CN105051645A

CN105051645A - Thermal mitigation in dual subscription dual active devices

Info

Publication number: CN105051645A
Application number: CN201480004817.4A
Authority: CN
Inventors: 弗朗西斯·恩益; 阿米·德比希尔; 罗纳德·埃尔顿; 阿米特·马哈詹; 麦可·麦可克劳; 礼萨·沙希迪; 斯里达尔·班达鲁; 阿希什·高内卡
Original assignee: Qualcomm Inc
Current assignee: Qualcomm Inc
Priority date: 2013-06-17
Filing date: 2014-03-17
Publication date: 2015-11-11
Anticipated expiration: 2034-03-17
Also published as: CN105051645B

Abstract

A system, a method and an apparatus are described. The apparatus includes a modem that responds to a thermal mitigation request by invoking different levels of thermal mitigation for different concurrently active connections. In some instances, the modem may invoke thermal mitigation with respect to a first active connection and refrain from invoking thermal mitigation with respect to a second active connection maintained by the modem. The apparatus determines the first and second active connections based on subscriptions corresponding to subscriber identification modules, an identification of a power amplifier or group of power amplifiers responsible for a thermal issue in the modem. The selection of mitigation levels for each active connection and decisions to invoke mitigation on one connection while refraining from invoking mitigation on another connection may be based on priorities of the active connections, including quality of service related priorities.

Description

Heat in two reservation Dual Action device alleviates

according to 35U.S.C. § 119 CLAIM OF PRIORITY

Present application for patent advocates that the title applied on January 16th, 2013 is " heat in double SIM card Dual Action device alleviates (ThermalMitigationInDualSIMDualActiveDevices) " the 61/753rd, the title of No. 419 U.S. Provisional Application cases and application on June 17th, 2013 is the 13/919th of " heat in two reservation Dual Action device alleviates (ThermalMitigationinDualSubscriptionDualActiveDevices) " the, the benefit of priority of No. 415 U.S.Utility Application, described two application cases transfer this assignee and described two application cases are clearly incorporated herein by reference at this.

Technical field

Various feature relates to the heat management of integrated semiconductor system, system and/or encapsulation.

Background technology

Wireless device generally includes integrated semiconductor system, and it also can be referred to as integrated circuit (IC), and it can comprise one or more processor, storer and the modulator-demodular unit for radio communication.Nude film in the encapsulation being included in one or more nude film that substrate provides can provide IC, and between nude film, there is the thermal coupling of a certain degree.Each in one or more nude film described can have different operating temperature marginal range based on the character of the circuit carried by one or more nude film.In an example, processor can have the operating temperature tolerance limit between-40 DEG C and+125 DEG C.In another example, storer can have the operating temperature tolerance limit between 0 DEG C and+70 DEG C.Modulator-demodular unit can comprise one or more power amplifier (PA) that can produce large calorimetric, and described large calorimetric can upset the operation of the assembly in IC or in the package casing of IC.

Power consumption by reducing one or more device improves the heat problem caused by the heating in IC or its encapsulation.The temperature of one or more nude film is regulated based on the temperature reading obtained from measurement nude film, the collecting encapsulation of sheath body of equipment and/or the temperature sensor of the temperature of shell.Usually, control nude film temperature with in the temperature tolerance remaining on assembly circuit and/or control device skin temperature limit with the regulation touch temperature to sheath body (or shell) temperature met based on device materials (pottery, glass, metal etc.).In an example, sheath body and skin temperature is specified to limit by UL/IEC60950-1 standard.Comprise application be can be to other restriction of the comfort level restriction of sheath body and/or skin temperature and/or scene proprietary.Such as, the personnel participating in video-game on one's own initiative may note the unit temp less than increasing, and it will attract someone attention of operative installations reading.In some integrated semiconductor systems, the heat from an assembly or nude film can affect assembly or nude film near other.Such as, although the modulator-demodular unit on nude film can the temperature place near its higher temperature range of tolerable variance be exercisable, but the processor that provides in same die or in same package or storer can be caused to shut down, because temperature is for this reason for too high processor or storer.

Summary of the invention

Various aspect comprises the method for method of the improvement providing a kind of heat management to the modulator-demodular unit in integrated semiconductor system, system and/or packaging, computer program and equipment.Described equipment can comprise radio modem.

In an aspect, described equipment can be configured to: receive and alleviate request to described radio modem; Determine that described radio modem is current and whether maintain one or more flexible connection; And alleviate request when determining that the current maintenance of described modulator-demodular unit is multiple and being flexibly connected in response to described and call and alleviate for described two heat of varying levels be flexibly connected.Can the heat for described two varying levels be flexibly connected be selected to alleviate based on the priority be associated with described flexible connection.

In one aspect, request can be alleviated call the heat be flexibly connected for second to alleviate or the heat of calling the second level be flexibly connected for described second alleviates and the heat called for the varying levels of described two flexible connections alleviates by calling the heat of the first level be flexibly connected relative to first and alleviate and preventing in response to described.

In one aspect, the heat that a level is called in the flow control be flexibly connected by initial or amendment one alleviates.The heat calling a level by the Power Limitation of transmitter that is initial or that increase radio modem alleviates.

In one aspect, first is flexibly connected and can be associated with a SIM of two Subscriber Identity Module (SIM) card Dual Action (DSDA) device, and the second flexible connection is associated with the 2nd SIM of DSDA device.Can select to alleviate for the heat of described two varying levels be flexibly connected based on the priority be associated with the reservation corresponding to described first and second SIM.

In one aspect, alleviate the heat called for described two varying levels be flexibly connected alleviate by identifying at least one power amplifier relevant to heat problem and calling heat relative to the flexible connection be associated with at least one power amplifier described.One or more power amplifier can be flexibly connected with each and be associated.The heat for described two varying levels be flexibly connected can be selected to alleviate based on associating between at least one power amplifier of described equipment with reservation.

In one aspect, described equipment can determine to alleviate request type and alleviating described in determining when request has limit priority type in the initial limited service pattern in described radio modem place.

Accompanying drawing explanation

Fig. 1 is the block diagram of the example that the network architecture is described.

Fig. 2 is the block diagram that the operation accessed terminal is described.

Fig. 3 is the figure of the first example of the power amplifier distribution illustrated in semiconductor device.

Fig. 4 is the figure of the second example of the power amplifier distribution illustrated in semiconductor device.

Fig. 5 is the figure of the first example of the thermal sensor distribution illustrated in modulator-demodular unit.

Fig. 6 is the figure of the second example of the thermal sensor distribution illustrated in modulator-demodular unit.

Fig. 7 is the process flow diagram of the method that heat alleviates.

Fig. 8 is the process flow diagram of the example of the method that heat when defining one or more thermal region on semiconductor devices alleviates.

Fig. 9 A to 9C is the process flow diagram of the case method that the heat when one or more connection is activity alleviates.

Figure 10 is the block component diagram of the equipment that can operate to alleviate the heat problem in accessing terminal.

Embodiment

In the following description, detail is provided to provide the thorough understanding to various aspect of the present invention.But, it will be understood by one of ordinary skill in the art that described aspect can be put into practice when not having these details.For example, can block diagram shows circuit to avoid obscuring described aspect with unnecessary details.In other cases, can not the well-known circuit of detail display, structure and technology not obscure aspect of the present invention.

A kind of system, method and apparatus are described.Described equipment can comprise the modulator-demodular unit of radio Phone unit, and it alleviates through adjusting or be configured to optionally to call heat by the identification in the source based on heat problem, the reservation of wireless device and/or two or more modes of operation connected of being maintained by wireless device and alleviate request in response to heat.In an example, described modulator-demodular unit can be flexibly connected relative to first and implement heat and alleviate and prevent relative to maintained by modulator-demodular unit second flexible connection simultaneously and call heat and alleviate.Based on the reservation corresponding to SIM, described equipment can determine that described first and second are flexibly connected.Described equipment identifiable design is responsible for the PA of the heat problem in modulator-demodular unit PA, and/or described equipment identifiable design comprises the PA group of at least one PA of the heat problem in responsible modulator-demodular unit.Calling alleviating and preventing the decision-making alleviated of calling in another connection of connecting can be supported data or voice service based on one or two connection.

Fig. 1 is simplification Figure 100 that wireless networking environment is described.Access terminal and 102 can be associated with one or more access point 104,110.Access terminal and 102 can comprise cellular phone, smart phone, SIP (SIP) phone, laptop computer, personal digital assistant (PDA), satelline radio, GPS, multimedia device, video or audio streaming transmitting device, video-unit, digital audio-frequency player, camera, game console, flat computer or other similar functional device any.Access terminal 102 can be called as access terminal, mobile terminal, wireless terminal, remote equipment, wireless terminal, subscriber equipment, user agent, wireless device, radio communication device, mobile device, portable radio, transfer table, subscriber stations, hand-held set, mobile client, wireless client or other suitable term a certain.

