CN105003892A - Heat dissipation structure, manufacturing method of heat dissipation structure and lamp with heat dissipation structure - Google Patents
Heat dissipation structure, manufacturing method of heat dissipation structure and lamp with heat dissipation structure Download PDFInfo
- Publication number
- CN105003892A CN105003892A CN201410149173.XA CN201410149173A CN105003892A CN 105003892 A CN105003892 A CN 105003892A CN 201410149173 A CN201410149173 A CN 201410149173A CN 105003892 A CN105003892 A CN 105003892A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- light emitting
- emitting diode
- heat conduction
- cylindrical shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
Abstract
The invention discloses a heat dissipation structure, a manufacturing method of the heat dissipation structure and a lamp with the heat dissipation structure. The heat dissipation structure comprises a body and a circuit board. The body is molded from heat conduction materials. When the body is molded from the heat conduction materials, the circuit board is embedded and wrapped in the body; and at least one light-emitting diode is distributed on the circuit board and is exposed out of the body. By means of the manner of wrapping injection molding, the circuit board is embedded in the body, and therefore the assembling cost can be saved.
Description
Technical field
The present invention relates to the radiator structure being applied in light-emitting diodes bulb, in its body espespecially a kind of, be embedded with the radiator structure of circuit board.
Background technology
General light-emitting diodes bulb includes a light source module, and its light source module is a circuit board being laid with recurrence optical diode, can produce light source by those light emitting diodes.Due to the thermal source that light emitting diode is small size and golf calorific value, it needs to connect cooling mechanism and discharges heat energy that its luminescence gives birth to avoid overheated burning.
The over-borrowing of existing light-emitting diodes bulb is by metal radiating seat as cooling mechanism, and the form that such as its radiating seat is common is that aluminium extruded is shaped.The shortcoming of prior art is, light source module and radiating seat must make respectively, then by light source module laminating or interlocking on radiating seat, therefore its assembly program expends considerable human cost and man-hour.
Summary of the invention
The object of the present invention is to provide a kind of radiator structure of Gou Zao Jian Unit, the preparation method of this radiator structure and there is the light fixture of this radiator structure.
For reaching aforesaid object, the invention provides a kind of radiator structure, it comprises a body and a circuit board.Body is shaped by Heat Conduction Material and forms.Circuit board, when Heat Conduction Material forming body, is buried underground simultaneously and is coated in body, circuit board is laid with at least one light emitting diode, and this light emitting diode exposes body.
Preferably, aforesaid radiator structure, its body comprises a cylindrical shell, and this light emitting diode exposes on an end face of cylindrical shell.
Preferably, aforesaid radiator structure, its radiator structure comprises multiple fin, those fin projections cylindrical shell lateral surface and radially ring be located at the lateral surface of cylindrical shell.
For reaching aforesaid object, the present invention also provides a kind of preparation method of radiator structure, and its step comprises: provide a circuit board; Lay a circuit on circuit boards and be electrically connected at least one light emitting diode of this circuit; One heat conduction material is provided; Melt Heat Conduction Material; The Heat Conduction Material coating circuit plate of thawing is formed a body, and this light emitting diode exposes body.
Preferably, the preparation method of aforesaid radiator structure, inserts a mould by circuit board in its step e, and injects mould after being melted by Heat Conduction Material and form body.
Preferably, the preparation method of aforesaid radiator structure, its Heat Conduction Material includes metal or ceramic constituents.
For reaching aforesaid object, the present invention also provides a kind of light fixture, and it comprises a body, a circuit board, a diffuser and a lamp holder.Body is shaped by Heat Conduction Material and forms.Circuit board, when Heat Conduction Material forming body, is buried underground simultaneously and is coated in body, circuit board is laid with at least one light emitting diode and this light emitting diode exposes body.Diffuser is arranged on body and shields this light emitting diode.Lamp holder is arranged on body relative to this diffuser.
Preferably, aforesaid light fixture, its body comprises a cylindrical shell, and this light emitting diode exposes on an end face of cylindrical shell.
Preferably, aforesaid light fixture, it comprises multiple fin, those fin projections cylindrical shell lateral surface and radially ring be located at the lateral surface of cylindrical shell.
Preferably, aforesaid light fixture, be equipped with a control module and multiple wire within its cylindrical shell, control module is electrically connected this lamp holder, one end of each wire is electrically connected the another side of circuit board, the other end then powered link control module of each wire through perforation.
Radiator structure of the present invention is by the mode of coated injection molding in conjunction with body and circuit board, and body is made with heat-conducting plastic and can be used in the heat radiation of circuit board, therefore, it is possible to save assembly cost.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the sectional perspective schematic diagram of the radiator structure of first embodiment of the invention.
Fig. 2 is the partial sectional view of the radiator structure of first embodiment of the invention in Fig. 1.
