CN105057910A - Sn-Zn-series lead-free brazing filler metal and preparation method thereof - Google Patents
Sn-Zn-series lead-free brazing filler metal and preparation method thereof Download PDFInfo
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- CN105057910A CN105057910A CN201510455877.4A CN201510455877A CN105057910A CN 105057910 A CN105057910 A CN 105057910A CN 201510455877 A CN201510455877 A CN 201510455877A CN 105057910 A CN105057910 A CN 105057910A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
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Abstract
The invention discloses Sn-Zn-series lead-free brazing filler metal. The Sn-Zn-series lead-free brazing filler metal consists of the following components in percentage by weight: 8-9% of Zn, 0.005-0.006% of Al, 0.005-0.15% of Nd and the balance of Sn. Compared with the prior art, the Sn-Zn-series lead-free brazing filler metal provided by the invention has relatively good oxidization resistance and wettability, and is low in melting point. The invention further discloses a preparation method for the Sn-Zn-series lead-free brazing filler metal.
Description
[technical field]
The present invention relates to technical field of alloy material, be specifically related to a kind of Sn-Zn series leadless solder and preparation method thereof.
[background technology]
Nd-Fe-B magnet steel, as the rising industry of energy-conserving and environment-protective, has been widely used in the technical fields such as information technology, automobile, nuclear magnetic resonance, wind-power electricity generation and motor.In actual applications, Nd-Fe-B magnet steel needs to be fixed on carrier, and the material of carrier mostly is mild steel, and the switching performance of Nd-Fe-B magnet steel and mild steel affects the serviceability of corresponding product.In correlation technique, the method for attachment of Nd-Fe-B magnet steel and mild steel mainly contains two kinds, and one is that glue is bonding, and two is laser electric welding.
Wherein, the phenomenon of the excessive glue of connected mode existence that glue is bonding, excessive glue not only pollutes frock, also affects the normal work of product, as affected coil oscillation space in voice coil loudspeaker voice coil; And large area during glue curing is heated and also can be produced certain impact to the magnetic property of neodymium iron boron, also there is certain problem in the reliability after hot and humid.
Laser electric welding has the heating and cooling speed of several pieces, and thermal stress is little, accurately can control the features such as heat input and heating location, make it in the welding of accurate foreign material, have good adaptability.But there is zinc coat on the surface of Nd-Fe-B magnet steel, the fusing point of zinc is low, and the zinc fume formed during laser electric welding easily forms bubble in weld zone, causes weld zone to there is micro-crack, thus greatly reduces weld strength.
Soldering adopts to make solder than the low-melting metal material of mother metal, and by weldment and solder heat to higher than solder fusing point, lower than mother metal fusion temperature, utilize liquid solder to soak mother metal, filling play movement also realizes with the counterdiffusion of mother metal phase the method being connected weldment.Soldering has not by the impact of Nd-Fe-B magnet steel Zinc coat, and unfailing performance is also obviously better than the bonding mode of glue, and therefore, soldering has its obvious advantage in the Joining Technology of Nd-Fe-B magnet steel and mild steel.
In soldering processes, crucial technology is the selection of solder, and the solder required for the connection of Nd-Fe-B magnet steel and mild steel should have better non-oxidizability and wetability, and high, the low-melting feature of strength of joint.And the solder needed for the connection of Nd-Fe-B magnet steel and mild steel, also there is no relevant report at present.
Therefore, be necessary to provide one to have better non-oxidizability and wetability, and high, low-melting solder of strength of joint and preparation method thereof.
[summary of the invention]
The object of the invention is to overcome above-mentioned technical problem, provide one to have better non-oxidizability and wetability, and high Sn-Zn series leadless solder of strength of joint and preparation method thereof.
For solving the problems of the technologies described above, the invention provides a kind of Sn-Zn series leadless solder, by weight percentage, comprising following component: Zn:8-9%; Al:0.005-0.006%; Nd:0.005-0.15%; Sn: surplus.
Preferably, by weight percentage, described Sn-Zn series leadless solder comprises following component: Zn:8-9%; Al:0.005-0.006%; Nd:0.03-0.05%; Sn: surplus.
Preferably, the fusing point of described Sn-Zn series leadless solder is 196-198 DEG C.
The invention provides a kind of preparation method of Sn-Zn series leadless solder, comprise the steps:
There is provided described Sn-Zn series leadless solder alloy raw material, and carry out smelting technology, wherein, described Sn-Zn series leadless solder alloy raw materials by weight meter, comprises following composition: Zn8-9%; Al0.005-0.006%; Nd0.005-0.15%; Sn surplus; Described Al, Nd provide with the form of Sn-10Al intermediate alloy and Sn-5Nd intermediate alloy respectively.
