CN104974362A - Preparation process of polyimide film - Google Patents
Preparation process of polyimide film Download PDFInfo
- Publication number
- CN104974362A CN104974362A CN201410129600.8A CN201410129600A CN104974362A CN 104974362 A CN104974362 A CN 104974362A CN 201410129600 A CN201410129600 A CN 201410129600A CN 104974362 A CN104974362 A CN 104974362A
- Authority
- CN
- China
- Prior art keywords
- kapton
- polyamic acid
- preparation technology
- film
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 229920001721 polyimide Polymers 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 27
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 239000010959 steel Substances 0.000 claims abstract description 11
- 239000004642 Polyimide Substances 0.000 claims abstract description 7
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 7
- 238000003786 synthesis reaction Methods 0.000 claims abstract description 6
- 229920005575 poly(amic acid) Polymers 0.000 claims description 25
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 24
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 24
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 16
- 206010039424 Salivary hypersecretion Diseases 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 15
- 208000026451 salivation Diseases 0.000 claims description 15
- 238000005516 engineering process Methods 0.000 claims description 13
- 235000010290 biphenyl Nutrition 0.000 claims description 12
- 239000004305 biphenyl Substances 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- 150000004984 aromatic diamines Chemical class 0.000 claims description 8
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 7
- 238000007669 thermal treatment Methods 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 3
- 150000004985 diamines Chemical class 0.000 abstract description 2
- 125000006159 dianhydride group Chemical group 0.000 abstract description 2
- 239000011159 matrix material Substances 0.000 abstract description 2
- 238000006116 polymerization reaction Methods 0.000 abstract description 2
- 238000005266 casting Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 22
- 238000000227 grinding Methods 0.000 description 6
- 238000010298 pulverizing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009102 absorption Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The invention discloses a preparation process of polyimide film. The polyimide film is prepared by virtue of the processes of raw material treatment, resin synthesis, steel strip flow casting, imidization treatment and the like and film formation. According to the preparation process, a diamine or dianhydride unit with a higher-rigidity structure is directly selected, and a polyimide matrix is prepared by adopting a homopolymerization or polymerization method, so that the strength, rigidity and dimensional stability of the polyimide film are improved; and by virtue of subsequent two-way stretching and heat treatment processes, the longitudinal and transverse moduli of the polyimide film are further improved, and the thermal expansion coefficient and thermal shrinkage rate of the polyimide film are reduced. The preparation process of the polyimide film, provided by the invention, is simple in technological process and is easy to control.
Description
Technical field
The present invention relates to a kind of preparation technology of Kapton.
Background technology
Kapton (PIF) is a kind of novel high temperature resistant organic polymer thin film.It has high-modulus, lower shrinkage, high strength, low water absorption, hydrolysis, radiation hardness, nontoxic, excellent insulativity and resistance to thermo-oxidative stability.Because it is that one of current thin-film material the most expensive is in the world so be called as " gold film ".It is the key insulating material of electric apparatus, is also the key material of micro-electronic manufacturing and encapsulation.
The polymkeric substance that the Kapton of traditional structure is is basic structural unit with pyromellitic acid anhydride (PMDA) and 4 ' 4-diaminodiphenyl oxide (ODA), by the restriction of its chemical structure, there is lower Young's modulus and larger linear expansivity and percent thermal shrinkage.The method of traditional raising Kapton modulus is by adding rigid inorganic nano-filler, adopts the method for in-situ polymerization to prepare Kapton hybrid film, to improve elasticity modulus of materials and dimensional stability.But the Kapton that this method is obtained, intensity is low, poor rigidity, dimensional stability are bad, and complex technical process, preparation process are wayward.
Summary of the invention
The technical problem to be solved in the present invention overcomes existing defect, provides a kind of preparation technology of Kapton.
