CN104987535A - Co-modified LDS (Laser Direct Structuring) additive and polyarylester composition containing same - Google Patents
Co-modified LDS (Laser Direct Structuring) additive and polyarylester composition containing same Download PDFInfo
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- CN104987535A CN104987535A CN201510410062.4A CN201510410062A CN104987535A CN 104987535 A CN104987535 A CN 104987535A CN 201510410062 A CN201510410062 A CN 201510410062A CN 104987535 A CN104987535 A CN 104987535A
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Abstract
The invention relates to a co-modified LDS (Laser Direct Structuring) additive. The co-modified LDS additive comprises the following components in parts by weight: 100 parts of laser-sensitive compound and 10 to 30 parts of modified compound containing hydroxyl groups and modified compound containing carboxyl groups, wherein the modified compound containing the hydroxyl groups is partially coated on the surface of the laser-sensitive compound; the general chemical formula of the laser-sensitive compound is XY2O4; the laser-sensitive compound is an isometric system, both X and Y are metallic elements and are from group IIIA, group IB, group IIB, group VIB, group VIIB or group VIII in the periodic table of chemical elements; and a metal thin film on a plastic product prepared from the co-modified LDS additive has good adhesive force.
Description
Technical field
The present invention relates to common modification LDS additive, also relate to the method for modifying of LDS additive, and the composition containing this LDS additive.
Background technology
Laser direct forming (LDS) technology refers to the region utilizing computer control laser scanning, by laser radiation on the product containing laser-sensitive additive, activated circuit pattern, on this product by the region that activates can in without electrochemistry plating the metal such as metal refining copper, nickel, gold, thus realization produces conductive pattern on three-dimensional plastic product.
Along with the fast development of laser direct forming (LDS) technology, the production rate of molding interconnection element (MouldedInterconnect Device) is more fast, flow process more simplifies, cost is more controlled, Application Areas is broader, its maximum advantage is, it can reduce the component number of electronic product and save space.Such as, the antenna of LDS technology manufacture is adopted to be widely used on the mobile terminal such as smart mobile phone, notebook computer, adopt the sensor that LDS technology manufactures, minimum conductor width can reach 150 μm, between minimum line, width can reach 150 μm, this not only decreases the quantity of components and parts, also reaches the object of saving space and loss of weight.
In addition, the advantage of LDS technology is also embodied in its handiness.If need to change conductive path on components and parts, only need the circuitous pattern changed in CAD to design, do not need to redesign mould.Because LDS technology does not need mask, so its course of processing is easier, tooling cost is lower.The Materials science being applied to LDS technology have also been obtained and develops fast.Resin matrix covers general-purpose plastics, engineering plastics and special engineering plastics.Wherein relatively more typical application is the alloy of polycarbonate, polycarbonate and acrylonitrile/butadiene/styrene, and the LDS antenna made of them has been widely used on smart mobile phone, panel computer and notebook computer.
But, metallic film sticking power on the plastic part prepared in prior art is not strong, although hundred lattice tests of most of metallic film are basic at 4-10%, but, along with environment residing for metallic film is more and more severe, producer to the strict demand of scrap rate, human consumer to the rigors of quality, the sticking power of metallic film needs by various complexity and strict test, and the LDS material of prior art cannot meet this requirement.
Summary of the invention
In order to solve the problems of the technologies described above, an object of the present invention is for providing a kind of modification LDS additive altogether.
Modification LDS additive altogether, comprise the laser-sensitive compound of 100 weight parts and the hydroxyl modified compound of 10-30 weight part, described hydroxyl modified compound part is coated on described laser-sensitive compound surface, and the chemical general formula of described laser-sensitive compound is XY
2o
4, laser-sensitive compound is tesseral system, and X and Y is metallic element, and X and Y is from group IIIA, I B race, II B race, VI B race, VII B race or VIII race in the periodic table of elements;
The chemical structural formula of described hydroxyl modified compound is as follows:
Described m is the integer of 0-5, and X is univalent perssad or the hydroxyl with oh group, and the position of described X on pyridine ring is the ortho position of sulfonic acid group or a position or contraposition.
