CN105033496A - High-strength and high-conductivity compound lead-free high-temperature solder and preparation method thereof - Google Patents
High-strength and high-conductivity compound lead-free high-temperature solder and preparation method thereof Download PDFInfo
- Publication number
- CN105033496A CN105033496A CN201510388451.1A CN201510388451A CN105033496A CN 105033496 A CN105033496 A CN 105033496A CN 201510388451 A CN201510388451 A CN 201510388451A CN 105033496 A CN105033496 A CN 105033496A
- Authority
- CN
- China
- Prior art keywords
- powder
- solder
- temperature
- free
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to high-strength and high-conductivity compound lead-free high-temperature solder and a preparation method thereof, and belongs to the technical field of lead-free solder manufacturing. The solder is composed of tin-based welding powder, copper alloy powder and paste flux. The tin-based welding powder, the copper alloy powder and the paste flux are weighed first; the tin-based welding powder and the paste flux are put into a container to be evenly stirred; the copper alloy powder is added into the container to continue being stirred till the three components are evenly mixed, and then high-temperature lead-free soldering paste is obtained. By means of the compound solder prepared through the method, the even mixing problem of the three components and the tin paste printing quality problem caused by powder of wide particle size range are effectively solved; the problem that tin-based solder is poor in high temperature resistance after being welded is remarkably solved, and meanwhile the problems that electric conductivity and thermal conductivity are not sufficient and load creep is large after welding can be solved and the problem that holes and cavities are caused by solidifying contraction after welding is effectively solved. The solder can replace existing high-Pb-content high-temperature solder to be used for packaging high-powder third-generation semiconductor discrete devices.
Description
Technical field
The present invention relates to compound lead-free high-temperature solder of a kind of high-strength highly-conductive and preparation method thereof, this solder is composited by uniform stirring by tinbase welding powder, copper alloy powder and weld-aiding cream three kinds of components.Belong to the manufacturing technology field of lead-free solder, particularly lead-free high-temperature soldering paste technology category.
Background technology
Attaching importance to environmental protection, promotion green product are the main trend of current world economy development, and the unleaded of electronic product is exactly a wherein major action.In the unleaded alternative aspect of middle low temperature solder containing pb, research through the more than ten years obtains reliability demonstration, and be widely used, but high kupper solder [w (Pb) >85%] does not but also have suitable substitute so far, therefore obtains temporary transient exemption in RoHS instruction yet.But according to instruction plan: RoHS Directive will phase out exempt item.Such as, exempt and will be removed, will realize the comprehensively unleaded of whole system when the time comes to the lead in 2016 end of the year car load cored solder, high kupper solder, also by replaced, therefore prepares the lead-free product that can be used for alternative vehicle-mounted high kupper solder of good performance significant.
At present four classes such as Au-Sn alloy, Sn-Sb base alloy, Zn-Al base alloy and Bi base alloy are mainly concentrated on to the research of high temperature lead-free solder in alloy material:
1,80Au-Sn solder: the fusing point of Au-Sn eutectic solder is 280 DEG C, the most close with the fusing point of high kupper solder, compatible good, compared with the unleaded eutectic solder of low melting point (about 217 DEG C), there is larger stability and reliability.But this solder is more crisp, and due to Au (w) be that 80% cost is too high, be thus mainly used in optoelectronic packaging, high reliability (as InP laser diode), high-power electronic device circuit level Hermetic Package and chip package.
2, Sn-Sb alloy: due to Sn-Sb [w (Sb)≤10%] alloy melting interval narrower (232 ~ 250 DEG C), and compatible good with existing solder, thus as the candidate material of high temperature lead-free solder.But its fusing point is lower, particularly solder unleaded since because the fusing point of existing lead-free solder is compared with the height (general high 30-40 DEG C) of Sn-Pb eutectic alloy, package temperature can promote to some extent, when causing multistage assembling, subsequent reflow or wave-soldering temperature can exceed its fusing point, and then affect the reliability of packaging, even cause product rejection.
3, Zn-Al alloy: Rettenmayr etc. and Shimizu decile be you can well imagine and replaced 95Pb-5Sn solder with Zn base alloy and realize chip and be connected.But Zn base alloy poor in processability, and be easily oxidized and cause moistening badness, and the greater activity of Zn base alloy also makes soldering reliability to be under suspicion, and therefore limits the application of such alloy to a great extent.