In order to solve the problems of the technologies described above, the invention provides following technical scheme:
The preparation technology of a kind of Kapton of the present invention, it comprises the following steps:
(1) Feedstock treating
Aromatic diamines and biphenyl dianhydride carried out grind, pulverize, dry;
(2) resins synthesis
Be that 1:1 ~ 1:1.1 successively joins in dimethylacetamide solution and carries out dissolving and reacting by the aromatic diamines after step (1) process and biphenyl dianhydride according to mass ratio, obtain polyamic acid solution, deaeration is laggard to be entered to salivate operation;
(3) steel band salivation
Carry out steel band salivation through the polyamic acid resin solution of step (2) gained and make polyamic acid solid film;
(4) imidization process
First, when the polyamic acid solid film after salivation being progressively heated to volatilization temperature required for desolventizing and stretching will be close temperature; Afterwards, film is longitudinally elongated; Finally, at 350 ~ 400 DEG C, carry out pyroprocessing, make polyamic acid be converted into polyimide;
(5) film forming
After film after step (4) imidization process is carried out two-way stretch and thermal treatment, obtain Kapton finished product.
Further, in step (1), described aromatic diamines is the one in mphenylenediamine or Ursol D.
Further, in step (1), described biphenyl dianhydride can also be aromatic dianhydride.
Further, in step (1), described aromatic diamines is withering under vacuo, and its vacuum tightness is 80Kpa ~ 100Kpa, and drying temperature is 160 ~ 180 DEG C, 4 ~ 5 hours time of drying.
Further, in step (1), described biphenyl dianhydride is dried in drying room, and its storing temperature is 180 ~ 210 DEG C, baking time 2 ~ 5 hours.
Further, in step (2), the massfraction of described dimethylacetamide solution is 15% ~ 25%.
Further, described dimethylacetamide solution can also be dimethyl formamide solution or N-Methyl pyrrolidone solution.
The beneficial effect that the present invention reaches is:
Present invention process process is simple, preparation process easily controls; By directly selecting the diamines or dianhydride units with higher rigid structure, adopt the method for homopolymerization or copolymerization to prepare polyimide matrix, thus improve the intensity of Kapton, rigidity and dimensional stability; By follow-up two-way stretch and thermal treatment process, further increase the modulus of Kapton vertical, horizontal, reduce its thermal expansivity and percent thermal shrinkage.
Embodiment
Below the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein is only for instruction and explanation of the present invention, is not intended to limit the present invention.
Embodiment 1
(1) Feedstock treating
Carried out by mphenylenediamine grinding, pulverizing, then by its drying treatment under vacuo, vacuum tightness is 90Kpa, and temperature is 160 DEG C, 5 hours time of drying;
Carried out by biphenyl dianhydride grinding, pulverizing, then it dried in drying room, storing temperature is 180 DEG C, and baking time is 5 hours, stand-by after being down to room temperature;
(2) resins synthesis
By the mphenylenediamine after step (1) process and biphenyl dianhydride be that 1:1 successively joins in dimethylacetamide solution (its massfraction is 15%) and carries out dissolving and reacting according to mass ratio, obtain polyamic acid solution, deaeration is laggard to be entered to salivate operation;
(3) steel band salivation
Carry out steel band salivation through the polyamic acid resin solution of step (2) gained and make polyamic acid solid film;
(4) imidization process
First, when the polyamic acid solid film after salivation being progressively heated to volatilization temperature required for desolventizing and stretching will be close temperature; Afterwards, film is longitudinally elongated; Finally, at 400 DEG C, carry out pyroprocessing, make polyamic acid be converted into polyimide;
(5) film forming
After film after step (4) imidization process is carried out two-way stretch and thermal treatment, obtain Kapton finished product.