Fig. 3 is the flow chart of the preparation method of the radiator structure of second embodiment of the invention.
Fig. 4 is the schematic perspective view of the light fixture of third embodiment of the invention.
Fig. 5 is the sectional view of the light fixture of third embodiment of the invention in Fig. 4.
Wherein, Reference numeral:
10 radiator structures
100 bodies
110 cylindrical shells
111 blind ends
112 open ends
120 fins
130 cavity volumes
131 openings
132 perforation
210 circuit boards
220 light emitting diodes
300 diffusers
400 lamp holders
500 control modules
600 wires
A ~ e step
Detailed description of the invention
Consult Fig. 1 to Fig. 2, better enforcement of the present invention provides a kind of radiator structure 10, and radiator structure 10 includes body 100, circuit board 210 and a multiple light emitting diode 220.
In the present embodiment, body 100 is preferably made for Heat Conduction Material injection molding, and its Heat Conduction Material can include metal or ceramic constituents, and body 100 includes a cylindrical shell 110 and multiple fin 120.Cylindrical shell 110 is in hollow form, and wherein one end of cylindrical shell 110 is a blind end 111, and its other end is then an open end 112.The blind end 111 of cylindrical shell 110 is formed with a cavity volume 130, and cavity volume 130 on the end face of blind end 111, form an opening 131 and the inwall of blind end 111 offers the perforation 132 being communicated with cavity volume 130.Each fin 120 respectively projection at the lateral surface of cylindrical shell 110 and those fins 120 radially Arranged rings be located at the lateral surface of cylindrical shell 110.
The profile of circuit board 210 matches with the Internal periphery of cavity volume 130, and circuit distribution is provided with a circuit (not shown).Preferably can by the mode of coated injection molding when Heat Conduction Material be shaped aforesaid body 100, coating circuit plate 210, makes circuit board 210 be embedded within cavity volume 130 whereby simultaneously.
Those light emitting diodes 220 are arranged on circuit board, and the heat energy that therefore light emitting diode 220 produces in operating can conduct to fin 120 by cylindrical shell 110 and be dissipated in air.
Consult Fig. 1 to Fig. 3, the second embodiment of the present invention provides a kind of preparation method of radiator structure, and it is in order to make radiator structure as described in the first embodiment, and it comprises step described later:
One circuit board 210 is provided in step a.Step b continues by means of step a, a circuit is formed on circuit boards in stepb by the mode etched, this circuit is preferably laid in the wherein one side of circuit board 210, but the present invention is not as limit, and on this face of circuit board, lay the light emitting diode 220 of multiple this circuit of electric connection.
In step c, provide a Heat Conduction Material, its Heat Conduction Material can comprise metal or ceramic constituents.Steps d continues by means of step c, by Heat Conduction Material heating and melting in steps d.
After completing steps b and d, continue and carry out step e, in step e, the aforementioned circuit board being laid with circuit and light emitting diode 220 is inserted in a mould, the Heat Conduction Material of thawing is injected this mould and forms a body 100, and make body 100 coating circuit plate 210.This bodily form 100 one-tenth has an opening 131, and the light emitting diode 220 on circuit board 210 is exposed in the opening.
Consult Fig. 4 to Fig. 5, the of the present invention 3rd implements to provide a kind of light emitting diode bulb, and it includes a radiator structure 10, multiple light emitting diode 220, diffuser 300, lamp holder 400, control module 500 and two wires 600.
In the present embodiment, radiator structure 10 as described in the first embodiment, therefore repeats no more in this.
Those light emitting diodes 220 are laid in the wherein simultaneously upper of circuit board 210 and the circuit be electrically connected on circuit board 210.The corresponding opening 131 of those light emitting diodes 220 configures, and therefore those light emitting diodes 220 are exposed to opening 131.
Diffuser 300 can the spherical cover body made of glass or transparent plastic, and it is located at the blind end 111 of cylindrical shell 110 and shields those light emitting diodes 220.
In the present embodiment, at least one part of lamp holder 400 is for metal makes and can conduct electricity, and it is provided with thread in appearance.Lamp holder 400 is in order to be spirally connected a lamp socket and be electrically connected to a power supply.Lamp holder 400 is arranged at the open end 112 of cylindrical shell 110, and shields this open end 112.
Control module 500 and those wires 600 are all placed in the space of cylindrical shell 110 inside, and control module 500 is electrically connected at lamp holder 400, and wherein the present invention does not limit the number of wire 600.Wherein one end of each wire 600 is electrically connected to the another side of circuit board 210 through the perforation 132 in cylindrical shell 110 blind end 111, the other end of each wire 600 is then electrically connected control module 500.Therefore, each light emitting diode 220 electricity is by circuit board 210, wire 600, control module 500 and be electrically connected lamp holder 400, and power supply can supply power to each light emitting diode 220 whereby to drive each light emitting diode 220 luminous.
Radiator structure of the present invention, its preparation method and there is the light fixture of this radiator structure, its mode by coated injection molding forms the body 100 of radiator structure 10 and makes circuit board 210 be embedded in body 100, does not therefore need circuit board 210 is assembled to body 100 and can saves human cost and the man-hour of assembling.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art can make various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection domain that all should belong to the claims in the present invention.
Claims (10)
1. a radiator structure, is characterized in that, comprises:
One body, this body is shaped by Heat Conduction Material and forms; And
One circuit board, when Heat Conduction Material is shaped this body, buries underground simultaneously and be coated in this body, this circuit board is laid with at least one light emitting diode, and this light emitting diode exposes this body.
2. radiator structure according to claim 1, is characterized in that, this body comprises a cylindrical shell, and this light emitting diode exposes on an end face of this cylindrical shell.
3. radiator structure according to claim 2, is characterized in that, this radiator structure comprises multiple fin, described fin projection this cylindrical shell lateral surface and radially ring be located at the lateral surface of this cylindrical shell.
4. a light fixture, is characterized in that, comprises:
One body, this body is shaped by Heat Conduction Material and forms;
One circuit board, when this Heat Conduction Material is shaped this body, buries underground simultaneously and is coated in this body, this circuit board is laid with at least one light emitting diode and this light emitting diode exposes this body;
One diffuser, is arranged on this body and shields this light emitting diode; And
One lamp holder, is arranged on this body relative to this diffuser.
5. light fixture according to claim 4, is characterized in that, this body comprises a cylindrical shell, and this light emitting diode exposes on an end face of this cylindrical shell.
6. light fixture according to claim 5, is characterized in that, this light fixture comprises multiple fin, described fin projection this cylindrical shell lateral surface and radially ring be located at the lateral surface of this cylindrical shell.
7. light fixture according to claim 4, it is characterized in that, be equipped with a control module and multiple wire within this body, this control module is electrically connected this lamp holder, respectively one end of this wire is electrically connected the another side of this circuit board, and respectively the other end of this wire is then electrically connected this control module.
8. a preparation method for radiator structure, is characterized in that, its step comprises:
A., one circuit board is provided;
B. lay a circuit on the board and be electrically connected at least one light emitting diode of this circuit;
C., one Heat Conduction Material is provided; And
D. this Heat Conduction Material is melted;
E. this Heat Conduction Material this circuit board coated melted is formed a body, and this light emitting diode exposes this body.
9. the preparation method of radiator structure according to claim 8, is characterized in that, in step e, this circuit board is inserted a mould, and this Heat Conduction Material melted is injected this mould Post RDBMS and forms this body.
10. the preparation method of radiator structure according to claim 8, is characterized in that, this Heat Conduction Material includes metal or ceramic constituents.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410149173.XA CN105003892A (en) | 2014-04-15 | 2014-04-15 | Heat dissipation structure, manufacturing method of heat dissipation structure and lamp with heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410149173.XA CN105003892A (en) | 2014-04-15 | 2014-04-15 | Heat dissipation structure, manufacturing method of heat dissipation structure and lamp with heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105003892A true CN105003892A (en) | 2015-10-28 |
Family
ID=54376671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410149173.XA Pending CN105003892A (en) | 2014-04-15 | 2014-04-15 | Heat dissipation structure, manufacturing method of heat dissipation structure and lamp with heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105003892A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102234410A (en) * | 2010-04-28 | 2011-11-09 | 上海合复新材料科技有限公司 | Heat-conducting thermosetting molding composite material and application thereof |
| CN102252297A (en) * | 2011-04-29 | 2011-11-23 | 上海威廉照明电气有限公司 | Assembly of heating component and heat-dissipation structure and LED (light emitting diode) lamp |
| CN202252967U (en) * | 2011-08-23 | 2012-05-30 | 讯凯国际股份有限公司 | Lighting device |
| CN102617927A (en) * | 2012-02-17 | 2012-08-01 | 许永信 | New material for reducing LED junction temperature and preparation method thereof |
-
2014
- 2014-04-15 CN CN201410149173.XA patent/CN105003892A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102234410A (en) * | 2010-04-28 | 2011-11-09 | 上海合复新材料科技有限公司 | Heat-conducting thermosetting molding composite material and application thereof |
| CN102252297A (en) * | 2011-04-29 | 2011-11-23 | 上海威廉照明电气有限公司 | Assembly of heating component and heat-dissipation structure and LED (light emitting diode) lamp |
| CN202252967U (en) * | 2011-08-23 | 2012-05-30 | 讯凯国际股份有限公司 | Lighting device |
| CN102617927A (en) * | 2012-02-17 | 2012-08-01 | 许永信 | New material for reducing LED junction temperature and preparation method thereof |
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Application publication date: 20151028 |
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| WD01 | Invention patent application deemed withdrawn after publication |