CN105051759B - Have the small-sized IC tag and its preparation method of multilayer coil antenna - Google Patents
Have the small-sized IC tag and its preparation method of multilayer coil antenna Download PDFInfo
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- CN105051759B CN105051759B CN201480016074.2A CN201480016074A CN105051759B CN 105051759 B CN105051759 B CN 105051759B CN 201480016074 A CN201480016074 A CN 201480016074A CN 105051759 B CN105051759 B CN 105051759B
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- Prior art keywords
- tag
- coil
- multilayer coil
- microminiature
- small
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
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- Near-Field Transmission Systems (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
Abstract
The present invention provides the small-sized IC tag for having microminiature IC tag and multilayer coil, the microminiature IC tag has the ribbon coil antenna for forming resonant circuit, the multilayer coil is repeatedly to be wrapped in axial circinate multilayer coil with circinate in the same plane, and it is the opening type coil for winding the terminal that the starting point started terminates with winding and being not connected with of the multilayer coil, the microminiature IC tag and each multilayer coil are non-electric-connecting, it is formed in a manner that the antenna surface of the multiple multilayer coil of the winding is parallel with the antenna surface of the antenna surface of the multilayer coil and the microminiature IC tag, the outside of the circinate multilayer coil is coated by insulating part.
Description
Technical field
The present invention relates to the small-sized IC tag and its preparation method for having multilayer coil antenna, more particularly to RFID (radio frequency identification)
Label, above-mentioned RFID label tag be suitable for microwave band, UHF (superfrequency) band communication frequency under can not be by using half-wavelength
The RFID label tag of antenna is come the RFID label tag of adaptation metal cope with, requirement miniaturization using in field.
Background technology
For the miniaturization of IC tag, in the state of the high sensitivity of built-in aerial for keeping powering to IC chip how
Reducing size becomes subject.It can select, using the sufficiently small submillimeter wave of wavelength, millimeter wave, also disobey using utilization
The compact electromagnetic wave resonator of the coil in the lumped constant of wavelength, capacitor part is relied to be minimized to realize.
A kind of RFID label tag for adapting to metal is disclosed in patent document 1, it is following to form：Have containing with IC chip connect
The RFID label tag main body of the small loop aerial connect and the arm (arm) across the above-mentioned IC chip of insulating layer covering, said arm is existed
Extension just corresponds to the length of the general half-turn of the ring to cover IC chip on the winding direction of the ring of small loop aerial.
On the other hand, a kind of cartridge is disclosed in patent document 2, the built-in aerial in the cartridge of contactless IC card,
Enhanced by the electromagnetic coupling with card internal antenna come the electric wave that communicate, play function as amplifier, so as to make communication away from
It is extended from waiting.It is recorded in patent document 2：Amplifier is set as with communication antenna to the communication antenna phase with non-contact IC card
Or antenna carrying area size bigger more than the opening area bigger of aerial coil or the number of turns of aerial coil, and taken
It carries.In addition it describes, amplifier antenna can be any one of coiled type antenna or wire antenna.
And then a kind of amplifier antenna is disclosed in patent document 3, it is made of, is configured in RFID Q coils and capacitor
Between label and RFID reader.The Q coils be by conductor in a manner that identical radius is unfolded in axial direction with spiral
What shape winding was repeatedly formed.
In addition, a kind of RFID label tag is disclosed in patent document 4, it is following to be formed：It is layered in the table back side and is formed with antenna diagram
The antenna substrate of case is electrically connected in series with through-hole etc. between multilayer board so that each aerial coil pattern with it is adjacent
Pattern connection, formed one closure coil.
Existing technical literature
Patent document
Patent document 1:Japanese Unexamined Patent Publication 2011-204130 bulletins
Patent document 2:Japanese Unexamined Patent Publication 2005-332015 bulletins
Patent document 3:Japanese Unexamined Patent Publication 2009-21970 bulletins
Patent document 4:Japanese Unexamined Patent Publication 2010-152449 bulletins
Invention content
Problem to be solved by the invention
Have if the UHF of a length of 15~16cm of half-wave, the IC tag rough classification of microwave band in air following two.
(1) the normal size IC tag of internal wavelength dependence significant half-wavelength resonance dipole keynote antenna (is on one side
10cm or so)
(2) ultra-small dimensions of the resonant circuit connected by coil, capacitor of no wavelength dependency are built-in with
IC tag (being on one side a few mm degree, such as 2.5mm), LC resonance
Defined reception can be realized the IC tag of above-mentioned (1) is even if for 5m~7m degree across distance (communication distance)
Sensitivity, and in contrast, under the detection electric wave output of the same terms, the IC tag of above-mentioned (2) can only obtain across distance
The receiving sensitivity of several mm.This is the result that override considers subminaturization.
Demand as market, it is desirable that：As the small-sized IC tag for adapting to metal, realize in tolerable microminiature label
Several times size (rank of a few mm square, such as be on one side 5mm to 8mm, it is below " small-sized IC tag ") in the environment of, it can obtain
To at least tens cm degree across the small-sized IC tag for communicating sensitivity of distance.
Such small-sized IC tag is suitably arranged at screw hole, recess, metal surface, corner of metal various equipment etc.
The narrow part position of a few mm square ranks.Such as inspect periodically in needs the valve of running water pipe, the various public affairs such as iron covering of sewer
Common facility, equipment need to carry out in the various fields such as the leased equipments such as the vehicle of merchandise control, the Medical Devices to need repairing
It is contemplated that the purposes of small-sized IC tag.If such small-sized IC tag, then no matter the object-based device of the IC tag is installed, is set
The setting environment applied etc. is metal covering or non-metal surfaces, can directly be set.Therefore, to these object-based devices, facility into
The a small amount of processing of row, it is contemplated that environment, appearance the selection degree of freedom at setting position also increase.
The invention of patent document 1 is equivalent to above-mentioned (2) in leap apart from aspect, although small-sized communication distance is short.
Even if the day with wavelength dependency and dual-purpose protection metallic plate of above-mentioned (1) is used to improve communication distance
Line resonator, if minimized to 1/tens i.e. rank of a few mm square of wavelength (such as 30~32cm), sensitivity
Also it can be remarkably decreased, become impractical with.Therefore, even the mode of above-mentioned (1), miniaturization is also limited.
On the other hand, it is known that IC tag is extended by such amplifier recorded in patent document 2, patent document 3
Communication distance.
