CN104968814A - Lower melting point binder metals - Google Patents
Lower melting point binder metals Download PDFInfo
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- CN104968814A CN104968814A CN201380072460.9A CN201380072460A CN104968814A CN 104968814 A CN104968814 A CN 104968814A CN 201380072460 A CN201380072460 A CN 201380072460A CN 104968814 A CN104968814 A CN 104968814A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
- C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
- C22C29/08—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on tungsten carbide
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
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- E—FIXED CONSTRUCTIONS
- E21—EARTH DRILLING; MINING
- E21B—EARTH DRILLING, e.g. DEEP DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
- E21B10/54—Drill bits characterised by wear resisting parts, e.g. diamond inserts the bit being of the rotary drag type, e.g. fork-type bits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
Abstract
A copper, manganese, nickel, zinc and tin binder metal composition having a melting point of 1500 DEG For less that includes zinc and tin at a sum weight of about 26.5% to about 30.5% in which zinc is at least about 12% and Sn is at least about 6.5%.
Description
Background technology
The manufacture of frame of the bit relates to the mixture that heating is placed on the hard matrix granule (as wolfram varbide) in frame of the bit mould and metal-to-metal adhesive (binder metal), and described heating continues to penetrate in described hard matrix granule to make described metal-to-metal adhesive for about 75 to 205 minutes at the temperature of 1875-2100 Fahrenheit degree (°F).Process of osmosis creates the metal-matrix matrix material of formation " frame of the bit ".When molten metal binder to flow through the space between the crystal grain of hard matrix granule by wicking action, permeate.After cooling, hard matrix granule and metal-to-metal adhesive form hard, durable, solid metal-matrix matrix material.If process of osmosis is incomplete, then frame of the bit is normally defective, and may have crackle.Permeate the surrounding the molten metal binder be attached on matrix grain of depending on the crystal grain flowing through hard matrix granule.For permeating completely, metal-to-metal adhesive thoroughly melts, to have good mobility and tack.But, when diamond-impregnated bit body (wherein diamond is also mixed into or embeds in matrix granule), long Thief zone temperature (e.g., 1875 to 2100 °F) compromises diamond, and adds the thermal rupture tendency of frame of the bit.
Summary of the invention
Content introduction of the present invention series of concepts, has further description in these concepts embodiment below.Content of the present invention, neither be intended to key feature or the essential feature of determining claimed theme, neither be intended to the scope of the theme helping restriction claimed.
In some embodiments, metal adhesive compositions has 1500 °F or lower fusing point, this metal-to-metal adhesive comprises zinc (Zn) and the tin (Sn) that gross weight accounts for about 26.5% to about 30.5%, and wherein Zn accounts at least about 12% and Sn accounts at least about 6.5%; Nickel (Ni) accounts for about 4.5% to about 6.5 % by weight; Manganese (Mn) accounts for about 11% to about 26 % by weight; And copper (Cu) accounts for about 40% to about 55 % by weight.In some embodiments, metal adhesive compositions does not comprise manganese (Mn).Disclosed metal-to-metal adhesive is used for permeating hard matrix granule at the infiltration temperature of 1800 °F or lower as permeate agent, and this metal-to-metal adhesive keeps the intensity suitable with the matrix prepared with metal-to-metal adhesive available at present and toughness.
Accompanying drawing explanation
Describe the embodiment of metal-to-metal adhesive with reference to the accompanying drawings.
Fig. 1-6 shows by the temperature correlation heat flow curve calculated according to each dsc of carrying out (DSC) in the following metal-to-metal adhesive of one or more embodiment: the respective metal tackiness agent represented respectively by formula 2, formula 3, formula 4, formula 5, formula 6 and comparison expression 1; Wherein top line represents heating curve (5) and bottom line represents cooling curve (10), and the melting temperature recorded is the instruction peak value (15) of heating curve (5).
Fig. 7 is scanning electronic microscope (SEM) image, it illustrates the adhesive construction of percolated metal-groundmass composite material after Spinodal etchant etching prepared by the rich Cu metal-to-metal adhesive of tungsten carbide particle and comparison expression 1, wherein indicate wolfram varbide (20) and rich Cu phase (25).
Fig. 8 is energy dispersive spectrometry (EDS) spectrum, it illustrates the single rich Cu FCC (face-centered cubic) phase (25) of the comparison expression 1 metal-matrix matrix material of Fig. 7.
Fig. 9 is scanning electronic microscope (SEM) image, it illustrates the adhesive construction of metal-matrix matrix material after Spinodal etchant etching prepared by the metal-to-metal adhesive of tungsten carbide particle and formula 4 according to one or more embodiment.
Figure 10 is the EDS spectrum of rich Sn and the Ni FCC phase (35) of formula 4 metal-matrix matrix material according to Fig. 9 of one or more embodiment.
Figure 11 is the EDS spectrum of rich Cu and the Zn FCC phase (30) of formula 4 metal-matrix matrix material according to Fig. 9 of one or more embodiment.
Figure 12 shows according to the wolfram varbide with infiltration of one or more embodiment and the solid substrate of formula 4 metal-to-metal adhesive three opticmicroscope (OM) images at three infiltration temperature of shown 1950 °F, 1800 °F and 1700 °F, wherein indicates eta phase (40), monocrystalline tungsten carbide (20) and cast tungsten carbide (22).
Figure 13 is transmission electron microscope (TEM) image of the metal-to-metal adhesive of comparison expression-1, and the FCC lattice parameter wherein recorded is
(as a reference,
), indicate the rich Cu tackiness agent (45) of single FCC phase.
Figure 14 is selection area diffraction (SAD) pattern of the TEM image of Figure 13.
Figure 15 is the TEM image of the FCC-1 phase (50) according to the formula 3 of one or more embodiment, and the FCC lattice parameter wherein recorded is
Figure 16 is the SAD pattern of the TEM image of Figure 15.
Figure 17 is the TEM image of the FCC-2 phase (55) according to the formula 3 of one or more embodiment, and the FCC lattice parameter wherein recorded is
Figure 18 shows selection area diffraction (SAD) pattern of the TEM image of Figure 17.
Figure 19 shows sample inclination to the SAD pattern becoming the TEM image of the Figure 17 obtained after another angle with the TEM image of Figure 18.
Figure 20 is the TEM image of FCC-1 (50) according to formula 3 metal-to-metal adhesive of one or more embodiment and FCC-2 (55) phase, and its magnification is lower than the TEM image of Figure 15 and 17.
Embodiment
Earth-boring bits body can be made up of metal-matrix matrix material, and described matrix material comprises hard particles phase and ductile metals phase.Hard phase comprises fire-resistant or ceramic compound (such as, nitride and carbide are as wolfram varbide), and metallographic phase can be metal-to-metal adhesive, the metal be such as made up of copper and other non-ferrous alloy.Powder (i.e. particle) metallurgy method can be used to form metal-matrix matrix material, and the method comprises hot pressing, sintering and infiltration.Frame of the bit impregnatedly can have superhard material going up at least partially of its outside surface.Such frame of the bit is called as the frame of the bit of impregnated superhard material.For the frame of the bit of impregnated superhard material, metal-matrix matrix material is also used as the propping material supporting superhard material.In such embodiments, metal-matrix matrix material has physical properties controlled especially and mechanical properties, to expose superhard material.Form the method for frame of the bit as U.S. Patent number 6,394,202 and U.S. Patent number 8,109, described in 177.Some examples of frame of the bit comprise impregnated bit body, the have abrasive material hot pressing insert impregnated bit body of (GHI, grit hot-pressed insert) and polycrystalline diamond composite sheet (PDC) frame of the bit.
As described herein, the infiltration of metal-matrix matrix material comprises metal-matrix is heated to certain temperature, and this temperature high must being enough to makes metal-to-metal adhesive (also referred to as permeate agent) melt and be bonded to hard particles phase.So, in the process of osmosis of metal-matrix matrix material, metal-to-metal adhesive starts melting and flowing, and is attached on the crystal grain of grit.Therefore, the melting temperature of metal-to-metal adhesive directly determines the infiltration temperature for the formation of metal-matrix matrix material.As used herein, fusing point or temperature of fusion are the liquidus temperature of concrete composition, as Hsin Wang and Wallace Porter, described in ThermalConductivity 27/Thermal Expansion in October, 15,2004 (ISBN-10:1932078347|ISBN-13:978-1932078343).
