CN105014798A - Three-dimensional distribution diamond cutter and preparing technology thereof - Google Patents

Three-dimensional distribution diamond cutter and preparing technology thereof Download PDF

Info

Publication number
CN105014798A
CN105014798A CN201510387091.3A CN201510387091A CN105014798A CN 105014798 A CN105014798 A CN 105014798A CN 201510387091 A CN201510387091 A CN 201510387091A CN 105014798 A CN105014798 A CN 105014798A
Authority
CN
China
Prior art keywords
diamond
powder
diamond saw
kerf
distributed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510387091.3A
Other languages
Chinese (zh)
Other versions
CN105014798B (en
Inventor
闫焉服
高世军
李涛
王要利
陈新芳
闫猛
金梦圆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan University of Science and Technology
Original Assignee
Henan University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan University of Science and Technology filed Critical Henan University of Science and Technology
Priority to CN201510387091.3A priority Critical patent/CN105014798B/en
Publication of CN105014798A publication Critical patent/CN105014798A/en
Application granted granted Critical
Publication of CN105014798B publication Critical patent/CN105014798B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The invention discloses a three-dimensional distribution diamond cutter and a preparing method thereof and belongs to a cutter for nonmetal hard brittle materials. Firstly, a saw kerf is formed in a saw blade body; then, the saw kerf is filled with composite solder paste for soldering, and diamond powder in the composite solder paste is distributed in a three-dimensional manner and is arranged orderly as well; and next, the saw blade body is soldered to a cutter disk to form the diamond cutter. Due to the fact that the kerf is formed in the saw blade body and the diamond powder is soldered in the kerf, when the solder paste comprising the diamond powder is fused in the soldering process, the kerf with a certain angle can prevent diamond particles in the solder paste from floating upwards so that three-dimensional distribution of diamond can be achieved and the diamond can be arranged orderly as well. Therefore, the prepared diamond cutter is good in sharpness, the service life is prolonged, and the diamond cutter is used for cutting granite, marble, reinforced concrete and other nonmetal cutting hard brittle materials and is also widely applied to cutting airport runway antiskid seams, road and square expansion joints and other nonmetal materials and metal materials