However, the RFID label tag recorded in patent document 2,3 is not suitable with metal.That is, these RFID label tags be relative to
Mounting surface is arranged in parallel in the structure in aerial coil opening face, so if setting environment is metal covering, even if then label is set
Putting has insulating layer on the metal covering of antenna, also can electromagnetically contact and generate short circuit or built-in aerial entirety and metal covering capacitance
Coupling, flows through the high-frequency current being completely reversed in the image antenna projected to metal covering interior parallel.Therefore, in RFID label tag
The antenna in portion and the electromagnetic induction of image antenna are cancelled out each other so that electromagnetic wave is difficult to extraneous radiation, thus can not be filled
The sensitivity divided.And then these RFID label tags are premised on IC card of the HF entrained by people with electric wave (13.56MHz), in order to increase
Its strong sensitivity and take time.Assuming that the miniature dimensions HF bands situation of amplifier antenna using a few mm square degree
Under, it, can not be small by RFID label tag under the rank of a few mm square situations such as circle there are the number of turns of the HF with amplifier coil more than hundred
Type.Also, using setting environment be metal covering when, if the coil of amplifier is spirally to wind multiple coil,
The periphery of the coiled type antenna of amplifier and metal mounting surface in contact with or close to, so as to which metal covering and coiling generate high frequency short circuit,
The inductance value L of coil generates variation, such as reduces.Similarly, the parasitic capacitance C of coil also generates variation, such as increase.Cause
This, resonance condition disappears, and the communication sensitivity for having IC tag drastically deteriorates this problem.
In RFID label tag recorded in patent document 4, antenna pattern and the IC chip of multilayered structure are connected in series with.According to setting
Put environment, such as drain cover with IC tag assembled portion for equipment on road etc., it is also possible to sometimes due to wheel, sandy soil
Impact etc. cut-out through-hole is applied to multilager base plate from outside as stress, impact.In this case, the RFID of patent document 4
In label, the aerial coil of each substrate independently deforms, and antenna pattern is it is possible that generate interlayer cut-out.And, it is difficult to say adaptation
Metal is not equivalent to amplifier coil person, therefore when it is metal covering to use setting environment, communication distance is regarded as several yet
Below mm degree.
It can be stably obtained across distance at least tens the object of the present invention is to provide not influenced by setting environment
The small-sized IC tag of the communication sensitivity of cm degree.
The method used for solving the problem
Representative composition according to the present invention, the small-sized IC tag for having multilayer coil antenna are characterized in that having
Microminiature IC tag and at least one multilayer coil, above-mentioned microminiature IC tag have the ribbon coil antenna for forming resonant circuit
The IC chip being connect with the coil antenna, above-mentioned multilayer coil are repeatedly to be wrapped in around axis with circinate in the same plane
Circinate coil, and be the starting point that starts of winding of the multilayer coil and the opening molded line that is not connected with of terminal that winding terminates
Circle, above-mentioned microminiature IC tag and above-mentioned multilayer coil are formed in a manner of non-electric-connecting and electromagnetic coupling, above-mentioned microminiature IC
Label is parallel with the antenna surface of above-mentioned microminiature IC tag with the antenna surface of above-mentioned circinate multilayer coil with above-mentioned multilayer coil
Or the mode integration of overlapping, the outside of above-mentioned multilayer coil are coated by the component of insulating properties.
The effect of invention
In accordance with the invention it is possible to realize the small IC mark that can obtain the communication sensitivity for crossing over distance at least tens cm degree
Label.High sensitivity can be realized setting environment is such as metal covering.
Description of the drawings
Fig. 1 is the solid for representing to be equipped with the small-sized IC tag involved by the first embodiment of the present invention in metal object
Figure.
Fig. 2A is the vertical view of microminiature IC tag used in the small-sized IC tag of Fig. 1.
Fig. 2 B are the side views of microminiature IC tag used in the small-sized IC tag of Fig. 1.
Fig. 3 is microminiature IC tag to using Fig. 2 and multilayer coil to manufacture the small-sized IC tag of first embodiment
The figure that illustrates of example.
Fig. 4 is the figure of the manufacturing process of the small-sized IC tag of definition graph 3.
Fig. 5 is the figure illustrated to an example of the multilayer coil preparation method of Fig. 3.
Fig. 6 is the equivalent circuit of the multilayer coil of definition graph 3 and the figure of resonance condition.
Fig. 7 is the figure of reader example for representing to use the small-sized IC tag involved by first embodiment.
Fig. 8 is making of being communicated of the small-sized IC tag for representing involved by using the reader and first embodiment of Fig. 7
The figure of use-case.
Fig. 9 A are the examples for representing to be equipped with the small-sized IC tag involved by second embodiment of the invention in metal object
Stereogram.
Fig. 9 B are the stereograms for the action for illustrating the small-sized IC tag involved by second embodiment.
Figure 10 is the quantity for representing that the small-sized IC tag involved by second embodiment is obtained by experiment multilayer coil
(N) with the figure of an example of the result of the relationship of sensitivity (cm).
Figure 11 is the longitudinal section of the small-sized IC tag involved by third embodiment of the present invention.
Figure 12 is the stereogram of microminiature IC tag used in the small-sized IC tag involved by third embodiment.
Figure 13 is the figure for the manufacturing method for representing the small-sized IC tag involved by third embodiment.
Figure 14 is the figure for the manufacturing method for representing the small-sized IC tag involved by third embodiment.
Figure 15 is the longitudinal section of the small-sized IC tag involved by four embodiment of the invention.
Figure 16 is the figure for the manufacturing method for representing the small-sized IC tag involved by the 4th embodiment.
Figure 17 is the figure for the manufacturing method for representing the small-sized IC tag involved by the 4th embodiment.
Specific embodiment
Representative embodiments according to the present invention are being wound with circinate on the antenna surface of multiple multilayer coil, with
Small-sized IC tag is configured in the antenna surface of the multilayer coil mode parallel with the antenna surface of microminiature IC tag.As needed, it uses
They resin-coated outside of electrical insulating property.
Multilayer coil formation is wound repeatedly with circinate in the same plane and the beginning and end of multilayer coil is not connected to
Structure.That is, multilayer coil is involved in a manner of beginning and end not line with circinate, circinate multilayer coil is formed
Protect the structure on the inside of it in outside.
According to this constitution, the outermost circumference protection of circinate multilayer coil is located at the coil layer of inside in contrast, even if
When microminiature IC tag is installed to object, it can also mitigate the parasitism for playing the resonant interaction of objects such as obstruction and mounting surface as possible
The electromagnetic induction interferences such as capacitive coupling.Thus enable that resonant frequency conditional stability.Therefore, regardless of environment is set, all
It can realize stable highly sensitive small-sized IC tag.
Embodiment 1
Hereinafter, the small-sized IC tag involved by the first embodiment of the present invention is illustrated.Fig. 1 shows in metal object
300 are equipped with the example of the small-sized IC tag 10 involved by present embodiment.Small-sized IC tag 10 is in circinate multilayer coil
Integrally installed with the LC resonance type labels of microminiature IC tag 100 on 200 antenna surface, outside by electrical insulating property resin
240 are coated and carry out integration.
The shape of small-sized IC tag 10 is long TL, the approximate cuboid of width TW, high TH.With the side of small-sized IC tag (by
The face that long TL, high TH are formed) side of corresponding multilayer coil 200 becomes the antenna surface 210 of small-sized IC tag.That is,
The side of small-sized IC tag 10 becomes antenna surface 210.
Small-sized IC tag 10 has the core material of winding multilayer coil, will wind superimposed line along the peripheral surface of small-sized IC tag
The face of circle is defined as the coil surface of core material.In addition, in small-sized IC tag, peripheral surface (with wide TW along high TH, long TL directions around
The row face of one week) in a face 12 become to the setting face of 300 grade of metal object.The setting face 12 is defined as small-sized IC tag
" base ".
