CN105058722A - Die - Google Patents

Die Download PDF

Info

Publication number
CN105058722A
CN105058722A CN201510487314.3A CN201510487314A CN105058722A CN 105058722 A CN105058722 A CN 105058722A CN 201510487314 A CN201510487314 A CN 201510487314A CN 105058722 A CN105058722 A CN 105058722A
Authority
CN
China
Prior art keywords
thimble
injection molding
molding cavity
bed die
mould according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510487314.3A
Other languages
Chinese (zh)
Inventor
丁铭
张友明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bo Ao Plastic Electronic Co Ltd Of Suzhou City
Original Assignee
Bo Ao Plastic Electronic Co Ltd Of Suzhou City
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bo Ao Plastic Electronic Co Ltd Of Suzhou City filed Critical Bo Ao Plastic Electronic Co Ltd Of Suzhou City
Priority to CN201510487314.3A priority Critical patent/CN105058722A/en
Publication of CN105058722A publication Critical patent/CN105058722A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/40Removing or ejecting moulded articles
    • B29C45/4005Ejector constructions; Ejector operating mechanisms
    • B29C45/401Ejector pin constructions or mountings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/2602Mould construction elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00Optical elements, e.g. lenses, prisms

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention relates to a die. The die comprises an upper die, a lower die and at least two ejector pins, wherein the upper die and the lower die are oppositely arranged, the ejector pins are arranged in the upper die, an injection molding cavity for the injection molding of an optical element is formed between the upper die and the lower die, at least two ejector pin grooves are formed in the lower die and vertically penetrate through the lower die, the ejector pins are arranged in the ejector pin grooves, elastic sleeves are further arranged in the ejector pin grooves and arranged on the ejector pins in a sleeving manner, the ejector pin grooves are communicated with the injection molding cavity and positioned below the injection molding cavity, the ejector pins can oppositely move in the ejector pin grooves so as to extend into the injection molding cavity, lantern rings are arranged at the top ends of the ejector pins, springs are arranged between the lantern rings and the ejector pins, and the lantern rings can move up and down relative to the ejector pins so as to expose the top ends of the ejector pins. The die has the advantages that the ejector pins can be prevented from bending, breaking or wearing due to direct collision or friction with the lower die, so that the service life of the ejector pins is prolonged, the rigid impact of the ejector pins with the optical element is prevented, the bending or breaking of the ejector pins is also effectively avoided, and the optical element is also protected.

Description

Mould
Technical field
The present invention relates to a kind of mould.
Background technology
In recent years along with the develop rapidly of multimedia technology, increasing to the demand of the optical element be mounted on digital product, and require also more and more higher, optical element is also progressively to frivolous short future development, along with the size of optical element reduces, the diameter of thimble also reduces accordingly, therefore, the careless mistake due to operating personnel is often there is during form removal, cause thimble direct collision module, thus thimble is made to bend or fracture, thus increase maintenance capacity and the production cost of mould, in addition, when thimble uses in a mold, because thimble may rock, so make to produce friction between thimble and mould, make the easy loss of thimble, in addition, thimble is easy and optical element generation rigid shock when driving, it also result in the consume of thimble, simultaneously, also easy optical element to be damaged.
Because above-mentioned defect, the design people, actively in addition research and innovation, to founding a kind of mould of new structure, make it have more value in industry.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide a kind of mould, it can avoid the thimble of mould to bend or fracture, contributes to the service life of improving thimble.
A kind of mould of the present invention, comprise the mold and bed die and at least two thimbles be arranged in described mold that are oppositely arranged, the injection molding cavity in order to injection moulding optical element is formed between described mold and bed die, from top to bottom run through in described bed die and be formed with at least two thimble grooves, described thimble is arranged in described thimble groove, also resilient sleeve is provided with in described thimble groove, described resilient sleeve jacket casing is on described thimble, described thimble groove is communicated with described injection molding cavity, and be positioned at the below of described injection molding cavity, described thimble can move to stretch to described injection molding cavity in described thimble groove, the top of described thimble is provided with the collar, spring is provided with between the described collar and thimble, the described collar can move up and down the top of exposing thimble by thimble relatively.
Further, described resilient sleeve is the protective sleeve made by soft rubber.
Further, described soft rubber is ethene or propylene.
Further, the diameter range of described thimble is 0.5 ~ 1 millimeter.
Further, described thimble is provided with stator, described stator is placed in the described collar, and described spring clip is held in the bottom surface of described stator and the collar.
Further, described resilient sleeve comprises the vertical tube part be embedded in described bed die and the flank section be positioned at below described bed die, the diameter of described flank section is greater than the diameter of vertical tube part, and is greater than the diameter of thimble groove, has gap between described flank section and the lower surface of bed die.
Further, spring is clamped with between described flank section and the lower surface of bed die.
Further, described mold offers inner groovy, be provided with in described inner groovy and compress pin, described inner groovy is communicated with described injection molding cavity, and be positioned at the top of described injection molding cavity, described compressing between the upper end of pin and mold is provided with spring, described in compress pin and can stretch out described inner groovy under the action of the spring.
Further, the lower end compressing pin described in is provided with pad.
Further, the diameter range compressing pin described in is 0.3 ~ 0.5 millimeter.
By such scheme, the present invention at least has the following advantages: mould of the present invention by arranging resilient sleeve in bed die, and by tailstock barrel in this resilient sleeve, again the collar is set on the top of thimble, and be provided with spring between this collar and thimble, relatively can move up and down to expose the top of thimble by thimble to make the collar, thus avoid the thimble of mould and bed die direct collision or friction, cause bending or rupture and wearing and tearing, contribute to the service life of improving thimble, prevent again the rigid shock of thimble and optical element, also the bending of thimble or fracture is effectively avoided, and contribute to again protecting optical element.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.
Accompanying drawing explanation
Fig. 1 is the structural representation of mould of the present invention;
Fig. 2 is the enlarged drawing of circle A in Fig. 1;
Fig. 3 is the enlarged drawing of circle B in Fig. 1.
Detailed description of the invention
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
See Fig. 1 to Fig. 3, a kind of mould described in a preferred embodiment of the present invention comprises the mold 10 and bed die 20 and at least two thimbles 30 be arranged in described mold 10 that are oppositely arranged.The injection molding cavity 40 in order to injection moulding optical element (not shown) is formed between described mold 10 and bed die 20, from top to bottom run through in described bed die 20 and be formed with at least two thimble grooves 21, described thimble 30 is arranged in described thimble groove 21, and the diameter range of described thimble 30 is 0.5 ~ 1 millimeter.Also be provided with resilient sleeve 50 in described thimble groove 21, described resilient sleeve 50 is the protective sleeve made by soft rubber, and in the present embodiment, described soft rubber is ethene or propylene.Described resilient sleeve 50 overlaps on described thimble 30, described thimble groove 21 is communicated with described injection molding cavity 40, and be positioned at the below of described injection molding cavity 40, described thimble 30 can move to stretch to described injection molding cavity 40 in described thimble groove 21, the top of described thimble 30 is provided with the collar 31, be provided with the first spring 32 between the described collar 31 and thimble 30, the described collar 31 can move up and down the top of exposing thimble 30 by thimble 30 relatively.Described thimble 30 is provided with stator 33, and described stator 33 is placed in the described collar 31, and described first spring 32 is clamped in the bottom surface of described stator 33 and the collar 31.
As further improvement of this embodiment, described resilient sleeve 50 comprises the vertical tube part 51 be embedded in described bed die 20 and the flank section 52 be positioned at below described bed die 20, the diameter of described flank section 52 is greater than the diameter of vertical tube part 51, and be greater than the diameter of thimble groove 21, between described flank section 52 and the lower surface of bed die 20, there is gap, to cushion rigid shock, and provide cushion space to thimble 30.
As further improvement of this embodiment, be clamped with the second spring 53 between described flank section 52 and the lower surface of bed die 20, to cushion rigid shock.
As further improvement of this embodiment, described mold 10 offers inner groovy 11, be provided with in described inner groovy 11 and compress pin 60, described inner groovy 11 is communicated with described injection molding cavity 40, and be positioned at the top of described injection molding cavity 40, described compressing between the upper end of pin 60 and mold 10 is provided with the 3rd spring 61, described in compress pin 60 and can stretch out described inner groovy 11 under the effect of the 3rd spring 61.Compress pin 60 by arranging in mold 10, thus contribute to the demoulding between mold 10 and optical chip.The described lower end compressing pin 60 is provided with pad 62, contributes to preventing compressing the sticky glutinous of pin 60 and optical chip by this pad 62, meanwhile, prevents from compressing the infringement that resist force that pin 60 pairs of optical chips produce causes optical chip.The described diameter range compressing pin 60 is 0.3 ~ 0.5 millimeter.
In sum, above-mentioned mould by arranging resilient sleeve 50 in bed die 20, and thimble 30 is overlapped in this resilient sleeve 50, again the collar 31 is set on the top of thimble 30, and be provided with spring 32 between this collar 31 and thimble 30, relatively can move up and down to expose the top of thimble 30 by thimble 30 to make the collar 31, thus avoid thimble 30 and bed die 20 direct collision or the friction of mould, cause bending or rupture and wearing and tearing, contribute to the service life of improving thimble 30, prevent again the rigid shock of thimble 30 and optical element, also the bending of thimble 30 or fracture is effectively avoided, and contribute to again protecting optical element.
The above is only the preferred embodiment of the present invention; be not limited to the present invention; should be understood that; for those skilled in the art; under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.

Claims (10)

1. a mould, it is characterized in that: comprise the mold and bed die and at least two thimbles be arranged in described mold that are oppositely arranged, the injection molding cavity in order to injection moulding optical element is formed between described mold and bed die, from top to bottom run through in described bed die and be formed with at least two thimble grooves, described thimble is arranged in described thimble groove, also resilient sleeve is provided with in described thimble groove, described resilient sleeve jacket casing is on described thimble, described thimble groove is communicated with described injection molding cavity, and be positioned at the below of described injection molding cavity, described thimble can move to stretch to described injection molding cavity relative in described thimble groove, the top of described thimble is provided with the collar, spring is provided with between the described collar and thimble, the described collar can move up and down the top of exposing thimble by thimble relatively.
2. mould according to claim 1, is characterized in that: described resilient sleeve is the protective sleeve made by soft rubber.
3. mould according to claim 2, is characterized in that: described soft rubber is ethene or propylene.
4. mould according to claim 1, is characterized in that: the diameter range of described thimble is 0.5 ~ 1 millimeter.
5. mould according to claim 1, is characterized in that: described thimble is provided with stator, and described stator is placed in the described collar, and described spring clip is held in the bottom surface of described stator and the collar.
6. mould according to claim 1, it is characterized in that: described resilient sleeve comprises the vertical tube part be embedded in described bed die and the flank section be positioned at below described bed die, the diameter of described flank section is greater than the diameter of vertical tube part, and be greater than the diameter of thimble groove, between described flank section and the lower surface of bed die, there is gap.
7. mould according to claim 6, is characterized in that: be clamped with spring between described flank section and the lower surface of bed die.
8. mould according to claim 1, it is characterized in that: described mold offers inner groovy, be provided with in described inner groovy and compress pin, described inner groovy is communicated with described injection molding cavity, and be positioned at the top of described injection molding cavity, described compressing between the upper end of pin and mold is provided with spring, described in compress pin and can stretch out described inner groovy under the action of the spring.
9. mould according to claim 8, is characterized in that: described in compress pin lower end be provided with pad.
10. mould according to claim 8, is characterized in that: described in compress pin diameter range be 0.3 ~ 0.5 millimeter.
CN201510487314.3A 2015-08-11 2015-08-11 Die Pending CN105058722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510487314.3A CN105058722A (en) 2015-08-11 2015-08-11 Die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510487314.3A CN105058722A (en) 2015-08-11 2015-08-11 Die

Publications (1)

Publication Number Publication Date
CN105058722A true CN105058722A (en) 2015-11-18

Family

ID=54488340

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510487314.3A Pending CN105058722A (en) 2015-08-11 2015-08-11 Die

Country Status (1)

Country Link
CN (1) CN105058722A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106442067A (en) * 2016-11-08 2017-02-22 贺州学院 Debristling tool and compaction apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07144332A (en) * 1993-11-24 1995-06-06 Matsushita Electric Works Ltd Straight-hydraulic molding method and straight-hydraulic mold
CN101456226A (en) * 2007-12-10 2009-06-17 鸿富锦精密工业(深圳)有限公司 Die
CN101642946A (en) * 2008-08-08 2010-02-10 鸿富锦精密工业(深圳)有限公司 Optical element molding mould
CN203496181U (en) * 2013-08-16 2014-03-26 慈溪市精诚模具有限公司 Front mold bouncing pin structure for preventing product from being adhered to front mold
CN103950158A (en) * 2014-05-13 2014-07-30 四川中邦模具有限公司 Mold capable of protecting outer wall of molded blank material
CN203901659U (en) * 2014-06-10 2014-10-29 大连大显高木模具有限公司 Sliding block sprue stripping structure of automobile water chamber cover plate mold

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07144332A (en) * 1993-11-24 1995-06-06 Matsushita Electric Works Ltd Straight-hydraulic molding method and straight-hydraulic mold
CN101456226A (en) * 2007-12-10 2009-06-17 鸿富锦精密工业(深圳)有限公司 Die
CN101642946A (en) * 2008-08-08 2010-02-10 鸿富锦精密工业(深圳)有限公司 Optical element molding mould
CN203496181U (en) * 2013-08-16 2014-03-26 慈溪市精诚模具有限公司 Front mold bouncing pin structure for preventing product from being adhered to front mold
CN103950158A (en) * 2014-05-13 2014-07-30 四川中邦模具有限公司 Mold capable of protecting outer wall of molded blank material
CN203901659U (en) * 2014-06-10 2014-10-29 大连大显高木模具有限公司 Sliding block sprue stripping structure of automobile water chamber cover plate mold

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106442067A (en) * 2016-11-08 2017-02-22 贺州学院 Debristling tool and compaction apparatus

Similar Documents

Publication Publication Date Title
CN204523962U (en) A kind of side piercing die feeding pressure mechanism and side piercing die
CN105058721A (en) Mold
CN105058722A (en) Die
CN204196130U (en) A kind of novel die with pilot pin device
CN104626467B (en) Small-bore collision penetrating structure for mould
CN202956584U (en) Photomask positioning structure and photomask box
CN101456226A (en) Die
CN103419339B (en) Plastic packaging injection moulding apparatus and injection head thereof
CN203044673U (en) Male die protection mechanism of punching die
CN104056966A (en) Damping stamping mould
CN104948132A (en) Packer shoulder protection device
CN207014725U (en) A kind of demolding structure applied to injection mold
CN106273260B (en) Rectangular inductance pedestal injection forming mold
CN105270427B (en) Limited block and its manufacturing method
CN104368639A (en) Annular elastic piece extruding device
CN104175501A (en) Loader oil pipe protecting sleeve shaping structure and using method thereof
CN207642124U (en) A kind of composite die
CN105690684A (en) Shovel machine device for injection mold
CN204167082U (en) A kind of transformer casing
CN105071095A (en) Probe protection structure
CN207983890U (en) A kind of eyeglass injection mold with cavity protective case
CN102983107B (en) A kind of diode of soft material ring and hard epoxy encapsulation and preparation method thereof
CN203751097U (en) Slim hole pressing device with protecting structure
CN207156370U (en) A kind of plastic mould of automatic demoulding
CN208045440U (en) Quick Release repairs box and its pedestal

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20151118

RJ01 Rejection of invention patent application after publication