4, Bi base alloy: Bi base alloy is good due to fusing point suitable (about 270 DEG C), filling capacity, is considered to the unleaded candidate solders replacing traditional high Pb solder, as the JP2001-205477 proprietary alloy that Japanese Murata Manufacturing Co. Ltd. announces.Bi-Ag system solder is the Bi base alloy studying at most, under normal temperature, the mutual solubility of Bi and Ag is very little, its eutectic alloy fusing point is 262.5 DEG C, research shows that its percentage elongation is than SnAg25Sb10 (J alloy, fusing point 365 DEG C) not bad, increase the intensity that Ag content can improve Bi-Ag alloy, and the fragility of its alloy can be improved, but less than SnAg25Sb10 alloy generally, and add cost of alloy.
Another kind manufactures composite solder, specifically can be divided into two classes again: additional particle mechanical mixing and reaction in-situ method of formation.
Mechanical mixing be dissolve in solder matrix additional particle as dispersoid thus formed composite soldering.Namely elevate the temperature these dispersoids still old very little solubility in parent.The people such as Lin add TiO in common Sn-Pb solder
2nano combined lead base solder soldering paste is obtained with Cu nanometer powder.In order to relatively uniform reinforcement of disperseing in solder matrix, the people such as Mavoori and Jin developed a coated particle then repeatedly plastic deformation to reach the method for nano particle even dispersion in solder matrix.In this approach, eutectic Sn-37Pb brazing filler metal alloy powder (35 μm) and nano-scale TiO
2(5nm)/Al
2o
3(10nm) powder is by acutely rocking to reach completely discrete in ethanol and to mix with suitable ratio, is then formed the Sn-Pb lotion being coated with and being covered with oxide particle by lasting stirring.The people such as Tsao have studied series in Sn-3.5Ag-0.25Cu and add TiO
2nano particle.Result shows to add 0.25-1wt.%TiO in Sn-Ag-Cu lead-free brazing
2nano particle causes its liquidus temperature and adds 3.5-5.9 DEG C.The metallographic observation display β-Sn crystallite dimension of SAC lead-free brazing and Ag
3sn phase and Ag
3interval between Sn phase reduces.From the viewpoint of mechanical behavior, in SAC lead-free brazing, add the TiO of larger content
2nano particle can improve microhardness, and its extensibility decrease to some degree.The metallic particles of nanoscale and Au join in Sn-Ag base leadless solder by Masazumi, study the growth whether these nano particles can slow down intermetallic compound after four reflow process and long high-temperature aging; Be investigated simultaneously HI high impact draw these nano particles in test whether can reduce intermetallic compound fracture probability.Except the analysis of intermetallic compound, be investigated the impact effect of nano particle to solder drop test performance.Result show: compared with other several element, Co, Ni and Pt to the growth inhibition of intermetallic compound in repeated revert-melt process and the lifting of drop test performance very effective.
In-situ method is the main method that another kind prepares composite soldering, is formed and strengthen nano particle in the process of processing process brazing filler metal alloy itself.Wherein, embedding solder matrix enhancing particle is not from additional reinforcement.The people such as Lee have made one Cu with this in-situ method
6sn
5the composite soldering strengthened.They with the addition of the Cu powder (~ 1 μm) of coating RMA type brazing flux in Sn-3.5Ag eutectic solder, and in argon gas atmosphere, it are placed in Al
2o
3melt in crucible.In order to promote the reaction between Sn and Cu, when temperature is elevated to 573K, machinery is uniformly mixed the fusing solder of Cu powder.Solder keeps one minute in this temperature, then cools fast thus solidification in alcohol.The ingot casting solidified is hot rolled into thin slice, then strikes out disk.Be under the thermograde of 523K in maximum temperature, by disk remelting in the cylindrical chamber of silicone oil.The disk of fusing is formed as the solder ball of diameter 760 μm under capillary effect.By the composite soldering of even dispersion distribution can be obtained in this process.The people such as Hwang have developed a kind of in-situ method preparing composite soldering, and step is as follows: melted in permeable porcelain crucible by pure Sn, Ag, Cu ingot casting under argon gas atmosphere, are then cast in swage by solder mixture.Prepared the solder bar of IMC particle reinforce by rolling cast sheet, then strike out the thin slice that diameter is 1.5mm, form the solder ball of diameter 630 μm finally by hot oil bath.The initial IMC dendroid dendrite formed in solder matrix in casting cycle can be crushed to as good particle in plasticity work, and therefore after rolling, IMC particle can even dispersion distribution in solder matrix.