Access point 104 and/or 110 can comprise or be called as base station, base station transceiver, radio access node, access station, radio transceiver, Basic Service Set, extended service set, Node B, enode b (eNB) or other suitable term a certain.Two or more access points 104 and 110 can be runed by identical or different Virtual network operator.Each access point 104,110 can provide the radio interface in radio access network (RAN), and it provides the access to the core network service provided by one or more Virtual network operator.Any suitable radio access technologies (RAT) can be used to implement RAN, and RAN can with adopt the telecommunication standard of more modulation and multiple access technology compatible or conform to.For example, the RAN be associated with access point 104,110 can comprise one or many person in following each: adopt the universal terrestrial radio of the one in CDMA (CDMA) or its variant (such as wideband CDMA (W-CDMA)) to access (UTRA); Adopt the Flash-OFDM of the global system for mobile communications of TDMA, TD SDMA (TD-SCDMA), Long Term Evolution (LTE) as strengthening one group of USIM (UMTS), evolved UTRA (E-UTRA), IEEE802.11 (Wi-Fi), IEEE802.16 (WiMAX), IEEE802.20 and employing OFDMA.RAN also can comprise one or many person in Evolution-Data Optimized (EV-DO) or Ultra-Mobile Broadband (UMB) network.

In the illustrated case, accessing terminal 102 is associated with packet switch (PS) network (such as LTE) by eNB104, and is associated with circuit switching (CS) network for data and voice call by base station 110.Access terminal and 102 can register (passing through eNB104) to E-UTRAN and packet data network (PDN) gateway 110 can provide the connectivity accessed terminal between 102 and one or more outside packet data network 116.Access terminal 102 by base station 110 to 1xRTTCS network (it can be called as 1x network) registration such as to obtain speech and data, services by CDMA-2000 network.In an example, the allowance of General Packet Radio Service (GPRS) system 2G, 3G and W-CDMA mobile network uses the gateway function that can comprise Serving GPRS Support Node (SGSN) 114 that IP bag is transmitted into the external networks such as such as the Internet 116.SGSN114 can provide some interoperability services of the communication realized between gprs system and external packet-switched networks 116.Some aspect of the present invention is equally applicable to other combination of PS and CS network, such as, comprise GSM.

Depicted in figure 1 in example, MME106 serves as the Controlling vertex to the 102 relevant LTE business that access terminal.MME106 processes the signaling accessed terminal between 102 and core network usually, thus provides carrying and connection management service.In certain embodiments, intercommunication server IWS108 can perform single radio voice and call out continuous interworking solution function.Therefore, backhaul communication can be used between LTE and 1x network.Mobile switching centre (MSC) 112 can control the network switch element for being provided 1xRTT voice service by 1xRTT base station 110.

Accessing terminal 102, can be deployed in wherein multiple accessible community or RAN be in available position, and access terminal 102 different frequencies and/or different RAT can be used to access provide mobile management, session management, for the conveying of Internet Protocol (IP) bag service and the core network of other service.RAT can based on UMTS, TD-SCDMA, GSM, CDMA2000, WiMAX and LTE.

Fig. 2 be illustrate through adjust with operate in multiple network simultaneously access terminal 202 figure.Access terminal and 202 can receive the service provided by one or more core network 214 and 216.Access terminal and 202 can communicate with the first access point 204 and serve to obtain from first network 214 and communicate to obtain service from second network 216 with the second access point 206.Access terminal and 202 obtain service by two or more access points 204,206 and/or 208 from single network.Such as, access terminal and 202 can communicate to obtain service from second network 216 with the second access point 206 and the 3rd access point 208.In another configuration, accessing terminal 202 can communicate with the 3rd access point 208 or another access point and to serve to obtain from the 3rd network (not shown).Each network 214 and 216 provides speech and/or data, services by one or more RAN operated by identical or different Virtual network operator.

Accessing terminal 202 can through adjusting or is configured to support two or more SIM228, the subscribing user of difference service that it can be used for identifying and certification is provided by the operator on network 214 and/or 216.In an example, each SIM228 can store International Mobile Subscriber identity (IMSI) and relevant key, its can identify uniquely and certification access terminal 202 user and user by network 214 and/or 216 can booking service.Each SIM can be associated with other network identifier of telephone number or other identifier being different from telephone number or being associated with another SIM.In illustrated example, access terminal 202 portable telephone devices that can comprise two SIM card 208 and 210 being equipped with the call establishment realized on two different speeches and/or data network.Access terminal 202 can maintain two or more concurrent activitiess calling.The use of plurality of SIM cards 208 and 210 can permit accessing terminal 202 user's access and use different feature of subscribing to reduce cost, acquisition excellent service etc.

Access terminal and 202 can support multiple many SIM operator scheme.Such as, in two SIM stand-by (DSS) pattern, accessing terminal 202 can originally in the ready mode subscribed different from two.After setting up calling by a RAN214 or 216, accessing terminal 202 can cause the connection accessed terminal between 202 and another RAN216 or 214 to enter inactive state.

In DSDA pattern, accessing terminal 202 is connected to two networks 214 and 216 simultaneously by two connections and/or is connected to single network 214 or 216.There is accessing terminal of DSDA function 202 can switch between two call actives and/or connect two call actives at 202 places that access terminal.In DSDA pattern, access terminal and 202 can set up the first call active on first network 214, on second network 216, keep idle simultaneously.When calling is activity on the first reservation network 214 or 216, what have DSDA function accesses terminal 202 by the second reservation network 216 or 214 reception second calling.If it is movable for calling out on described first and second reservation networks 214 and 216, so user can optionally switch between the two calls, and/or can connect described two callings at 202 places that access terminal.Access terminal and 202 can support two or more SIM228 and can therefore define other operator scheme, comprise Three S's IM Dual Action (TSDA) pattern, four SIM Dual Action (QSDA) patterns etc.

202 multiple radio frequency (RF) chain 222 and 224 can be comprised through adjusting or be configured for use in accessing terminal of many SIM multi-activity pattern.The number of the RF chain 222 and 224 provided in 202 that accesses terminal can determine can by 202 supports that access terminal while the number of call active.Each RF chain 222 and 224 can be assigned for setting up and maintaining and being flexibly connected of access point 204,206 or 208.Described multiple RF chain 222,224 may be embodied in one or more RF modulator-demodular unit.RF modulator-demodular unit can comprise one or more RF chain 222,224, and each RF chain has at least one PA.Depicted in figure 2 in example, accessing terminal 202 can use two RF chains 222,224 to support to correspond to the parallel join of diverse access point 204 and 206 of network 214 and 216 respectively.RF modulator-demodular unit can comprise one or more processor, non-transitory memory storage and logic in addition, and it is configured to process, transmitting and Received signal strength and encodes and decode by the data of access terminal 202 transmittings and reception.

Fig. 3 is that the simplified schematic of the semiconductor device 302 of the location of some assembly that RF modulator-demodular unit 304 is described represents 300.RF modulator-demodular unit 304 can comprise multiple PA310,312,314,316 and 318.Each PA310,312,314,316 and 318 can be configured to operate in the subband distributing to the bandwidth that network connects.PA310,312,314,316 and 318 can be assigned to different PA groups 306 and 308, it may correspond in the RF chain physically separated through assigning to dispose the communication connected for different radio.In an example, based on by be arranged on that the SIM228 that accesses terminal in 202 identifies network reserved, RF chain 222,224 can be assigned to connection.In certain embodiments, PA group 306 and 308 is placed in the position physically separated of modulator-demodular unit 304 or device 302.PA group 306 and 308 can divide heat insulation and/or electric remarkable distance, heats contribution can be and can use thermal sensor to distinguish to make the heat of two or more groups 306 and 308.Thermal sensor can be deployed in the substrate of semiconductor device 302 or encapsulate on nude film that is interior, formation modulator-demodular unit on it, and/or on chip carrier.

Fig. 4 illustrates that the simplified schematic comprising the device 402 of RF modulator-demodular unit 404 represents 400.RF modulator-demodular unit 404 can comprise multiple PA410,412,414,416 and 418, and each PA can be configured to operating through dividing in one or more subband being used in the bandwidth that network connects.In this example, in the district that PA410,412,414,416 and 418 can be clustered in modulator-demodular unit 404 or cross over described district and disperse, with make through point to be used in use together with different RF chain PA410,412,414, the not separate remarkable distance of group of 416 and 418.In an example, the reservation that PA410,412,414,416 and 418 individually can be assigned to frequency subband, network connection and/or be identified by SIM.PA410,412,414,416 and 418 can be assigned by the deviser of device, and at least some embodiments, can be needed by the current operation of modulator-demodular unit 404 based on the modulator-demodular unit 404 from the join dependency to different RAN and be distributed one or more PA410,412,414,416 and 418.

