CN105023865B - One kind grinding crystal column surface corrosion device - Google Patents

One kind grinding crystal column surface corrosion device Download PDF

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Publication number
CN105023865B
CN105023865B CN201510420064.1A CN201510420064A CN105023865B CN 105023865 B CN105023865 B CN 105023865B CN 201510420064 A CN201510420064 A CN 201510420064A CN 105023865 B CN105023865 B CN 105023865B
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CN
China
Prior art keywords
sucker
fixing bolt
sucker stand
guide rail
clear water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201510420064.1A
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Chinese (zh)
Other versions
CN105023865A (en
Inventor
秦飞
孙敬龙
安彤
陈沛
宇慧平
王仲康
唐亮
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Beijing University of Technology
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Beijing University of Technology
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Publication date
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Priority to CN201510420064.1A priority Critical patent/CN105023865B/en
Publication of CN105023865A publication Critical patent/CN105023865A/en
Application granted granted Critical
Publication of CN105023865B publication Critical patent/CN105023865B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604Chemical etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

A kind of large scale is ground crystal column surface corrosion device, belongs to semiconductor manufacturing facility technical field, its is simple in construction, easy to operate.Including:Leg, accumulator tank, sucker stand, sucker, liquid bearing part.Accumulator tank is provided with guide rail, vacuum switch, discard solution discharge port;Vacuum lead is set in sucker stand;Liquid bearing part includes:Sliding block, pillar, crossbeam, guide rail beam, movable plate, acid solution containing tank, clear water containing tank, discharge opeing control valve door, liquid containing tank fixing bolt.The present invention can be accurately positioned and corrode to grinding crystal column surface optional position, compared with manual hand manipulation, more convenient efficient, while avoiding artificial manual operations by the danger corroded.

