hand during hot-press solidifying, forming crosslinked uneven defect, ensure that resin system forms stable structure, mechanical property is strong, achieves beyond thought effect.Material transparent and homogeneous of the present invention, heat-proof combustion-resistant, hardness are high, scrape resistant, have good intermiscibility with organic solvent, do not produce volatile matter, Stability Analysis of Structures, not easily shrink and be out of shape, surface hydrophobicity and viscosity little, there is good thermodynamic stability and chemical stability, do not discharge volatile organic component.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
The present embodiment is raw materials used is all commercial, belongs to industrial goods; Wherein the molecular weight of poly methyl silsesquioxane is 1.8 ~ 2.0 ten thousand; The molecular weight of polyarylether Ben based quinoxaline is 0.8 ~ 1.0 ten thousand.
The preparation method of embodiment one one kinds of wave-penetrating composite materials, comprises the following steps:
(1) be added to the water by 400g ytterbium nitrate and obtain the ytterbium nitrate aqueous solution, 1Kg silicon nitride is added to the water and obtains the silicon nitride aqueous solution, and mix two kinds of aqueous solution, stir, so add 40g formic acid, in 150 DEG C of reactions 3 hours, naturally cooling, obtained solid after centrifugal; The filler that median size is 80nm within 80 minutes, is obtained again in 900 DEG C of process;
(2) mix 100g diphenyl methane dimaleimide and 200g bisphenol A cyanate, 120 DEG C of stirrings added 8g imine biatomic acid after 45 minutes, continued stirring 10 minutes; Then add 20g phthalic anhydride, 60g bisphenol A epoxide resin, continue stirring 78 minutes; Obtain resin prepolymer;
(3) 100g resin prepolymer is dissolved in butanone, obtains resin liquid; Add in resin liquid after 22g polyarylether Ben based quinoxaline is dissolved in tetrachloroethane; Then successively 10g poly methyl silsesquioxane, 22g filler are added in resin liquid, stir 10 minutes in 120 DEG C, obtain compound system; Then being poured into by compound system scribbles in the mould of releasing agent, sloughs bubble under vacuum, puts into baking oven elevated cure, finally closes baking oven power supply, makes pour mass naturally cooling; Namely the demoulding obtains wave-penetrating composite material.
In step (3), elevated cure technique is: 150 DEG C/1 hour+170 DEG C/1 hour+200 DEG C/3 hours+220 DEG C/1 hour.
The preparation method of embodiment 21 kinds of wave-penetrating composite materials, comprises the following steps:
(1) be added to the water by 400g ytterbium nitrate and obtain the ytterbium nitrate aqueous solution, 1Kg silicon nitride is added to the water and obtains the silicon nitride aqueous solution, and mix two kinds of aqueous solution, stir, so add 40g formic acid, in 150 DEG C of reactions 3 hours, naturally cooling, obtained solid after centrifugal; The filler that median size is 80nm within 80 minutes, is obtained again in 900 DEG C of process;
(2) mix 100g diphenyl methane dimaleimide and 250g bisphenol A cyanate, 120 DEG C of stirrings added 10g imine biatomic acid after 45 minutes, continued stirring 10 minutes; Then add 15g phthalic anhydride, 50g bisphenol A epoxide resin, continue stirring 78 minutes; Obtain resin prepolymer;
(3) 100g resin prepolymer is dissolved in butanone, obtains resin liquid; Add in resin liquid after 25g polyarylether Ben based quinoxaline is dissolved in tetrachloroethane; Then successively 15g poly methyl silsesquioxane, 18g filler are added in resin liquid, stir 10 minutes in 120 DEG C, obtain compound system; Then being poured into by compound system scribbles in the mould of releasing agent, sloughs bubble under vacuum, puts into baking oven elevated cure, finally closes baking oven power supply, makes pour mass naturally cooling; Namely the demoulding obtains wave-penetrating composite material.
In step (3), elevated cure technique is: 150 DEG C/1 hour+170 DEG C/1 hour+200 DEG C/3 hours+220 DEG C/1 hour.