As a kind of technical scheme of the present invention, modification LDS additive altogether of the present invention also comprises containing carboxy-modified compound, and the described chemical structural formula containing carboxy-modified compound is as follows:
Described m is the integer of 0-5, and X is univalent perssad or the carboxyl with carboxylic group, and the position of described X on pyridine ring is the ortho position of sulfonic acid group or a position or contraposition.
As a kind of technical scheme of the present invention, the mass ratio containing carboxy-modified compound and hydroxyl modified compound of the present invention is 1:0.5-2.
As a kind of technical scheme of the present invention, modification LDS additive altogether of the present invention also comprises the metal hydroxides of 1-10 weight part, and described metal hydroxides part is coated on laser-sensitive compound surface.
As a kind of technical scheme of the present invention, the mass ratio of metal hydroxides of the present invention and hydroxyl modified compound is 1:3-5.
As a kind of technical scheme of the present invention, the particle diameter of laser-sensitive compound of the present invention is 1-50 micron.
The preparation method of modification LDS additive altogether, comprises the following steps:
S10, by ultrasonic disperse 5 ~ 30min in 100 weight part laser-sensitive compounds, 10-30 weight part hydroxyl modified compound, obtain emulsion;
S20, the emulsion of gained is stirred 5 ~ 30min at 50 ~ 90 DEG C after, temperature remains on 70-85 DEG C, continues reaction 2 ~ 4h;
S30, the colloidal sol obtained respectively wash 4 times with deionized water, dehydrated alcohol respectively after centrifugation, then at 90 DEG C, dry acquisition precursor powder;
S40, dried precursor powder is placed on 150 ~ 200 DEG C at calcining 2 ~ 3h obtain common modification LDS additive.
As a kind of technical scheme of the present invention, S10 step of the present invention also comprises containing carboxy-modified compound, and the described mass ratio containing carboxy-modified compound and hydroxyl modified compound is 1:0.5-2.
As a kind of technical scheme of the present invention, it is Mass Calculation that S10 step of the present invention also comprises with metal hydroxides, in metal hydroxides, the metal chloride of 1-10 weight part, after S20 step, also comprise S201 step: slowly drip 30 weight part volatile salt precipitant solution, continue reaction 2 ~ 4h.
Polyarylate compositions, comprises the polyarylate resin of 100 weight parts, the filler of 10-100 weight part, the aforesaid LDS additive of 1-30 weight part.
Hereinafter method of the present invention will be described in further detail.In following scheme, except as otherwise noted, each definition as above limited.
Embodiment
All publications mentioned in this article, patent application, patent and other reference, if do not illustrated on the contrary, all quote its full content clearly and add herein, as them in this article by full disclosure.
Unless otherwise defined, all technology used herein and scientific terminology have the identical implication usually understood with one skilled in the art of the present invention.When there is contradiction, be as the criterion with the definition in this specification sheets.
Term as used herein " by ... preparation " and " comprising " synonym.Term used herein " comprises ", " comprising ", " having ", " containing " or its other distortion any, be intended to cover the comprising of non-exclusionism.Such as, comprise the composition of listed elements, step, method, goods or device and need not be only limitted to those key elements, but other key element of clearly not listing or the intrinsic key element of this kind of composition, step, method, goods or device can be comprised.
Conjunction " by ... composition " get rid of any key element, step or the component do not pointed out.If in claim, this phrase will make claim be closed, make it not comprise material except those materials described, but except relative customary impurities.When phrase " by ... composition " to appear in the clause of claim main body instead of immediately preceding after theme time, it is only limited to the key element described in this clause; Other key element is not excluded outside described claim as a whole.
During the Range Representation that equivalent, concentration or other value or parameter limit with scope, preferable range or a series of upper limit preferred value and lower preferable values, this is appreciated that all scopes specifically disclosing and formed by arbitrary pairing of any range limit or preferred value and any range lower limit or preferred value, no matter and whether this scope separately discloses.Such as, when disclosing scope " 1 to 5 ", described scope should be interpreted as comprising scope " 1 to 4 ", " 1 to 3 ", " 1-2 ", " 1-2 and 4-5 ", " 1-3 and 5 " etc.When numerical range is described in this article, unless otherwise indicated, otherwise this scope intention comprises its end value and all integers within the scope of this and mark.