Description

A kind of distributed in three dimensions diamond cutter and manufacturing process thereof
Technical field
The present invention relates to the cutting field of the hard brittle materias such as colored rock, marble, armored concrete, a kind of distributed in three dimensions diamond cutter and manufacturing process thereof specifically.
Background technology
The superiority that diamond is uniformly distributed in order arrangement on cutter head is familiar with by people, but being implemented on cutter head, is more difficult thing, with artificial realize on cutter head diamond uniform be distributed with arrangement be possible, but produce in enormous quantities, realize industrialization then more difficult, therefore diamond uniform distribution is ordered in the processing & machine tool implemented in production is then very the key link.
Patent 200920070665.4 provides the cutter head of a kind of diamond order arrangement, the blade superposition sintering that this cutter head is provided with diamond particles by multilayer forms, wherein, diamond particles on blade ordered arrangement thus formed diamond order arrangement cutter head, this cutter head can reduce concentration, the saving diamond cost of diamond particles, improve cutting efficiency simultaneously, extend the service life of cutter head, but there is the problems such as complex structure, manufacture craft is loaded down with trivial details, cost of manufacture is high.Patent 201110324083.6 adopts laser boring making red copper template to realize diamond order exclusion and three dimensions is uniformly distributed, and cause cutter production cost high, efficiency is low, is difficult to industrialization.Patent 201110304819.3 adopts and on cutter head carcass, is formed with some ordered arrangements and the accommodation hole running through cutter head carcass, and diamond particles is filled in the accommodation hole of cutter head carcass to realize diamond order distribution, but crisscross accommodation hole difficulty of processing is large.Patent 200710161619.0 adopts the template with the large aperture of super grit particles, adds cost, and welding process and step are too loaded down with trivial details and complicated.
Summary of the invention
The object of this invention is to provide a kind of the ordered arrangement distributed in three dimensions diamond cutter and the manufacturing process thereof that are applied to the hard brittle materias such as colored rock, marble, armored concrete, this diamond cutter is uniformly distributed and arranges diamond saw blade in order, adopt manufacturing process with low cost, realize diamond order arrangement and distributed in three dimensions, production technology is simple, easy to operate, considerably reduce the production cost of diamond cutter.
The present invention for the technical scheme realizing above-mentioned technical purpose and adopt is: a kind of distributed in three dimensions diamond cutter, comprise cutterhead and be distributed in the diamond saw blade on cutterhead, described diamond saw blade is made up of blade bodies and some the diamond saw kerfs being distributed in its surface, the described parallel distribution of diamond saw kerf, and its direction and cutterhead direction of rotation are 30-60 ° of angle.
Described diamond saw blade adopts commercially available solder to be welded on cutterhead with brazing mode, is provided with technology groove between adjacent two panels diamond saw blade.
Described diamond saw kerf is formed by the soldering of composite soldering cream; this composite soldering cream is mixed by 40-100 object bortz powder, commercially available braze welding diamond solder paste and additional enhancing particle; wherein; bortz powder and additional enhancing particle addition are respectively 10-30% and 5-15% of commercially available braze welding diamond solder paste weight, and described additional enhancing particle is one or more mixing in 40-100 object tungsten carbide powder, alumina powder, zirconia powder and silicon dioxide powder.
The manufacturing process of above-mentioned diamond cutter, comprises the following steps:
1) existing metal saw blade is got as blade bodies, and at its Surface Machining some joint-cutting arranged in parallel as diamond saw kerf, and the direction of diamond saw kerf and the direction of rotation of cutterhead are 30-60 ° of angle;
2) get commercially available braze welding diamond solder paste, and itself and 40-100 object bortz powder and additional enhancing particle are mixed and made into composite soldering cream, then composite soldering cream is inserted in diamond saw kerf, for subsequent use;
In described composite soldering cream, the weight of bortz powder and additional enhancing particle is respectively 10-30% and 5-15% of commercially available braze welding diamond solder paste weight, and described additional enhancing particle is one or more mixing in 40-100 object tungsten carbide powder, alumina powder, zirconia powder and silicon dioxide powder;
3) by step 2) in the blade bodies of populated composite soldering cream put in vacuum drying oven and carry out soldering, naturally to cool after soldering, thus obtained diamond saw blade;
During soldering, keep the vacuum in vacuum drying oven to be less than 0.1Pa, heating-up temperature is 700-1150 DEG C, and the heat time is 0.5-1h;
4) diamond saw blade obtained in step 3) is carried out soldering with existing cutterhead with commercially available solder to be combined, naturally obtained product after cooling.
The width of described diamond saw kerf is 2-3 times of bortz powder particle diameter.
Beneficial effect: the present invention by arranging joint-cutting in blade bodies, and in joint-cutting braze welding diamond powder, during soldering, during the fusing of diamond dust solder paste, the joint-cutting with certain angle can hinder the diamond particles in solder paste to float, diamond order distribution can be realized again, thus make the diamond cutter sharpness of preparation good, service life extends, remove for granite, marble, outside the cutting processing of the hard brittle materias such as armored concrete, also be widely used in the anti-coulisse of airfield runway, the cutting processing of highway and expansion joint, square and other nonmetallic materials and metal material.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of blade bodies;
Fig. 3 is the section structure schematic diagram of Fig. 2;
Reference numeral: 1, cutterhead, 2, diamond saw blade, 201, blade bodies, 202, diamond saw kerf, 3, soldered seam, 4, technology groove.
Detailed description of the invention
As shown in Figure 1,2 and 3, a kind of distributed in three dimensions diamond cutter, the diamond saw blade 2 comprising cutterhead 1 and be distributed on cutterhead 1, diamond saw blade 2 adopts commercially available diamond solder (as BNi7 flux paste, BNi2 flux paste or CuSnTi flux paste) to be welded on cutterhead 1 with brazing mode, technology groove 4 is provided with between adjacent two panels diamond saw blade 2, described diamond saw blade 2 is made up of blade bodies 201 and some the diamond saw kerfs 202 being distributed in its surface, the described parallel distribution of diamond saw kerf 202, its direction and cutterhead 1 direction of rotation are 30-60 ° of angle.
Embodiment 1
The manufacturing process of above-mentioned distributed in three dimensions diamond cutter, comprises the following steps:
1) existing metal saw blade is got as blade bodies 201, and at its Surface Machining some joint-cutting arranged in parallel as diamond saw kerf 202, the spacing of diamond saw kerf 202 is arranged as required, width is 2-3 times of bortz powder particle diameter, and the cross central line that the direction of diamond saw kerf 202 and blade bodies 201 launch the rear rectangle plane formed is 30 ° of angles;
2) get the BNi7 flux paste of commercially available braze welding diamond, and itself and 40-100 object bortz powder and additional enhancing particle are mixed and made into composite soldering cream, then composite soldering cream is inserted in diamond saw kerf 202, for subsequent use;
In described composite soldering cream, the weight of bortz powder and additional enhancing particle is respectively 10% and 5% of commercially available braze welding diamond solder paste weight, and described additional enhancing particle is 40-100 object tungsten carbide powder;
3) by step 2) in the blade bodies 201 of populated composite soldering cream put in vacuum drying oven and carry out soldering, naturally to cool after soldering, thus obtained diamond saw blade 2;
During soldering, keep the vacuum in vacuum drying oven to be less than 0.1Pa, heating-up temperature is 700 DEG C, and the heat time is 1h;
4) diamond saw blade 2 obtained in step 3) is carried out soldering with existing cutterhead 1 with the BNi7 flux paste of commercially available braze welding diamond to be combined, naturally obtained product after cooling.
Embodiment 2
The manufacturing process of above-mentioned distributed in three dimensions diamond cutter, comprises the following steps:
1) existing metal saw blade is got as blade bodies 201, and at its Surface Machining some joint-cutting arranged in parallel as diamond saw kerf 202, the spacing of diamond saw kerf 202 is arranged as required, width is 2-3 times of bortz powder particle diameter, and the cross central line that the direction of diamond saw kerf 202 and blade bodies 201 launch the rear rectangle plane formed is 60 ° of angles;
2) get the BNi2 flux paste of commercially available braze welding diamond, and itself and 40-100 object bortz powder and additional enhancing particle are mixed and made into composite soldering cream, then composite soldering cream is inserted in diamond saw kerf 202, for subsequent use;
In described composite soldering cream, the weight of bortz powder and additional enhancing particle is respectively 30% and 15% of commercially available braze welding diamond solder paste weight, and described additional enhancing particle is the mixture of the re-oxidation aluminium powders such as 40-100 object and silicon dioxide powder;
3) by step 2) in the blade bodies 201 of populated composite soldering cream put in vacuum drying oven and carry out soldering, naturally to cool after soldering, thus obtained diamond saw blade 2;
During soldering, keep the vacuum in vacuum drying oven to be less than 0.1Pa, heating-up temperature is 1150 DEG C, and the heat time is 0.5h;
4) diamond saw blade 2 obtained in step 3) is carried out soldering with existing cutterhead 1 with the BNi2 flux paste of commercially available braze welding diamond to be combined, naturally obtained product after cooling.
Embodiment 3
The manufacturing process of above-mentioned distributed in three dimensions diamond cutter, comprises the following steps:
1) existing metal saw blade is got as blade bodies 201, and at its Surface Machining some joint-cutting arranged in parallel as diamond saw kerf 202, the spacing of diamond saw kerf 202 is arranged as required, width is 2-3 times of bortz powder particle diameter, and the cross central line that the direction of diamond saw kerf 202 and blade bodies 201 launch the rear rectangle plane formed is 45 ° of angles;
2) get the CuSnTi flux paste of commercially available braze welding diamond, and itself and 40-100 object bortz powder and additional enhancing particle are mixed and made into composite soldering cream, then composite soldering cream is inserted in diamond saw kerf 202, for subsequent use;
In described composite soldering cream, the weight of bortz powder and additional enhancing particle is respectively 20% and 10% of commercially available braze welding diamond solder paste weight, described additional enhancing particle be 40-100 object tungsten carbide powder, alumina powder, zirconia powder and silicon dioxide powder according to etc. the mixing of weight ratio;
3) by step 2) in the blade bodies 201 of populated composite soldering cream put in vacuum drying oven and carry out soldering, naturally to cool after soldering, thus obtained diamond saw blade 2;
During soldering, keep the vacuum in vacuum drying oven to be less than 0.1Pa, heating-up temperature is 925 DEG C, and the heat time is 45min;
4) diamond saw blade 2 obtained in step 3) is carried out soldering with existing cutterhead 1 with the CuSnTi flux paste of commercially available braze welding diamond to be combined, naturally obtained product after cooling.

Claims (5)

1. a distributed in three dimensions diamond cutter, comprise cutterhead (1) and be distributed in the diamond saw blade (2) on cutterhead (1), it is characterized in that: described diamond saw blade (2) is made up of blade bodies (201) and some diamond saw kerfs (202) being distributed in its surface, described diamond saw kerf (202) parallel distribution, and the cross central line that its direction and blade bodies (201) launch the rear rectangle plane formed is 30-60 ° of angle.
2. a kind of distributed in three dimensions diamond cutter according to claim 1, it is characterized in that: described diamond saw blade (2) adopts commercially available solder to be welded on cutterhead (1) with brazing mode, is provided with technology groove (4) between adjacent two panels diamond saw blade (2).
3. a kind of distributed in three dimensions diamond cutter according to claim 1, it is characterized in that: described diamond saw kerf (202) is formed by the soldering of composite soldering cream, this composite soldering cream is 40-100 object bortz powder by particle diameter, commercially available braze welding diamond solder paste and additional enhancing particle mix, wherein, the weight of bortz powder and additional enhancing particle is respectively 10-30% and 5-15% of commercially available braze welding diamond solder paste weight, described additional enhancing particle is particle diameter 40-100 object tungsten carbide powder, alumina powder, in zirconia powder and silicon dioxide powder, one or more mix.
4. the manufacturing process of distributed in three dimensions diamond cutter according to claim 1, is characterized in that, comprise the following steps:
1) existing metal saw blade is got as blade bodies (201), and at its Surface Machining some joint-cutting arranged in parallel as diamond saw kerf (202), and the cross central line of rectangle plane that the direction of diamond saw kerf (202) and blade bodies (201) are formed after launching is 30-60 ° of angle;
2) get commercially available braze welding diamond solder paste, and itself and 40-100 object bortz powder and additional enhancing particle are mixed and made into composite soldering cream, then composite soldering cream is inserted in diamond saw kerf (202), for subsequent use;
In described composite soldering cream, the weight of bortz powder and additional enhancing particle is respectively 10-30% and 5-15% of commercially available braze welding diamond solder paste weight, and described additional enhancing particle is one or more mixing in 40-100 object tungsten carbide powder, alumina powder, zirconia powder and silicon dioxide powder;
3) by step 2) in the blade bodies (201) of populated composite soldering cream put in vacuum drying oven and carry out soldering, naturally to cool after soldering, thus obtained diamond saw blade (2);
During soldering, keep the vacuum in vacuum drying oven to be less than 0.1Pa, heating-up temperature is 700-1150 DEG C, and the heat time is 0.5-1h;
4) diamond saw blade obtained in step 3) (2) is carried out soldering with existing cutterhead (1) with commercially available solder to be combined, naturally obtained product after cooling.
5. the manufacturing process of distributed in three dimensions diamond cutter according to claim 4, is characterized in that: the width of described diamond saw kerf (202) is 2-3 times of bortz powder particle diameter.
CN201510387091.3A 2015-07-06 2015-07-06 A kind of distributed in three dimensions diamond cutter and its manufacturing process Expired - Fee Related CN105014798B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510387091.3A CN105014798B (en) 2015-07-06 2015-07-06 A kind of distributed in three dimensions diamond cutter and its manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510387091.3A CN105014798B (en) 2015-07-06 2015-07-06 A kind of distributed in three dimensions diamond cutter and its manufacturing process

Publications (2)

Publication Number Publication Date
CN105014798A true CN105014798A (en) 2015-11-04
CN105014798B CN105014798B (en) 2017-07-28