Continue with reference to figure 2,3 and 4, modulator-demodular unit 304 and 404 can be configured or through adjust with alleviate in response to heat request or order access terminal 202 assembly.Heat alleviates request and may be used for controlling the power consumption of modulator-demodular unit 304 or 404 to reduce the temperature accessed terminal in 202, and/or avoids in integrated semiconductor system 302 or 402 and/or the further temperature carried in the encapsulation of semiconductor device 302 or 402 increases.High temperature can cause semiconductor device 202,252 or with the fault of semiconductor device 302 or 402 other device juxtaposed and damage.In an example, gain control circuit restricting signal output power can be used to control power.In another example, can use and divide clock signal or otherwise slow down processor instruction circulation or the circuit of steering logic clocking rate to control power.

To heat alleviate order response alterable and can based on the priority being assigned to heat and alleviating request.Such as, modulator-demodular unit 304 or 404 can be configured or ask or order to alleviate in response to heat through adjusting, and reduces power consumption by following operation: amendment transmitter power; Amendment processing clock speed; Amendment modulation scheme; Implementation data current control is to reduce emission rate; And/or revise another operating characteristics or the characteristic of modulator-demodular unit 304 or 404.Request is alleviated for higher priority heat, connecting by stopping one or more, hanging one or more connection and/or reducing power consumption further by connection is idle state from active transition.

In the system of routine, alleviate angle from heat, RF modulator-demodular unit 304 or 404 is regarded as simple function element, and will control modulator-demodular unit 304 or 404 all elements power consumption intention under send heat and alleviate request.But access terminal in 202 at many SIM, modulator-demodular unit 304 or 404 can comprise multiple RF chain 222 and 224, and one of them RF chain 222 or 224 can be the source of heat problem, and another RF chain 224 or 222 does not make remarkable contribution to heat problem.

In certain embodiments, optionally application heat alleviates to make to alleviate for any one delayed heat in the RF chain 222 and/or 224 join with the join dependency with low-heat risk, alleviates program for RF the chain 224 and/or 222 execution power reduction of expection or the remarkable heat problem of known generation and other heat simultaneously.Such as, GSM/EDGE/GPRS connects and can be associated with the relatively little risk of the heat problem causing accessing terminal in 202, and obtains optimal heat for adopting the RF chain 222 or 224 of the connection of the technology more likely causing heat problem alleviate by solving.Be less than all technology and all modem technologys of non-required and meet heat by solving when multiple wireless connections activity and alleviate request and solve heat problem.Therefore, can maintain access terminal 202 at least some function, even also like this when disposing serious heat and alleviating problem.

Heat alleviates scheme and agreement needs modulator-demodular unit 304,404 to be marked as the hypothesis of the possible arch-criminal of the heat problem detected based on described modulator-demodular unit and to have performed and alleviate level usually.According to some aspect disclosed herein, can only about the technology relevant to heat problem, with described technology to the contribution of heat problem pro rata, and/or the mode of operation that based upon activities connects performs heat and alleviates request.

Based on the movable RAT supported by the assembly in integrated modem 304 or 404 and circuit simultaneously, some embodiment uses can distinguish that described assembly and circuit are to the system and method for the contribution of heat problem.To indivedual contribution of identified heat problem, different hot mitigation techniques can be applied to described assembly and circuit based on described assembly and circuit.Assembly and circuit partly can be attributable to the call active of setting up and maintaining on the RAT supported by described assembly and circuit to indivedual contributions of heat problem.Comparatively speaking, all component that conventional modulator-demodular unit expection and/or need is associated from different concurrent activities technology and circuit in accordance with alleviating request, even if one or many person in described technology is not like this to the remarkable contributor of identified heat problem yet.

Some embodiment is distinguished the priority of the minimizing of power consumption from the activity that the different reservations by 202 supports that access terminal are associated by basis and is enabled the progression method alleviated heat.The modulator-demodular unit 304,404 accessed terminal in 202 can be configured to the current operation status based on the assembly be associated in integrated modem 304 or 404 and circuit and distinguish the difference contribution of described assembly and circuit.The modulator-demodular unit 304,404 accessed terminal in 202 with DSDA function can be considered as the multiple different entity operated independently to a certain extent, and modulator-demodular unit 304,404 can be configured to alleviate the order power consumption of Control Component and circuit and activity independently of one another at least some heat being directed to modulator-demodular unit 304,404.

In an example, one or more assembly of modulator-demodular unit 304,404 and circuit may be used for being connected with speech by network 114 or 116 associating, and modulator-demodular unit 304,404 can differently dispose one or more assembly described and circuit with the assembly of the modulator-demodular unit 304,404 be associated with data cube computation by network 116 or 114.Multiple power reduction levels can be applied in response to heat alleviates order the assembly and circuit that are associated with voice call by modulator-demodular unit 304 or 404, and described power reduction levels is different from the power reduction levels being applied to assembly and the circuit be associated with data call.

The one that modulator-demodular unit 304 or 404 can process in data call and voice call differently from one another in response to heat alleviates order.In an example, modulator-demodular unit 304 or 404 reduces by scheduling and data rate and the initial heat for connecting the data, services provided at first network alleviates, and the power simultaneously postponing to be used for the active voice call that heterogeneous networks connects alleviates.In another example, " waiting answering " calling on the first reservation network 114 or 116 can be abandoned in response to heat alleviates order, the call active on the second reservation network 116 or 114 can be maintained simultaneously.

Continue with reference to figs. 2 to 4, accessing terminal 202 can monitor temperature in some region of semiconductor device 302,402.In integrated circuit, nude film or encapsulation, the temperature monitored can close to the thermal region defined in advance of group comprising assembly and circuit 306,308 and 406.Each group of assembly 306,308 and 406 can be associated with single reservation.Such as, have DSDA function access terminal 202 can comprise can individually be assigned for be arranged on the independent RF chain 222 and 224 used together with the one in the multiple SIM228 accessed terminal in 202.Each RF chain 222,224 can comprise one or more PA group 306 and/or 308, or one or many person in available PA310,312,314,316,318,410,412,414,416 and/or 418.Each PA310,312,314,316,318,410,412,414,416 and/or 418 can be used for by modulator-demodular unit connecting via the correspondence in subscribed RAN carrying out operating in the frequency band communicated.In certain embodiments, one or more temperature sensor can be placed on the vicinity of PA group 306 or 308 or indivedual PA310,312,314,316,318,410,412,414,416 and/or 418 sides.Modulator-demodular unit 204 can maintain and make PA310,312,314,316,318,410,412,414,416,418 and/or the information that is associated with the RF chain 222,224 being mapped to the reservation be associated with the one in SIM228 of PA group 306,308.In an example, temperature sensor can comprise and being integrated in modem circuit, being attached to nude film, being provided in encapsulating or otherwise relative to carrying the integrated circuit of modulator-demodular unit and one or more thermistor of disposing.

Fig. 5 is the schematic diagram 500 that the semiconductor device 502 wherein defining multiple thermal region 504 and 506 is described.Thermal region 504 and 506 can be included in and wherein monitor and the some sections controlled in the IC of heat problem, encapsulation or equipment and region.Thermal region 504 and 506 can overlap with the assembly in source and the physical packets of circuit likely becoming heat problem.In an example, thermal region 504 can be associated with corresponding to the assembly of RF chain 222 or 224 and the grouping of circuit that comprise PA512 and 514, and another thermal region 506 can be associated with corresponding to the assembly of RF chain 222 or 224 and the grouping of circuit that comprise PA516 and 518.More than one thermal region 504 and 506 can be associated with single RF chain 222 or 224.

One or more temperature sensor 508,510 and/or 520 can be disposed to monitor the temperature in each thermal region 504,506.Special temperature sensor (DTS) 508,510 can be deployed in each thermal region 504,506 or near, to make DTS508,510 can monitor may originating of heat problem, such as PA512,514,516 or 518.Each DTS508,510 usual its targets of close proximity (one such as, in PA512,514,516 or 518) and locating.PA512,514, the temperature of 516 and/or 518 can be used for the contribution of the heat problem determined in PA512,514,516 and/or 518 pairs of semiconductor devices 502 or encapsulation.DTS can comprise multiple thermal sensor, and each thermal sensor is configured to monitor the one in PA516 or 518.