United States Patent (USP) 6,360,939B1 discloses a kind of method of the lead-free solder paste manufactured in electronics industry, this soldering paste has a basic solder powder and infusible interpolation metal powder constituent in welding process, add powder fusing point higher than the fusing point of basic solder powder a lot, basic solder powder comprises the Ag of Sn and 1-20% of 80-90%, adds powdered-metal and is selected from the metal constituent element comprising Sn, Ni, Cu, Ag and Bi and other mixtures; The researcher of Akron university of the U.S. significantly improves Joint Strength by the nano particle adding copper or titanium oxide in Sn-Pb solder; IBM Corporation is then by adding molybdenum and tantalum nano particle has prepared composite solder, and Chinese patent CN1672858A discloses the tin-silver solder containing memory alloy particle; Chinese patent CN1672859A discloses containing nano zircite granule enhancement type tin-silver solder and method for making thereof; And composite solder two kinds of components in welding process that US Patent No. 2002/0040624A1 and CN1732063A announces are all molten state, require that the fusing point difference of two components in solder is less than 15 DEG C.
In composite solder, whether different component fusing (dissolving) not only depends on that the fusing point between the different component that composite solder itself comprises is poor, and closely bound up with infiltration spread coefficient mutual between different component and process window when welding etc.Above-mentioned research and patent report, in all not mentioned composite solder, the matching of the pattern of different component powder, grain size specification and Size Distribution is on the impact of solder, the impact of the electric heating property at the different component interphase interaction in welding process and postwelding composite solder interface existing forms butt welding point (or weld seam); The high heat-conductivity conducting particle suitable with Size Distribution to the specification of adding vast scale in high-temperature solder system matrix rarely has report especially; Particularly, solder is as a kind of special functional material, it in use needs to melt and solidification and crystallization process again, this seems particularly important to composite solder system, and solidification shrinkage and cavity and expanding with heat and contract with cold in high-temperature service process thereof due to solder postwelding are the keys causing non-fully fusing system composite solder to be difficult to practical application in industry.
Summary of the invention
The object of the invention is to provide compound lead-free high-temperature solder of a kind of high-strength highly-conductive and preparation method thereof, in welding process, refractory metal particle in solder is reacted with periphery low melting point ingredient in situ and forms high-melting-point IMC, consume inner low-melting component simultaneously, thus significantly improve the temperature resistant capability of Sn-Sb or Sn-Bi bianry alloy postwelding, the solder joint making it be formed has higher remelting temperature, improves the fatigability of resistance to temperature and resistance to temperature impact.Realize the high temperature application of solder, substitute traditional high Pb alloy and high cost Au-Sn alloy.Meanwhile, for the ease of tin cream printing use and mechanical recombination process in uniformity controlling, the different powder in composite solder have employed particle size and Size Distribution mates two kinds of suitable components.
In the low cold-shrink type of employing of the invention or cold expanding mold base welding powder, coupling adds high heat conduction, the conducting particles of one-size and specification, increases to what reduce defect in composite solder that normally used kamash alloy (as Sn-Cu or Sn-Ag-Cu) solidification shrinkage amount larger in postwelding process of setting causes the inefficacy caused because expanding with heat and contract with cold under phenomenon and postwelding temperature are on active service.The high-temperature metal particle of the high connductivity/heat conduction containing larger proportion unique in high-temperature solder of the present invention, can suppress when weld job to cave in and bridging, postwelding serves as skeleton and conduction/passage of heat (copper core); In solder, low-melting component penetrates in copper core gap by capillarity and forms fine and close flawless solder joint simultaneously, and rely on reaction in-situ, consume low-melting alloy composition in composite solder interface, improve Joint Strength and postwelding resistance to elevated temperatures, to meet the use of its high temperature application scenario.
The present invention takes following technical scheme:
The compound lead-free high-temperature solder of a kind of high-strength highly-conductive, this solder by tinbase welding powder, copper alloy powder, and weld-aiding cream three kinds of components compositions.
Described tinbase welding powder is the general welding powder of Sn-Bi system or Sn-Sb system, and such tinbase welding powder has a common feature and belongs to low cold-shrink type or cold expanding shaped material exactly.
Described Sn-Bi system welding powder is Sn-Bi system eutectic alloy or hypereutectic alloy welding powder.
Described tinbase welding powder comprises SnBi58, SnBi57Ag1, SnSb5, SnSb10 and SnSb10Ni0.5 welding powder etc.