In addition, unless there is clear and definite contrary instruction, otherwise "or" refers to the "or" of comprising property instead of the "or" of exclusiveness.Such as, the following any one form A "or" B:A that all satisfies condition is true (or existence) and B is pseudo-(or not existing), A is not for pseudo-(or existing) and B is true (or existence), and A and B is very (or existence).
In addition, the indefinite article " one " before key element of the present invention or component and " one " are to quantitative requirement (i.e. occurrence number) unrestriction of key element or component.Therefore " one " or " one " should be read as and comprise one or at least one, and the key element of singulative or component also comprise plural form, unless the obvious purport of described quantity refers to singulative.
Laser-sensitive compound of the present invention refers at specific laser, if wavelength is the compound activated under the laser of 1064nm.
Modification LDS additive altogether, comprise the laser-sensitive compound of 100 weight parts and the hydroxyl modified compound of 10-30 weight part, described hydroxyl modified compound part is coated on described laser-sensitive compound surface, and the chemical general formula of described laser-sensitive compound is XY
2o
4, laser-sensitive compound is tesseral system, and X and Y is metallic element, and X and Y is from group IIIA, I B race, II B race, VI B race, VII B race or VIII race in the periodic table of elements;
The chemical structural formula of described hydroxyl modified compound is as follows:
Described m is the integer of 0-5, and X is univalent perssad or the hydroxyl with oh group, and the position of described X on pyridine ring is the ortho position of sulfonic acid group or a position or contraposition.
laser-sensitive compound
Described metallic compound preferably comprises the cluster configuration of two or more metal oxides in definable crystalline form.Total crystalline form has following general formula when being in ideal (namely not contaminated, do not derive) state:
XY
2O
4
Laser-sensitive compound is tesseral system, and X and Y is metallic element, and X and Y is from group IIIA, I B race, II B race, VI B race, VII B race or VIII race in the periodic table of elements.
Wherein
1, X is selected from the group be made up of cadmium, zinc, copper, cobalt, magnesium, tin, titanium, iron, aluminium, nickel, manganese, chromium and combination thereof, it is that the first metal oxide cluster (" metal oxide cluster 1 ", is generally tetrahedral structure) provides main cationic components;
2, Y is selected from the group be made up of cadmium, manganese, nickel, zinc, copper, cobalt, magnesium, tin, titanium, iron, aluminium, chromium and combination thereof, it is that the second metal oxide cluster (" metal oxide cluster 2 ", is generally octahedral structure) provides main cationic components;
3, wherein, in above-mentioned radicals X or Y, anyly may can be used as " X " for the metallic cation of divalent, any may be that the metallic cation of 3 valencys can be used as " Y ";
4, wherein, the geometrical configuration of " metal oxide cluster 1 " (being generally tetrahedral structure) is different from the geometrical configuration of " metal oxide cluster 2 " (being generally octahedral structure),
5, wherein, the metallic cation of X and Y can be used as the metallic cation of " metal oxide cluster 2 " (being generally octahedral structure), as when " falling " spinel type crystal structure,
6, wherein, O main (if not exclusiveness) is oxygen; And
7, wherein, described " metal oxide cluster 1 " and " metal oxide cluster 2 " form a kind of single identifiable design crystal-type structure electromagnetic radiation to high susceptibility together.
At one particularly preferably in embodiment of the present invention, CuCr can be selected
2o
4.The suitable spinel containing copper commercially can be bought and obtain, as bought from the PK 3095 of Ferro (DE), buying 34E23 or 34E30 from Johnson Matthey (DE).
At one particularly preferably in embodiment of the present invention, the copper oxide of selecting type CuO or Cu2O, preferably can use nanoparticle herein, as bought from Nanophase Technologies Corporation, NANOARC (R) the Copper Oxide of Illinois, USA.