The preparation method of embodiment 31 kinds of wave-penetrating composite materials, comprises the following steps:
(1) be added to the water by 400g ytterbium nitrate and obtain the ytterbium nitrate aqueous solution, 1Kg silicon nitride is added to the water and obtains the silicon nitride aqueous solution, and mix two kinds of aqueous solution, stir, so add 40g formic acid, in 150 DEG C of reactions 3 hours, naturally cooling, obtained solid after centrifugal; The filler that median size is 80nm within 80 minutes, is obtained again in 900 DEG C of process;
(2) mix 100g diphenyl methane dimaleimide and 230g bisphenol A cyanate, 120 DEG C of stirrings added 9g imine biatomic acid after 45 minutes, continued stirring 10 minutes; Then add 18g phthalic anhydride, 58g bisphenol A epoxide resin, continue stirring 78 minutes; Obtain resin prepolymer;
(3) 100g resin prepolymer is dissolved in butanone, obtains resin liquid; Add in resin liquid after 23g polyarylether Ben based quinoxaline is dissolved in tetrachloroethane; Then successively 13g poly methyl silsesquioxane, 20g filler are added in resin liquid, stir 10 minutes in 120 DEG C, obtain compound system; Then being poured into by compound system scribbles in the mould of releasing agent, sloughs bubble under vacuum, puts into baking oven elevated cure, finally closes baking oven power supply, makes pour mass naturally cooling; Namely the demoulding obtains wave-penetrating composite material.
In step (3), elevated cure technique is: 150 DEG C/1 hour+170 DEG C/1 hour+200 DEG C/3 hours+220 DEG C/1 hour.
The preparation method of comparative example one one kinds of wave-penetrating composite materials, comprises the following steps:
(1) be added to the water by 400g ytterbium nitrate and obtain the ytterbium nitrate aqueous solution, 1Kg silicon nitride is added to the water and obtains the silicon nitride aqueous solution, and mix two kinds of aqueous solution, stir, so add 40g formic acid, in 150 DEG C of reactions 3 hours, naturally cooling, obtained solid after centrifugal; The filler that median size is 80nm within 80 minutes, is obtained again in 900 DEG C of process;
(2) mix 100g diphenyl methane dimaleimide and 200g bisphenol A cyanate, 120 DEG C of stirrings added 60g bisphenol A epoxide resin after 45 minutes, continued stirring 78 minutes; Obtain resin prepolymer;
(3) 100g resin prepolymer is dissolved in butanone, obtains resin liquid; Add in resin liquid after 22g polyarylether Ben based quinoxaline is dissolved in tetrachloroethane; Then 28g filler is added in resin liquid, stir 10 minutes in 120 DEG C, obtain compound system; Then being poured into by compound system scribbles in the mould of releasing agent, sloughs bubble under vacuum, puts into baking oven elevated cure, finally closes baking oven power supply, makes pour mass naturally cooling; Namely the demoulding obtains wave-penetrating composite material.
In step (3), elevated cure technique is: 150 DEG C/1 hour+170 DEG C/1 hour+200 DEG C/3 hours+220 DEG C/1 hour.
Stretching, the bending property of wave-penetrating composite material is tested respectively according to GB3354-84, GB356-82; Test the second-order transition temperature of wave-penetrating composite material with dynamic mechanical analysis instrument (DMTA), temperature rise rate 3 DEG C/min, vibrational frequency is 1Hz; Dielectric properties adopt waveguide short method, frequency 10GHz.
The performance test results of above-mentioned wave-penetrating composite material is in table 1.
The performance of table 1 wave-penetrating composite material
| Flexural strength/MPa | Modulus in flexure/GPa | tanδ | ε | T g/℃ | |
| Embodiment one | 186 | 6.3 | 0.010 | 2.9 | 161 |
| Embodiment two | 178 | 5.9 | 0.010 | 3.0 | 154 |
| Embodiment three | 180 | 5.9 | 0.011 | 3.1 | 157 |
| Comparative example one | 161 | 4.2 | 0.019 | 3.3 | 130 |
To sum up, rationally, between each component, consistency is good, has prepared wave-penetrating composite material thus, has good mechanical property, has excellent resistance toheat especially, meets the development and application of wave-penetrating composite material for wave-penetrating composite material composition disclosed by the invention.