In multilayer coil 200, electric conductor in the same plane, i.e., using the axis at a right angle with small-sized 10 side of IC tag as
It is multiple with the winding of whirlpool (VORTEX) shape on the same plane at center.Microminiature label 100 and multilayer coil 200 are electrically connected with non-
It connects and the mode of electromagnetic coupling is formed.In addition, " stacking " herein refers to centered on above-mentioned axis, " stacking " is carried out around it.
Fig. 2A represents the vertical view of the microminiature IC tag 100 of Fig. 1, and Fig. 2 B represent side view.Microminiature IC tag 100 has
There are the IC tag main part 101 set of the surface side in flat-shaped substrate and the IC tag insulated substrate formed in substrate back
104.About IC tag main part 101, flat shape is in approximating square, by being fixed therein the IC chip 110 of centre, at this
With the planar coil antenna 102 on the multiple the same face using printed wiring etc. of circinate winding and guarantor around IC chip 110
The compositions such as protective material.The inner end and outer end of coil antenna 102 are connect by wire bonding etc. with IC chip 110.
In Fig. 3, illustrate an example of the preparation method of the small-sized IC tag 10 of first embodiment.Multilayer coil 200 has
The core material (core materials) 220 of rectangular-shape, in the side of the core material, that is, antenna surface bonding microminiature IC tag 100.In core material 220
Coil surface periphery, the multiple ribbon coil 230 of winding (stackings).That is, circinate multilayer coil 200 is by will be by conductive material structure
Into and it is insulation-coated after ribbon coil 230, round core material (insulating layer) 220, repeatedly wound with circinate in the same plane
It is formed around axis.Ribbon coil 230 is the unconnected open coil of winding beginning and end of coil.
Core material 220 is by magnetic loss angle (magnetic loss angle tangent (magnetic loss tangent), tan δ0) small material
It forms.The material small as magnetic loss angle, can enumerate the modeling such as with fluororesin, nylon, vinyl chloride, PET, ABS, epoxy resin
Expect the material that material is main material.In other words, as long as the material of core material 220 is used as " loss in the high band region such as UHF
The material that insulating element less " functions.
In addition, whirlpool (VORTEX) is normally defined in the same plane with rotation and close to center (or far from center)
Curve.As an example, it can enumerate in polar coordinates, with the smooth monotonic function of θ, (dullness is passed with the distance r at center
Increasing function or monotonic decreasing function) to mark, and be equally spaced Archimedes spiral between line.
The whirlpool of multilayer coil 200 not only includes the curve of above-mentioned monotonic function in the present invention, also comprising at least part
The whirlpool being formed by straight lines.For example, comprising by more straight lines and the whirlpool that the flat shape that forms of their short side is rectangle is connected
Whirlpool.Ribbon coil 230 shown in Fig. 3 extends more parallel lines along across 220 opposite side of core material (core materials).Separately
Outside, in the present invention, " parallel " not only comprising parallel in mathematical meaning, also comprising substantial parallel.Also, it is formed with whirlpool
More parallel lines during the coil that shape is laminated in coil, the distance at the center away from core material (core materials) 220 are periodically reduced,
Corner connects, and the whirlpool of rectangle has been integrally formed.Band-like coil 230 is the terminal that the starting point that its winding starts terminates with winding
Not connected opening type coil.The multilayer coil 200 is also non-electric-connecting with microminiature IC tag 100.
The side of core material formed multilayer coil 200 antenna surface 210 size preferably be overlapped thereon it is extra small
The size of the antenna surface of type IC tag 100 is identical or than its bigger.Make the antenna surface 210 of multilayer coil 200 and by coil antenna
The antenna surface that 102 encirclements form is opposite and parallel, and microminiature IC tag 100 and multilayer coil 200 are integrally formed (in this institute
That says parallel allows from two antenna angulations to be mathematically parallel to not stringent such as within 10 degree strictly
It is parallel).The outside of ribbon coil 230 is coated by the resin 240 of electrical insulating property, becomes protective layer.The one of the protective layer outer surface
The face of part, the i.e. direction at a right angle with antenna surface 210, using as the installation to metal parts setting microminiature IC tag
The mode that face 12 functions is formed (with reference to Fig. 1).
That is, the outer surface in the direction at a right angle (with reference to Fig. 4) with the axis O-O of multilayer coil, as small-sized IC tag 10
Metal mounting surface functions, and the coil surface and metal covering of microminiature IC tag 100 are at a generally normal angle.Therefore, for being distributed in
The high-frequency currents such as standing wave of metal covering I (with reference to Fig. 1), even if across insulating element, the outermost of multilayer coil 200 is also by electricity
Magnetic induction is coupled, as amplifier work commonly referred to as.It can not be steady by environment is set to be influenced thereby, it is possible to realize
Surely it obtains crossing over apart from big communication sensitivity, and the small-sized IC tag that can be set at narrow position.In addition, in setting environment
In the case of for non-metal surfaces, due to not having standing wave electric current, high-frequency current, mounting means is free.In this case,
Self-evident, the outer surface in the direction parallel with the axis of multilayer coil is also used as mounting surface.Even if however, also there is setting ring
Border seems nonmetallic, also can have a case that metal object in close proximity to the inside of near surface.Therefore, according only to the small of rectangular-shape
It, can also be the one of outer surface in the case that the appearance of type IC tag can not specify the relationship of the axis of its outer surface and multilayer coil
Part carries out can recognize that it is the expression for adapting to metal covering.
As the microminiature IC tag 100 for being suitble to such miniaturized applications, have such as appearance and size for 2.5mm ×
The microminiature label (Hitachi Chemical Co., Ltd. (registered trademark) IM5-PK2525 types label) of the UHF bands of 2.5mm.
If in addition, without with rotation and by paracentral circinate coil, and with the such fixed spiral shells of radius r of spring
Spin line circle makes amplifier, and be disposed on metal covering, then on metal covering, all can in each circle of the coil of amplifier
There is the position that electromagnetic coupling is carried out with metal.This means that first electromagnetic coupling point and next Coupling point can generate high frequency
Short circuit.That is, greatly deviate from the resonance condition when coil of amplifier to be placed in free space.Therefore, in order to adaptation metal is made
Label, need the marginal layer (Vela Layer around spring) size is set as the large-size that can ignore electromagnetic induction degree of coupling.
This is unfavorable characteristic for the miniaturization of small-sized IC tag 10.
Fig. 4 is the figure of the manufacturing process of the small-sized IC tag of definition graph 3.
First, it is in order in its used band resonant, ribbon coil 230 is i.e. insulation-coated about multilayer coil 200
Belt metal foil afterwards is wrapped in stipulated number around the central shaft O-O of core material 220 in the same plane.Core material 220 according to
The size setting of microminiature label 100, in 920MHz bands, coil 230 to the winding number (stacking times) of the core material 220 although
Also rely on coil width, but at least 2 times, it is desirable to be 3 to 4 times.
Then, the antenna surface 210 for making multilayer coil 200 is consistent with the end face of core material (core materials) 220, make the antenna surface with
The formed antenna surface of the encirclement of coil antenna 102 of microminiature label 100 is opposite on common axis O-O, with adhesives etc.