In described copper alloy powder, the weight content of copper is 80%-100%.Preferably, described copper alloy powder is pure Cu powder or Cu-Sn powder (Cu >=80%); Described Cu-Sn powder is CuSn10 powder or CuSn20 powder.The feature of such metal powder has high connductivity, thermal conductivity.
In the compound lead-free high-temperature solder of described high-strength highly-conductive, the powder morphology of tinbase welding powder and copper alloy powder two kinds of metal components, grain size specification and Size Distribution are close.Preferably, tinbase welding powder and copper alloy powder are spherical powder or subsphaeroidal powder, and grain size distribution is identical.
In the compound lead-free high-temperature solder of described high-strength highly-conductive, the part by weight that the ratio of component meets tinbase welding powder and copper alloy powder is 20:1 ~ 2:1, and weld-aiding cream accounts for the 10-12wt% of total solder weight.
The preparation method of the compound lead-free high-temperature solder of above-mentioned high-strength highly-conductive, its preparation process comprises the steps:
1) prepare burden: take tinbase welding powder, copper alloy powder, weld-aiding cream;
2) tinbase welding powder and weld-aiding cream are placed in container to stir;
3) copper alloy powder is added in container to continue to be stirred to three kinds of components even, namely obtain high-temp leadless soldering paste, store for subsequent use.
Beneficial effect: solder based on Sn-Sb or the Sn-Bi solder adopting low cold-shrink type or cold expanding type, what decrease defect in the composite solder that normally used kamash alloy (as Sn-Cu or Sn-Ag-Cu) solidification shrinkage amount larger in postwelding process of setting causes increases phenomenon, promotes weld point temperature cycle life.Cu or the Cu-Sn high-temperature metal particle with high heat conduction, conductive features simultaneously added, played the advantage of different component in composite solder, can suppress to cave in and bridging when weld job, postwelding serves as skeleton and conduction/passage of heat; And low melting point composition penetrates into around copper core by capillarity and forms fine and close flawless solder joint in gap in solder, and rely on reaction in-situ, low-melting alloy composition is consumed in composite solder interface, form continuous print high temperature skeleton simultaneously, improve Joint Strength and postwelding resistance to elevated temperatures, the use of its high temperature application scenario can be met.
Below by drawings and Examples, the present invention is described in detail.It should be understood that described embodiment only relates to the preferred embodiments of the invention, do not departing from the spirit and scope of the present invention situation, the changes and improvements of various component and content are all possible.
Accompanying drawing explanation
Fig. 1 is preparation technology's flow chart of the compound lead-free high-temperature solder of high-strength highly-conductive of the present invention.
Fig. 2 A and Fig. 2 B is respectively the metallograph of the front schematic diagram of high-strength highly-conductive of the present invention compound lead-free high-temperature solder backflow and the rear solder joint of backflow.
Before Fig. 3 A and Fig. 3 B is respectively the compound lead-free high-temperature solder Reflow Soldering of high-strength highly-conductive of the present invention, the DSC test curve of solder is tested with the rear solder DSC curve of backflow.
Fig. 4 is the stretching resistance curve plotting of the compound lead-free high-temperature solder of high-strength highly-conductive of different component of the present invention.
Detailed description of the invention
As shown in Figure 1, be preparation technology's flow process of the compound lead-free high-temperature solder of high-strength highly-conductive of the present invention, stir after tinbase welding powder and weld-aiding cream mixing, add copper alloy powder, continue to stir, obtain high-temp leadless soldering paste.Concrete preparation process comprises the steps: 1) batching, that is, take tinbase welding powder, a certain proportion of copper alloy powder (100% >=Cu >=80%), a certain proportion of weld-aiding cream; 2) tinbase welding powder and a certain proportion of weld-aiding cream are placed in container to stir; 3) copper alloy powder is evenly imported in stirred vessel to continue to be stirred to three kinds of components even; 4) prepare high-temp leadless soldering paste, store for subsequent use.