Family

ID=54405271

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510387091.3A Expired - Fee Related CN105014798B (en) 2015-07-06 2015-07-06 A kind of distributed in three dimensions diamond cutter and its manufacturing process

Country Status (1)

Country Link
CN (1) CN105014798B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106863153A (en) * 2015-12-07 2017-06-20 株式会社迪思科 Cutting machine cutter
CN108161776A (en) * 2017-12-19 2018-06-15 南京航空航天大学 It is brazed diamond segment composite wheel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1583388A (en) * 2004-06-04 2005-02-23 吴延波 Diamond bits and saw disc therewith
CN2918018Y (en) * 2006-06-14 2007-07-04 石家庄博深工具集团有限公司 Arc tooth protecting diamond disc saw blade
CN201300494Y (en) * 2008-12-04 2009-09-02 河北富世华冀凯金刚石工具有限公司 Diamond circular saw blade
CN202528322U (en) * 2011-11-08 2012-11-14 博深工具股份有限公司 Incongruous turbine V-shaped groove diamond circular saw blade

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1583388A (en) * 2004-06-04 2005-02-23 吴延波 Diamond bits and saw disc therewith
CN2918018Y (en) * 2006-06-14 2007-07-04 石家庄博深工具集团有限公司 Arc tooth protecting diamond disc saw blade
CN201300494Y (en) * 2008-12-04 2009-09-02 河北富世华冀凯金刚石工具有限公司 Diamond circular saw blade
CN202528322U (en) * 2011-11-08 2012-11-14 博深工具股份有限公司 Incongruous turbine V-shaped groove diamond circular saw blade

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
高志廷: "金刚石三维分布及金刚石刀具钎焊研究", 《中国优秀硕士学位论文全文数据库(工程科技Ⅰ辑)》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106863153A (en) * 2015-12-07 2017-06-20 株式会社迪思科 Cutting machine cutter
CN108161776A (en) * 2017-12-19 2018-06-15 南京航空航天大学 It is brazed diamond segment composite wheel

Also Published As

Publication number Publication date
CN105014798B (en) 2017-07-28

Similar Documents

Publication Publication Date Title
JP5541547B2 (en) Cutting / polishing tool and manufacturing method thereof
KR100648326B1 (en) Method for making a sintered article and products produced thereby
CN1238717A (en) Crenelated abrasive tool
CN105014798A (en) Three-dimensional distribution diamond cutter and preparing technology thereof
CN204367186U (en) The fan-shaped sandwich Segmented diamond circular saw blade of a kind of short tooth
CN105216120B (en) A kind of diamond cutter and preparation method thereof, diamond compound tool
CN108858808A (en) The preparation method of combined type diamond grooving saw blade
CN108115263A (en) Agitating friction weldering stirring-head and preparation method thereof
CN103696695A (en) Submarine oil twist bit and production process thereof
CN108161781A (en) A kind of preparation method of novel multi-layer Study on Brazed Superabrasive Tools
CN105417958B (en) A kind of method that high-intensity foam glass material is prepared using copper tailing
US20170361388A1 (en) Method for Manufacturing a Continuous Drill Ring for a Core Drill Bit
CN201664967U (en) Cemented carbide circular saw blade
CN203228320U (en) Diamond saw blade tool bit for cutting stone
CN102079109A (en) Diamond saw blade and machining process thereof
CN204108862U (en) A kind of diamond cup wheel
CN106112122A (en) The Laser Welding welding diamond disc that can the most dry cut
KR101234572B1 (en) Diamond Tool and Method for Manufacturing the Diamond Tool
CN108858804A (en) Fluting thin diamond saw blade
CN109866117B (en) Processing method for preparing structured grinding wheel by secondary cladding process
KR100910592B1 (en) Processing tip and tools using the same
CN108908742A (en) 2+1 assembled highly-effective diamond grooving saw blade
CN207480932U (en) Two-sided leaf-teeth dry chip
CN207577452U (en) A kind of hard alloy and steel matrix brazed shank tool
CN201151166Y (en) Novel diamond bit

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170728

Termination date: 20180706

CF01 Termination of patent right due to non-payment of annual fee