The two is bonded.Then, as needed with the resin 240 of insulating properties (with reference to Fig. 1) coating multilayer coil 200 and microminiature label
100 outsides, carry out integration, form multilayer coil 200.
Thus in the small-sized IC tag 10 manufactured, multilayer coil 200 is considered as 1 secondary coil respectively, microminiature label 100
When coil is considered as 2 secondary coil, two coils form electromagnetic coupling relationship by mutual induction, can be as in structure and electromagnetically
On integrated IC tag 10 work.
In addition, for convenience of description, microminiature label 100 is adhered to the side of core material 220 in Fig. 4, but can also be
It is parallelly put on the direction of arrow in figure inside core material (illustration omitted).For example core material 220 can also be set as along antenna
Face is divided into the first core material of left and right two, the second core material.Then, it is formed and held in the central portion of the opposite antenna surface of two core materials
Receive the recess portion of microminiature label 100.Ribbon coil 230 is wound into (stacking) repeatedly respectively on the first core material, the second core material.So
Afterwards, microminiature label is configured in a manner that the center (axis O-O) of each antenna surface is consistent in the recess portion of the first core material, the second core material
100, entirety is coated by using insulative resin to carry out integration, so as to form small-sized IC tag.
Then, it for multilayer coil 200, is illustrated while with reference to Fig. 5, Fig. 6.
Fig. 5 is the expanded view of multilayer coil.Coil 230 is by the belt metal foil 231 after insulation-coated and its lower floor
The flat-shaped part that the intercoil insulations such as adhesives material 232 is formed.About coil 230, when will be in its used frequency band
When wound with circinate to obtain resonance, produced for the first time when can also be set as being wound by the length for cracking it open and being unfolded on the contrary
The specific length P of raw resonanceL.That is, about with specific length PLCoil 230, winding starting point 233 and winding terminal 234 it
Between distance determined according to resonant frequency.
When resonant frequency is set as f, coil 230 needs to meet following formula (1).
Wherein, L2The mainly inductive capacity of multilayer coil, C are mainly to be present between the coil of multilayer coil posting of waiting
Raw capacitance.
Fig. 6 represents the equivalent circuit of coil 230.Inductive capacity L about multilayer coil2With the line for being present in multilayer coil
Parasitic capacitance C between circle, as known in electromagnetism, under the either case for being connected in series with, being connected in parallel, coil
230 structure all meets above-mentioned formula (1).That is, although the equivalent LC resonant circuits of coil mainly have tandem type and parallel connection
Two kinds of type, but due to being identical resonance condition, make multilayer coil for the easily opening type coil to realize at a low price.
Wish that the winding terminal 234 of multilayer coil 200 is configured to, be located at when being wound to core material (core materials) 220 small
Side other than the base 12 of type IC tag 10, i.e. to the face other than the setting face of metal object 300 etc..
According to the small-sized IC tag 10 of the present embodiment, pass through the multilayer coil to being wound in the same plane with circinate
200 antenna surface 210 installs microminiature label, and is coated entirety with insulative resin, thus by microminiature IC tag 100 and layer
200 integration of superimposing thread circle.
Therefore, in the case of for example insulation-coated peeled off, even if the base 12 of integrated IC tag 10, superimposed line
The i.e. circinate metal of wound section for enclosing 200 bottoms is contacted with the metal covering 300 of mounting object, the resonance of multilayer coil 200
Frequency f is not easy to change.This is because it is covered in the same plane with the outermost circumference of the multilayer coil 200 of circinate winding
Protect the wound section than its inner laminated coil in the inner part.It is because of as shown in the installation condition of Fig. 1, even if being laminated
The part 12 of coil most peripheral bottom contacts and the L of the part with metal object 3002, C generate locality variation, with circinate
The inside of the multilayer coil of winding also carries out electromagnetism protection by the coil of most peripheral, and the influence of metal contact is not easy to involve interior
Resonance constant (the L of side2, C), therefore L as a whole2It is extremely small with the variation of C values.
Similarly, even if the setting environment of IC tag is in water, is not easy to the resonance constant (L on the inside of multilayer coil2、
C it) has an impact, therefore L as a whole2It is extremely small with the variation of C values, it is able to maintain that high sensitivity.
Then, Fig. 7 is reader example for representing to use the small-sized IC tag involved by first embodiment
Figure.
IC tag communication read-and-write device 400 has the operation portion 420 for being set to body surfaces, display unit 430, setting
In body interior power supply and control circuit portion (illustration omitted) and be wholely set with body interior antenna (paster antenna,
The general antenna such as microstrip antenna) 410.
Fig. 8 is to enable IC tag communication with read-and-write device 400 close to until the shape of distance that small-sized IC tag communicates
State.Under the state, the multilayer coil of the antenna 410 and small-sized IC tag of the test section of IC tag communication read-and-write device 400
200 and microminiature label 100 coil generating electromagnetic coupling.If only illustrate such as magnetic flux of the radiation electric wave from antenna
Amount, then radiate electric wave and the wavelength that a cycle is formed by Φ with-Φ formed chain and is connected.To a magnetic flux of the connection chain
Φ is measured, multilayer coil 200 is set as coil L2, the coil antenna 102 of microminiature label 100 is set as coil L1, by mutual
Sense (M) and electromagnetic couplings are carried out to two coils L1, L2, as all integrated IC tag work in structure and electromagnetically
Make.That is, by mutual induction, if multilayer coil 200 is set as 1 side, sensing electric current I2 is become with 1 primary current, with it
Corresponding 2 sides become coil L1, and the mode that 2 primary currents corresponding with it become sensing electric current I1 senses microminiature IC tag
100 coil antenna 102.The signal of the identification informations such as its ID is back to the microminiature label 100 of the sensing current work
The antenna 410 of IC tag communication read-and-write device 400.Its result is shown in the display unit of IC tag communication read-and-write device
430.The individually only sensitivity of 3cm or so, but promoted altogether by being combined with multilayer coil 200 of microminiature label 100 as a result,
It shakes, can realize for example, about 10 times of sensitivity.
As an example, about the small-sized IC tag 10 of the present embodiment, inventor will be with insulation-coated band-like aluminium
Coil 230 of the metal foil (PL=40mm) as multilayer coil 200, to the wide 3.5mm, long 3.5mm, high 2.0mm as core material
Rectangular-shape magnetic rubber in the same plane with circinate wind 3~4 times, makings shape be long TL=5.8mm, width TW
=4.2mm, high TH=4.0mm approximate cuboid small-sized IC tag.Then, it is arrived by experimental verification：When on a metal plate
When setting the small-sized IC tag, for the IC tag communication electric wave output of 920MHz, 30dBm, apart from metal sheet surface 20cm
The overhead of~30cm is responded.