The preparation of the compound lead-free high-temperature solder of embodiment 1T3 type SnSb10Ni0.5+CuSn20 high-strength highly-conductive:
1) SnSb10Ni0.5 conventional T3 type (25-45 μm) high temperature welding powder, granularity is taken respectively at the CuSn20 powder of 25-45 μm and general high temperature weld-aiding cream; The weight ratio of SnSb10Ni0.5 conventional T3 type (25-45 μm) high temperature welding powder, CuSn20 powder is 20:1, and please refer to the embodiment 1 in table 1, general high temperature weld-aiding cream accounts for the 10w% of solder gross weight;
2) conventional T3 type (25-45 μm) the high temperature welding powder of SnSb10Ni0.5 and general high temperature weld-aiding cream are placed in tin cream stirred tank, SnSb10Ni0.5 powder and weld-aiding cream are stirred into homogeneous lotion;
3) in above-mentioned lotion, slowly add CuSn20 powder, and continue to stir 5min twice, intermediate hold is once cleared up stirred tank wall and is adhered to;
4) soldering paste is poured in solder paste cartridge, namely obtain: T3 type SnSb10Ni0.5:CuSn20=20:1, weld-aiding cream ratio are the compound lead-free high-temperature solder of high-strength highly-conductive of 10wt%, put into refrigerator and are in store for.
The preparation of the compound lead-free high-temperature solder of embodiment 2T4 type SnSb10Ni0.5+CuSn20 high-strength highly-conductive:
1) SnSb10Ni0.5 conventional T4 type (20-38 μm) high temperature welding powder, granularity is taken respectively at the CuSn20 powder of 20-38 μm and general high temperature weld-aiding cream; The weight ratio of SnSb10Ni0.5 conventional T4 type (20-38 μm) high temperature welding powder, CuSn20 powder is with reference to the embodiment 2 in table 1, and be 2:1, general high temperature weld-aiding cream accounts for the 10w% of solder gross weight;
2) conventional T4 type (20-38 μm) the high temperature welding powder of SnSb10Ni0.5 and general high temperature weld-aiding cream are placed in tin cream stirred tank, SnSb10Ni0.5 powder and weld-aiding cream are stirred into homogeneous lotion;
3) in above-mentioned lotion, slowly add CuSn20 powder, and continue to stir 5min twice, intermediate hold is once cleared up stirred tank wall and is adhered to;
4) soldering paste is poured in solder paste cartridge, namely obtain: T4 type SnSb10Ni0.5:CuSn20=2:1, weld-aiding cream ratio are the compound lead-free high-temperature solder of high-strength highly-conductive of 10wt%, put into refrigerator and are in store for.
The preparation of embodiment 3-4T5 or the compound lead-free high-temperature solder of T6 type SnSb10Ni0.5+CuSn10 high-strength highly-conductive:
Be 10:1 and 5:1 (embodiment 3 and 4 in table 1) according to the weight ratio of the CuSn10 powder (granularity is respectively 15-25 μm or 5-15 μm) of conventional T5 type (15-25 μm) of SnSb10Ni0.5 or T6 type (5-15 μm) high temperature welding powder, same particle size Size Distribution respectively, general high temperature weld-aiding cream accounts for the 10w% of solder gross weight, takes raw material; Other preparation process, with reference to embodiment 1, obtains: T5 type SnSb10Ni0.5:CuSn20=10:1 or T6 type SnSb10Ni0.5:CuSn20=5:1, weld-aiding cream ratio are the compound lead-free high-temperature solder of high-strength highly-conductive of 10wt%.
The compound lead-free high-temperature solder of typical high-strength highly-conductive that table 1 is prepared for embodiment 1-4 compares with contrast solder performance.Can be seen by table 1, the thermal conductivity of solder of the present invention is apparently higher than contrast solder, and the thermal conductivity of embodiment 1-4 solder is 50-81W/mK, and the thermal conductivity contrasting solder is only 9-38W/mK.
Table 1 exemplary complex lead-free high-temperature solder and contrast solder performance
Embodiment 5-28
With reference to two kinds of metal dust granularities and part by weight in the composite solder of embodiment 5-28 in table 2, take tinbase welding powder, copper powder or Cu-Sn alloyed powder respectively, account for the general high temperature weld-aiding cream of total solder weight 10w%; Tinbase welding powder and weld-aiding cream are placed in container stir; Copper powder or Cu-Sn alloyed powder are evenly added in container to continue to be stirred to three kinds of components even; Prepare high-temp leadless soldering paste, store for subsequent use.
The component of the compound lead-free high-temperature solder of high-strength highly-conductive that table 2 is representative instance of the present invention and application of temperature thereof.Can be seen by table 2, the welding temperature of the compound lead-free high-temperature solder of high-strength highly-conductive of the present invention is 180-300 DEG C, solder joint heat-resisting ability > 260 DEG C.The equal requirement that can meet the anti-secondary back of solder joint (general Electronic Assemblies secondary back temperature is lower than 260 DEG C).
Metal component coupling and welding temperature in the typical compound lead-free high-temperature solder of high-strength highly-conductive of table 2
As shown in Figure 2 A and 2 B, the metallograph of the front schematic diagram of the embodiment of the present invention 1 high-strength highly-conductive compound lead-free high-temperature solder backflow and the rear solder joint of backflow is respectively.
As can be seen from metallograph:
(1) there is IMC layer between Cu-Sn on copper particle and tin solder border, and thickness is about 1-2 μm, and boundary is similar to acanthosphere shape (cluster-shaped), Fusion Strain just with expection perfect condition;
(2) particle size of acanthosphere be 30-40 μm suitable with the copper powders granularity of adding in composite solder, excessively fusion (that is, remaining copper core) is described not, has also confirmed expection further, namely can form good solder joint.The copper alloy particles distributed in " cluster-shaped ", can form penetrating via in one direction, promotes alloy heat conduction/conductive capability; In tissue, the rich Sn phase of continuous print disappears, discrete is filled in Cu skeleton, gap between boundary layer and SnSb phase, and this is also the basic reason of such solder heat-resisting ability > 260 DEG C.
(3) the same about 1-2 μm of the IMC layer thickness between composite solder with Cu substrate, illustrates that the welding procedure adopted is more satisfactory.
As shown in Figure 3 A and Figure 3 B, before being respectively the compound lead-free high-temperature solder Reflow Soldering of the embodiment of the present invention 2 high-strength highly-conductive, the DSC test curve of solder is tested with the rear solder DSC curve of backflow.Therefrom can find out: before backflow, composite solder has obvious endothermic peak below 300 DEG C, illustrate and namely melting phenomenon occurs below 300 DEG C, and the low temperature endothermic peak of solder (i.e. welding after) after backflow is not obvious, illustrate that its heat-resisting ability obviously promotes.
As shown in Figure 4, the stretching resistance curve plotting of the compound lead-free high-temperature solder of the high-strength highly-conductive for different component of the present invention and typical comparison's solder, is from left to right respectively SnSb10Ni0.5, SnSb10Ni0.5+5%CuSn20, SnSb10Ni0.5+15%CuSn20, SnSb10Ni0.5+20%CuSn20, SnSb10Ni0.5+25%CuSn20, SnSb10Ni0.5+30%CuSn20, SnPb92.5Ag2.5 solder.Can find out that the solder bond intensity of the compound lead-free high-temperature solder of the present invention's series high-strength highly-conductive is all higher than Sn5Pb92.5Ag2.5 high-temperature solder general at present from stretching resistance test result.
The compound lead-free high-temperature solder of high-strength highly-conductive of the present invention is led copper powder or Cu-Sn alloyed powder and a certain proportion of high temperature weld-aiding cream be composited by the tinbase welding powder of low-shrinkage, height that a certain proportion of granularity is suitable.Its preparation process first takes tinbase welding powder and requires the weld-aiding cream of ratio and be placed in the container with agitating device, then in its whipping process, the copper powder of quantitative proportioning or Cu-Sn alloyed powder are evenly imported wherein, form the even complex of tinbase powder-copper powder or Cu-Sn alloyed powder-weld-aiding cream three kinds of components, composite solder prepared by the method efficiently solves the paste solder printing quality problems that the Homogeneous phase mixing problem of three kinds of components and wide particle size range powder bring.This solder to utilize in composite solder interface reaction in-situ between two kinds of different powder to consume low-melting component, the remarkable heat-resisting quantity difference difficult problem improving tin solder postwelding, high particle of leading can improve the problems such as postwelding conduction/thermal conductivity deficiency and heavy load creep simultaneously, and by hole/empty problem that the postwelding solidification shrinkage that material is selected and ratio optimization effectively alleviates composite causes, the high-temperature solder of alternative existing high Pb content is used for the encapsulation of high-power third generation semi-conductor discrete device.
Claims (10)
1. the compound lead-free high-temperature solder of high-strength highly-conductive, is characterized in that: this solder is made up of tinbase welding powder, copper alloy powder and weld-aiding cream.
2. the compound lead-free high-temperature solder of high-strength highly-conductive according to claim 1, is characterized in that: described tinbase welding powder is Sn-Bi system or Sn-Sb system welding powder.
3. the compound lead-free high-temperature solder of high-strength highly-conductive according to claim 2, is characterized in that: described Sn-Bi system welding powder is Sn-Bi system eutectic alloy or hypereutectic alloy welding powder.
4. the compound lead-free high-temperature solder of high-strength highly-conductive according to claim 2, is characterized in that: described tinbase welding powder is SnBi58, SnBi57Ag1, SnSb5, SnSb10 or SnSb10Ni0.5 welding powder.
5. the compound lead-free high-temperature solder of high-strength highly-conductive according to claim 1, is characterized in that: in described copper alloy powder, and the weight content of copper is 80%-100%.
6. the compound lead-free high-temperature solder of high-strength highly-conductive according to claim 5, is characterized in that: described copper alloy powder is Cu powder or Cu-Sn powder.
7. the compound lead-free high-temperature solder of high-strength highly-conductive according to claim 6, is characterized in that: described Cu-Sn powder is CuSn10 powder or CuSn20 powder.
8. the compound lead-free high-temperature solder of high-strength highly-conductive according to claim 1, is characterized in that: described tinbase welding powder and copper alloy powder are spherical powder or subsphaeroidal powder, and grain size distribution is identical.
9. the compound lead-free high-temperature solder of high-strength highly-conductive according to claim 1, is characterized in that: described tinbase welding powder and the weight ratio of copper alloy powder are 20:1 ~ 2:1, and described weld-aiding cream is the 10-12wt% of total solder weight.
10. the preparation method of the compound lead-free high-temperature solder of the high-strength highly-conductive according to any one of claim 1-9, comprises the steps:
1) prepare burden: take tinbase welding powder, copper alloy powder, weld-aiding cream;
2) tinbase welding powder and weld-aiding cream are placed in container to stir;
3) copper alloy powder is added in container to continue to be stirred to three kinds of components even, namely obtain high-temp leadless soldering paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510388451.1A CN105033496B (en) | 2015-07-03 | 2015-07-03 | A kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510388451.1A CN105033496B (en) | 2015-07-03 | 2015-07-03 | A kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105033496A true CN105033496A (en) | 2015-11-11 |
| CN105033496B CN105033496B (en) | 2018-01-09 |
Family
ID=54440774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510388451.1A Active CN105033496B (en) | 2015-07-03 | 2015-07-03 | A kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105033496B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108927609A (en) * | 2018-08-13 | 2018-12-04 | 深圳市亿铖达工业有限公司 | A kind of preparation method of compound lead-free tin cream |
| CN111902238A (en) * | 2018-03-30 | 2020-11-06 | 千住金属工业株式会社 | Solder paste |
| CN113231757A (en) * | 2021-06-22 | 2021-08-10 | 内蒙古玉桥合金材料制造有限公司 | Tin-based soldering paste and preparation method thereof |
| CN117548897A (en) * | 2023-11-27 | 2024-02-13 | 北京理工大学 | Solid solution strengthening solder and preparation method of high-reliability interconnection joint thereof |
| CN118081175A (en) * | 2024-04-10 | 2024-05-28 | 宁波耐森电气科技有限公司 | Induction low-temperature brazing solder paste, sealing method and device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020040624A1 (en) * | 2000-10-05 | 2002-04-11 | Sinzo Nakamura | Solder paste |
| CN101069938A (en) * | 2006-05-10 | 2007-11-14 | 北京有色金属研究总院 | Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use |
| CN101362261A (en) * | 2007-08-10 | 2009-02-11 | 北京康普锡威焊料有限公司 | Low temperature leadless welding material for electronic component |
| WO2010051106A2 (en) * | 2008-09-12 | 2010-05-06 | Arizona Board of Regents, a body corporate acting for and on behalf of Arizona State University | Methods for attaching flexible substrates to rigid carriers and resulting devices |
| CN102282918A (en) * | 2010-02-25 | 2011-12-14 | 松下电器产业株式会社 | Wiring substrate, method for producing wiring substrate, and via paste |
| CN102896439A (en) * | 2011-07-28 | 2013-01-30 | 北京有色金属研究总院 | Sn-Sb-X high-temperature lead-free solder |
| CN102896435A (en) * | 2011-07-28 | 2013-01-30 | 北京有色金属研究总院 | In-suit reaction type high-temperature lead-free solder paste |