Embodiment 2
(1) Feedstock treating
Carried out by Ursol D grinding, pulverizing, then by its drying treatment under vacuo, vacuum tightness is 80Kpa, and temperature is 180 DEG C, 4 hours time of drying;
Aromatic dianhydride carried out grinding, pulverizing, then it dried in drying room, storing temperature is 210 DEG C, and baking time is 2 hours, stand-by after being down to room temperature;
(2) resins synthesis
By the Ursol D after step (1) process and aromatic dianhydride be that 1:1.1 successively joins in dimethyl formamide solution (its massfraction is 25%) and carries out dissolving and reacting according to mass ratio, obtain polyamic acid solution, deaeration is laggard to be entered to salivate operation;
(3) steel band salivation
Carry out steel band salivation through the polyamic acid resin solution of step (2) gained and make polyamic acid solid film;
(4) imidization process
First, when the polyamic acid solid film after salivation being progressively heated to volatilization temperature required for desolventizing and stretching will be close temperature; Afterwards, film is longitudinally elongated; Finally, at 350 DEG C, carry out pyroprocessing, make polyamic acid be converted into polyimide;
(5) film forming
After film after step (4) imidization process is carried out two-way stretch and thermal treatment, obtain Kapton finished product.
Embodiment 3
(1) Feedstock treating
Carried out by Ursol D grinding, pulverizing, then by its drying treatment under vacuo, vacuum tightness is 100Kpa, and temperature is 170 DEG C, 4.5 hours time of drying;
Carried out by biphenyl dianhydride grinding, pulverizing, then it dried in drying room, storing temperature is 200 DEG C, and baking time is 3 hours, stand-by after being down to room temperature;
(2) resins synthesis
By the Ursol D after step (1) process and biphenyl dianhydride be that 1:1.1 successively joins in N-Methyl pyrrolidone solution (its massfraction is 20%) and carries out dissolving and reacting according to mass ratio, obtain polyamic acid solution, deaeration is laggard to be entered to salivate operation;
(3) steel band salivation
Carry out steel band salivation through the polyamic acid resin solution of step (2) gained and make polyamic acid solid film;
(4) imidization process
First, when the polyamic acid solid film after salivation being progressively heated to volatilization temperature required for desolventizing and stretching will be close temperature; Afterwards, film is longitudinally elongated; Finally, at 350 DEG C, carry out pyroprocessing, make polyamic acid be converted into polyimide;
(5) film forming
After film after step (4) imidization process is carried out two-way stretch and thermal treatment, obtain Kapton finished product.
To the Kapton finished product test property indices of embodiment 1 to 3, result is as follows:
Last it is noted that the foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although with reference to previous embodiment to invention has been detailed description, for a person skilled in the art, it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a preparation technology for Kapton, is characterized in that, comprises the following steps:
(1) Feedstock treating
Aromatic diamines and biphenyl dianhydride carried out grind, pulverize, dry;
(2) resins synthesis
Be that 1:1 ~ 1:1.1 successively joins in dimethylacetamide solution and carries out dissolving and reacting by the aromatic diamines after step (1) process and biphenyl dianhydride according to mass ratio, obtain polyamic acid solution, deaeration is laggard to be entered to salivate operation;
(3) steel band salivation
Carry out steel band salivation through the polyamic acid resin solution of step (2) gained and make polyamic acid solid film;
(4) imidization process
First, when the polyamic acid solid film after salivation being progressively heated to volatilization temperature required for desolventizing and stretching will be close temperature; Afterwards, film is longitudinally elongated; Finally, at 350 ~ 400 DEG C, carry out pyroprocessing, make polyamic acid be converted into polyimide;
(5) film forming
After film after step (4) imidization process is carried out two-way stretch and thermal treatment, obtain Kapton finished product.
2. the preparation technology of a kind of Kapton according to claim 1, is characterized in that, in step (1), described aromatic diamines is the one in mphenylenediamine or Ursol D.
3. the preparation technology of a kind of Kapton according to claim 1, is characterized in that, in step (1), described biphenyl dianhydride can also be aromatic dianhydride.
4. the preparation technology of a kind of Kapton according to claim 1, is characterized in that, in step (1), described aromatic diamines is withering under vacuo, its vacuum tightness is 80Kpa ~ 100Kpa, and drying temperature is 160 ~ 180 DEG C, 4 ~ 5 hours time of drying.