The self-evident general domain that can also be arranged on other than metal covering of IC tag of the present invention.For example, using general
The IC tag of specification carry out equipment the management such as inspect periodically in the case of, the setting environment as object-based device, it is contemplated that arrive
Situation that is narrow and selecting either one of metal covering or non-metal surfaces according to situation to set.For manager, even if in this way
In the environment of, by using the present invention, also there is the advantages of IC tag of common-use size being utilized to cope with freely.In this case,
When non-metal surfaces set IC tag, to setting face, there is no limit.On the other hand, when metal covering sets IC tag, with each day
The coil surface of the line coil mode vertical with installation metal covering is set.In this way, the most peripheral and metal covering of circinate aerial coil
Side approaches, and enhances with the electromagnetic coupling of the high-frequency currents such as the standing wave that is flowed through in metal surface, can obtain big sensitivity.Cause
This, even if the resonance condition of aerial coil slightly deviation, sensitivity are not easy to reduce.Therefore, in order to more carry out in gold
The interaction for high-frequency currents such as the standing waves that communicates with RFID label tag that metal surface flows through, about circinate aerial coil
Coil surface shape, more preferably with straight line, short side (circular arc) the approximate rectangle for linking them compared with round.And then the shape
It is the shape that physically also can steadily set.
As described above, according to the present invention, multilayer coil is the structure wound in the same plane with circinate, therefore is had
Following feature.
(feature 1) is according to the present invention, even if integrated IC tag bottom is in the metal covering and multilayer coil of mounting object
The metal contact of the wound section of bottom, the resonant frequency of the multilayer coil are not easy to change.This is because for L's and C
Value, the wound section of inner laminated coil is protected with the outermost circumference of multilayer coil.
(feature 2) is according to the present invention, based on the defencive function described in feature 1, earth current (electric welding, thunder etc.) or electric discharge
Electric current becomes the metal covering of the mounting object of ground side from the outermost circumference flow direction of multilayer coil, and relaying configuration is in outermost circumference
The microminiature IC tag of side is influenced from surge.
(feature 3) according to the present invention, multilayer coil is that the core material few to electromagnetic consumable is wound from the off, in terminal knot
Wrapping is around the opening type coil that beginning and end is not connected with.Open type coil and the amplifier coil recorded in patent document 2,3
The manufacture of the coil of beginning and end connection is compared like that, has the advantages that not needing to the bridging wiring for connection.Consider
When being present in the parasitic capacitance C between the coil of multilayer coil, the equivalent LC resonant circuits of coil mainly have tandem type and parallel connection
Two kinds of type, but due to being identical resonance condition on electromagnetism, form the easily opening type coil to realize at a low price.
Embodiment 2
Then, the small-sized IC tag involved by second embodiment of the invention is illustrated.Fig. 9 A are represented in metal
Object is equipped with the stereogram of the example of the small-sized IC tag involved by second embodiment of the invention.Involved by second embodiment
Small-sized IC tag 10 in, relative to a microminiature IC tag 100 of the small-sized IC tag 10 involved by first embodiment,
On its nearly antenna surface and the axis O-O direction at a right angle with the antenna surface, overlap multiple multilayer coils 200 (A~
N).In other words, multilayer coil 200 (A~N) arranged in parallel in axial direction.Multiple multilayer coils are non-electric-connecting and generation
Electromagnetic coupling.Therefore, have pair it is possible that the increased effect of durability of the external stress of mechanicalness of cut-out coil, in addition with big
Amplitude improves the effect of the sensitivity of small-sized IC tag 10.This is equivalent to multiple side by side at nearly microminiature IC tag 100
The resonator (coil) of same shape.That is, in second embodiment, there are one microminiature labels 100 and multiple for arrangement on axis
Multilayer coil 200 (A~N), each multilayer coil are integrated by the adhesives 250 of insulating properties, form width TWn, high TH, length
A small-sized IC tag 10 of TL.Insulating properties adhesives 250 use the small material of magnetic loss angle.To multilayer coil 200 (A~
N), when resonant frequency being set as f, coil 230 is required for meeting above-mentioned formula (1).
In addition, in the example of Fig. 9 A, microminiature IC tag 100 is located at left end, but can also be configured at multiple stackings
The right end of coil 200 (A~N) or centre.That is, microminiature IC tag 100 may be at any position on axis.Mounting object is
In the case of metal, one of peripheral surface of small-sized IC tag 10 parallel with axis, such as base 12 become mounting surface.
Multiple multilayer coils 200 (A~N) are the opening type coils of the amplifier work as microminiature IC tag 100.
That is, multiple amplifiers are respectively as promoting, resonance, coil winding starts and winding terminates not connected opening resonator
It functions.More electromagnetic waves are sent into microminiature label 100 by multilayer coil 200 (A~N) as a result, therefore as highly sensitive
The small-sized IC tag 10 of degree.
The resin quilt of electrical insulating property is used in the outside of microminiature label 100 and multiple multilayer coils 200 (A~N) as needed
It covers.Between microminiature label 100 and each open type coil of multiple multilayer coils 200 (A~N) and multiple multilayer coils 200
Each open type coil of (A~N) is mutual, is all formed in a manner of non-electric-connecting and electromagnetic coupling.That is, small-sized IC tag 10
Form overlapping open type coil and multiple stratification and the equivalent line for making adjoining course electromagnetic coupling in the state of non-contact
Circle.
The width of each multilayer coil is small, thus by them on axis O-O directions arranged in parallel and the small-sized IC tag that is formed
10 whole width can be equal or be below it with long TL, high TH.As an example, inventor etc. is using above-mentioned
The microminiature label of the UHF bands of 2.5mm × 2.5mm first by a multilayer coil 200, realizes appearance and size as TWn=
The small-sized IC tag 10 of the cubic shaped of TH=TL=3mm × 3mm × 3mm.
Fig. 9 B are the stereograms for the action for illustrating the small-sized IC tag involved by second embodiment.For the small-sized of Fig. 9 B
IC tag 10, make IC tag communication read-and-write device 400 shown in Fig. 8 close to can extremely communicate apart from when, IC tag leads to
The test section antenna 410 of credit read-and-write device 400 and multiple multilayer coils 200 (A~N) of small-sized IC tag and microminiature IC
The coil generating electromagnetic coupling of label 100.For a magnetic flux phi of connection chain, multiple multilayer coils 200 (A~N) are set
For coil L21~L2n, the coil antenna 102 of microminiature IC tag 100 is set as coil L1, two lines are made by mutual induction (M)
Enclose L1 and L21~L2nElectromagnetic coupling is carried out, as integrated IC tag work in structure and electromagnetically.That is, pass through
Mutual induction, 1 primary current of multilayer coil 200 (A~N) become sensing electric current I21~I2n, the sense of 2 primary currents corresponding with it
The coil antenna 102 of induced current I1 sensing microminiatures IC tag 100.As a result, by the way that multiple multilayer coils 200 is made to be used as microminiature
The amplifier resonance of the coil antenna 102 of IC tag 100, can realize high sensitivity.
In addition, multilayer coil is needed with the structure wound with circinate, and meet above-mentioned formula (1), but its antenna is flat
Face shape is not necessarily required to completely the same with the flat shape of the antenna of microminiature IC tag.