In another particularly preferred embodiment of the present invention, senior spinel oxide can be selected, as the spinel containing manganese.The various mixture with the metallic compound of spinel structure can also be used.
hydroxyl modified compound
The chemical structural formula of described hydroxyl modified compound is as follows:
Described m is the integer of 0-5, and X is univalent perssad or the hydroxyl with oh group, and the position of described X on pyridine ring is the ortho position of sulfonic acid group or a position or contraposition.
The chemical formula of aforementioned structure can be bought by lark Wei Deng company and obtain, and also can be obtained by synthesis.The compou nd synthesis of this structure is the common practise of this area, and the present invention repeats no more.
containing carboxy-modified compound
As a kind of technical scheme of the present invention, modification LDS additive altogether of the present invention also comprises containing carboxy-modified compound, and the described chemical structural formula containing carboxy-modified compound is as follows:
Described m is the integer of 0-5, and X is univalent perssad or the carboxyl with carboxylic group, and the position of described X on pyridine ring is the ortho position of sulfonic acid group or a position or contraposition.
The chemical formula of aforementioned structure can be bought by lark Wei Deng company and obtain, and also can be obtained by synthesis.The compou nd synthesis of this structure is the common practise of this area, and the present invention repeats no more.
As one embodiment of the present invention, the mass ratio containing carboxy-modified compound and hydroxyl modified compound of the present invention is 1:0.5-2.
As one embodiment of the present invention, modification LDS additive altogether of the present invention also comprises the metal hydroxides of 1-10 weight part, and described metal hydroxides part is coated on laser-sensitive compound surface.
As one embodiment of the present invention, the mass ratio of metal hydroxides of the present invention and hydroxyl modified compound is 1:3-5.
As one embodiment of the present invention, the particle diameter of laser-sensitive compound of the present invention is 1-50 micron.
As one embodiment of the present invention, the preparation method of modification LDS additive altogether, comprises the following steps:
S10, by ultrasonic disperse 5 ~ 30min in 100 weight part laser-sensitive compounds, 10-30 weight part hydroxyl modified compound, obtain emulsion;
S20, the emulsion of gained is stirred 5 ~ 30min at 50 ~ 90 DEG C after, temperature remains on 70-85 DEG C, continues reaction 2 ~ 4h;
S30, the colloidal sol obtained respectively wash 4 times with deionized water, dehydrated alcohol respectively after centrifugation, then at 90 DEG C, dry acquisition precursor powder;
S40, dried precursor powder is placed on 150 ~ 200 DEG C at calcining 2 ~ 3h obtain common modification LDS additive.
As one embodiment of the present invention, S10 step of the present invention also comprises containing carboxy-modified compound, and the described mass ratio containing carboxy-modified compound and hydroxyl modified compound is 1:0.5-2.
As one embodiment of the present invention, it is Mass Calculation that S10 step of the present invention also comprises with metal hydroxides, in metal hydroxides, the metal chloride of 1-10 weight part, after S20 step, also comprise S201 step: slowly drip 30 weight part volatile salt precipitant solution, continue reaction 2 ~ 4h.
As one embodiment of the present invention, polyarylate compositions, comprises the polyarylate resin of 100 weight parts, the filler of 10-100 weight part, the aforesaid LDS additive of 1-30 weight part.
Embodiment 1. is modification LDS additive altogether, comprise the laser-sensitive compound of 100 weight parts and the hydroxyl modified compound of 10-30 weight part, described hydroxyl modified compound part is coated on described laser-sensitive compound surface, and the chemical general formula of described laser-sensitive compound is XY
2o
4, laser-sensitive compound is tesseral system, and X and Y is metallic element, and X and Y is from group IIIA, I B race, II B race, VI B race, VII B race or VIII race in the periodic table of elements;
The chemical structural formula of described hydroxyl modified compound is as follows:
Described m is the integer of 0-5, and X is univalent perssad or the hydroxyl with oh group, and the position of described X on pyridine ring is the ortho position of sulfonic acid group or a position or contraposition.
Embodiment 2. is identical with embodiment 1, and difference is, modification LDS additive also comprises containing carboxy-modified compound altogether, and the described chemical structural formula containing carboxy-modified compound is as follows:
Described m is the integer of 0-5, and X is univalent perssad or the carboxyl with carboxylic group, and the position of described X on pyridine ring is the ortho position of sulfonic acid group or a position or contraposition.