5. the preparation technology of a kind of Kapton according to claim 1, is characterized in that, in step (1), described biphenyl dianhydride is dried in drying room, and its storing temperature is 180 ~ 210 DEG C, baking time 2 ~ 5 hours.
6. the preparation technology of a kind of Kapton according to claim 1, is characterized in that, in step (2), the massfraction of described dimethylacetamide solution is 15% ~ 25%.
7. the preparation technology of a kind of Kapton according to claim 1, is characterized in that, in step (2), described dimethylacetamide solution can also be dimethyl formamide solution or N-Methyl pyrrolidone solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410129600.8A CN104974362B (en) | 2014-04-01 | 2014-04-01 | A kind of preparation process of Kapton |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410129600.8A CN104974362B (en) | 2014-04-01 | 2014-04-01 | A kind of preparation process of Kapton |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104974362A true CN104974362A (en) | 2015-10-14 |
| CN104974362B CN104974362B (en) | 2018-08-14 |
Family
ID=54271354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410129600.8A Active CN104974362B (en) | 2014-04-01 | 2014-04-01 | A kind of preparation process of Kapton |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104974362B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110372896A (en) * | 2019-06-20 | 2019-10-25 | 重庆文理学院 | A kind of heat treatment process of low thermal expansion coefficient polyimide |
| CN110885464A (en) * | 2019-11-22 | 2020-03-17 | 桂林电器科学研究院有限公司 | Preparation method of isotropic dimensionally stable polyimide film |
| CN111057256A (en) * | 2019-11-22 | 2020-04-24 | 桂林电器科学研究院有限公司 | Preparation method of size-stable polyimide film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101289543A (en) * | 2008-06-06 | 2008-10-22 | 东华大学 | Method for preparing 1,4-di(2,4-diamino phenoxy)benzenoid form polyimide film for flexible copper clad plate |
| CN103254431A (en) * | 2013-04-23 | 2013-08-21 | 广东丹邦科技有限公司 | Polyimide film for flexible film flip chip and preparation method of polyimide film |
| CN103524768A (en) * | 2013-10-30 | 2014-01-22 | 宏威高新材料有限公司 | Novel electronic-grade polyimide film with low linear expansion coefficient and production method thereof |
| CN103524767A (en) * | 2013-10-30 | 2014-01-22 | 宏威高新材料有限公司 | Novel electronic-grade polyimide film with low linear expansion coefficient and manufacturing method thereof |
-
2014
- 2014-04-01 CN CN201410129600.8A patent/CN104974362B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101289543A (en) * | 2008-06-06 | 2008-10-22 | 东华大学 | Method for preparing 1,4-di(2,4-diamino phenoxy)benzenoid form polyimide film for flexible copper clad plate |
| CN103254431A (en) * | 2013-04-23 | 2013-08-21 | 广东丹邦科技有限公司 | Polyimide film for flexible film flip chip and preparation method of polyimide film |
| CN103524768A (en) * | 2013-10-30 | 2014-01-22 | 宏威高新材料有限公司 | Novel electronic-grade polyimide film with low linear expansion coefficient and production method thereof |
| CN103524767A (en) * | 2013-10-30 | 2014-01-22 | 宏威高新材料有限公司 | Novel electronic-grade polyimide film with low linear expansion coefficient and manufacturing method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110372896A (en) * | 2019-06-20 | 2019-10-25 | 重庆文理学院 | A kind of heat treatment process of low thermal expansion coefficient polyimide |
| CN110885464A (en) * | 2019-11-22 | 2020-03-17 | 桂林电器科学研究院有限公司 | Preparation method of isotropic dimensionally stable polyimide film |
| CN111057256A (en) * | 2019-11-22 | 2020-04-24 | 桂林电器科学研究院有限公司 | Preparation method of size-stable polyimide film |
| CN111057256B (en) * | 2019-11-22 | 2021-01-15 | 桂林电器科学研究院有限公司 | Preparation method of size-stable polyimide film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104974362B (en) | 2018-08-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Li et al. | Effect of adjustable molecular chain structure and pure silica zeolite nanoparticles on thermal, mechanical, dielectric, UV-shielding and hydrophobic properties of fluorinated copolyimide composites | |