Description

One kind grinding crystal column surface corrosion device
Technical field
It is specially a kind of grinding crystal column surface corrosion device the present invention relates to semiconductor processing equipment technical field.
Background technology
Electronic Encapsulating Technology, which is continued to develop, promotes Electronic Packaging product gradually to be sent out to thin, small, light and highly integrated direction Exhibition.Silicon Wafer, to meet package thickness requirement, needs that wafer is thinned as the base material of Electronic Packaging before encapsulation.By Turn grinding technique in low damage, efficient advantage wafer spin has turned into main flow skilled worker's technology that wafer is ground.However, mechanical Grinding will cause into crystal column surface damage and produce residual stress, and residual stress makes wafer produce buckling deformation or even rupture, because This measurement and sign to grinding residual stress is crucial.Residual stress exists in the range of crystal column surface layer certain depth, mesh The main cutting crystal wafer of the preceding test to sub-surface residual stress makes cross-section samples, then detection sectional plane residual stress.However, this Method can introduce new cutting stress while dischargeing part grinding residual stress.Chemical solution substep etch combination Raman light Spectrum can more accurately obtain the residual-stress value of different depth, but because wafer size is larger, manually corrode relatively complicated, Other corrosive liquid has strong corrosivity, if splashing human body occurs dangerous situation.Accordingly, it would be desirable to which a kind of special device is improved Corrosion efficiency, it is to avoid the generation of dangerous situation.
The content of the invention
The present invention proposes a kind of grinding crystal column surface corrosion device, can be by adjusting sliding feet and sliding beam to crystal column surface Treat that corrosion sites are positioned, fast erosion, experimentation need to only transfer the discharge opeing control valve door i.e. achievable corrosion to wafer And cleaning, it is safe and reliable.
The present invention is adopted the following technical scheme that:
One kind grinding crystal column surface corrosion device, it is characterised in that:Including:Leg, recovery slot part, sucker stand portion Point, sucker and liquid bearing part;The leg 101 is connected by leg fixing bolt 404 with accumulator tank 102;The accumulator tank Part includes:Guide rail 103, bail 206, vacuum switch 401, discard solution discharge port 201, discard solution discharge port fixing bolt 402, Pipeline opening 202, pipeline opening fixing bolt;Guide rail 103 is located at the top both sides symmetric position of accumulator tank 102;The end of guide rail 103 is provided with The limit slippage pin 205 of bail 206 de-orbits;Vacuum switch 401, discard solution discharge port 201, pipeline opening 202, which are located at, to be reclaimed The bottom of groove 102, the control sucker 105 of vacuum switch 401 is vacuumized, and discard solution discharge port fixing bolt 402 is by discard solution discharge port 201 are fixed on accumulator tank 102, the fixing pipe road junction 202 of pipeline opening fixing bolt 403;The sucker stand part includes:Sucker branch Frame base 704, sucker stand base screw 705, sucker stand post 703, sucker stand cushion cap 104, sucker stand cushion cap screw, The inside of sucker stand post 703 is provided with hollow pipeline 702;Sucker stand base 704 is connected with the bottom center region of accumulator tank 102, Sucker stand base screw 705 aligns with the screw of accumulator tank 102, the connecting sucker bracket base 704 of sucker stand post 703 and sucker Support cushion cap 104, sucker stand post 703 sets the chamber of pipeline 702 and sucker, sucker 105 and sucker stand cushion cap 104 Consolidated by bolt;Liquid bearing part includes:Pillar 106, crossbeam 107, crossbeam fixing bolt 108, guide rail beam fixing bolt 109th, guide rail beam 110, acid solution containing tank 111, acid solution containing tank fixing bolt 903, clear water containing tank fixing bolt 902, clear water Containing tank 112, sliding feet 205, drip nozzle 207, drip nozzle fixing bolt 901, discharge opeing control valve door 301, sliding beam 302, clear water row Outlet 1001, acid solution outlet 1002;Sliding feet 205 is consolidated with pillar 106, and pillar 106 fixes spiral shell with crossbeam 107 by crossbeam Bolt 108 is connected, and crossbeam 107 is connected with guide rail beam 110 by guide rail beam fixing bolt 109, acid solution containing tank 111 and clear water containing tank 112 are bolted with sliding beam 302, and discharge opeing control valve door 301 controls acid solution and clear water discharge.
Further, there is sealing gasket between sucker 105 and sucker stand cushion cap 104.
Further, discharge opeing control valve door (301) control clear water outlet 1001, acid solution outlet 1002 one of them with drop Mouth 207 is connected, or is turned off both.
Further, drip nozzle 207 is located at the center of sliding beam 302.
The present invention can obtain following beneficial effect:
1st, the present invention can treat that corrosion sites are positioned by adjusting sliding feet and sliding beam to crystal column surface, quick rotten Erosion.
2nd, the present invention need to only transfer discharge opeing control valve door i.e. achievable corrosion and cleaning to wafer, it is to avoid manually grasp Make situation about causing danger.
3rd, the present invention is simple in construction, easy to use, safe and reliable.
Brief description of the drawings:
Fig. 1 is overall structure diagram of the present invention.
Fig. 2 is side structure schematic view of the present invention.
Fig. 3 is top structure schematic diagram of the present invention.
Fig. 4 is polycrystalline substance schematic diagram of the present invention.
Fig. 5 reclaims slot structure schematic diagram for the present invention.
Fig. 6 is accumulator tank cross-sectional view of the present invention.
Fig. 7 is sucker stand structural representation of the present invention.
Fig. 8 is fluid present invention bearing part structural representation.
Fig. 9 is fluid present invention bearing part bottom surface structure schematic diagram.
Figure 10 is fluid present invention bearing part cross-sectional view.
In figure:
101-leg, 102-accumulator tank, 103-guide rail, 104-sucker stand, 105-sucker, 106-pillar, 107-crossbeam, 108-crossbeam fixing bolt, 109-guide rail fixing bolt, 110-guide rail beam, 111-acid solution containing tank, 112-clear water containing tank, 201-discard solution discharge port, 202-pipeline opening, 203-alignment pin, 204-sucker fixing bolt, 205-sliding feet, 206-bail, 207-drip nozzle, 301-discharge opeing control valve door, 302-sliding beam, 401-vacuum control is opened Close, 402-discard solution discharge port fixing bolt, 403-pipeline opening fixing bolt, 404-leg fixing bolt, 601-control flume, 701-sucker stand cushion cap screw, 702-pipeline, 703-sucker stand post, 704-sucker stand base, 705-sucker branch Frame base screw, 901-drip nozzle fixing bolt, 902-clear water containing tank fixing bolt, 903-acid solution containing tank fixing bolt, 1001-clear water outlet, 1002-acid solution outlet, 1003-control flume.
Embodiment:
The present invention is described in detail below in conjunction with the accompanying drawings:
Fig. 1 is overall structure diagram of the present invention, and Fig. 2 is side structure schematic view of the present invention, and Fig. 3 ties for present invention top Structure schematic diagram, Fig. 4 is polycrystalline substance schematic diagram of the present invention;Leg 101 is connected by leg fixing bolt 404 with accumulator tank 102, real When testing, support device can be fixed.The recovery slot part includes:Guide rail 103, bail 206, vacuum switch 401, Discard solution discharge port 201, discard solution discharge port fixing bolt 402, pipeline opening 202, pipeline opening fixing bolt 403.Guide rail 103 can be by machine Tool turning is obtained, and is located at the top both sides symmetric position of accumulator tank 102;The end of guide rail 103 is provided with bail 206 with limit slippage pin 205 in order to avoid sliding feet 205 de-orbits;Vacuum switch 401, discard solution discharge port 201, pipeline opening 202 are located at accumulator tank 102 Bottom;Vacuum switch 401 controls the vacuum of sucker 105;Discard solution discharge port fixing bolt 402 is by discard solution discharge port 201 are fixed on the bottom of accumulator tank 102, and discard solution discharge port 201 is connected with exterior line drains waste liquid;Pipeline opening fixing bolt 403 Fixing pipe road junction 202, pipeline opening 202 is connected by pipeline with vavuum pump.
Fig. 5 reclaims slot structure schematic diagram for the present invention, and Fig. 6 is accumulator tank cross-sectional view of the present invention;Accumulator tank 201 Middle part is provided with devil liquor recovery groove, and waste liquid is discharged by the discard solution discharge port 201 of groove bottom, and vacuum switch 401 is located at control In groove 601 processed, control flume 601 can be obtained by mechanical tapping mode, and the end diameter of vacuum switch 401 and control flume 601 are straight Footpath is identical and more than the diameter of pipeline opening 202.
Fig. 7 is sucker stand structural representation of the present invention, including:Sucker stand base 704, sucker stand base screw 705th, during sucker stand post 703, sucker stand cushion cap 104, sucker stand cushion cap screw 701, the inside of sucker stand post 703 are provided with Vacant duct 702;Sucker stand base 704 is connected with the bottom center region of accumulator tank 102, and sucker stand base screw 705 is with returning Receive the alignment of the screw of groove 102, the connecting sucker bracket base 704 of sucker stand post 703 and sucker stand cushion cap 104, sucker stand post 703 set the chamber of pipelines 702 and sucker, and sucker 105 is consolidated with sucker stand cushion cap 104 by bolt, sucker 105 and Sealing gasket is provided between sucker stand cushion cap 104.
Fig. 8 is fluid present invention bearing part structural representation, and Fig. 9 illustrates for fluid present invention bearing part bottom surface structure Figure, Figure 10 is fluid present invention bearing part cross-sectional view;
Including:Pillar 106, crossbeam 107, crossbeam fixing bolt 108, guide rail beam fixing bolt 109, guide rail beam 110, acid solution Containing tank 111, acid solution containing tank fixing bolt 903, clear water containing tank fixing bolt 902, clear water containing tank 112, sliding feet 205th, drip nozzle 207, drip nozzle fixing bolt 901, discharge opeing control valve door 301, sliding beam 302, clear water outlet 1001, acid solution discharge Mouth 1002;Sliding feet 205 is consolidated with pillar 106, and pillar 106 is connected with crossbeam 107 by crossbeam fixing bolt 108, crossbeam 107 It is connected with guide rail beam 110 by guide rail beam fixing bolt 109, acid solution containing tank 111 is by acid solution containing tank fixing bolt 903 with sliding Beam 302 is fixed, and clear water containing tank 112 is fixed by clear water containing tank fixing bolt 903 and sliding beam 302, discharge opeing control valve door 301 In control flume 1003, it is straight that discharge opeing control valve 301 end diameters of door are more than clear water outlet 1001, acid solution outlet 1002 Footpath, one of them is connected with drip nozzle 207 for controllable clear water outlet 1001, acid solution outlet 1002, or makes both while being in Closed mode, drip nozzle 207 is consolidated positioned at the central area of sliding beam 302 by drip nozzle fixing bolt 901 with sliding beam 302.

Claims (4)

1. one kind grinding crystal column surface corrosion device, it is characterised in that:Including:Leg, reclaim slot part, sucker stand part, Sucker and liquid bearing part;The leg (101) is connected by leg fixing bolt (404) with accumulator tank (102);It is described to reclaim Slot part includes:Guide rail (103), bail (206), vacuum switch (401), discard solution discharge port (201), discard solution discharge port are solid Determine bolt (402), pipeline opening (202), pipeline opening fixing bolt;Guide rail (103) is located at accumulator tank (102) symmetrical position in top both sides Put;Guide rail (103) end de-orbits provided with bail (206) limit slippage pin (205);Vacuum switch (401), waste liquid row Mouth (201), pipeline opening (202) are put positioned at accumulator tank (102) bottom, vacuum switch (401) control sucker (105) is taken out very Discard solution discharge port (201) is fixed on accumulator tank (102), pipeline opening fixing bolt by sky, discard solution discharge port fixing bolt (402) (403) fixing pipe road junction (202);The sucker stand part includes:Sucker stand base (704), sucker stand base screw (705), sucker stand post (703), sucker stand cushion cap (104), sucker stand cushion cap screw, sucker stand post (703) are internal Provided with hollow pipeline (702);Sucker stand base (704) is connected with accumulator tank (102) bottom center region, sucker stand base Screw (705) aligns with accumulator tank (102) screw, sucker stand post (703) connecting sucker bracket base (704) and sucker stand Cushion cap (104), sucker stand post (703) sets the chamber of pipeline (702) and sucker, and sucker (105) is held with sucker stand Platform (104) is consolidated by bolt;Liquid bearing part includes:Pillar (106), crossbeam (107), crossbeam fixing bolt (108), lead Beam-and-rail fixing bolt (109), guide rail beam (110), acid solution containing tank (111), acid solution containing tank fixing bolt (903), clear water are contained Put groove fixing bolt (902), clear water containing tank (112), sliding feet (205), drip nozzle (207), drip nozzle fixing bolt (901), row Hydraulic control valve door (301), sliding beam (302), clear water outlet (1001), acid solution outlet (1002);Sliding feet (205) and branch Post (106) is consolidated, and pillar (106) is connected with crossbeam (107) by crossbeam fixing bolt (108), crossbeam (107) and guide rail beam (110) connected by guide rail beam fixing bolt (109), acid solution containing tank (111) and clear water containing tank (112) and sliding beam (302) It is bolted, discharge opeing control valve door (301) control acid solution and clear water discharge.
2. a kind of according to claim 1 be ground crystal column surface corrosion device, it is characterised in that sucker (105) and sucker branch Frame cushion cap has sealing gasket between (104).
3. a kind of according to claim 1 be ground crystal column surface corrosion device, it is characterised in that discharge opeing control valve door (301) One of them is connected with drip nozzle (207) for control clear water outlet (1001), acid solution outlet (1002), or is turned off both.
4. a kind of according to claim 1 be ground crystal column surface corrosion device, it is characterised in that drip nozzle (207), which is located at, to be slided Beam (302) center.
CN201510420064.1A 2015-07-16 2015-07-16 One kind grinding crystal column surface corrosion device Expired - Fee Related CN105023865B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510420064.1A CN105023865B (en) 2015-07-16 2015-07-16 One kind grinding crystal column surface corrosion device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510420064.1A CN105023865B (en) 2015-07-16 2015-07-16 One kind grinding crystal column surface corrosion device

Publications (2)

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CN105023865A CN105023865A (en) 2015-11-04
CN105023865B true CN105023865B (en) 2017-10-10

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5439547A (en) * 1991-05-29 1995-08-08 Tokyo Electron Kabushiki Kaisha Semiconductor manufacturing apparatus with a spare vacuum chamber
JP3607143B2 (en) * 1999-11-19 2005-01-05 株式会社タカトリ Method and apparatus for attaching protective tape to semiconductor wafer
CN101842889A (en) * 2007-10-29 2010-09-22 综合制造科技有限公司 The device that is used for supporting workpiece
CN203737648U (en) * 2013-12-24 2014-07-30 北京七星华创电子股份有限公司 Substrate single-face rinsing device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030213560A1 (en) * 2002-05-16 2003-11-20 Yaxin Wang Tandem wafer processing system and process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5439547A (en) * 1991-05-29 1995-08-08 Tokyo Electron Kabushiki Kaisha Semiconductor manufacturing apparatus with a spare vacuum chamber
JP3607143B2 (en) * 1999-11-19 2005-01-05 株式会社タカトリ Method and apparatus for attaching protective tape to semiconductor wafer
CN101842889A (en) * 2007-10-29 2010-09-22 综合制造科技有限公司 The device that is used for supporting workpiece
CN203737648U (en) * 2013-12-24 2014-07-30 北京七星华创电子股份有限公司 Substrate single-face rinsing device

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