Embodiment 3. is identical with embodiment 2, and difference is, the described mass ratio containing carboxy-modified compound and hydroxyl modified compound is 1:0.5-2.
Embodiment 4. is identical with embodiment 1, and difference is, modification LDS additive also comprises the metal hydroxides of 1-10 weight part altogether, and described metal hydroxides part is coated on laser-sensitive compound surface.
Embodiment 5. is identical with embodiment 4, and difference is, the mass ratio of described metal hydroxides and hydroxyl modified compound is 1:3-5.
Embodiment 6. is identical with embodiment 1, and difference is, the particle diameter of described laser-sensitive compound is 1-50 micron.
Embodiment 7. is total to the preparation method of modification LDS additive, comprises the following steps:
S10, by ultrasonic disperse 5 ~ 30min in 100 weight part laser-sensitive compounds, 10-30 weight part hydroxyl modified compound, obtain emulsion;
S20, the emulsion of gained is stirred 5 ~ 30min at 50 ~ 90 DEG C after, temperature remains on 70-85 DEG C, continues reaction 2 ~ 4h;
S30, the colloidal sol obtained respectively wash 4 times with deionized water, dehydrated alcohol respectively after centrifugation, then at 90 DEG C, dry acquisition precursor powder;
S40, dried precursor powder is placed on 150 ~ 200 DEG C at calcining 2 ~ 3h obtain common modification LDS additive.
Embodiment 8. is identical with embodiment 7, and difference is, it is characterized in that, the described mass ratio containing carboxy-modified compound and hydroxyl modified compound is 1:0.5-2.
Embodiment 9. is identical with embodiment 8, difference is, it is Mass Calculation that described S10 step also comprises with metal hydroxides, in metal hydroxides, the metal chloride of 1-10 weight part, after S20 step, also comprise S201 step: slowly drip 30 weight part volatile salt precipitant solution, continue reaction 2 ~ 4h.
Embodiment 10. polyarylate compositions, comprises the polyarylate resin of 100 weight parts, the filler of 10-100 weight part, the common modification LDS additive in the claim 1-6 of 1-30 weight part described in any one claim.
Below, the present invention enumerates following examples, further describes the present invention.
Laser-sensitive compd A 1:CuCr
2o
4
Laser-sensitive compd A 2:CuO
Laser-sensitive compound A-13: CuMn
2o
4
Carboxy-modified compound B-11 6-sulfonic group-2,4-phthalic acid
Carboxy-modified compd B 2 6-sulfonic group-2,3-benzene dicarboxyl acetic acid
Carboxy-modified compd B 3 6-sulfonic group-2,3-benzene dicarboxyl valeric acid
Hydroxyl modification Compound C 1 6-sulfonic group-4-hydroxyl-2 phenylformic acid
Hydroxyl modification Compound C 2 6-sulfonic group-4-hydroxyl--2 phenylpropionic acids
Hydroxyl modification Compound C 3 6-sulfonic group-3-hydroxyl-2 phenylvaleric acid
Metal hydroxides D1: magnesium hydroxide
Metal hydroxides D2: aluminium hydroxide
The outstanding Buddhist nun of polyarylester PAR Japan blocks U8400
Embodiment 1
Modification LDS additive altogether: obtained by aforesaid preparation method, the A1 of 100 weight parts, the C1 of 10 weight parts.
Raw material prepares: the polyarylate resin of 100 weight parts, the filler of 80 weight parts, the common modification LDS additive of 5 weight parts.
Mixture: resin matrix, heat conductive filler, laser-sensitive additive, other additives are joined in high-speed mixer, mixes;
Utilize twin screw extruder to extrude obtained mixture, cool, pelletizing obtains target product;
In a mold, from for 60mm and thickness be the fan-shaped cast gate of 1.5mm to 60 × 60mm and thickness be 2mm die cavity in potting resin, carry out shaping.Cut gate portions, obtain plating tests sheet.
In the scope of 10 × 10mm of obtained plating tests sheet, use the laser irradiation device (the YAG laser peak power output of wavelength 1064nm is 13W) of LP-Z SERIES, irradiate with output rating 80%, recurrence interval 20 μ s, speed 4m/s.