| CN104625466A (en) * | 2015-01-21 | 2015-05-20 | 哈尔滨工业大学深圳研究生院 | Tin-radical welding flux/copper particle composite welding flux capable of forming high-temperature welding spots rapidly at low temperature |
-
2015
- 2015-07-03 CN CN201510388451.1A patent/CN105033496B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020040624A1 (en) * | 2000-10-05 | 2002-04-11 | Sinzo Nakamura | Solder paste |
| CN101069938A (en) * | 2006-05-10 | 2007-11-14 | 北京有色金属研究总院 | Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use |
| CN101362261A (en) * | 2007-08-10 | 2009-02-11 | 北京康普锡威焊料有限公司 | Low temperature leadless welding material for electronic component |
| WO2010051106A2 (en) * | 2008-09-12 | 2010-05-06 | Arizona Board of Regents, a body corporate acting for and on behalf of Arizona State University | Methods for attaching flexible substrates to rigid carriers and resulting devices |
| CN102282918A (en) * | 2010-02-25 | 2011-12-14 | 松下电器产业株式会社 | Wiring substrate, method for producing wiring substrate, and via paste |
| CN102896439A (en) * | 2011-07-28 | 2013-01-30 | 北京有色金属研究总院 | Sn-Sb-X high-temperature lead-free solder |
| CN102896435A (en) * | 2011-07-28 | 2013-01-30 | 北京有色金属研究总院 | In-suit reaction type high-temperature lead-free solder paste |
| CN104625466A (en) * | 2015-01-21 | 2015-05-20 | 哈尔滨工业大学深圳研究生院 | Tin-radical welding flux/copper particle composite welding flux capable of forming high-temperature welding spots rapidly at low temperature |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111902238A (en) * | 2018-03-30 | 2020-11-06 | 千住金属工业株式会社 | Solder paste |
| US11633815B2 (en) | 2018-03-30 | 2023-04-25 | Senju Metal Industry Co., Ltd. | Solder paste |
| CN108927609A (en) * | 2018-08-13 | 2018-12-04 | 深圳市亿铖达工业有限公司 | A kind of preparation method of compound lead-free tin cream |
| CN108927609B (en) * | 2018-08-13 | 2020-08-07 | 深圳市亿铖达工业有限公司 | Preparation method of composite lead-free solder paste |
| CN113231757A (en) * | 2021-06-22 | 2021-08-10 | 内蒙古玉桥合金材料制造有限公司 | Tin-based soldering paste and preparation method thereof |
| CN117548897A (en) * | 2023-11-27 | 2024-02-13 | 北京理工大学 | Solid solution strengthening solder and preparation method of high-reliability interconnection joint thereof |
| CN118081175A (en) * | 2024-04-10 | 2024-05-28 | 宁波耐森电气科技有限公司 | Induction low-temperature brazing solder paste, sealing method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105033496B (en) | 2018-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6912519B2 (en) | Solder composition | |
| JP5067163B2 (en) | Solder paste and solder joint | |
| JP5324007B1 (en) | Solder alloy, solder paste and electronic circuit board | |
| JP5238088B1 (en) | Solder alloy, solder paste and electronic circuit board | |
| CN105033496B (en) | A kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof | |
| JP4826630B2 (en) | Solder paste | |
| CN100462183C (en) | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method | |
| CN100537117C (en) | Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use | |
| CN101239425A (en) | Leadless high-temperature electronic solder and preparation | |
| CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
| CN108465973A (en) | A kind of unleaded medium temperature solder(ing) paste and preparation method thereof | |
| JP2014193473A (en) | Solder powder and paste for solder using the same | |
| JP2010029868A (en) | Lead-free solder paste, electronic circuit board using the same, and method for manufacturing the same | |
| TWI695893B (en) | Solder paste | |
| CN107538149B (en) | A kind of Sn-Cu-Co-Ni lead-free solder and preparation method thereof | |
| JP2003245793A (en) | Soldering composition, soldering method, and electronic component | |
| CN109082559A (en) | A kind of low silver-colored high-reliability lead-free solder alloy of SnAgCuNiGeCe | |
| JP2006000909A (en) | Soldering material, and electronic component soldered by the same | |
| JP2017070959A (en) | Au-Sb-Sn SOLDER PASTE | |
| JP2014221484A (en) | Pb-FREE Zn-BASED SOLDER PASTE | |
| CN114571137A (en) | Copper-based brazing paste, copper-based pre-alloy and preparation method thereof | |
| Liu et al. | Effect of laser input energy on AuSnx intermetallic compounds formation in solder joints with different thickness of Au surface finish on pads |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |