CN105018946A - Copper material surface detergent - Google Patents
Copper material surface detergent Download PDFInfo
- Publication number
- CN105018946A CN105018946A CN201510381999.3A CN201510381999A CN105018946A CN 105018946 A CN105018946 A CN 105018946A CN 201510381999 A CN201510381999 A CN 201510381999A CN 105018946 A CN105018946 A CN 105018946A
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- parts
- copper material
- material surface
- surface cleaner
- surface detergent
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Abstract
The invention discloses a copper material surface detergent, which is characterized in that active ingredients mainly comprise the following ingredients and parts in mass: 10-13 parts of non-ionic surface active agent, 10-20 parts of anionic surfactant, 8-10 parts of silicon dioxide grinding agent, 0.1-2 parts of stabilizer, 5-8 parts of sulfamic acid, 5-10 parts of corrosion inhibitor and 2-5 parts of sodium bicarbonate. The copper material surface detergent is safe, easy to use and convenient; the non-ionic surface active agent and the anionic surfactant are adopted for compounding, so that the detergency is good, and the system can be stable for a long time due to the addition of the stabilizer; and since the silicon dioxide grinding agent with a particular grain diameter is added, the bright effect of the product can be strengthened.
Description
Technical field
The present invention relates to metal treatment field, particularly relate to a kind of copper material surface cleaner.
Background technology
Brass work has been placed for a long time in atmosphere, can work with Carbon Dioxide in Air, oxygen, causes unglazed or produces spot; With sweat stain, oil stain and the koniology that can be infected with human body after human contact and discharge.These dirts are difficult to remove with general washing composition, and should use special metal detergent.Also there is no a kind of sanitising agent effectively can removing above-mentioned spot, dirt etc. in the market.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of safe, handy, copper material surface cleaner easily.
The present invention is achieved through the following technical solutions:
A kind of copper material surface cleaner, it is characterized in that, wherein activeconstituents is mainly following several composition and mass fraction thereof: nonionogenic tenside 10 ~ 13 parts, anion surfactant 10-20 part, silica abrasive 8-10 part, stablizer 0.1-2 part, thionamic acid 5 ~ 8 parts, inhibiter 5 ~ 10 parts, sodium bicarbonate 2 ~ 5 parts.
As preferably, also containing 30 ~ 60 parts of deionized waters.
As preferably, described inhibiter is urotropine.
The invention has the beneficial effects as follows: copper material surface cleaner of the present invention is safe, handy, convenient, adopt nonionogenic tenside and anion surfactant composite, have good soil removability, the interpolation of stablizer makes system steady in a long-term.Owing to adding the silica abrasive of particular particle size, product brightness effect of the present invention is strengthened.
Embodiment
A kind of copper material surface cleaner, it is characterized in that, wherein activeconstituents is mainly following several composition and mass fraction thereof: nonionogenic tenside 10 ~ 13 parts, anion surfactant 10-20 part, silica abrasive 8-10 part, stablizer 0.1-2 part, thionamic acid 5 ~ 8 parts, inhibiter 5 ~ 10 parts, sodium bicarbonate 2 ~ 5 parts.Also containing 30 ~ 60 parts of deionized waters.Described inhibiter is urotropine.
The above, be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any change of expecting without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (3)
1. a copper material surface cleaner, it is characterized in that, wherein activeconstituents is mainly following several composition and mass fraction thereof: nonionogenic tenside 10 ~ 13 parts, anion surfactant 10-20 part, silica abrasive 8-10 part, stablizer 0.1-2 part, thionamic acid 5 ~ 8 parts, inhibiter 5 ~ 10 parts, sodium bicarbonate 2 ~ 5 parts.
2. copper material surface cleaner according to claim 1, is characterized in that, also containing 30 ~ 60 parts of deionized waters.
3. copper material surface cleaner according to claim 1, is characterized in that, described inhibiter is urotropine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510381999.3A CN105018946A (en) | 2015-07-03 | 2015-07-03 | Copper material surface detergent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510381999.3A CN105018946A (en) | 2015-07-03 | 2015-07-03 | Copper material surface detergent |
Publications (1)
Publication Number | Publication Date |
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CN105018946A true CN105018946A (en) | 2015-11-04 |
Family
ID=54409234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510381999.3A Pending CN105018946A (en) | 2015-07-03 | 2015-07-03 | Copper material surface detergent |
Country Status (1)
Country | Link |
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CN (1) | CN105018946A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106283089A (en) * | 2016-08-25 | 2017-01-04 | 仇颖超 | A kind of preparation method of solid-liquid biphase mechanical metal abluent |
CN115161647A (en) * | 2022-07-13 | 2022-10-11 | 江苏富乐华半导体科技股份有限公司 | Method for improving copper surface oxidation after copper-clad ceramic substrate welding |
-
2015
- 2015-07-03 CN CN201510381999.3A patent/CN105018946A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106283089A (en) * | 2016-08-25 | 2017-01-04 | 仇颖超 | A kind of preparation method of solid-liquid biphase mechanical metal abluent |
CN115161647A (en) * | 2022-07-13 | 2022-10-11 | 江苏富乐华半导体科技股份有限公司 | Method for improving copper surface oxidation after copper-clad ceramic substrate welding |
CN115161647B (en) * | 2022-07-13 | 2023-07-21 | 江苏富乐华半导体科技股份有限公司 | Method for improving oxidation of copper surface of copper-clad ceramic substrate after welding |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151104 |
|
WD01 | Invention patent application deemed withdrawn after publication |