Preferably, described smelting technology comprises solder melt preparation process, and described preparation process is as follows: described Sn, Zn are heated to 380-420 DEG C, and pass into inert gas protection; Be incubated after described Sn, Zn melt completely; Add described Sn-10Al intermediate alloy and Sn-5Nd intermediate alloy, and carry out stirring and skimming, obtain solder melt.
Preferably, described smelting technology also comprises solder melt cooling step, and the temperature of described solder melt is down to 285-315 DEG C.
Preferably, described smelting technology also comprises the step cooled solder melt cast being obtained Sn-Zn series leadless solder.
Preferably, the preparation technology of described Sn-10Al intermediate alloy is as follows:
There is provided Sn-10Al intermediate alloy raw material, according to weight percent meter, Al is 10%, Sn is surplus; Described Sn, Al are heated to 700-800 DEG C, and pass into inert gas protection; Dissolve in completely after described Sn until described Al and stop heating and cooling making temperature be down to 380-420 DEG C, now, carry out stirring and skimming, obtain described Sn-10Al intermediate alloy melt; By described Sn-10Al intermediate alloy melt cast, obtain described Sn-10Al intermediate alloy.
Preferably, the preparation technology of described Sn-5Nd intermediate alloy is as follows: provide Sn-5Nd intermediate alloy raw material, and according to weight percent meter, Nd is 5%, Sn is surplus; Described Sn, Nd are heated to 700-800 DEG C, and pass into inert gas protection; Dissolve in completely after described Sn until described Nd and stop heating and cooling making temperature be down to 380-420 DEG C, now, carry out stirring and skimming, obtain described Sn-5Nd intermediate alloy melt; By described Sn-5Nd intermediate alloy melt cast, obtain described Sn-5Nd intermediate alloy.
Preferably, described inert gas is argon gas or nitrogen.
Compared with correlation technique, Sn-Zn series leadless solder provided by the invention, component comprises Sn, Zn, Al and Nd, wherein, metal A l can form layer of oxide layer on the solder surface of melting, stop the oxidation of Zn in solder, thus improve the non-oxidizability of Sn-Zn alloy, and then the wetability of solder can be improved; Meanwhile, Al adds the intensity that can also increase solder, improves soldering joint strength to a certain extent; Metal Nd adds, and the oxide on the solder surface under molten condition is obviously reduced, and oxide concentration causes the wettability of solder on mother metal greatly to reduce on solder surface, the minute surface of solder surface in light.Therefore, the solder adopting the preparation method of Sn-Zn series leadless solder provided by the invention to obtain, has non-oxidizability and wetability is excellent, and strength of joint is high, low-melting advantage.
[accompanying drawing explanation]
Fig. 1 is that the spreading ratio of Sn-Zn series leadless solder of the present invention calculates schematic diagram.
[detailed description of the invention]
Below in conjunction with drawings and embodiments, the invention will be further described.
The raw materials by weight meter of Sn-Zn series leadless solder of the present invention, comprises following component: Zn8-9%; Al0.005-0.006%; Nd0.005-0.15%; Sn surplus; Wherein, described Al, Nd provide with the form of Sn-10Al intermediate alloy and Sn-5Nd intermediate alloy respectively.Described Sn-Zn series leadless solder carries out smelting technology by above-mentioned raw materials and obtains.In the present invention, because the different melting points of the fusing point of Sn, Zn alloying element and Al, Nd is large, and Zn is easily oxidized, and therefore, Al, Nd add with the form of intermediate alloy.Concrete embodiment is with reference to following examples 1-16.
Embodiment 1
To prepare 1000 solders
Described Sn-Zn series leadless solder, each components based on weight percentage is respectively:
Zn:8%; Al:0.005%; Nd:0.03%; Sn: surplus.
The preparation method of described Sn-Zn series leadless solder, comprises the steps:
Step S1: prepare intermediate alloy
Step S11: according to weight percent meter, Al are 10%, Sn is surplus, preparation Sn-10Al intermediate alloy, and concrete preparation method is as follows:
Step S111: described Sn, Al are heated to 700 DEG C, and pass into inert gas protection;
Step S112: dissolve in completely after described Sn until described Al and stop heating and cooling making temperature be down to 380 DEG C, now, carry out stirring and skimming, obtain described Sn-10Al intermediate alloy melt;
Step S113: described Sn-10Al intermediate alloy melt is poured into tabular ingot casting, obtains described Sn-10Al intermediate alloy.
Step S12: according to weight percent meter, Nd are 5%, Sn is surplus, preparation Sn-5Nd intermediate alloy, and concrete preparation method is as follows:
Step S121: described Sn, Nd are heated to 700 DEG C, and pass into inert gas protection;
Step S122: dissolve in completely after Sn until described Nd and stop heating and cooling making temperature be down to 380 DEG C, now, carry out stirring and skimming, obtain described Sn-5Nd intermediate alloy melt;
Step S123: described Sn-5Nd intermediate alloy melt is poured into tabular ingot casting, obtains described Sn-5Nd intermediate alloy.
Step S2: the melting of brazing filler metal alloy
Step S21: by the percentage by weight originally implementing middle Sn-Zn series leadless solder component, 913.5gSn, 80gZn are heated to 380 DEG C, and pass into inert gas protection, be incubated 30min after described Sn, Zn melt completely;
Step S22: add described Sn-10Al intermediate alloy 0.5g, Sn-5Nd intermediate alloy 6g in step S1, and carry out stirring and skimming, obtain solder melt;
Step S23: when described solder melt temperature drops to 315 DEG C, solder melt being cast in specification is that in the swage of 20cm × 5cm, cooled and solidified obtains solid ingot, i.e. solder finished product.
In this enforcement, inert gas is nitrogen or argon gas.
The Sn-Zn series leadless solder obtained according to the preparation method in the present embodiment, fusing point is 196 DEG C.
Embodiment 2
To prepare 1000 solders
Described Sn-Zn series leadless solder, each components based on weight percentage is respectively:
Zn:8%; Al:0.006%; Nd:0.04%; Sn: surplus.
The preparation method of described Sn-Zn series leadless solder, comprises the steps:
Step S1: prepare intermediate alloy
Step S11: according to weight percent meter, Al are 10%, Sn is surplus, preparation Sn-10Al intermediate alloy, and concrete preparation method is as follows:
Step S111: described Sn, Al are heated to 750 DEG C, and pass into inert gas protection;
Step S112: dissolve in completely after described Sn until described Al and stop heating and cooling making temperature be down to 400 DEG C, now, carry out stirring and skimming, obtain described Sn-10Al intermediate alloy melt;
Step S113: by described Sn-10Al intermediate alloy melt note in U-lag steel, form the tabular ingot casting that 5mm is thick, obtain described Sn-10Al intermediate alloy.Tabular ingot casting can be made like this to cool fast, reduce alloy oxidization burning loss at high temperature.
Step S12: according to weight percent meter, Nd are 5%, Sn is surplus, preparation Sn-5Nd intermediate alloy, and concrete preparation method is as follows:
Step S121: described Sn, Nd are heated to 750 DEG C, and pass into inert gas protection;
Step S122: dissolve in completely after described Sn until described Nd and stop heating and cooling making temperature be down to 400 DEG C, now, carry out stirring and skimming, obtain described Sn-5Nd intermediate alloy melt;
Step S123: be cast in U-lag steel respectively by described Sn-5Nd intermediate alloy melt, forms the tabular ingot casting that 5mm is thick, obtains described Sn-5Nd intermediate alloy.Like this, tabular ingot casting can be made to cool fast, reduce alloy oxidization burning loss at high temperature.
Step S2: the melting of brazing filler metal alloy
Step S21: by the percentage by weight originally implementing middle Sn-Zn series leadless solder component, 911.4gSn, 80gZn are heated to 400 DEG C, and pass into inert gas protection, be incubated 10min after described Sn, Zn melt completely;
Step S22: add described Sn-10Al intermediate alloy 0.6g, Sn-5Nd intermediate alloy 8g in step S1, and carry out stirring and skimming, obtain solder melt;
Step S23: when described solder melt temperature drops to 300 DEG C, solder melt being cast in specification is that in the swage of 20cm × 5cm, cooled and solidified obtains solid ingot, i.e. solder finished product.
In this enforcement, inert gas is nitrogen or argon gas.
The Sn-Zn series leadless solder obtained according to the preparation method in the present embodiment, fusing point is 197 DEG C.
Embodiment 3
To prepare 1000 solders
Described Sn-Zn series leadless solder, each components based on weight percentage is respectively:
Zn:8%; Al:0.006%; Nd:0.05%; Sn: surplus.
The preparation method of described Sn-Zn series leadless solder, comprises the steps:
Step S1: prepare intermediate alloy
Step S11: according to weight percent meter, Al are 10%, Sn is surplus, preparation Sn-10Al intermediate alloy, and concrete preparation method is as follows:
Step S111: described Sn, Al are heated to 800 DEG C, and pass into inert gas protection;
Step S112: dissolve in completely after described Sn until described Al and stop heating and cooling making temperature be down to 420 DEG C, carry out stirring and skimming, obtain described Sn-10Al intermediate alloy melt;
Step S113: by described Sn-10Al intermediate alloy melt note in U-lag steel, form the tabular ingot casting that 7mm is thick, obtains closing in the middle of Sn-10Al.Like this, tabular ingot casting can be made to cool fast, reduce alloy oxidization burning loss at high temperature.
Step S12: according to weight percent meter, Nd are 5%, Sn is surplus, preparation Sn-5Nd intermediate alloy, and concrete preparation method is as follows:
Step S121: described Sn, Nd are heated to 800 DEG C, and pass into inert gas protection;
Step S122: dissolve in completely after described Sn until described Nd and stop heating and cooling making temperature be down to 420 DEG C, now, carry out stirring and skimming, obtain described Sn-5Nd intermediate alloy melt;
Step S123: be cast in U-lag steel respectively by described Sn-5Nd intermediate alloy melt, forms the tabular ingot casting that 7mm is thick, obtains Sn-5Nd intermediate alloy.Like this, tabular ingot casting can be made to cool fast, reduce alloy oxidization burning loss at high temperature.
Step S2: the melting of brazing filler metal alloy
Step S21: by the percentage by weight originally implementing middle Sn-Zn series leadless solder component, 909.4gSn, 80gZn are heated to 420 DEG C, and pass into inert gas protection, be incubated 5min after described Sn, Zn melt completely;
Step S22: add Sn-10Al intermediate alloy 0.6g, Sn-5Nd intermediate alloy 10g in step S1, and carry out stirring and skimming, obtain solder melt;
Step S23: when described solder melt temperature drops to 315 DEG C, solder melt being cast in specification is that in the swage of 20cm × 5cm, cooled and solidified obtains solid ingot, i.e. solder finished product.
In this enforcement, inert gas is nitrogen or argon gas.
The Sn-Zn series leadless solder obtained according to the preparation method in the present embodiment, fusing point is 198 DEG C.
Embodiment 4-16
With reference to the preparation method of Sn-Zn series leadless solder in embodiment 2, prepare the brazing filler metal alloy of following component respectively, obtain embodiment 4-16.Wherein, each components based on weight percentage of Sn-Zn series leadless solder.
| Embodiment | Alloying component |
| Embodiment 4 | Sn-9Zn-60ppmAl-0.005Nd |
| Embodiment 5 | Sn-9Zn-60ppmAl-0.01Nd |
| Embodiment 6 | Sn-9Zn-60ppmAl-0.03Nd |
| Embodiment 7 | Sn-9Zn-60ppmAl-0.05Nd |
| Embodiment 8 | Sn-9Zn-60ppmAl-0.1Nd |
| Embodiment 9 | Sn-9Zn-60ppmAl-0.15Nd |
| Embodiment 10 | Sn-9Zn |
| Embodiment 11 | Sn-9Zn-5ppmAl |
| Embodiment 12 | Sn-9Zn-10ppmAl |
| Embodiment 13 | Sn-9Zn-30ppmAl |
| Embodiment 14 | Sn-9Zn-60ppmAl |
| Embodiment 15 | Sn-9Zn-90ppmAl |
| Embodiment 16 | Sn-9Zn-150ppmAl |
Wherein, embodiment 10-16 is comparative example.In embodiment, the content of alloying component is explained as follows:
Example: in embodiment 4, Sn-9Zn-60ppmAl-0.005Nd represents the content of Zn to be the content of 9%, Al be that the content of 0.006%, Nd is 0.005%, and surplus is Sn.The explanation of the content reference embodiment 4 of alloying component in other embodiments.
Embodiment 10 is Sn-Zn alloy, and preparation method only need by Sn, Zn melting, and the parameters such as the temperature parameter in melting, temperature retention time, chilling temperature are identical with the relevant parameter of corresponding step in embodiment 2;
Embodiment 11-16 is Sn-Zn-Al alloy, and wherein, Al adds in the mode of Sn-10Al intermediate alloy, and the preparation method of Sn-10Al intermediate alloy is identical with the preparation method of Sn-10Al intermediate alloy in embodiment 2, and namely relevant parameter is identical; The method of smelting of Sn-Zn-Al alloy is with reference to the method for smelting in embodiment 2, and the parameters such as the temperature parameter namely in melting, temperature retention time, chilling temperature are identical with the relevant parameter of corresponding step in embodiment 2.
The Sn-Zn series leadless solder obtained according to above-mentioned preparation method, the fusing point of embodiment 4-9 is all within the scope of 197 ± 0.5 DEG C.
The Sn-Zn series leadless solder obtained by embodiment 1-16 carries out non-oxidizability test, and method of testing is as follows:
In a heated condition, solder surface is adsorb oxygen atom because of oxidation, and the quality of solder is changed.Therefore, under identical heating condition, different mass change amounts characterizes the difference of antioxygenic property between solder.Skim to solder surface every 10min, make it constantly expose the fresh liquid level of non-oxidation layer, the heat time is 8h, and heating-up temperature is 260 DEG C, and heating instrument is from design metal bath heating furnace, as follows.The stainless steel cuvette of solder container to be aperture area be 33cm2.Heat and completely to be weighed together with the oxidizing slag clawed by solder, weighing instruments is FC204 type electronic analytical balance, and accuracy is 1 × 10-4g.
Oxidation weight gain test result is as follows:
Table 1: oxidation weight gain test result
| Numbering | Alloying component | Oxidation weight gain (× 10 -3g) |
| Embodiment 1 | Sn-8Zn-50ppmAl-0.03Nd | 2.1 |
| Embodiment 2 | Sn-8Zn-60ppmAl-0.04Nd | 2.2 |
| Embodiment 3 | Sn-8Zn-60ppmAl-0.05Nd | 2.6 |
| Embodiment 4 | Sn-9Zn-60ppmAl-0.005Nd | 2.7 |
| Embodiment 5 | Sn-9Zn-60ppmAl-0.01Nd | 2.0 |
| Embodiment 6 | Sn-9Zn-60ppmAl-0.03Nd | 2.1 |
| Embodiment 7 | Sn-9Zn-60ppmAl-0.05Nd | 2.8 |
| Embodiment 8 | Sn-9Zn-60ppmAl-0.1Nd | 3.5 |
| Embodiment 9 | Sn-9Zn-60ppmAl-0.15Nd | 3.9 |
| Embodiment 10 | Sn-9Zn | 33.1 |
| Embodiment 11 | Sn-9Zn-5ppmAl | 24.4 |
| Embodiment 12 | Sn-9Zn-10ppmAl | 14.7 |
| Embodiment 13 | Sn-9Zn-30ppmAl | 5.7 |
| Embodiment 14 | Sn-9Zn-60ppmAl | 3.6 |
| Embodiment 15 | Sn-9Zn-90ppmAl | 3.9 |
| Embodiment 16 | Sn-9Zn-150ppmAl | 4.1 |
The antioxygenic property of Sn-Zn series leadless solder increases with increasing weight of oxidation and reduces.The test data of being tested as can be seen from above-mentioned non-oxidizability, when not having Al in Sn-Zn series leadless solder alloy composition, increasing weight of oxidation is large, illustrates that the non-oxidizability of Sn-Zn series leadless solder is poor; And non-oxidizability is relevant with the content of Al metal, Al content increases, and non-oxidizability strengthens, but after Al content is increased to certain value, the increase DeGrain of antioxygenic property.
In Sn-Zn series leadless solder alloy, when adding Al and Nd two kinds of metals, antioxygenic property is stronger simultaneously; But after metal Nd content reaches certain numerical value, increasing weight of oxidation increases on the contrary, corresponding antioxygenic property is deteriorated.
The Sn-Zn series leadless solder obtained by embodiment 1-16 carries out wetability test, and method of testing is as follows:
In the middle part of every block copper coin, place a solder ball, scaling powder is evenly applied to solder ball surface, then these copper coins are lain in a horizontal plane on the liquid level of metal bath of (260 ± 5) DEG C, after solder ball melts sprawl completely, take out copper sheet horizontal positioned, be cooled to room temperature, measure solder joint height.Spreading ratio computing formula is:
P＝(D-h)/D×100％
As shown in Figure 1, Fig. 1 is the spreading ratio calculating schematic diagram of Sn-Zn series leadless solder.In above-mentioned computing formula, D is by the diameter (mm) of test solder ball 1 used; P is spreading ratio (%); H is the solder joint height (mm) after expansion has soaked.
Wetability test result is as follows:
Table 2: the spreading ratio of brazing filler metal alloy
The test data of being tested as can be seen from above-mentioned wetability, metal Nd plays a decisive role in Sn-Zn series leadless solder wetability, and Nd content increases, and spreading ratio improves, and wetting effect strengthens; As can be seen from embodiment 14-16, after Al content is increased to certain numerical value, spreading ratio reduces on the contrary, and wetting effect weakens.
By Sn-Zn series leadless solder provided by the invention, carry out soldering, strength of welded joint meets instructions for use, and strength of joint is high.Because of not leaded in described Sn-Zn series leadless solder component, therefore, this brazing filler metal compositions useful is nontoxic, ensure that the personal safety of operating personnel in welding procedure.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a Sn-Zn series leadless solder, is characterized in that, by weight percentage, described Sn-Zn series leadless solder comprises following component:
Zn：8-9％；
Al：0.005-0.006％；
Nd：0.005-0.15％；
Sn: surplus.
2. Sn-Zn series leadless solder according to claim 1, is characterized in that, by weight percentage, described Sn-Zn series leadless solder comprises following component:
Zn：8-9％；
Al：0.005-0.006％；
Nd：0.03-0.05％；
Sn: surplus.
3. Sn-Zn series leadless solder according to claim 1 and 2, is characterized in that, the fusing point of described Sn-Zn series leadless solder is 196-198 DEG C.
4. a preparation method for Sn-Zn series leadless solder, is characterized in that, comprising the steps: provides described Sn-Zn series leadless solder alloy raw material, and carry out smelting technology, wherein, described Sn-Zn series leadless solder alloy raw materials by weight meter, comprises following composition: Zn8-9%; Al0.005-0.006%; Nd0.005-0.15%; Sn surplus; Described Al, Nd provide with the form of Sn-10Al intermediate alloy and Sn-5Nd intermediate alloy respectively.
5. the preparation method of Sn-Zn series leadless solder according to claim 4, is characterized in that, described smelting technology comprises solder melt preparation process, and described preparation process is as follows:
Described Sn, Zn are heated to 380-420 DEG C, and pass into inert gas protection;
Be incubated after described Sn, Zn melt completely;
Add described Sn-10Al intermediate alloy and Sn-5Nd intermediate alloy, and carry out stirring and skimming, obtain solder melt.
6. the preparation method of Sn-Zn series leadless solder according to claim 5, is characterized in that, described smelting technology also comprises solder melt cooling step, and the temperature of described solder melt is down to 285-315 DEG C.
7. the preparation method of Sn-Zn series leadless solder according to claim 6, is characterized in that, described smelting technology also comprises the step cooled solder melt cast being obtained Sn-Zn series leadless solder.
8. the preparation method of Sn-Zn series leadless solder according to claim 4, is characterized in that, the preparation technology of described Sn-10Al intermediate alloy is as follows:
There is provided Sn-10Al intermediate alloy raw material, according to weight percent meter, Al is 10%, Sn is surplus;
Described Sn, Al are heated to 700-800 DEG C, and pass into inert gas protection;
Dissolve in completely after described Sn until described Al and stop heating and cooling making temperature be down to 380-420 DEG C, now, carry out stirring and skimming, obtain described Sn-10Al intermediate alloy melt;
By described Sn-10Al intermediate alloy melt cast, obtain described Sn-10Al intermediate alloy.
9. the preparation method of Sn-Zn series leadless solder according to claim 4, is characterized in that, the preparation technology of described Sn-5Nd intermediate alloy is as follows:
There is provided Sn-5Nd intermediate alloy raw material, according to weight percent meter, Nd is 5%, Sn is surplus;
Described Sn, Nd are heated to 700-800 DEG C, and pass into inert gas protection;
Dissolve in completely after described Sn until described Nd and stop heating and cooling making temperature be down to 380-420 DEG C, now, carry out stirring and skimming, obtain described Sn-5Nd intermediate alloy melt;
By described Sn-5Nd intermediate alloy melt cast, obtain described Sn-5Nd intermediate alloy.
10. the preparation method of the Sn-Zn series leadless solder according to any one of claim 5-9, is characterized in that, described inert gas is argon gas or nitrogen.
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| CN103056543A (en) * | 2013-01-18 | 2013-04-24 | 江苏师范大学 | Lead-free nanometer solder containing Yb, A1 and B |
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