| CN104211973B (en) | Polyimide film | |
| US10150848B2 (en) | Polymer cellulose nanocrystal composite aerogels | |
| CN104974362A (en) | Preparation process of polyimide film | |
| CN104974346B (en) | A kind of preparation method for the bimaleimide resin that liquid crystal type allyl compound is modified | |
| CN103275481B (en) | A kind of self-repair type shape memory polyurethane composite and preparation method thereof | |
| CN107556750B (en) | High-temperature-resistant polyetherimide composite foam material and preparation method thereof | |
| WO2015176545A1 (en) | High temperature-resistant thermoplastic shape-memory polyimide and preparation method therefor | |
| CN105542363B (en) | A kind of preparation method of bi-directional synchronization stretching PVDF based coextruded films | |
| CN103980490A (en) | Shape memory polyimide prepared by virtue of chemical imidization and preparation method thereof | |
| CN105237785A (en) | Preparation method for polyimide thin film | |
| Chen et al. | Dielectric properties of photocrosslinkable polyimide/functional graphene oxide composites | |
| CN102167836B (en) | Preparation method of polyvinylidene fluoride thin film | |
| CN103709348A (en) | Production method for anti-ablation temperature-resistant phenolic resin | |
| Liu et al. | Recyclable tough thermosets with an imide-hexahydrotriazine structure | |
| Huang et al. | High-strength, self-reinforcing and recyclable multifunctional lignin-based polyurethanes based on multi-level dynamic cross-linking | |
| CN107417918B (en) | Cross-linkable PBO copolymer and preparation method and application thereof | |
| Xie et al. | Thermo-and near infrared light-induced reversible multi-shape memory materials for actuators and sensors | |
| JP2002128893A (en) | Manufacturing method of polyimide powder, polyimide powder, polyimide-powder-molded article and its manufacturing method | |
| CN108440754A (en) | One kind is containing tertiary butyl substitution m-Terphenyl structure polyimide film material and preparation method thereof | |
| Tian et al. | Research on the relationship between structure and properties of the soluble polyaryl ether ketone terminated with phthalonitrile | |
| CN106977880B (en) | A kind of preparation method and applications of acid anhydride non-covalent modification graphene | |
| WO2017214743A1 (en) | Process for preparing poly(terephthaloyl-p-phenylene diamine) | |
| CN104629023A (en) | Preparation method of carbon nanotube/polyester composite material | |
| CN105131287A (en) | Method for synthesizing end-amino epoxy resin toughening type curing agent |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Chenyu Inventor after: Song Yanjiang Inventor after: Liu Shunzhen Inventor before: Song Yanjiang Inventor before: Liu Shunzhen |
|
| CB03 | Change of inventor or designer information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Preparation process of polyimide film Effective date of registration: 20200628 Granted publication date: 20180814 Pledgee: Bank of China Wuxi Binhu sub branch Pledgor: WUXI SHUNXUAN NEW MATERIALS Co.,Ltd. Registration number: Y2020980003467 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210426 Granted publication date: 20180814 Pledgee: Bank of China Wuxi Binhu sub branch Pledgor: WUXI SHUNXUAN NEW MATERIALS Co.,Ltd. Registration number: Y2020980003467 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A preparation process of polyimide film Effective date of registration: 20210811 Granted publication date: 20180814 Pledgee: WUXI BRANCH, INDUSTRIAL BANK Co.,Ltd. Pledgor: WUXI SHUNXUAN NEW MATERIALS Co.,Ltd. Registration number: Y2021320010301 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |