CN104987668B - A kind of preparation method of pliable and tough transparent epoxy resin - Google Patents
A kind of preparation method of pliable and tough transparent epoxy resin Download PDFInfo
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- CN104987668B CN104987668B CN201510393514.2A CN201510393514A CN104987668B CN 104987668 B CN104987668 B CN 104987668B CN 201510393514 A CN201510393514 A CN 201510393514A CN 104987668 B CN104987668 B CN 104987668B
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Abstract
A kind of preparation method of pliable and tough transparent epoxy resin, is first carried out the redox reaction of epoxy-functional, prepares modified resin by epoxy resin and reducing agent；Then modified resin is mixed with epoxy resin, more cured reaction, prepare pliable and tough transparent epoxy resin cured article.The method has the advantages that modern design, preparation process is simple, involved reaction condition are gentle, easily operated, and prepared epoxy resin pliability is high, the transparency is high, low production cost.
Description
Technical field
The present invention relates to pliable and tough epoxy resin field is and in particular to a kind of preparation method of pliable and tough transparent epoxy resin.
Background technology
Epoxy resin has excellent cementability, wearability, mechanical property, chemical stability and contraction because it is good
The advantages of rate is low and with low cost and be widely used in the national economy such as space flight and aviation, wind-powered electricity generation generating, adhesive, machinery, coating
Various fields.However, asphalt mixtures modified by epoxy resin lipid is crisp, the low fault of construction of impact strength is so as to application is subject to certain restrictions it is difficult to expire
The requirement of foot many engineering technology increasingly stringents.Therefore, how to improve epoxy resin pliability become widen epoxy resin should
Study hotspot with scope.
Generally, improving the flexible method of epoxy resin is by adding rubber elastomer, thermoplastic resin, rigid inorganic
Filler, TLCP wait until to reach the raising flexible effect of epoxy resin in epoxy resin-base.However, by
Poor with the biphase compatibility of epoxy resin in additive, so the epoxy resin being prepared by the method can produce phase dividing
From, lead to the transparency of epoxy resin to be greatly reduced, limit modified epoxy resin in the higher field of transparency requirement
Application.
Content of the invention
The technical problem solving：Present invention aim at providing a kind of preparation method of pliable and tough transparent epoxy resin, the party
Method has the advantages that gentle, easily operated, the prepared epoxy resin of modern design, preparation process is simple, involved reaction condition
Pliability is high, the transparency is high, low production cost.
Technical scheme：A kind of preparation method of pliable and tough transparent epoxy resin, first carries out decyclization by epoxy resin and reducing agent
The redox reaction of oxygen functional group, prepares modified resin；Then modified resin is mixed with epoxy resin, then through solid
Change reaction, prepare pliable and tough transparent epoxy resin cured article, concrete preparation process is as follows：
The first step：Epoxy resin is added in organic solvent, its epoxy resin is 1 with the mass ratio of organic solvent:4
～1:10, under room temperature, stirring 0.3～0.5h makes epoxy resin be dissolved in solvent, obtains colourless transparent solution；Subsequently, by epoxy
Resin solution is heated to 60～100 DEG C, adds reducing agent to be reacted, reacts 4～6h, vacuum distillation removes solvent, obtains Huang
The modified resin of color clear viscous liquids shape；
Second step：By modified resin with epoxy resin by being mixed, add D230 type polyethers amine hardener, modified tree
The mixing quality ratio of fat and epoxy resin is 1:9～1:3, firming agent is 1 with the mass ratio of hybrid resin:3～1:5,20
Precuring 6～12h at～30 DEG C, then solidifies 3～5h at 80 DEG C again, prepares pliable and tough transparent epoxy resin cured product.
The epoxy resin of the above-mentioned first step and the mass ratio of solvent are 1:10, this had been reduced in order to avoid epoxide group
In journey, system produces gelation effect.
The organic solvent used of the above-mentioned first step is selected from one of acetone, toluene, dimethylbenzene, Ketohexamethylene.
Reducing agent used by the above-mentioned first step is selected from hydration hydrazine and its derivative, vitamin C, sodium borohydride, hydroiodic acid, right
One of Benzodiazepiness.
Reducing agent used by the above-mentioned first step is 2 with the mass ratio of epoxy resin:1.
The temperature of above-mentioned first step reaction is 60 DEG C, and the response time is 4h.
The mixing quality ratio of the modified resin of above-mentioned second step and epoxy resin is 1:3.
The firming agent of above-mentioned second step and the mass ratio of hybrid resin are 1:4.
The solidification temperature of above-mentioned second step and hardening time be：Precuring 6h at room temperature, then solidifies at 80 DEG C again
3h.
Above-mentioned epoxy resin used is selected from bisphenol A type epoxy resin, bis-phenol H type epoxy resin, bisphenol F type epoxy tree
At least one in fat, bisphenol-s epoxy resin.
Beneficial effect：
1., compared with the general raising flexible method of epoxy resin, prepared by the present invention goes the former of epoxidation modification resin
Expect, from epoxy resin, therefore modified resin and epoxy resin, there is the excellent compatibility epoxy resin it is ensured that preparing
There is the excellent transparency, when the mass ratio of modified resin and epoxy resin is 1:When 3, the epoxy resin cure preparing produces
The light transmittance of thing can reach 85%, more than the 82% of unmodified epoxy resin, much larger than with acrylonitrile butadiene rubber modified epoxy resin
62.07% (mass ratio of nitrile rubber and epoxy resin is 1:3).
2. the epoxidation modification resin that goes of present invention preparation is not involved in cross-linking reaction in the curing process, plays internal plasticization and makees
With the epoxy resin therefore preparing has excellent pliability, when the mass ratio of modified resin and epoxy resin is 1:3
When, the elongation at break of the epoxy resin-cured product preparing can reach 110%, much larger than with acrylonitrile butadiene rubber modified ring
(nitrile rubber is 1 with the mass ratio of epoxy resin to the 14.07% of oxygen tree fat:3).
3. the present invention is with epoxy resin as raw material, cheap, wide material sources, can substantially reduce the production cost of product.
4. preparation process process is simple, reaction condition is gentle, product quality is stable, energy consumption is low, the three wastes are few, is a kind of environmental protection
Economic preparation method.
Brief description
Fig. 1 is the infrared spectrogram of epoxy resin, in figure 913cm-1It is the characteristic peak of epoxide group.
Fig. 2 is the infrared spectrogram of modified resin, and 913cm in figure-1Epoxide group characteristic peak, illustrates through reduction
Reaction, the epoxide group in epoxy resin is successfully got rid of.
Specific embodiment
Below by example, the present invention is specifically described, embodiment provides detailed embodiment and specific operation
Step, is served only for further illustrating it is impossible to be interpreted as limiting the scope of the invention to the present invention.
Embodiment 1
The bisphenol A epoxide resin (its infrared spectrum is as shown in Figure 1) weighing 20g is dissolved in 200g acetone, is subsequently heated
To 60 DEG C, add 40g hydrazine hydrate to be reacted, react 4h, vacuum distillation removes acetone, obtains yellow transparent thick liquid nano
Modified resin, its infrared spectrum is as shown in Figure 2.Contrast Fig. 1 and Fig. 2, we can be found that 913cm in modified resin-1
Epoxide group characteristic peak, the epoxide group of this explanation epoxy resin is successfully removed.
Weigh 10g modified resin to be placed in single-necked flask, be subsequently added 90g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Embodiment 2
The bisphenol A epoxide resin weighing 30g is dissolved in 300g acetone, is subsequently heated to 60 DEG C, adds 60g hydrazine hydrate to enter
Row reaction, reacts 4h, and vacuum distillation removes acetone, obtains the modified resin of yellow transparent thick liquid nano.
Weigh 20g modified resin to be placed in single-necked flask, be subsequently added 80g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Embodiment 3
The bisphenol A epoxide resin weighing 30g is dissolved in 300g acetone, is subsequently heated to 60 DEG C, adds 60g hydrazine hydrate to enter
Row reaction, reacts 4h, and vacuum distillation removes acetone, obtains the modified resin of yellow transparent thick liquid nano.
Weigh 25g modified resin to be placed in single-necked flask, be subsequently added 75g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Embodiment 4
The bisphenol A epoxide resin weighing 30g is dissolved in 120g dimethylbenzene, is subsequently heated to 100 DEG C, adds 150g hydration
Hydrazine is reacted, and reacts 6h, and vacuum distillation removes removal xylene, obtains the modified resin of yellow transparent thick liquid nano.
Weigh 25g modified resin to be placed in single-necked flask, be subsequently added 75g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 10h, solidify 4h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Embodiment 5
The bisphenol A epoxide resin weighing 30g is dissolved in 180g acetone, is subsequently heated to 60 DEG C, adds 60g hydroquinone
Reacted, reacted 6h, vacuum distillation is removed acetone, obtains the modified resin of yellow transparent thick liquid nano.
Weigh 25g modified resin to be placed in single-necked flask, be subsequently added 75g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 12h, solidify 5h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Embodiment 6
The bisphenol A epoxide resin weighing 30g is dissolved in 300g dimethylbenzene, is subsequently heated to 80 DEG C, adds 60g to benzene two
Phenol is reacted, and reacts 6h, and vacuum distillation removes removal xylene, obtains the modified resin of yellow transparent thick liquid nano.
Weigh 25g modified resin to be placed in single-necked flask, be subsequently added 75g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 20g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Embodiment 7
The bisphenol A epoxide resin weighing 30g is dissolved in 300g dimethylbenzene, is subsequently heated to 85 DEG C, adds 150g hydrogen iodine
Acid is reacted, and reacts 6h, and vacuum distillation removes removal xylene, obtains the modified resin of yellow transparent thick liquid nano.
Weigh 15g modified resin to be placed in single-necked flask, be subsequently added 45g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 20g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Embodiment 8
The bisphenol A epoxide resin weighing 30g is dissolved in 300g acetone, is subsequently heated to 90 DEG C, adds 60g hydroiodic acid to enter
Row reaction, reacts 6h, and vacuum distillation removes acetone, obtains the modified resin of yellow transparent thick liquid nano.
Weigh 25g modified resin to be placed in single-necked flask, be subsequently added 75g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Embodiment 9
The bis-phenol H epoxy resin weighing 30g is dissolved in 300g acetone, is subsequently heated to 60 DEG C, adds 90g hydrazine hydrate to enter
Row reaction, reacts 4h, and vacuum distillation removes acetone, obtains the modified resin of yellow transparent thick liquid nano.
Weigh 25g modified resin to be placed in single-necked flask, be subsequently added 75g bis-phenol H epoxy resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Embodiment 10
The bisphenol F epoxy resin weighing 30g is dissolved in 300g acetone, is subsequently heated to 60 DEG C, adds 60g hydrazine hydrate to enter
Row reaction, reacts 4h, and vacuum distillation removes acetone, obtains the modified resin of yellow transparent thick liquid nano.
Weigh 25g modified resin to be placed in single-necked flask, be subsequently added 75g bisphenol F epoxy resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 1.
Comparative example 1
Weigh 80g bisphenol A epoxide resin to be placed in single-necked flask, be subsequently adding D230 type polyetheramine 20g, stir 30min.
Then system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing
Carry out tensile property and light transmittance test is as shown in table 2.
Comparative example 2
Weigh 10g nitrile rubber to be placed in single-necked flask, be subsequently added 90g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 2.
Comparative example 3
Weigh 25g nitrile rubber to be placed in single-necked flask, be subsequently added 75g bisphenol A epoxide resin, in the rotating speed of 400rpm
Under be stirred making two kinds of mixed with resin uniform.Then add D230 type polyetheramine 25g in hybrid resin, stir 30min.So
Afterwards system is poured in dumbbell shape mould, after room temperature precuring 6h, solidify 3h again at 80 DEG C.The curing system preparing enters
Row tensile property and light transmittance test are as shown in table 2.
The mechanical performance of table 1 modified epoxy curing system and light transmittance
The mechanical performance of table 2 pure epoxy resin and acrylonitrile butadiene rubber modified epoxy resin curing system and light transmittance
By the as shown by data of table 1, with the increase of modified resin consumption, the continuous reduction of the tensile strength of epoxy resin,
Elongation at break constantly raises, and light transmittance hardly loses, and some sample transmittance even improve.By table 2
As shown by data, is its flexible amplification very little with its elongation at break of acrylonitrile butadiene rubber modified epoxy resin, well below this
Invent the toughness reinforcing epoxy resin of the modified resin of preparation.And the light transmittance of acrylonitrile butadiene rubber modified epoxy resin is with butyronitrile rubber
The increase of glue content and be greatly reduced.Therefore can be prepared by the method for the present invention and there is the pliable and tough ring of higher transparency
Oxygen tree fat, its pliability and transparency are better than the rubber toughened epoxy resin of tradition, can be used for thering is flexibility, transparency requirement
The embedding of product surface and sealing.
Claims (10)
1. a kind of preparation method of pliable and tough transparent epoxy resin is it is characterised in that first carry out decyclization by epoxy resin and reducing agent
The redox reaction of oxygen functional group, prepares modified resin；Then modified resin is mixed with epoxy resin, then through solid
Change reaction, prepare pliable and tough transparent epoxy resin cured article, concrete preparation process is as follows：
The first step：Epoxy resin is added in organic solvent, its epoxy resin is 1 with the mass ratio of organic solvent:4 ~
1:10, under room temperature, stirring 0.3 ~ 0.5 h makes epoxy resin be dissolved in solvent, obtains colourless transparent solution；Subsequently, by epoxy
Resin solution is heated to 60 ~ 100 DEG C, adds reducing agent to be reacted, reacts 4 ~ 6 h, wherein reducing agent and epoxy resin
Mass ratio be 2:1 ~ 5:1；After reaction terminates, vacuum distillation removes solvent, obtains the modification of yellow transparent thick liquid nano
Resin；
Second step：By modified resin with epoxy resin by being mixed, add D230 type polyethers amine hardener, modified resin with
The mixing quality ratio of epoxy resin is 1:9 ~ 1:3, firming agent is 1 with the mass ratio of hybrid resin:3 ~ 1:5,20 ~
Precuring 6 ~ 12 h at 30 DEG C, then solidifies 3 ~ 5 h again at 80 DEG C, prepares pliable and tough transparent epoxy resin solidification and produces
Thing.
2. the preparation method of pliable and tough transparent epoxy resin according to claim 1 is it is characterised in that the asphalt mixtures modified by epoxy resin of the first step
Fat is 1 with the mass ratio of organic solvent:10.
3. the preparation method of pliable and tough transparent epoxy resin according to claim 1 is it is characterised in that having used by the first step
One of machine solvent selected from acetone, toluene, dimethylbenzene, Ketohexamethylene.
4. pliable and tough transparent epoxy resin according to claim 1 preparation method it is characterised in that used by the first step also
Former dose is selected from one of hydration hydrazine and its derivative, vitamin C, sodium borohydride, hydroiodic acid, hydroquinone.
5. pliable and tough transparent epoxy resin according to claim 1 preparation method it is characterised in that used by the first step also
The former dose of mass ratio with epoxy resin is 2:1.
6. pliable and tough transparent epoxy resin according to claim 1 preparation method it is characterised in that the first step reaction temperature
Spend for 60 DEG C, the response time is 4 h.
7. the preparation method of pliable and tough transparent epoxy resin according to claim 1 is it is characterised in that the modified of second step is set
The mixing quality ratio of fat and epoxy resin is 1:3.
8. the preparation method of pliable and tough transparent epoxy resin according to claim 1 is it is characterised in that the firming agent of second step
Mass ratio with hybrid resin is 1:4.
9. the preparation method of pliable and tough transparent epoxy resin according to claim 1 is it is characterised in that the solidification temperature of second step
Spend and hardening time is：Precuring 6 h at room temperature, then solidifies 3 h again at 80 DEG C.
10. the preparation method of pliable and tough transparent epoxy resin according to claim 1 is it is characterised in that epoxy resin used
In bisphenol A type epoxy resin, bis-phenol H type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin at least one
Kind.
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|---|---|---|---|---|
| CN103011150A (en) * | 2012-12-27 | 2013-04-03 | 上海交通大学 | Flexible graphene composite film and preparation method thereof |
| CN104136479A (en) * | 2011-12-20 | 2014-11-05 | 陶氏环球技术有限责任公司 | Toughening agent for epoxy thermoset |
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| US20090099312A1 (en) * | 2007-10-15 | 2009-04-16 | Carl Duane Weber | Amine terminated tougheners for epoxy resin based adhesives and materials |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104136479A (en) * | 2011-12-20 | 2014-11-05 | 陶氏环球技术有限责任公司 | Toughening agent for epoxy thermoset |
| CN103011150A (en) * | 2012-12-27 | 2013-04-03 | 上海交通大学 | Flexible graphene composite film and preparation method thereof |
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