Multilayer coil is the structure wound in the same plane with circinate, therefore even if multiple multilayer coils 200 (A~
N the metal of the wound section of any bottom) is contacted with the metal covering 300 of mounting object, the resonant frequency f of each multilayer coil
It is not easy to change.This is because outermost circumference all covering protections of each multilayer coil are than its inner laminated coil more in the inner part
Wound section, therefore the inside of multilayer coil carries out electromagnetism protection by the coil of most peripheral, the influence of metal contact is not easy wave
And the resonance constant (L2, C) of inside.
Further, since it can not will be connected between the substrate inside multilager base plate with through-hole, therefore the not only work in manufacture
Ordinal number is reduced, and cost is reduced, and even if in the case where applying stress, the such setting environment of impact to multilager base plate from outside,
The possibility for not having antenna pattern to generate interlayer cut-out is also improved the effect of reliability.
Figure 10 represents that the quantity (N) of the multilayer coil of the small-sized IC tag involved by second embodiment is obtained by experiment
With the figure of an example of the result of the relationship of sensitivity (cm).Small-sized IC tag uses the UHF bands of above-mentioned 2.5mm × 2.5mm
Microminiature label, in the center configuration microminiature IC tag 100 of multiple multilayer coils 200 (A~N), to each multilayer coil
Quantity (N) make multiple samples.The communication distance in metal sheet surface overhead when then, to they are set on a metal plate
(cm) it is measured, as communication sensitivity.In addition, it is shown in solid lines their average value.As shown in Figure 10, for only super
The situation (N=0) of small-sized IC tag 100, the quantity (N) of multilayer coil more increase, and sensitivity (cm) more increases.But sensitivity
Increase has the tendency that the increase with (N) and saturation.
According to the example of Figure 10, if (N) is set as 3, the communication sensitivity across distance 30cm or so is obtained, such as
(N) is set as 4 by fruit, then has obtained the communication sensitivity across distance 40cm or so.On the other hand, if (N) is set as 8~
10, then the sensitivity of 50cm or so has been obtained, in other words, can have been obtained relative to the sensitivity that (N)=1 is about 2.5 times.So
And the manufacture cost for increasing there is also the quantity (N) with multilayer coil and generating is increased, is lacked as setting volume increase
Point.Accordingly, it is considered to the permissible range of environment is set, in other words consider required sensitivity, cost and allows setting face ruler
Very little grade determines (N).(N) in practicality, is made to be preferred for 1~6, more preferably 2~4.
According to the present embodiment, can realize can not be influenced by setting environment and stably obtain highly sensitive leap distance
Communication sensitivity small-sized IC tag.It can realize that even if such as setting environment is metal covering, it may have across distance tens
The small IC label of a few mm square ranks of the communication sensitivity of cm degree.
Embodiment 3
Then, the small-sized IC tag involved by third embodiment of the invention is illustrated.Involved by third embodiment
And small-sized IC tag 10, equally constituted using printed base plate to make with the small-sized IC tag 10 involved by second embodiment
Small-sized IC tag 10.That is, in third embodiment, the strip line wound with circinate is made on substrate by printed wiring
It is different from second embodiment to enclose this point.
Figure 11 is the longitudinal section of the small-sized IC tag involved by third embodiment of the invention.Figure 12 is implemented in third
The stereogram of microminiature IC tag used in small-sized IC tag involved by mode.It before this will be with circinate winding of band-type coil
The coil formed is known as multilayer coil, for the purpose for the consistency for keeping explanation, is formed on substrate with printed wiring pattern
Multilayer coil is also referred to as with the coil that circinate is entwined in the same plane.Hereinafter, the multilayer coil 200 by the broad sense
The quantity that arranged in parallel carries out lamination is set as N, and the situation of the N=3 is illustrated.
In small-sized IC tag 10 involved by third embodiment, by a microminiature IC tag 100 and multiple superimposed lines
Enclose 200 (A~C) on axis O-O directions arranged in parallel and carry out lamination.Microminiature IC tag 100 includes：In tabular insulation base
The IC chip 110 of central portion (on axis) setting of 104 surface side of plate, the line set on the outside on the direction at a right angle with the axis
It encloses antenna 102, the closing line 108 that the two is connected and protects their protection materials 242.It is the feelings of metal in mounting object
Under condition, one of peripheral surface of small-sized IC tag 10 parallel with axis, such as base 12 become mounting surface.
Each multilayer coil 200 (A~C) have set in 104 surface side of insulated substrate coil antenna 102 (this with it is suitable
It is equivalent in forming the situation of ribbon coil 230 of multilayer coil 200).By microminiature IC tag 100 and each multilayer coil
200 (A~C) are attached by insulating properties adhesives 250 and integration.That is, in third embodiment, on common axis
Arrangement is there are one microminiature label 100 and multiple multilayer coils 200 (A~C), with insulating properties adhesives 250 by each superimposed line
Circle integration, forms a small-sized IC tag 10.Protection materials 242 and adhesives 250 can be identical materials.Protected material
Material 242, insulating properties adhesives 250 use the small material of magnetic loss angle.
The opening type coil that the coil antenna 102 of each multilayer coil 200 is starting point and above-mentioned terminal is not connected with.The opposing party
Face, as shown in figure 12, the coil antenna 102 of microminiature label 100 is in the same manner as each multilayer coil 200 i.e. coil antenna 102, shape
Terminate the circinate shape of winding into winding from the off, in terminal, but its inner end and outer end pass through closing line 108 and IC cores
It is different from the coil antenna 102 of multilayer coil 200 that piece 110 connects this point.
For each multilayer coil 200, when resonant frequency is set as f, coil 230 (being herein coil antenna 102) is required for
Meet above-mentioned formula (1).In addition, in the example of Figure 11, microminiature IC tag 100 is located at left end, but can also be configured in multiple layers
The centre of superimposing thread circle 200 (A~C).That is, microminiature IC tag 100 may be at any position on axis.
Then, on one side with reference to Figure 13, Figure 14, on one side to the manufacturing method of the small-sized IC tag involved by third embodiment
An example illustrate.
First, as shown in figure 13, the printed base plate (hereinafter referred to as plate) for being configured with multiple microminiature IC tags 100 is made
500 and it is configured with the plates 501,502,503 of multiple coil substrates 200 (A~C).At this point, when being overlapped 4 blocks of plates (in axis direction)
When, in a manner of being overlapped by the position of the coil antenna of microminiature IC tag 100 and the position of the coil antenna of coil substrate 200,
Each coil substrate 20 in 100 respective positions of microminiature IC tag and plate 501,502 and 503 in decision plate 500 is respective
Position.
Then, as shown in Figure 14, made plate 500,501,502,503 is attached by adhesives 250 and carries out one
Change.Then, it is cut as dotted line, thus, it is possible to obtain being each provided with a microminiature IC tag 100 and three multilayer coils
The small-sized IC tag 10 of 200 (A~C) is 30 small-sized IC tags 10 in the example of figure.
In addition, in Figure 13, plate 500 can also be configured between other plates 501,502,503.In this case, it can obtain
There is the small-sized IC tag 10 of microminiature IC tag 100 to the intermediate configurations in multiple multilayer coils 200 (A~N).
According to the present embodiment, can with realize at a low price can not be influenced by setting environment and stably obtain it is highly sensitive across
The more small-sized IC tag of the communication sensitivity of distance.For example, can even if ring be set to realize by general printed wiring technology
Border can also obtain the small IC label of a few mm square ranks across the communication sensitivity of tens cm degree of distance for metal covering.
In addition, by using printed wiring technology, it can be on that can not be influenced to obtain stable communication spirit by setting environment
The small-sized IC tag of sensitivity carries out mass production, and can be to provide at a low price.
Embodiment 4
Then, the small-sized IC tag involved by four embodiment of the invention is illustrated.In 4th embodiment, make
It for printed base plate (plate), is formed with such as copper foil as the glass epoxy substrate of conductor foil using on two sides, the two of substrate
Face forms coil, then applies in coil surface gold-plated etc..
Figure 15 is the longitudinal section of the small-sized IC tag involved by four embodiment of the invention.In glass epoxy substrate
104 two sides is formed with conductor foil, and coil antenna 102 is formed on the two sides of the substrate 104.In the glass epoxy substrate of left end
The central portion on 104 surfaces is configured with IC chip 110, by closing line 108, IC chip 110 and the coil day set on the outside of it
Line 102 connects.As a result, microminiature IC tag 100 is formed in the left-hand face of the substrate 104.In its of glass epoxy substrate 104
His surface, without IC chip 110, these surfaces become multilayer coil 200.
Then, on one side with reference to Figure 16, Figure 17, on one side to the manufacturing method of the small-sized IC tag involved by the 4th embodiment
An example illustrate.
In 4th embodiment, also in the same manner as third embodiment, it is produced on the single side configuration of glass epoxy substrate 104
Have multiple microminiature IC tags 100 and be overleaf only configured with multiple coil substrates 200 (A~C) printed base plate 500 and
Two sides is only configured with the plurality of plates of multiple coil substrates 200 (A~C).Hereinafter, main pair of click-through different from third embodiment
Row explanation.
Portion glass epoxy substrate 104, being equivalent to after fragment cutting for having microminiature IC tag 100 is shown in Figure 16
The sectional view divided.Shown in Figure 17 without microminiature IC tag 100 it is glass epoxy substrate 104, be equivalent to fragment cutting
The sectional view of part afterwards.Then, multiple glass epoxy substrates 104 are aligned with the position overlapping so that coil antenna, every
It reinforcing material (buildup material) 260 and carries out hot pressing by whole integration.Then, they are cut, so as to
Obtain being each provided with multiple small-sized IC tags 10 of a microminiature IC tag 100 and three multilayer coils 200 (A~C).
In the case of manufacturing method using the 4th embodiment, the usage amount of glass epoxide base material is reduced, and process
Number is also reduced, thus can with the small-sized IC tag of inexpensive volume production, in addition with can make small-sized IC tag thickness it is thinning this
The advantages of sample.
According to the present embodiment, by using printed wiring technology, it can not be influenced and be stablized by setting environment
Communication sensitivity small-sized IC tag mass production, and can be to provide at a low price.
Embodiment 5
In embodiment 3 and embodiment 4, the antenna surface size of multilayer coil 200 and the antenna surface ruler of microminiature IC tag 100
Very little is identical, but can also replace it and the size of the antenna surface of multilayer coil 200 is made to be more than the day of microminiature IC tag 100
The size in line face.In this case, in the same manner as embodiment 1, embodiment 2, the 1st layer stackup coil of multilayer coil 200 is extra small
The outside of the antenna surface of type IC tag 100 is formed.For example, in Figure 13, the whirlpool of microminiature IC tag 100 is formed on plate 500
Shape aerial coil and size are more than its circinate resonance coil.On the other hand, it is only formed and is laminated on plate 501,502,503
The resonance coil of coil 200.
According to the present embodiment, can not be influenced to obtain stable communication sensitivity by setting environment to provide at a low price
Small-sized IC tag.
Symbol description
10：Small-sized IC tag, 12：The base of small-sized IC tag, 100：Microminiature IC tag, 101：IC tag main part,
102：Coil antenna, 104：IC tag insulated substrate, 108：Closing line, 110：IC chip, 200：Circinate multilayer coil, 210：
Antenna surface, 220：Core material (core materials), 230：Ribbon coil, 240：Insulative resin, 242：Protection materials, 250：Insulating properties is glued
Connect material, 260：Insulative resin, 300：Metal object, 400：IC tag communication read-and-write device, 500~503：Printed base plate
(plate), I：High-frequency current, I1：Sense electric current, I2：Sense electric current, φ：Magnetic flux.
Claims (15)
1. a kind of small-sized IC tag for having multilayer coil antenna, which is characterized in that
Have microminiature IC tag and at least one multilayer coil,
The microminiature IC tag has the ribbon coil antenna for forming resonant circuit and the IC chip being connect with the coil antenna,
The multilayer coil is with whirlpool on the same plane centered on the axis at a right angle with the small IC label side
Shape is repeatedly wrapped in axial circinate coil, and is starting point and the terminal of winding end that the winding of the multilayer coil starts
Not connected opening type coil,
The microminiature IC tag and the multilayer coil are formed in a manner of non-electric-connecting and electromagnetic coupling,
By the antenna surface of the circinate multilayer coil it is parallel with the antenna surface of the microminiature IC tag or overlapping in a manner of, will
The microminiature IC tag and multilayer coil integration,
The outside of the multilayer coil is coated by insulating part.
2. the small-sized IC tag as described in claim 1 for having multilayer coil antenna, which is characterized in that
With the multiple multilayer coils being arranged in together with the microminiature IC tag on the common axis,
Each multilayer coil is mutually non-electric-connecting.
3. the small-sized IC tag as described in claim 1 for having multilayer coil antenna, which is characterized in that
The multilayer coil is 2 to 4 in used band resonant, winding number.
4. have the small-sized IC tag of multilayer coil antenna as described in claim 1, which is characterized in that
The multilayer coil is to be wrapped in ribbon coil on core material with circinate to form,
The core material is made of the few material of electromagnetic consumable,
The ribbon coil is wound in a manner of in used band resonant, along overall length have it is insulation-coated after strip metal
Foil and intercoil insulation material,
In the side of the core material integrally provided with the microminiature IC tag.
5. the small-sized IC tag as claimed in claim 4 for having multilayer coil antenna, which is characterized in that
It is more than the size of the antenna surface of the microminiature IC tag by the size of the antenna surface that the multilayer coil is formed.
6. the small-sized IC tag as described in claim 1 for having multilayer coil antenna, which is characterized in that
The microminiature label is installed in the antenna surface of the multilayer coil, the multilayer coil and the microminiature label
Whole to be coated and be integrated by insulative resin, the outer surface in direction at a right angle is configured to make with the axis of the multilayer coil
It is functioned for metal mounting surface.
7. the small-sized IC tag as claimed in claim 2 for having multilayer coil antenna, which is characterized in that
The quantity N of the multilayer coil is 1 to 6.
8. a kind of small-sized IC tag for having multilayer coil antenna, which is characterized in that
Have microminiature IC tag, at least one multilayer coil and the setting face formed in the outer surface of the multilayer coil,
The microminiature IC tag has the coil antenna for forming resonant circuit,
The multilayer coil is wound in a manner of in used band resonant, be with the small IC label side Cheng Zhi
Axial circinate coil is repeatedly wrapped on same plane centered on the axis at angle with circinate, and is the multilayer coil
It winds the starting point started and winds the opening type coil that the terminal terminated is not connected with,
The microminiature IC tag and the multilayer coil are formed in a manner of non-electric-connecting and electromagnetic coupling,
With the parallel or overlapping in the axis direction with the antenna surface of the microminiature IC tag of the antenna surface of the multilayer coil
Mode, by the microminiature IC tag and the multilayer coil integration,
The setting face in direction at a right angle is configured to function as metal mounting surface with the axis of the multilayer coil.
9. have the small-sized IC tag of multilayer coil antenna as claimed in claim 8, which is characterized in that
The winding number of the multilayer coil is 2 to 4,
Multilayer coil arranged in parallel in the axis direction has 1 to 6.
10. the small-sized IC tag as claimed in claim 8 for having multilayer coil antenna, which is characterized in that
The microminiature IC tag is set to the surface side of one piece of insulated substrate,
The multilayer coil is set to the surface side of other at least one piece insulated substrates and corresponding with the microminiature IC tag
Position,
Each insulated substrate carries out integration by insulating properties adhesives.
11. the small-sized IC tag as claimed in claim 8 for having multilayer coil antenna, which is characterized in that
The microminiature IC tag is set to the surface side of one piece of insulated substrate,
The multilayer coil is set to the back side of one piece of insulated substrate and the surface of other at least one piece insulated substrate
With the back side and position corresponding with the microminiature IC tag,
Each insulated substrate carries out integration by insulating properties adhesives.
12. a kind of preparation method for the small-sized IC tag for having multilayer coil antenna, which is characterized in that
The small-sized IC tag has microminiature IC tag and at least one multilayer coil,
The microminiature IC tag have formed on insulated substrate composition resonant circuit coil antenna and with the coil day
The IC chip of line connection,
By in the electric conductor of used band resonant same centered on the axis at a right angle with the small IC label side
It is repeatedly wrapped in around axis with circinate in one plane, what the starting point and the terminal of winding end that formation winding starts were not connected with opens
The circinate multilayer coil of type is put,
Become under parallel position relationship with the antenna surface of the microminiature IC tag in the antenna surface of the multilayer coil, by institute
It states microminiature IC tag and the multilayer coil and integration is carried out with non-electric-connecting and electromagnetic coupling state.
13. the preparation method of the small-sized IC tag as claimed in claim 12 for having multilayer coil antenna, which is characterized in that
Belt metal foil after will be insulation-coated is wound 2 to 4 times around the central shaft of core material in the same plane, described in formation
Multilayer coil,
So that the antenna surface of the multilayer coil is consistent with the end face of the core material, and on the shaft with the microminiature label
Coil antenna the opposite mode of antenna surface, the two is subjected to integration with adhesives bonding.
14. the preparation method of the small-sized IC tag as claimed in claim 12 for having multilayer coil antenna, which is characterized in that
Be produced on printed base plate that multiple microminiature IC tags are configured in face and with face in the microminiature IC
The corresponding position of label is respectively provided with multiple coil substrates of the multilayer coil,
The printed base plate and the multiple coil substrate are overlapped, and pass through bonding in a manner of the corresponding position consistency
Material carries out integration,
It is cut as unit of each microminiature IC tag, so as to which multiple small-sized IC tags be made.
15. the preparation method of the small-sized IC tag as claimed in claim 12 for having multilayer coil antenna, which is characterized in that
It is produced on single side and is configured with multiple microminiature IC tags and is overleaf only configured with multiple with the superimposed line
Circle multiple coil substrates printed base plate and multiple multiple coil bases with the multilayer coil are only configured on two sides
Multiple printed base plates of plate,
The printed base plate and the multiple coil substrate are overlapped, and pass through adhesives in a manner of corresponding position consistency
Carry out integration,
It is cut as unit of each microminiature IC tag, so as to which multiple small-sized IC tags be made.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013054007 | 2013-03-15 | ||
| JP2013-054007 | 2013-03-15 | ||
| PCT/JP2014/055122 WO2014141906A1 (en) | 2013-03-15 | 2014-02-28 | Compact ic tag provided with laminated coil antenna, and manufacturing method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105051759A CN105051759A (en) | 2015-11-11 |
| CN105051759B true CN105051759B (en) | 2018-06-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480016074.2A Expired - Fee Related CN105051759B (en) | 2013-03-15 | 2014-02-28 | Have the small-sized IC tag and its preparation method of multilayer coil antenna |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5927337B2 (en) |
| CN (1) | CN105051759B (en) |
| WO (1) | WO2014141906A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3053165A1 (en) * | 2016-06-28 | 2017-12-29 | Smartinst | IMMERSE BIDIRECTIONAL COMMUNICATION DEVICE |
| JP6957962B2 (en) * | 2017-04-28 | 2021-11-02 | 株式会社村田製作所 | RFID tag manufacturing method |
| WO2019146237A1 (en) | 2018-01-23 | 2019-08-01 | 株式会社村田製作所 | Rfid tag, article provided with rfid tag, and method for manufacturing article |
| JP6904488B2 (en) | 2018-12-14 | 2021-07-14 | 株式会社村田製作所 | Wireless communication systems, electrical equipment, and wireless communication tags |
| JP7049981B2 (en) * | 2018-12-17 | 2022-04-07 | 長野計器株式会社 | Physical quantity measuring device |
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| US7119693B1 (en) * | 2002-03-13 | 2006-10-10 | Celis Semiconductor Corp. | Integrated circuit with enhanced coupling |
| JP2005332015A (en) * | 2004-05-18 | 2005-12-02 | Toppan Printing Co Ltd | Card case with booster |
| EP2375493B1 (en) * | 2006-01-19 | 2018-03-21 | Murata Manufacturing Co., Ltd. | Wireless IC device |
| CN103500873B (en) * | 2009-01-09 | 2016-08-31 | 株式会社村田制作所 | Wireless ic device and wireless ic module |
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- 2014-02-28 WO PCT/JP2014/055122 patent/WO2014141906A1/en active Application Filing
- 2014-02-28 CN CN201480016074.2A patent/CN105051759B/en not_active Expired - Fee Related
- 2014-02-28 JP JP2015505395A patent/JP5927337B2/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102027637A (en) * | 2008-05-13 | 2011-04-20 | 户田工业株式会社 | Composite magnetic antenna and RF tag, metal part and metal instrument having the composite magnetic antenna or the RF tag |
| CN102201073A (en) * | 2010-03-26 | 2011-09-28 | 株式会社日立情报系统 | RFID tag equipped with RFID boradband protective metal member |
| CN102376010A (en) * | 2010-07-20 | 2012-03-14 | 欧贝特科技公司 | Microcircuit equipment comprising device used for amplifying gain of antenne |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5927337B2 (en) | 2016-06-01 |
| WO2014141906A1 (en) | 2014-09-18 |
| CN105051759A (en) | 2015-11-11 |
| JPWO2014141906A1 (en) | 2017-02-16 |
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