The temperature sensor (ATS) 520 be associated can be provided to monitor the temperature in thermal region 504 or 506.By ATS520 using supplementing or replacing as DTS508.ATS520 can be configured to measure the temperature of multiple PA512 and 514 on thermal region 504 and/or the effect of PA512 and/or 514.Therefore, ATS520 can be positioned at a distance of may originating apart from heat problem, to monitor and the temperature that multiple assemblies in thermal region 504 or are around associated, and/or measure that may adversely to affect be not temperature in one or more assembly in source of temperature of increase or the region of the operation of circuit.

Fig. 6 is the schematic diagram 600 that the semiconductor device 602 defining single thermal region is wherein described.Described thermal region can comprise a part for whole semiconductor device 602 or semiconductor device 602.In certain embodiments, described thermal region comprise comprise corresponding to the assembly of one or more RF chain 222 and/or 224 and circuit modulator-demodular unit at least partially.As depicted, PA606,608,610 and 612 is dispersed in the region of whole semiconductor device 602, and PA616,618,620 and 622 troops close to each other.In certain embodiments, all PA606,608,610,612,616,618,620 and 622 can be clustered in one or more group or be dispersed in whole given area.Usually, a group of the sensor 604,614 of at least one ATS and/or DTS is comprised for monitoring the temperature in described single thermal region.The configuration of based semiconductor device 602, layout, density and/or other attribute can dispose multiple sensor 604 and 614.

In certain embodiments, different heat can be implemented in the different thermal regions 504,506 in modulator-demodular unit and alleviate program.In certain embodiments, can individually implement different heat relative to the assembly found in thermal region or circuit and alleviate program.In an example, the priority of request, the RAT be associated from RF chain 222 and 224 and the type of calling set up on RF chain 222 and 224 and state can be alleviated based on heat different heat to be alleviated process and be applied to the RF chain 222 and 224 accessed terminal in 202 with DSDA function.

Different heat can be implemented in 202 and alleviate process having accessing terminal of DSDA function based on the temperature measured by one or more PA310,312,314,316 and/or 318.Continue with reference to figs. 2 to 6, modulator-demodular unit 304,404 can comprise multiple RF chain 222 and 224, and each RF chain 222 and 224 has at least one PA310,312,314,316 and/or 318.Access terminal 202 treating apparatus can obtain and monitor measured temperature from one or more sensor (such as ATS520 and DTS508 and/or 510).Receive heat alleviate request afterwards, at once can check that measured temperature is to determine the potential source of heat problem.Described potential source can be one or more indivedual PA310,312,314,316 and/or 318.Described potential source can be identified as one or more group of assembly, such as PA310,312 and 314 and/or PA316 and 318.Described potential source can be identified as and reside in one or more thermal region 306 and/or 308.

When the group of one or more assembly, circuit, assembly or circuit and/or thermal region 306,308 being identified as the potential source of heat problem, different heat can being performed to the different elements of modulator-demodular unit and alleviate process.Such as, when 310,312,314,316 or 318 are defined as the potential contributor to the heat problem in modulator-demodular unit, heat can be alleviated subsequently be applied to for PA310,312,314, belonging to 316 or 318 or the RF chain 222 or 224 be assigned to, and heat is not alleviated and is applied to other RF chain 224 or 222.Be provided to the power of RF chain 222 or 224, termination by reducing or hang the wireless connections supported by RF chain 222 or 224 and/or by the connection enforcement flow control supported by RF chain 224 or 222, and heat is alleviated be applied to RF chain 224 or 222.

In an example, gain control logic can be configured to the emissive power reducing one or more RF chain 222,224, and then directly controls power stage and be attributable to the heating be associated of poor efficiency of amplifier and other circuit.In another example, power consumption and the heating be associated can be the function of the operating frequency of circuit, and realize by the clocking rate slowing down circuit reducing.In another example, the number percent of the time of transmitting RF chain 224 or 222 can be reduced to the restriction of data processing amount applying, and the introducing of flow control can effectively reduce temperature increase when the heat that can effectively dissipate produced.

In certain embodiments, can obtain about whether heat being alleviated the decision-making being applied to RF chain 222 or 224 based on the character of the reservation be associated with RF chain 222 or 224 and/or type.According to some aspect described herein, can assign based on one or many person in following each thermal region (i) PA310,312,314, the structure of each group of 316 or 318; (ii) PA310,312,314, the physical location of 316 or 318; And (iii) and PA310,312,314,316 or 318 reservations be associated.Further association can be set up between thermal sensor 508,510 and 520, thermal region 504,506 and reservation.Usually, at least one thermal sensor 508,510 and/or 520 can be assigned to each thermal region 504,506.The proprietary heat of reservation can be set up subsequently in modulator-demodular unit to alleviate.Subscribe proprietary heat and alleviate the difference response that can cause the heat of varying level being alleviated to order.But, at least some embodiments, response alleviates to the heat of making a reservation of modulator-demodular unit identical concerning can be some high priority order.Such as, " level 3 " order can be defined ask and otherwise order emergency level to represent crisis situation or to alleviate in response to heat.It is initial that the response of ordering level 3 can cause for made a reservation limited service pattern, permits limited modem activity and only urgent call whereby, until remove temperature crisis.

What have a function of DSDA at some accesses terminal in 202, all PA410,412,414,416 or 418 can be grouped in one or more thermal region, and the difference response of implementing heat to be alleviated to order can be subscribed for difference relative to each configuration of subscribing and current state based on modulator-demodular unit.In an example, the one in reservation can set up voice call, data and/or speech are connected in another reservation is simultaneously movable.Usually, originally heat is alleviated and be applied to data call, because usually set up data call with the quality of service requirement lower than the voice call of time-sensitive.In another example, when setting up voice of the Internet protocol (VoIP) and call out on data call, data and voice call can be simultaneously movable on subscribed data network.Voip call can based on traffic performance from the time insensitive change into time-sensitive communication and quality of service requirement that data transfer connects.In another example, only movable on the network that can subscribe at two of data cube computation, and based on other factorses such as such as operator's preference and/or the service quality of consulting, the heat of differentiation can be alleviated and be applied to described connection.The priority that the service quality consulted and operator's preference also may be used for distinguishing the calling of video, speech and other high priority time-sensitive alleviates for application heat.

In certain embodiments, modulator-demodular unit can comprise the PA310,312,314,316 and/or 318 that can be assigned to different modulating demodulator techniques at different time.Therefore, some embodiment can determine, access or maintain identify PA310,312,314, the information of 316 or 318 which modem technology of current service.Can there is (IRAT) handover between (such as) RAT or maintain when reselecting and upgrade PA310,312,314,316 and/or 318 to the mapping of modem technology.In order to heat alleviates object, when thermal region 306,308 is marked as the position of heat problem, modulator-demodular unit identifiable design be present in movable PA310 in thermal region 306,308,312,314,316 and or 318 and/or which active modem technology of being associated with thermal region 306,308 be may originating of heat problem.The heat can implementing to be used for marked thermal region 306,308 based on following hypothesis subsequently alleviates: can mainly through manage be associated with marked thermal region 306,308 movable PA310,312,314,316 and/or 318 and active modem technology alleviate heat problem in thermal region 306,308.

With reference to figure 2 and 5, there is accessing terminal of DSDA function and 102 may be configured with the PA group comprising the PA512 and 514 being assigned to the first thermal region 504, and comprise the 2nd PA group of the PA516 and 518 being assigned to the second thermal region 506.First thermal region 504 and the second thermal region 506 can be positioned the different physical locations in semiconductor device 502.In an example, use is one group of one or more DTS device 510 of thermal region 506 distribution and is that one group of one or more ATS device 520 that another region 504 is distributed monitors two thermal regions (Z (n), wherein n=1:2).Heat problem can based on the measured temperature obtained by ATS device 520 and/or DTS device 510 owing to reservation.In another example, use be one or more DTS device 508 of distributing of thermal region 504 to monitor described two thermal regions, and one group of one or more DTS device 510 can be assigned to another region 506.Heat problem can based on the measured temperature of any combination acquisition by DTS device 508 and 510 owing to reservation.

Have DSDA function access terminal 202 modulator-demodular unit comprise cross over two thermal regions 504 and 506 placed in the middle in two different and different physical locations and dispose PA512,514,516 and 518 time, the response alleviating request or order to heat can be based on region.Specifically, the reservation be associated with the thermal region 504 or 506 in the source being identified as heat problem can observe heat alleviate request, and the thermal region 504 or 506 not being labeled the source of heat problem can be ignored at least some heat and alleviates request.When both thermal regions 504 and 506 are identified as the source of heat problem, subscribe for two and usually alleviate request in accordance with described heat, all observe heat to make all voice calls and data call when two thermal regions 504 or 506 are all identified as the source of heat problem and alleviate request.