The MIDCopper100XBStrike that plating process afterwards utilizes the MacDermid company without electrolysis to manufacture, with the coating bath of 60 DEG C.Take out after 20 minutes, prepare 100 above-mentioned test films in the same way, carry out hundred lattice tests.Calculating the area that on average comes off is 3.5%.
Embodiment 2
Identical with embodiment 1, but that adopt is the A2 of 100 weight parts, the C2 of 20 weight parts.Calculating the area that on average comes off is 3.5%.
Embodiment 3
Identical with embodiment 1, but that adopt is the A3 of 100 weight parts, the C3 of 30 weight parts.Calculating the area that on average comes off is 3.0%.
Comparative example 1
Identical with embodiment 1, but what adopt is the 6-sulfonic group-2-phenylformic acid of 100 weight parts, the C1 of 10 weight parts.Calculating the area that on average comes off is 5.5%.
Comparative example 2
Identical with embodiment 1, but that adopt is the A1 of 100 weight parts, the C1 of 10 weight parts, but do not adopt aforesaid method to prepare modification LDS additive altogether, but be directly added in polyarylate compositions.Calculating the area that on average comes off is 5.0%.
Can find out, the present invention is adding the modified compound with oh group, significantly improves the area that on average comes off, the sticking power of the metallic film of raising.Adopt the compound with carboxyl and sulfonic acid group effectively can improve the mechanical property of material simultaneously, in experiment of the present invention, (phenylformic acid and Phenylsulfonic acid mol ratio are 1:1 to the Izod notched Izod impact strength of the moulded piece of embodiment 1 (according to ISO 180/4A be 3.2mm at thickness) with adopting single hydroxy-acid group or sulfonic acid group, total mass is identical with C1) compared with, its shock strength improves about 30%.
Embodiment 4
Identical with embodiment 1, but that adopt is the C2 of 20 weight parts, the B1 of 10 weight parts.Calculating the area that on average comes off is 2.0%.
Embodiment 5
Identical with embodiment 1, but that adopt is the C3 of 10 weight parts, the B2 of 10 weight parts.Calculating the area that on average comes off is 2.0%.
Embodiment 6
Identical with embodiment 1, but that adopt is the C2 of 10 weight parts, the B3 of 20 weight parts.Calculating the area that on average comes off is 2.0%.
Comparative example 3
Identical with embodiment 1, but that adopt is the C2 of 20 weight parts, the B1 of 2 weight parts.Calculating the area that on average comes off is 3.5%.
Can find out, adopt specific ratio, the conformability of the two is better.
Embodiment 7
Identical with embodiment 1, but that adopt is the C2 of 20 weight parts, the B1 of 10 weight parts, 4 weight part magnesium hydroxides.Calculating the area that on average comes off is 1.0%.
Embodiment 8
Identical with embodiment 1, but that adopt is the C2 of 30 weight parts, the B1 of 15 weight parts, 10 weight part aluminium hydroxides.Calculating the area that on average comes off is 0.5%.
Embodiment 9
Identical with embodiment 1, but that adopt is the C2 of 30 weight parts, and the B1 of 15 weight parts, 10 weight part aluminium hydroxides, use ABS Zhenjiang very beautiful, PA-717C_ASTM is as resin.Calculating the area that on average comes off is 4.5%.
Although the present invention is illustrated with typical embodiment and describes, and do not mean that it is limited in shown details, because multiple amendment may be there is under spirit of the present invention and substitutes not deviating from.Thus, when those skilled in the art only use normal experiment just can obtain with the improvement of invention disclosed herein and be equal to, and believe that these improve and are equal in the spirit and scope of the present invention defined all in the claims.