Claims (7)
1. a preparation method for wave-penetrating composite material, is characterized in that, comprises the following steps:
(1) add in the silicon nitride aqueous solution by the ytterbium nitrate aqueous solution, stir, so add formic acid, in 150 DEG C of reactions 3 hours, naturally cooling, obtained solid after centrifugal; Within 80 minutes, filler is obtained again in 900 DEG C of process;
(2) mix diphenyl methane dimaleimide and bisphenol A cyanate, 120 DEG C of stirrings added imine biatomic acid after 45 minutes, continued stirring 10 minutes; Then add phthalic anhydride, bisphenol A epoxide resin, continue stirring 78 minutes; Obtain resin prepolymer;
(3) resin prepolymer is dissolved in butanone, obtains resin liquid; Add in resin liquid after polyarylether Ben based quinoxaline is dissolved in tetrachloroethane; Then successively poly methyl silsesquioxane, filler are added in resin liquid, stir 10 minutes in 120 DEG C, obtain compound system; Then being poured into by compound system scribbles in the mould of releasing agent, sloughs bubble under vacuum, puts into baking oven elevated cure, finally closes baking oven power supply, makes pour mass naturally cooling; Namely the demoulding obtains wave-penetrating composite material.
2. the preparation method of wave-penetrating composite material according to claim 1, it is characterized in that, in step (1), the mass ratio of described ytterbium nitrate, silicon nitride, formic acid is 0.4: 1: 0.04; The median size of described filler is 80nm.
3. the preparation method of wave-penetrating composite material according to claim 1, it is characterized in that, in step (2), the mass ratio of diphenyl methane dimaleimide, bisphenol A cyanate, imine biatomic acid, phthalic anhydride, bisphenol A epoxide resin is 1: 2 ~ 2.5: 0.08 ~ 0.1: 0.15 ~ 0.2: 0.5 ~ 0.6.
4. the preparation method of wave-penetrating composite material according to claim 1, it is characterized in that, in step (3), the mass ratio of resin prepolymer, polyarylether Ben based quinoxaline, poly methyl silsesquioxane, filler is 1: 0.22 ~ 0.25: 0.1 ~ 0.15: 0.18 ~ 0.22.
5. the preparation method of wave-penetrating composite material according to claim 1, it is characterized in that, the molecular weight of described poly methyl silsesquioxane is 1.8 ~ 2.0 ten thousand; The molecular weight of polyarylether Ben based quinoxaline is 0.8 ~ 1.0 ten thousand.
6. the preparation method of wave-penetrating composite material according to claim 1, it is characterized in that, in step (3), elevated cure technique is: 150 DEG C/1 hour+170 DEG C/1 hour+200 DEG C/3 hours+220 DEG C/1 hour.
7. the wave-penetrating composite material prepared of the preparation method of any one wave-penetrating composite material according to claims 1 to 6.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111269537A (en) * | 2020-03-19 | 2020-06-12 | 北华航天工业学院 | Preparation method of epoxy resin-based composite wave-transmitting material |
| CN111362702A (en) * | 2020-03-17 | 2020-07-03 | 中国工程物理研究院激光聚变研究中心 | Preparation method of SiOC radar type wave-absorbing material |
-
2015
- 2015-08-31 CN CN201510542815.7A patent/CN105062065A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111362702A (en) * | 2020-03-17 | 2020-07-03 | 中国工程物理研究院激光聚变研究中心 | Preparation method of SiOC radar type wave-absorbing material |
| CN111362702B (en) * | 2020-03-17 | 2022-05-17 | 中国工程物理研究院激光聚变研究中心 | Preparation method of SiOC radar type wave-absorbing material |
| CN111269537A (en) * | 2020-03-19 | 2020-06-12 | 北华航天工业学院 | Preparation method of epoxy resin-based composite wave-transmitting material |
| CN111269537B (en) * | 2020-03-19 | 2022-06-17 | 北华航天工业学院 | Preparation method of epoxy resin-based composite wave-transmitting material |
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Application publication date: 20151118 |