With reference to figure 2 and 6, can have DSDA function access terminal 202 modulator-demodular unit in only define a thermal region (Z (1)).Some or all thermal regions crossed in PA606,608,610,612,616,618,620 and/or 622 and disperse and can be whole region allocation one group of ATS and/or DTS device 604.In this example, heat problem is made to the distribution of subscribing by the thermal measurement value that receives from ATS/DTS device 604 and/or to a certain combination of each operating characteristic connected of the network 214 or 216 subscribed.Multiple 616,618,620 and 622 can be clustered in thermal region, and can be PA616,618,620 and 622 troop one group of ATS and/or DTS device 614 be provided.In this example, a certain combination by the thermal measurement value, the thermal measurement value from ATS/DTS device 604 reception and/or each operating characteristic connected to the network 214 or 216 subscribed that receive from ATS/DTS device 614 makes heat problem to the distribution of subscribing.

Can at least partly based on operating characteristic and/or the state of the network 214 or 216 subscribed to the response alleviating request.When two reservations are associated with voice call, only problematic speech needs to alleviate request in accordance with heat.Data cube computation more may cause heat problem usually, and originally data alleviate response can be directed to data cube computation.

Modulator-demodular unit can determine that how disposing heat alleviates request.Specifically, modulator-demodular unit can originally identify there is heat problem thermal region, determine thermal region and subscribe between associating, and determine current active radiotelegraphy and subscribe between associating.Modulator-demodular unit can alleviate level based on heat subsequently and determine the response needed for each thermal region.Heat can be defined independently for each thermal region and alleviate level, and heat alleviate level can further based on the most likely region in the source of heat problem or the determination of technology.

Fig. 7 is the modulator-demodular unit level process flow diagram of the example of the process illustrated for alleviating request in response to heat.To be identified and owing to when supporting the modulator-demodular unit of connection using one or more RAT at heat problem, can in step 702 place initial described process.Modulator-demodular unit can be configured to alleviate request in response to multiple different heat.Heat alleviates request can ask specific heat to alleviate action, and/or other instruction of the severe level of its identifiable design priority or heat problem.Such as, the heat problem that selectivity and/or stagewise respond enabled alleviating request identifiable design and modulator-demodular unit is associated non-current level.The heat that modulator-demodular unit can be configured in response to being associated with the level of scope between 0 to 10 alleviates request, wherein level 0 indicate unidentified go out heat problem, and level 10 needs immediately and peak response.For the object of this example, define heat and alleviate Request Priority level 4.But the level of any number can alleviate request with heat and be associated.

In step 704 place, modulator-demodular unit can determine whether described request comprises highest priority request.The heat defining 4 levels wherein alleviates in the example of Request Priority, and the scope of level alleviates level request from level 0 to level 3 heat, and level 0 indicates unidentified heat problem whereby, and wherein can issue level 3 when forming crisis situation.If determine that heat alleviates request and has limit priority (such as, level 3 is asked), so in step 714 place, modulator-demodular unit can cause all activity technology in accordance with alleviating request.Usually, modulator-demodular unit adopts as calculated to resist the instant and/or urgent action of heat problem.

If alleviate the levels of priority asking to have lower than limit priority, so in step 706 place, modulator-demodular unit can determine the number of the RAT of current active.If an only RAT activity, so in step 716 place, modulator-demodular unit can call the heat alleviating the levels of priority of request suitable for described heat and alleviate.

If more than one RAT is movable, so in step 708 place, the movable RAT of the movable PA of modulator-demodular unit identifiable design and correspondence.The heat that can be flexibly connected application varying level for each alleviates, and modulator-demodular unit can support that being flexibly connected application heat for some alleviates.In step 710 place, modulator-demodular unit can call heat for each thermal region being identified as having heat problem and alleviate.The heat called for thermal region alleviates and can comprise the heat called for one or more PA in described thermal region and alleviate.

Fig. 8 is the process flow diagram illustrated for alleviating the process of request in response to the heat in each thermal region of modulator-demodular unit.In step 802 place, modulator-demodular unit can determine the number of the movable RAT in thermal region.If determine only to support a movable RAT in described thermal region, so in step 812 place, modulator-demodular unit can alleviate the levels of priority (such as, the first and second levels alleviate request) of request in response to described heat and call heat and alleviate.

In step 804 place, modulator-demodular unit can determine whether each in two movable RAT relates to voice call, and if two RAT relate to voice call, so in step 814 place, modulator-demodular unit can call two voice responses heat being alleviated to request.In one example, the described pair of voice response can be called out current based on which is movable, waiting answering or idle determination and/or can based on the determination of calling and/or RAT priority.

In step 806 place, modulator-demodular unit can determine whether described two movable RAT relate to both speech and data call.If both speech and data call are movable, so in step 816 place, modulator-demodular unit can call response speech and the suitable heat of data call being alleviated to request.In one example, described response can make voice call unaffected, causes the power reduction for data call simultaneously.In another example, whether described response part can comprise VoIP connection based on described data call; If voip call is underway, so in step 814 place, heat alleviate can follow two voice response and current based on which calling be movable, waiting answering or idle determination and/or can based on the determination of calling and/or RAT priority.

In step 808 place, modulator-demodular unit can determine whether that two movable RAT both relate to data call, and if so in step 818 place, modulator-demodular unit can call and connect for Double Data the response that suitable heat alleviates request.In one example, described response can the one in data call comprise VoIP connect cause another data call reduce power consumption.In another example, alleviating response can based on the determination of service quality, RAT priority, operator's preference and other factors.

Response heat being alleviated to request can be defined based on by subscribing, by thermal region and/or the distribution of heat problem that caused by type of call.For purposes of illustration, the response based on reservation that can use when modulator-demodular unit has single thermal region is described now.When two movable RAT being detected and two calling all relate to voice call time, modulator-demodular unit can be ignored priority 0 and 1 heat and alleviate request; Ask for level 2, modulator-demodular unit can terminate the voice call of current waiting answering and maintain active voice call.Limited service pattern (such as only urgent call) is activated in response to level 3 heat alleviates request.

In certain embodiments, modulator-demodular unit at once can be given a warning to user by user interface after receiving level 1 heat and alleviating request.Described warning can inform that the one in user two calling should be terminated.Described warning can ask user to be identified in the voice call that should maintain when heat problem increases.At once the calling that user identifies can be maintained after upgrading one level 2 heat alleviates request.If user refuses to identify the calling for stopping, the default call defined in advance so can be maintained.Described default call be can be the calling of current active or is subscribed the calling made by special speech.

According to some aspect, when two movable RAT being detected and when data call and voice call are activities, the heat that modulator-demodular unit can be prevented in initiating speech calling alleviates, until receive level 3 heat to alleviate request.Modulator-demodular unit can in response to level 1 heat alleviate request and implementation data calling on flow control.Modulator-demodular unit can after receiving level 2 heat and alleviating request the backout routine of the initial transmitter power for data call restriction at once.The limited service pattern activated in response to level 3 heat alleviates request causes modulator-demodular unit to stop data launching usually.

According to some aspect, when two movable RAT being detected and when a data call and two voice calls are activities, the heat that modulator-demodular unit can be prevented in initiating speech calling alleviates, until receive level 3 heat to alleviate request.Modulator-demodular unit can in response to level 1 heat alleviate request and implementation data calling on flow control.Modulator-demodular unit can after receiving level 2 heat and alleviating request the backout routine of the initial transmitter power for data call restriction at once.The limited service pattern activated in response to level 3 heat alleviates request causes modulator-demodular unit to stop data launching usually.

Fig. 9 A comprises the process flow diagram 900 that the method alleviated for the heat in modulator-demodular unit is described.Described method can by 202 execution (see Fig. 2) that access terminal.

In step 902 place, accessing terminal 202 can receive or produce heat and alleviate request.Heat can be produced in response to the measured temperature accessed terminal in 202 and alleviate request.

In step 904 place, access terminal 202 can determine modulator-demodular unit current whether maintain one or more be flexibly connected.Modulator-demodular unit can maintain the first flexible connection and second and be flexibly connected.Second is flexibly connected and can be associated with being flexibly connected than first higher service quality.One or many person during described first flexible connection and described second is flexibly connected can carrying voice or video call.In some cases, the first flexible connection and second is flexibly connected both carrying voice callings.

In step 906 place, can based on modulator-demodular unit current whether maintain one or more be flexibly connected determination and make decisions.If determine the current maintenance of modulator-demodular unit one or be not flexibly connected, so in step 910 place, access terminal 202 can call for access terminal 202 all transceivers and/or the alleviating of other assembly.If determine that modulator-demodular unit maintains multiple connection, so method proceeds to step 908.

In step 908 place, 202 heat can calling the varying level be flexibly connected for two in response to alleviating request that access terminal alleviate.In an example, can the heat as called varying level described by about the process flow diagram 920 shown in Fig. 9 B alleviate.

Fig. 9 B comprises the process flow diagram 920 that the method alleviated for the heat in modulator-demodular unit is described.Described method can by 202 execution that access terminal.Access terminal 202 determined to be flexibly connected for two in response to alleviating request and the heat of calling varying level alleviates time can perform described method.In an example, this type of decision-making is made at step 906 place of the method illustrated in process flow diagram 900 in figure 9 a.

In step 922 place, accessing terminal 202 can be flexibly connected relative to first and call heat and alleviate.First is flexibly connected and can calls out by carrying voice.Voice call can waiting answering, and the heat being flexibly connected relative to first and calling alleviates the voice call that can comprise and stop described waiting answering.Be flexibly connected relative to first the heat called alleviate can comprise stop subscribe by special speech the calling made.The heat called relative to the first flexible connection alleviates the notice that can comprise the potential termination providing at least one voice call.

First is flexibly connected and can comprises data cube computation.The heat called relative to the first flexible connection alleviates can comprise the initial first flow control be flexibly connected.The heat called relative to the first flexible connection alleviates the flow control that can comprise amendment first and be flexibly connected.

The heat called relative to the first flexible connection alleviates the Power Limitation of the transmitter that can comprise initial or increase modulator-demodular unit.

In step 924 place, access terminal and 202 can prevent to be flexibly connected relative to second and call heat and alleviate.

In certain embodiments, can be flexibly connected first and be identified as and be associated with a SIM of DSDA device, and be flexibly connected to be identified as by second and be associated with the 2nd SIM of DSDA device.Can alleviate based on optionally calling heat according to the determination of the reservation corresponding to described first and second SIM.Modulator-demodular unit can comprise multiple power amplifier.At least one power amplifier can be associated with heat problem and at least one power amplifier can be identified as just to be flexibly connected by first and use.At least one power amplifier can be identified as the member of the power amplifier group be associated with heat problem.Each in power amplifier group is arranged in the common thermal region of integrated circuit (IC) apparatus.At least one power amplifier can be identified based on the measured value obtained by the thermal sensor be physically located near power amplifier group.

In certain embodiments, at least one power amplifier can be associated with the reservation of DSDA device.Call with described association the between described reservation the heat be flexibly connected relative to first based at least one power amplifier described to alleviate.

Fig. 9 C comprises the process flow diagram 940 that the method alleviated for the heat in modulator-demodular unit is described.Can by access terminal 202 in response to alleviate request and perform described method.In an example, step 902 place of the method that can illustrate in the process flow diagram 900 of Fig. 9 A receives and alleviates request, and the method that at once can describe in flowchart 940 after alleviating request described in receiving, or one or more other step place of the method illustrated in the process flow diagram 900 of Fig. 9 A.

In step 942 place, access terminal and 202 can determine the type alleviating request that is that receive at radio modem place or that produce.

In step 944 place, based on alleviate request type determination and make decisions.If alleviating request is that limit priority type alleviates request, so accesses terminal and 202 can call in step 946 place and/or enforce limited service operator scheme.Limited service pattern is applied to all transceivers in modulator-demodular unit usually.In an example, limited service pattern can prevent the all-calls except urgent call.

If alleviating request is not that limit priority type alleviates request, so can disposes according to other program and alleviate request.In an example, method carries out the method that describes to perform or restart to perform the process flow diagram 900 shown in about Fig. 9 A through step 948.

Figure 10 is Figure 100 0 of the example of the hardware embodiments of devices illustrated, described equipment can be adopt treatment circuit 1004 access terminal 202.Treatment circuit 1004 can implement bus architecture, and described bus architecture is generally represented by bus 1030.Bus 1030 can comprise interconnect bus and the bridge of any number of application and attribute and the overall design constraints depending on treatment circuit 1004.The various electrical chains comprising one or more processor and/or hardware module, treatment circuit 1004 and non-transitory computer-readable media 1032 can be connected together by bus 1030.Bus 1030 also can by well-known in affiliated field and be therefore connected together by other electrical chains various be not described further, and other circuit various is such as timing source, peripherals, voltage regulator and power management circuitry.

Treatment circuit 1004 can be coupled to one or more transceiver 1014,1016.Transceiver 1014,1016 can be coupled to one or more antenna 1024,1026.Transceiver 1014,1016 is provided for the device communicated with various miscellaneous equipment via transmission medium.Treatment circuit 1004 can comprise one or more processor being responsible for general process (comprising the execution of the software be stored on computer-readable media 1032).Software causes treatment circuit 1004 to perform above for the various functions that any particular device describes when being performed by treatment circuit 1004.Non-transitory computer-readable media 1032 also can be used for storing the data manipulated when executive software by treatment circuit 1004.Disposal system comprises at least one in module 1006,1008,1010 and 1012 further.Described module can be run on treatment circuit 1004, resident/to be stored in software module in computer-readable media 1032, be coupled to one or more hardware module for the treatment of circuit 1004 or its a certain combination.Treatment circuit 1004 can be access terminal 202 embedded components.

Access terminal and 202 also can comprise one or more input media 1020, it can comprise keypad, keyboard and/or touch-screen or another such device.Access terminal and can comprise one or more display device 1024.Access terminal and can comprise or be coupled to one or more sensor 1018.Sensor 1018 can comprise the thermal sensor being deployed in whole access terminal (comprising close to the power amplifier in transceiver 1014 and/or 1016) in 202, and can comprise one or many person in thermopair, thermistor, infrared detector etc.

In one configuration, equipment 202 for radio communication comprises for receiving the device 1004 alleviating request, 1006, 1014, 1016, 1024, 1026, for determining the current device 1004 whether maintaining one or more and be flexibly connected of modulator-demodular unit, 1006, 1014, 1016, 1024, 1026, for controlling the device 1004 of the power consumption in modulator-demodular unit, 1008, 1014, 1016, for providing the device 1004 of the notice of the potential termination of speech or video call, 1010, 1020, 1022, and for identifying the device 1004 of the heat problem in modulator-demodular unit, 1012, 1018.

Equally, term " aspect " does not require that all aspects of the present invention comprise discussed feature, advantage or operator scheme.Term " coupling " is used in reference to the direct or indirect coupling between two objects in this article.Such as, if object A is physically touching object B, and object B touching object C, so object A and C can still be regarded as coupled to each other arriving, even if they directly physically do not touch like this each other yet.For example, the first nude film can be coupled to the second nude film in encapsulation, even if never direct physical ground contact the second nude film is also like this for the first nude film.

Term wafer and substrate can, in this article for comprising any structure with exposed surface, use the formation of described exposed surface according to the integrated circuit (IC) of each aspect of the present invention.Term " nude film " can in this article for comprising IC.Nude film can comprise one or more circuit.Term substrate is understood as that and comprises semiconductor wafer.Semiconductor structure during term substrate is also used in reference to manufacture, and other layer manufactured thereon can be comprised.Term substrate comprises doping and non-doped semiconductor, the epitaxial semiconductor layer that supported by base semiconductor.Or by the semiconductor layer of dielectric support, and those skilled in the art's other semiconductor structure well-known.Term insulator is through defining to comprise than being generally called the more nonconducting any material of the material of conductor by those skilled in the art.Term " unit " can refer to as the assembly into the part of nude film and/or the circuit of nude film.Unit can be arranged in a nude film or unit can be semiconductor device, system and/or is distributed in the part of the encapsulation on some nude films and/or circuit.Therefore, unit can refer to physically and/or in logic be arranged in some positions assembly.

One or many person in assembly, step, feature and/or function illustrated in Fig. 1 to 10 can rearrange and/or be combined into single component, step, feature or function or be embodied in some assemblies, step or function.When not departing from novel feature disclosed herein, also additional element, assembly, step and/or function can be added.The unit illustrated in Fig. 1 to 6 and 10 and/or assembly can be configured to the one or many person performed in method described herein, feature or step.Novel algorithm described herein also can be efficiently implemented in software and/or be embedded in hardware.

And, it should be noted that embodiment can be described as the process being depicted as process flow diagram, FB(flow block), structural drawing or block diagram.Although operation can be described as sequential process by process flow diagram, many operations can walk abreast or perform simultaneously.In addition, the order of operation can be rearranged.When the operation of process completes, described procedure ends.Process can be corresponding with method, function, step, subroutine, subroutine etc.When process function is corresponding, its termination turns back to call function with described function or principal function is corresponding.

In addition, non-transitory machine-readable storage media can be one or more device for storing instruction and data, comprises ROM (read-only memory) (ROM), random access memory (RAM), magnetic disc storage media, optic storage medium, flash memory device and/or other machine-readable medium for storing information.Term " machine-readable medium " or " machine-readable storage media " including but not limited to portable or fixed-storage device, optical storage, and can store other media various of instruction and/or data.

In addition, several embodiment can be implemented by hardware, software, firmware, middleware, microcode or its any combination.When implementing with software, firmware, middleware or microcode, can be stored in the non-transitory machine-readable medium of such as medium or other memory storage in order to the program code or code segment performing necessary task.Processor can perform necessary task.Code segment can represent step, function, subroutine, program, routine, subroutine, module, software package, classification, or instruction, data structure or program statement combination in any.One code segment can by transmit and/or reception information, data, independent variable, parameter or memory content are coupled to another code segment or hardware circuit.Information, independent variable, parameter, data etc. can be transmitted, forward or transmit via any suitable modes such as comprising memory sharing, Message Transmission, alternative space, Internet Transmission.

Can use general processor, digital signal processor (DSP), special IC (ASIC), field programmable gate array (FPGA) or other programmable logic components, discrete gate or transistor logic, discrete hardware components or its implement or perform the example that combination discloses and the various illustrative components, blocks, module, circuit (such as, treatment circuit), element and/or the assembly that describe through design herein with any combination performing function described herein.General processor can comprise microprocessor, but in replacement scheme, processor can be any conventional processors, controller, microcontroller or state machine.Processor can also be embodied as the combination of computation module, and the combination of such as DSP and microprocessor, the combination of multi-microprocessor, one or more microprocessor are combined with DSP core, or any other this type of configuration.

The method described in conjunction with example disclosed herein or algorithm can processing unit, programming instruction or other direction form be embodied directly in hardware, the software module that can be performed by processor or both combinations, and can be contained in single assembly or cross over multiple device and distribute.Software module can reside in RAM storer, flash memory, ROM storer, eprom memory, eeprom memory, register, hard disk, removable disk, CD-ROM, or in the nonvolatile medium of other form arbitrary known in technique.Medium can be coupled to processor, makes processor from read information and can write information to medium.In replacement scheme, medium can formula integral with processor.

Those skilled in the art will understand further, and the various illustrative components, blocks, module, circuit and the algorithm steps that describe in conjunction with the embodiment disclosed herein can be embodied as electronic hardware, computer software or both combinations.For clearly demonstrating this interchangeability of hardware and software, functional about it substantially above and describe various Illustrative components, block, module, circuit and step.This is functional is embodied as hardware or software depends on application-specific and the design constraint applied to whole system.

Various feature of the present invention as herein described may be implemented in different system and does not depart from the present invention.It should be noted that aforementioned aspect of the present invention is only example, and should not be construed as restriction the present invention.The description of each aspect of the present invention is set is illustrative, and does not limit the scope of claims.Therefore, teaching of the present invention easily can be applied to the equipment of other type, and is appreciated by those skilled in the art that many replacement schemes, amendment and change.

Claims

1. heat alleviates a method, and it comprises:

Receive and alleviate request for radio modem;

Determine that described radio modem is current and whether maintain one or more flexible connection; And

When determining the multiple flexible connection of the current maintenance of described modulator-demodular unit, alleviate request and the heat of calling the varying level be flexibly connected for two alleviates in response to described.

2. method according to claim 1, wherein call to alleviate for described two heat of varying levels be flexibly connected and comprise:

The heat being flexibly connected the first level of calling relative to first alleviates; And

Call heat relative to the second flexible connection prevention to alleviate.

3. method according to claim 1, the heat wherein called for described two varying levels be flexibly connected based on the priority be associated with described two flexible connections alleviates.

4. method according to claim 3, is wherein assigned to the flexible connection supporting speech or video call by limit priority.

5. method according to claim 3, the described priority be wherein associated with described two flexible connections corresponds to the service quality priority be associated with described two flexible connections.

6. method according to claim 3, each carrying voice in wherein said two flexible connections or video call.

7. method according to claim 6, wherein calls to alleviate to comprise for described two heat of varying levels be flexibly connected and stops being flexibly connected by first the video or voice call that carry, maintains the video or voice call that are carried by another flexible connection simultaneously.

8. method according to claim 6, is wherein called to alleviate to comprise for described two heat of varying levels be flexibly connected and stops waiting answering voice call or subscribed the calling made by special speech.

9. method according to claim 6, the heat wherein called for described two varying levels be flexibly connected alleviates the notice comprising the potential termination providing at least one speech or video call.

10. method according to claim 1, it comprises further:

The type of request is alleviated described in determining; And

When alleviating request described in determining and there is limit priority type, the limited service pattern at initial described radio modem place.

11. methods according to claim 1, the heat wherein called for described two varying levels be flexibly connected alleviates the flow control comprised in an initial flexible connection.

12. methods according to claim 1, the heat wherein called for described two varying levels be flexibly connected alleviates the flow control comprising amendment one and be flexibly connected.

13. methods according to claim 1, wherein call to alleviate for described two heat of varying levels be flexibly connected and comprise Power Limitation that is initial or that increase the transmitter of described radio modem.

14. methods according to claim 1, wherein:

First flexible connection is associated with a SIM of two Subscriber Identity Module SIM Dual Action DSDA device;

Second flexible connection is associated with the 2nd SIM of described DSDA device; And

The heat called for described two varying levels be flexibly connected based on the priority be associated with the reservation corresponding to described first and second SIM alleviates.

15. methods according to claim 1, wherein call to alleviate for described two heat of varying levels be flexibly connected and comprise:

Identify at least one power amplifier relevant to heat problem; And

Call heat relative to the flexible connection be associated with at least one power amplifier described to alleviate.

16. methods according to claim 15, wherein identify that at least one power amplifier described comprises and identify the power amplifier group relevant to described heat problem.

17. methods according to claim 16, each in wherein said power amplifier group is arranged in the common thermal region of integrated circuit (IC) apparatus.

18. methods according to claim 16, wherein identify at least one power amplifier described based on the measured value obtained by the thermal sensor be physically located near described power amplifier group.

19. methods according to claim 15, it comprises further makes at least one power amplifier described be associated with the reservation of two SIM Dual Action DSDA device, wherein alleviates with the described heat called for described two varying levels be flexibly connected that associates between described reservation based at least one power amplifier described.

20. 1 kinds of radio modems, it comprises:

Multiple power amplifier, each power amplifier and is flexibly connected and is associated; And

Processor, it is configured to:

Receive and alleviate request for radio modem;

21. radio modems according to claim 20, wherein said processor is configured to be alleviated by the heat of following operation calls for described two varying levels be flexibly connected:

Call heat relative to the second flexible connection prevention to alleviate.

22. radio modems according to claim 20, the heat that wherein said processor is configured to call for described two varying levels be flexibly connected based on the priority be associated with described two flexible connections alleviates.

23. radio modems according to claim 22, are wherein assigned to the flexible connection supporting speech or video call by limit priority.

24. radio modems according to claim 22, the described priority be wherein associated with described two flexible connections corresponds to the service quality priority be associated with described two flexible connections.

25. radio modems according to claim 22, each carrying voice in wherein said two flexible connections or video call.

26. radio modems according to claim 25, wherein said processor is configured to by stopping being flexibly connected by first the video or voice call that carry, maintain simultaneously and be flexibly connected by another the video or voice call that carry, and the heat called for described two varying levels be flexibly connected alleviates.

27. radio modems according to claim 25, wherein said processor is configured to by stopping waiting answering voice call or subscribing by special speech the calling made and the heat called for the varying levels of described two flexible connections alleviates.

28. radio modems according to claim 25, wherein said processor is configured to the heat called by providing the notice of the potential termination of at least one speech or video call for described two varying levels be flexibly connected and alleviates.

29. radio modems according to claim 20, wherein said processor is configured to:

The type of request is alleviated described in determining; And

30. radio modems according to claim 20, the heat that the flow control that wherein said processor is configured to be flexibly connected by initial is called for described two varying levels be flexibly connected alleviates.

31. radio modems according to claim 20, the heat that wherein said processor is configured to call for described two varying levels be flexibly connected by revising a flow control be flexibly connected alleviates.

32. radio modems according to claim 20, wherein said processor is configured to be alleviated by initial or the heat increased the Power Limitation of the transmitter of described radio modem is called for described two varying levels be flexibly connected.

33. radio modems according to claim 20, wherein:

The heat that described processor is configured to call for described two varying levels be flexibly connected based on the priority be associated with the reservation corresponding to described first and second SIM alleviates.

34. radio modems according to claim 20, wherein said processor is configured to be alleviated by the heat of following operation calls for described two varying levels be flexibly connected:

Identify at least one power amplifier relevant to heat problem; And

35. radio modems according to claim 34, wherein said processor is configured to by identifying that the power amplifier group relevant to described heat problem identifies at least one power amplifier described.

36. radio modems according to claim 35, each in wherein said power amplifier group is arranged in the common thermal region of integrated circuit (IC) apparatus.

37. radio modems according to claim 35, the measured value that wherein said processor is configured to based on being obtained by the thermal sensor be physically located near described power amplifier group identifies at least one power amplifier.

38. radio modems according to claim 34, wherein said processor is configured at least one power amplifier described is associated with the reservation of two SIM Dual Action DSDA device, and wherein said processor is configured to alleviate with the described heat called for described two varying levels be flexibly connected that associates between described reservation based at least one power amplifier described.

39. 1 kinds of equipment for radio communication, it comprises:

For receiving the device alleviating request for radio modem;

For determining the current device whether maintaining one or more and be flexibly connected of described radio modem; And

For alleviating request and the device that calls that the heat of varying level that is flexibly connected for two alleviates when determining the multiple flexible connection of the current maintenance of described modulator-demodular unit in response to described.

40. according to equipment according to claim 39, wherein comprises for alleviating request to be flexibly connected the first level of calling heat relative to first and alleviate in response to described and be flexibly connected the device prevented and call heat and alleviate relative to second for calling the device alleviated for described two heat of varying levels be flexibly connected.

41. according to equipment according to claim 39, and the heat wherein called for described two varying levels be flexibly connected based on the priority be associated with described two flexible connections alleviates.

42. equipment according to claim 41, are wherein assigned to the flexible connection supporting speech or video call by limit priority.

43. equipment according to claim 41, the described priority be wherein associated with described two flexible connections corresponds to the service quality priority be associated with described two flexible connections.

44. equipment according to claim 41, each carrying voice in wherein said two flexible connections or video call.

45. equipment according to claim 44, wherein comprise for alleviating request in response to described and stop being flexibly connected by first the video or voice call that carry and maintaining the device of video or the voice call carried by another flexible connection for calling the device alleviated for described two heat of varying levels be flexibly connected.

46. equipment according to claim 44, are wherein comprised for alleviating request in response to described and stop waiting answering voice call or subscribed the device of the calling made by special speech for calling the device alleviated for described two heat of varying levels be flexibly connected.

47. equipment according to claim 44, wherein comprise for alleviating request in response to described and provide the device of the notice of the potential termination of at least one speech or video call for calling the device alleviated for described two heat of varying levels be flexibly connected.

48. according to equipment according to claim 39, and it comprises further:

For alleviating the device of the type of request described in determining; And

For the device of the limited service pattern at initial described radio modem place when alleviating request described in determining and there is limit priority type.

49. according to equipment according to claim 39, wherein comprises in response to the described device alleviating request and an initial flow control be flexibly connected for calling the device alleviated for described two heat of varying levels be flexibly connected.

50. according to equipment according to claim 39, wherein comprises for alleviating request in response to described and revise the device of the flow control that is flexibly connected for calling the device alleviated for described two heat of varying levels be flexibly connected.

51. according to equipment according to claim 39, wherein comprises in response to described request and the device that is initial or that increase the Power Limitation of the transmitter of described radio modem of alleviating for calling the device alleviated for described two heat of varying levels be flexibly connected.

52. according to equipment according to claim 39, wherein:

53. according to equipment according to claim 39, wherein for call the device alleviated for described two heat of varying levels be flexibly connected comprise for by following operation in response to the described device alleviating request:

Identify at least one power amplifier relevant to heat problem; And

54. equipment according to claim 53, wherein identify at least one power amplifier described in the power amplifier group relevant to described heat problem.

55. equipment according to claim 54, each in wherein said power amplifier group is arranged in the common thermal region of integrated circuit (IC) apparatus.

56. equipment according to claim 54, wherein identify at least one power amplifier described based on the measured value obtained by the thermal sensor be physically located near described power amplifier group.

57. equipment according to claim 53, it comprises the device for making at least one power amplifier described be associated with the reservation of DSDA device further, wherein selects the heat of the described varying level be flexibly connected for described two to alleviate based at least one power amplifier described with described association the between described reservation.

58. 1 kinds of non-transitory processor readable memory mediums, it has one or more instruction stored thereon, and one or more instruction described causes at least one treatment circuit described when being performed by least one treatment circuit:

Receive and alleviate request for radio modem;

59. non-transitory processor readable memory mediums according to claim 58, one or more wherein said stored instruction causes at least one treatment circuit described when being performed by least one treatment circuit:

Call heat relative to the second flexible connection prevention to alleviate.

60. non-transitory processor readable memory mediums according to claim 58, wherein select the heat of the described varying level be flexibly connected for described two to alleviate based on the priority be associated with described two flexible connections.

61. non-transitory processor readable memory mediums according to claim 60, are wherein assigned to the flexible connection supporting speech or video call by limit priority.

62. non-transitory processor readable memory mediums according to claim 60, the described priority be wherein associated with described two flexible connections corresponds to the service quality priority be associated with described two flexible connections.

63. non-transitory processor readable memory mediums according to claim 60, each carrying voice in wherein said two flexible connections or video call.

64. non-transitory processor readable memory mediums according to claim 63, one or more wherein said stored instruction causes at least one treatment circuit described by stopping being flexibly connected by first the video or voice call that carry and maintaining the video that carried by another flexible connection or voice call alleviates request in response to described when being performed by least one treatment circuit.

65. non-transitory processor readable memory mediums according to claim 63, one or more wherein said stored instruction causes at least one treatment circuit described by stopping waiting answering voice call or subscribing by special speech the calling made and alleviate request in response to described when being performed by least one treatment circuit.

66. non-transitory processor readable memory mediums according to claim 63, one or more wherein said stored instruction causes at least one treatment circuit described to alleviate request by providing the notice of the potential termination of at least one speech or video call in response to described when being performed by least one treatment circuit.

67. non-transitory processor readable memory mediums according to claim 58, one or more wherein said stored instruction causes at least one treatment circuit described when being performed by least one treatment circuit:

The type of request is alleviated described in determining; And

68. non-transitory processor readable memory mediums according to claim 58, one or more wherein said stored instruction causes at least one treatment circuit described to alleviate request by initial one flow control be flexibly connected in response to described when being performed by least one treatment circuit.

69. non-transitory processor readable memory mediums according to claim 58, one or more wherein said stored instruction causes at least one treatment circuit described to alleviate request by the flow control in amendment one flexible connection in response to described when being performed by least one treatment circuit.

70. non-transitory processor readable memory mediums according to claim 58, wherein said medium has one or more instruction, and one or more instruction described causes at least one treatment circuit described to alleviate request to the Power Limitation of the transmitter of described radio modem in response to described by initial or increase when being performed by least one treatment circuit.

71. non-transitory processor readable memory mediums according to claim 58, wherein:

Wherein said medium has one or more instruction, and one or more instruction described causes at least one treatment circuit described alleviated by the heat called based on the priority be associated with the reservation corresponding to described first and second SIM for described two varying levels be flexibly connected and alleviate request in response to described when being performed by least one treatment circuit.

72. non-transitory processor readable memory mediums according to claim 58, one or more wherein said stored instruction causes at least one treatment circuit described to alleviate request by following operation in response to described when being performed by least one treatment circuit:

Identify at least one power amplifier relevant to heat problem; And

73. according to the non-transitory processor readable memory medium described in claim 72, and one or more wherein said stored instruction causes at least one treatment circuit described by identifying that the power amplifier group relevant to described heat problem alleviates request in response to described when being performed by least one treatment circuit.

74. according to the non-transitory processor readable memory medium described in claim 73, and each in wherein said power amplifier group is arranged in the common thermal region of integrated circuit (IC) apparatus.

75. according to the non-transitory processor readable memory medium described in claim 73, wherein identifies at least one power amplifier described based on the measured value obtained by the thermal sensor be physically located near described power amplifier group.

76. according to the non-transitory processor readable memory medium described in claim 72, and one or more wherein said stored instruction causes at least one treatment circuit described when being performed by least one treatment circuit:

At least one power amplifier described is associated with the reservation of DSDA device; And

Alleviate with the described heat called for described two varying levels be flexibly connected that associates between described reservation based at least one power amplifier described.