Claims (8)
1. be total to modification LDS additive, comprise the laser-sensitive compound of 100 weight parts and the hydroxyl modified compound of 10-30 weight part, described hydroxyl modified compound part is coated on described laser-sensitive compound surface, and the chemical general formula of described laser-sensitive compound is XY
2o
4, laser-sensitive compound is tesseral system, and X and Y is metallic element, and X and Y is from group IIIA, I B race, II B race, VI B race, VII B race or VIII race in the periodic table of elements;
The chemical structural formula of described hydroxyl modified compound is as follows:
Described m is the integer of 0-5, and X is univalent perssad or the hydroxyl with oh group, and the position of described X on pyridine ring is the ortho position of sulfonic acid group or a position or contraposition;
Described common modification LDS additive also comprises containing carboxy-modified compound, and the described chemical structural formula containing carboxy-modified compound is as follows:
Described m is the integer of 0-5, and X is univalent perssad or the carboxyl with carboxylic group, and the position of described X on pyridine ring is the ortho position of sulfonic acid group or a position or contraposition;
The described mass ratio containing carboxy-modified compound and hydroxyl modified compound is 1:0.5-2.
2. modification LDS additive altogether according to claim 1, it is characterized in that, described common modification LDS additive also comprises the metal hydroxides of 1-10 weight part, and described metal hydroxides part is coated on laser-sensitive compound surface.
3. modification LDS additive altogether according to claim 2, it is characterized in that, the mass ratio of described metal hydroxides and hydroxyl modified compound is 1:3-5.
4. modification LDS additive altogether according to claim 1, it is characterized in that, the particle diameter of described laser-sensitive compound is 1-50 micron.
5. be total to the preparation method of modification LDS additive, comprise the following steps:
S10, by ultrasonic disperse 5 ~ 30min in 100 weight part laser-sensitive compounds, 10-30 weight part hydroxyl modified compound, obtain emulsion;
S20, the emulsion of gained is stirred 5 ~ 30min at 50 ~ 90 DEG C after, temperature remains on 70-85 DEG C, continues reaction 2 ~ 4h;
S30, the colloidal sol obtained respectively wash 4 times with deionized water, dehydrated alcohol respectively after centrifugation, then at 90 DEG C, dry acquisition precursor powder;
S40, dried precursor powder is placed on 150 ~ 200 DEG C at calcining 2 ~ 3h obtain common modification LDS additive.
6. the preparation method of modification LDS additive altogether according to claim 5, it is characterized in that, described S10 step also comprises hydroxyl modified compound, and the described mass ratio containing carboxy-modified compound and hydroxyl modified compound is 1:0.5-2.
7. the preparation method of modification LDS additive altogether according to claim 5, it is characterized in that, it is Mass Calculation that described S10 step also comprises with metal hydroxides, in metal hydroxides, the metal chloride of 1-10 weight part, after S20 step, also comprise S201 step: slowly drip 30 weight part volatile salt precipitant solution, continue reaction 2 ~ 4h.
8. polyarylate compositions, comprises the polyarylate resin of 100 weight parts, the filler of 10-100 weight part, the common modification LDS additive in the claim 1-4 of 1-30 weight part described in any one claim.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101068894A (en) * | 2004-11-17 | 2007-11-07 | Prc-迪索托国际公司 | Urethane acrylate tie coats |
| CN101842856A (en) * | 2007-08-31 | 2010-09-22 | 泽塔科尔公司 | Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom |
| CN102675615A (en) * | 2012-05-25 | 2012-09-19 | 何宇峰 | Sulfonate-type water-soluble hydroxy-containing saturated polyester resin and preparation method thereof |
| CN102770278A (en) * | 2009-12-21 | 2012-11-07 | 三菱化学欧洲合资公司 | Aromatic polycarbonate composition |
-
2015
- 2015-07-11 CN CN201510410062.4A patent/CN104987535A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101068894A (en) * | 2004-11-17 | 2007-11-07 | Prc-迪索托国际公司 | Urethane acrylate tie coats |
| CN101842856A (en) * | 2007-08-31 | 2010-09-22 | 泽塔科尔公司 | Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom |
| CN102770278A (en) * | 2009-12-21 | 2012-11-07 | 三菱化学欧洲合资公司 | Aromatic polycarbonate composition |
| CN102675615A (en) * | 2012-05-25 | 2012-09-19 | 何宇峰 | Sulfonate-type water-soluble hydroxy-containing saturated polyester resin and preparation method thereof |
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Application publication date: 20151021 |