According to one or more embodiment, the infiltration temperature that the tackiness agent with 1500 °F or lower fusing point allows is about 1800 °F or lower, and brings the improvement of the phase of metal-matrix matrix material.In some embodiments, the face-centered cubic-1 (FCC-1) in the matrix material formed by above-mentioned metal-to-metal adhesive is in FCC-2 phase the state roughly balanced mutually.Namely the ratio of FCC-1 and FCC-2 is that 1-1.5 (FCC-1) is than 1.0 (FCC-2).In addition, under about 1800 °F or lower hyposmosis temperature, the eta phase of matrix material reduces.The thermal rupture by the eta phase and frame of the bit that roughly (1.0-1.5:1.0) FCC-1 phase of balancing and the matrix material of FCC-2 phase are formed with minimizing with minimizing is inclined to.
Example for the superhard material in impregnated bit body comprises polycrystalline diamond (PCD) and thermally-stabilised polycrystalline diamond (TSP), and both is all known in the art.The example of PCD and TSP material as U.S. Patent number 8,020, described in 644.Any suitable tackiness agent (such as cobalt or silicon carbide tackiness agent) can be used to form TSP material.In addition, the TSP material of higher density is formed by the PCD material of the higher density utilizing less cobalt binder.In some embodiments, when forming the frame of the bit of impregnated superhard material, metal-matrix matrix material obtains by permeating at the infiltration temperature of about 1800 °F with the metal-to-metal adhesive compared with low melting point temperature disclosed by the invention.In some embodiments, when forming impregnated bit body (sometimes also referred to as diamond-impregnated bit body) of impregnated PCD or TSP, metal-matrix matrix material obtains by permeating at the infiltration temperature of about 1800 °F with the metal-to-metal adhesive compared with low melting point temperature disclosed by the invention, makes diamond be not easy to suffer damage in the course of processing of diamond-impregnated bit body like this.
One or more embodiment comprises a kind of metal adhesive compositions, this metal adhesive compositions has 1500 °F or lower melting temperature, and wherein metal-to-metal adhesive copper removal (Cu), manganese (Mn) and nickel (Ni) also comprise the tin (Sn) of increasing amount and these two kinds of metals of zinc (Zn) and specific total amount outward.As described herein; for the manufacture of the metal adhesive compositions in frame of the bit parts, there is 1500 °F or lower melting temperature; and fully melt to obtain good mobility and the tack to grit matrix grain at lower infiltration temperature (as 1800 °F or lower), thus effectively reduce the thermal rupture tendency of frame of the bit.
In some embodiments, compared with the metal adhesive compositions of low melting point temperature, there is the intensity suitable with the metal adhesive compositions of higher melt temperature.That is, in metal adhesive compositions, Sn or Zn of specific increase significantly reduces the melting temperature of metal-to-metal adhesive, and does not damage the viscosifying power of metal-to-metal adhesive, intensity or toughness.
By the equilibrium phase diagram and simulation process of setting (under Gulliver-Scheil non-equilibrium condition) that use thermodynamical model to perform multi-component alloys system, determine Cu-Mn-Ni-Zn-Sn metal-to-metal adhesive alloy composite and there is 1500 °F or lower melting temperature, gross weight wherein together with Sn with Zn is increase relative to the metal-to-metal adhesive used at present, but can not damage viscosifying power, intensity or toughness.In fact, by solid metal-matrix that metal-to-metal adhesive disclosed herein is made, there are two phases, comparatively speaking with other metal-to-metal adhesive (such as, the metal-to-metal adhesive of the comparison expression 1 described in table 1, its have 1655 °F record fusing point) matrix made only has single phase.
As used herein in the present, term " about " represents before being used in numerical value that this numerical value comprises and is less than this numerical value 0.5 and is greater than this numerical value 0.5.
In some embodiments, metal adhesive compositions has 1500 °F or lower fusing point, and comprises Cu, Mn, Ni, Zn and Sn, and wherein Sn accounts at least about 6.5 % by weight; The gross weight of Zn and Sn accounts for about 26.5 % by weight to about 30.5 % by weight; Ni accounts for about 4.5 % by weight to about 6.5 % by weight; Mn accounts for about 11 % by weight to about 26 % by weight; And Cu accounts for about 40 % by weight to about 55 % by weight.
In other embodiments, composition does not comprise manganese, and the copper containing weight balancing amount.Such as, Sn accounts for and accounts for about 26.5% to about 30.5% at least about the gross weight of 6.5 % by weight, Sn together with Zn; Ni accounts for about 4.5 to about 6.5 % by weight; And Cu accounts for about 51 to about 81 % by weight.
In some embodiments, metal adhesive compositions has 1500 °F or lower fusing point, and comprises Cu, Mn, Ni, Zn and Sn, and wherein Sn accounts for and accounts for about 26.5% to about 30.5% at least about the gross weight of 6.75 % by weight, Sn together with Zn; Ni accounts for about 4.5 to about 6.5 % by weight; Mn accounts for about 14 to about 21 % by weight; About 45 to about 52 % by weight are accounted for Cu.
In some embodiments, metal adhesive compositions has 1500 °F or lower fusing point, and comprises Cu, Mn, Ni, Zn and Sn, and wherein Sn accounts for and accounts for about 26.5% to about 30.5% at least about the gross weight of 6.75 % by weight, Sn together with Zn; Ni accounts for about 4.5 to about 6.5 % by weight; Mn accounts for about 17 % by weight; About 49% is accounted for Cu.
In some embodiments, metal adhesive compositions has 1500 °F or lower fusing point, and comprises Cu, Mn, Ni, Zn and Sn, and wherein Sn accounts for about 6.75% to about 16 % by weight; Zn accounts for about 12% to about 22.75 % by weight; Ni accounts for about 4.5% to about 6.5 % by weight; Mn accounts for about 11 to about 26 % by weight; And Cu accounts for about 40 to about 55 % by weight.
In other embodiments, metal adhesive compositions has 1500 °F or lower fusing point, and is included in Cu, Mn, Ni, Zn and Sn of being represented by formula 2 herein, and wherein Sn accounts for about 16 % by weight; Zn accounts for about 12 % by weight; Ni accounts for about 6 % by weight; Mn accounts for about 17 % by weight; And Cu accounts for about 49% weight.Fig. 1 shows the DSC temperature curve of formula 2 metal-to-metal adhesive, and it records peak value (15) place of fusing point in heating curve (5).As shown in Figure 1, the fusing point that records of the metal-to-metal adhesive of formula 2 is 771 DEG C (1420 °F).
In other embodiments, metal adhesive compositions has 1500 °F or lower fusing point, and is included in Cu, Mn, Ni, Zn and Sn of being represented by formula 3 herein, and wherein Sn accounts for about 10 % by weight; Zn accounts for about 19 % by weight; Ni accounts for about 5 % by weight, Mn and accounts for about 17 % by weight; And Cu accounts for about 49 % by weight.Fig. 2 shows the DSC temperature curve of formula 3 metal-to-metal adhesive, and it records peak value (15) place of fusing point in heating curve (5).As shown in Figure 2, the fusing point that records of the metal-to-metal adhesive of formula 3 is 798 DEG C (1468 °F).
In other embodiments, metal adhesive compositions has 1500 °F or lower fusing point, and is included in Cu, Mn, Ni, Zn and Sn of being represented by formula 4 herein, and wherein Sn accounts for about 13 % by weight; Zn about 15.5 % by weight; Ni accounts for about 5.5 % by weight; Mn accounts for about 17 % by weight; And Cu accounts for about 49 % by weight.Fig. 3 shows the DSC temperature curve of formula 4 metal-to-metal adhesive, and it records peak value (15) place of fusing point in heating curve (5).As shown in Figure 3, the fusing point that records of the metal-to-metal adhesive of formula 4 is 779 DEG C (1434 °F).
In other embodiments, metal adhesive compositions has 1500 °F or lower fusing point, and is included in Cu, Mn, Ni, Zn and Sn of being represented by formula 5 herein, and wherein Sn accounts for about 15 % by weight; Zn accounts for about 12.5 % by weight; Ni accounts for about 6.5 % by weight; Mn accounts for about 17 % by weight; And Cu accounts for about 49 % by weight.Fig. 4 shows the DSC temperature curve of formula 5 metal-to-metal adhesive, and it records peak value (15) place of fusing point in heating curve (5).As shown in Figure 4, the fusing point that records of the metal-to-metal adhesive of formula 5 is 779 DEG C (1434 °F).
In other embodiments, metal adhesive compositions has 1500 °F or lower fusing point, and is included in Cu, Mn, Ni, Zn and Sn of being represented by formula 6 herein, and wherein Sn accounts for about 6.75 % by weight; Zn accounts for about 22.75 % by weight; Ni accounts for about 4.5 % by weight; Mn accounts for about 17 % by weight; And Cu accounts for about 49 % by weight.Fig. 5 shows the DSC temperature curve of formula-6 metal-to-metal adhesive, and it records peak value (15) place of fusing point in heating curve (5).As shown in Figure 5, the fusing point that records of the metal-to-metal adhesive of formula 6 is 811 DEG C (1492 °F).
Fig. 6 shows the DSC temperature curve of comparison expression 1, and it records peak value (15) place of fusing point in heating curve (5).As shown in Figure 6, the fusing point that records of the metal-to-metal adhesive of comparison expression 1 is 902 DEG C (1655 °F).
Table 1 below illustrates multiple chemical formula of formula 2,3,4,5,6 and comparison expression 1 and record melting temperature (the DSC curve by Fig. 1-6), and crystallization property (based on calculation of thermodynamics).Pointed crystallization property comprises face-centered cubic (FCC) data of each alloy.
Table 1
According to some embodiments, the metal-to-metal adhesive with 1500 °F or lower fusing point has the sosoloid FCC-1/FCC-2 Microstructure attributes of balance, this Microstructure attributes did not all find in other metal-to-metal adhesive (such as, the metal-to-metal adhesive of comparison expression 1).The balance of the FCC-1 (30) in the metal-matrix matrix material be made up of the metal-to-metal adhesive of formula 4 and FCC-2 (35) phase as shown in SEM image (Fig. 9), and provides corresponding sxemiquantitative chemical constitution in energy-dispersive spectroscopy (EDS) (Figure 10 and 11).The two-phase metal-matrix (FCC-1 (50) and FCC-2 (55)) of formula 3 tackiness agent also Figure 15,17 and 20 TEM image in be resolved out.By contrast, the metal-to-metal adhesive of comparison expression 1 is resolved out in SEM and the EDS image of Fig. 7 and 8, and wherein single FCC-1 (25) metal-to-metal adhesive is occupied an leading position in metal-matrix matrix material.The single FCC-1 phase (45) of the metal-to-metal adhesive of comparative example 1 is also resolved out in the TEM image shown in Figure 13.These observed results conform to multicomponent thermodynamical model, as shown in table 1.(difference calculating fusing point and measured value is that thermodynamic data storehouse owing to employing extrapolation in this research and chemical constitution change.)
According to some embodiments, the metal-to-metal adhesive with 1500 °F or lower fusing point penetrates in matrix granule (as wolfram varbide), to be formed in the metal-matrix matrix material used in frame of the bit at lower infiltration temperature.Opticmicroscope (OM) image of Figure 12 shows 1950 °F, the responding layer that formed around cast tungsten carbide (20) at the infiltration temperature of 1800 °F and 1700 °F (as indicated).Lower infiltration temperature reduces the dissolving of cast tungsten carbide (22) and inhibits the formation of brittlement phase (as carbon defects eta-phase (40)).In addition, lower infiltration temperature maintains adamantine integrity.
In some embodiments, metal adhesive compositions comprises additive element, and what wherein said additive element accounted for described metal adhesive compositions is up to about 5 % by weight.Such as, additive element comprises boron, silicon, iron, cobalt, aluminium, titanium, niobium, molybdenum, tungsten and/or their combination.Such as, metal adhesive compositions can comprise boron and silicon simultaneously.In some embodiments, what the boron added together and silicon accounted for metal adhesive compositions is up to about 5 % by weight.In some embodiments, the boron added together and silicon account for and are up to about 0.5 % by weight.In some embodiments, the boron comprised accounts for 0.05% to 0.07 % by weight, and the silicon added accounts for 0.15 to 0.18 % by weight.
In some embodiments, the metal-matrix matrix material with low melting point metal tackiness agent disclosed herein is used in have and is multiplely arranged in the frame of the bit of blade (as rib (rib)) on frame of the bit and the manufacture of cutting element, such as U.S. Patent number 8,020, described in detail by 644.As described in this reference, metal-matrix material can combine from different hard particles with the frame of the bit with blade preparing all respects and cutting element.For the preparation of at U.S. Patent number 8,100, the metal-matrix matrix material of parts disclosed in 203 can comprise low melting point metal tackiness agent disclosed herein, and its fusing point is 1500 °F or lower.Such as, in some embodiments, make metal-matrix matrix material with low melting point metal tackiness agent disclosed by the invention, adopt this metal-matrix matrix material to make frame of the bit, this frame of the bit comprises one or more blade with diamond abrasive (grit).In other embodiments, polycrystalline diamond composite sheet (PDC) insert be attached on frame of the bit has the base material be made up of metal-matrix matrix material, and this metal-matrix matrix material is made up of low melting point metal tackiness agent disclosed by the invention.In other embodiments, thermally-stabilised polycrystalline diamond (TSP) cutting element comprises the base material prepared by metal-matrix matrix material, and this metal-matrix matrix material is made up of low melting point metal tackiness agent disclosed by the invention.The method using PCD or TSP cutting element is known in the art, such as U.S. Patent number 6,892,836 and U.S. Patent Publication No. 2010/0126779 described in.In another example, as mentioned above, low melting point metal tackiness agent disclosed by the invention as permeate agent for the formation of in abrasive material hot pressing insert (GHI), such as, as U.S. Patent number 6,394,202 and U.S. Patent number 8,109, described in 77.In all above-mentioned embodiments, low melting point metal tackiness agent disclosed herein can be used to replace metal-to-metal adhesive disclosed in quoted reference.
Following embodiment is only for illustration of property object, does not limit scope or the content of the application.
Embodiment
The character of the metal-to-metal adhesive of embodiment 1 formula 2-6
As shown in table 2 below, analyze mechanical properties and the energy properties of the metal-to-metal adhesive of formula 2-6, and show data so that compared with the metal-to-metal adhesive of comparison expression 1.
Table 2
Infiltration temperature is deposite metal tackiness agent and allows metal-to-metal adhesive to have good fluidity and be attached to temperature required on the crystal grain (as tungsten carbide crystal grain) of grit.As shown in table 2, the metal-to-metal adhesive of formula 2,3,4,5 and 6 has the infiltration temperature of 1800 °F, this metal-to-metal adhesive than formula 2,3,4,5 and 6 melting temperature height separately about 300 degree.By contrast, the metal-to-metal adhesive of contrast 1 has the fusing point of 1655 °F, has the infiltration temperature of 1950 °F.The infiltration temperature with the metal-to-metal adhesive of the formula 2-6 of 1500 °F or lower fusing point can make infiltration hard phase matrix granule (as wolfram varbide) carry out under 1800 °F or lower temperature.In some embodiments, metal-to-metal adhesive as disclosed herein is used for permeating at the infiltration temperature of about 1790 °F.In some embodiments, metal-to-metal adhesive as disclosed herein is used for permeating at the infiltration temperature of about 1780 °F.In other embodiments, metal-to-metal adhesive as disclosed herein is used for permeating at the infiltration temperature of about 1770 °F.
The solid substrate of wolfram varbide and metal-to-metal adhesive measures cross-breaking strength (TRS), and described metal-to-metal adhesive is each metal-to-metal adhesive of formula 2-6 and comparison expression 1.In table 2, the solid substrate of the metal-to-metal adhesive of use formula 2,3,4,5 or 6 has the TRS of 121 ± 5 (per square inch kips), and this is suitable with the TRS of the solid metal-groundmass composite material be made up of the metal-to-metal adhesive of comparison expression 1.
The linear elasticity plane strain fracture toughness KIC of solid metal-groundmass composite material measures by using single shaft bending method, with inch-pound or ksiin
1/2represent result.The toughness of the solid substrate of the metal-to-metal adhesive of use formula 2,3,4,5 or 6 is suitable with the toughness of the solid metal-groundmass composite material be made up of the metal-to-metal adhesive of comparison expression 1.
Embodiment 2 dsc (DSC)
Dsc analysis is carried out according to standard method known in the art.In brief, the model DSC 404Fl of NETZSCH is used
differential scanning calorimeter analyze the fusing of each metal-to-metal adhesive, to measure the conversion of energy of metal-to-metal adhesive.
Embodiment 3 prepares OM and SEM of solid metal-groundmass composite material
Solid metal-groundmass composite material is made up of tungsten carbide particle and metal-to-metal adhesive, forms solid metal-groundmass composite material by the infiltration of tungsten carbide particle and metal-to-metal adhesive.Tackiness agent TEM sample is prepared according to standard program, and by Gatan Precision Ion Polishing System (PIPS
tM) complete final reduction process.JEOL 2010 transmission electron microscope carries out tem observation and analysis, acceleration voltage 200kV.Obtain selection area diffraction (SAD) pattern of each TEM image.Corresponding to the TEM image of Figure 13 SAD pattern as shown in Figure 14.Corresponding to the TEM image of Figure 15 SAD pattern as shown in Figure 16, and correspond to Figure 17 TEM image two SAD patterns in two different angles as shown in figs. 18 and 19.
Disclosed in this paper entire chapter, (wherein the gross weight % of Zn and Sn is 26.5% to 30.5%, and wherein Zn accounts at least 12% and Sn accounts at least 6.75% to comprise the metal-to-metal adhesive of Cu, Mn, Ni, Zn and Sn; Ni accounts for 4.5% to 6.5 % by weight; Mn accounts for 11% to 26 % by weight; And Cu accounts for 40% to 55 % by weight) there is 1500 °F or lower fusing point, and there is the cross-breaking strength of 90-140ksi, it changes along with hard phase matrix granule.As shown in the accompanying drawing of this specification sheets and discuss, the metal-to-metal adhesive of disclosed embodiments of the present invention penetrates in hard matrix granule under about 1800 °F or lower infiltration temperature.
Although only describe a few exemplary embodiment in detail above, the many improvement of those skilled in the art's easy understand is possible, and do not depart from fact content disclosed by the invention, and all these improvement all will be included within scope disclosed by the invention.The clearly intention of applicant is not quote 35 U.S.C.112, makes any restriction for the 6th section to any claim herein, except those be specifically used together with correlation function wherein word " for ... means " claim.
Claims (20)
1. metal adhesive compositions, it has the fusing point of 1500 ℉ or lower, and this metal adhesive compositions comprises:
Zinc (Zn) at least about 12 % by weight;
Tin (Sn) at least about 6.5 % by weight;
The nickel (Ni) of about 4.5 % by weight to about 6.5 % by weight;
The manganese (Mn) of about 11 % by weight to about 26 % by weight;
The copper (Cu) of about 40 % by weight to about 55 % by weight; And
The gross weight of Zn and Sn accounts for about 26.5 % by weight to about 30.5 % by weight.
2. the metal adhesive compositions of claim 1, wherein Mn accounts for about 14 % by weight to about 21 % by weight, and Cu accounts for about 40 % by weight to about 55 % by weight.
3. the metal adhesive compositions of claim 1, wherein Mn accounts for about 17 % by weight, and Cu accounts for about 49 % by weight.
4. the metal adhesive compositions of claim 1, also comprises the additive being selected from boron, silicon, iron, cobalt, aluminium, titanium, niobium, molybdenum, tungsten and combination thereof.
5. percolated metal-groundmass composite material, comprises: the hard matrix granule permeated with the metal adhesive compositions of claim 1.
6. percolated metal-the groundmass composite material of claim 5, wherein percolated metal-matrix has the cross-breaking strength (TRS) of 90-140ksi.
7. frame of the bit, it comprises multiple blade, and described multiple blade comprises the percolated metal-groundmass composite material of claim 5.
8. percolated metal-groundmass composite material, it comprises the metal adhesive compositions of claim 1, wherein said percolated metal tackiness agent has the mixture of the first face-centered cubic (FCC) and the 2nd FCC phase, and a FCC phase has the chemical parameters and lattice parameter that are different from the 2nd FCC phase.
9. percolated metal-the groundmass composite material of claim 8, a wherein said FCC phase is about 1 to 1.5:1 with the ratio of described 2nd FCC phase.
10. frame of the bit, comprises: the hard matrix granule permeated with the metal adhesive compositions of claim 1.
11. metal adhesive compositions, it has the fusing point of 1500 ℉ or lower, and this metal adhesive compositions comprises:
The Sn of about 6.5 % by weight to about 16 % by weight;
The Zn of about 12 % by weight to about 22.75 % by weight;
The Ni of about 4.5 % by weight to about 6.5 % by weight;
The Mn of about 11 % by weight to about 26 % by weight; With
The Cu of about 40 % by weight to about 55 % by weight.
The metal adhesive compositions of 12. claims 11, wherein Mn accounts for about 17 % by weight, and Cu accounts for about 49 % by weight.
The metal adhesive compositions of 13. claims 12, wherein Sn accounts for about 16 % by weight; Zn accounts for about 12 % by weight, and Ni accounts for about 6 % by weight.
The metal adhesive compositions of 14. claims 12, wherein Sn accounts for about 10 % by weight, Zn and accounts for about 19 % by weight, and Ni accounts for about 5 % by weight.
The metal adhesive compositions of 15. claims 12, wherein Sn accounts for about 13 % by weight, Zn and accounts for about 15.5 % by weight, and Ni accounts for about 5.5% weight.
The metal adhesive compositions of 16. claims 12, wherein Sn accounts for about 15 % by weight, Zn and accounts for about 12.5 % by weight, and Ni accounts for about 6.5 % by weight.
The metal adhesive compositions of 17. claims 12, wherein Sn accounts for about 6.75 % by weight, Zn and accounts for about 22.75 % by weight, and Ni accounts for about 4.5 % by weight.
The method of 18. formation percolated metal-groundmass composite materials, comprising:
Use metal-to-metal adhesive infiltration tungsten carbide particle, described metal-to-metal adhesive comprises:
Zinc (Zn) at least about 12 % by weight;
Tin (Sn) at least about 6.5 % by weight;
The nickel (Ni) of about 4.5 % by weight to about 6.5 % by weight;
The manganese (Mn) of about 11 % by weight to about 26 % by weight;
The copper (Cu) of about 40 % by weight to about 55 % by weight; And
The gross weight of Zn and Sn accounts for about 26.5 % by weight to about 30.5 % by weight.
The method of 19. claims 18, wherein said infiltration is permeated under being included in the temperature of about 1800 ℉ or lower.
20. metal adhesive compositions, it has the fusing point of 1500 ℉ or lower, and this metal adhesive compositions comprises:
Zinc (Zn) at least about 12 % by weight;
Tin (Sn) at least about 6.5 % by weight;
The nickel (Ni) of about 4.5 to about 6.5 % by weight;
The copper (Cu) of about 51 to about 81 % by weight; And
The gross weight of Zn and Sn accounts for about 26.5 % by weight to about 30.5 % by weight.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261748045P | 2012-12-31 | 2012-12-31 | |
| US61/748,045 | 2012-12-31 | ||
| US13/836,734 | 2013-03-15 | ||
| US13/836,734 US20140182948A1 (en) | 2012-12-31 | 2013-03-15 | Lower melting point binder metals |
| PCT/US2013/076356 WO2014105595A1 (en) | 2012-12-31 | 2013-12-19 | Lower melting point binder metals |
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| Publication Number | Publication Date |
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| CN104968814A true CN104968814A (en) | 2015-10-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201380072460.9A Pending CN104968814A (en) | 2012-12-31 | 2013-12-19 | Lower melting point binder metals |
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| Country | Link |
|---|---|
| US (1) | US20140182948A1 (en) |
| CN (1) | CN104968814A (en) |
| WO (1) | WO2014105595A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110643880A (en) * | 2019-11-07 | 2020-01-03 | 广东省材料与加工研究所 | Drill bit matrix material and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3181269A1 (en) | 2015-12-18 | 2017-06-21 | VAREL EUROPE (Société par Actions Simplifiée) | Method of reducing intermetallic ompounds in matrix bit bondline by reduced temperature process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1026337C (en) * | 1990-01-05 | 1994-10-26 | 诺顿公司 | Low melting point copper-manganese-zine alloy for infiltration binder in matrix body rock drill bits |
| EP0967293A2 (en) * | 1998-06-26 | 1999-12-29 | Kiyohito Ishida | Functionally graded alloy, use thereof and method for producing the same |
| EP1077268A1 (en) * | 1999-08-12 | 2001-02-21 | Smith International, Inc. | Composition for binder material |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6375706B2 (en) * | 1999-08-12 | 2002-04-23 | Smith International, Inc. | Composition for binder material particularly for drill bit bodies |
| US20040244540A1 (en) * | 2003-06-05 | 2004-12-09 | Oldham Thomas W. | Drill bit body with multiple binders |
| US8349466B2 (en) * | 2007-02-22 | 2013-01-08 | Kennametal Inc. | Composite materials comprising a hard ceramic phase and a Cu-Ni-Sn alloy |
-
2013
- 2013-03-15 US US13/836,734 patent/US20140182948A1/en not_active Abandoned
- 2013-12-19 CN CN201380072460.9A patent/CN104968814A/en active Pending
- 2013-12-19 WO PCT/US2013/076356 patent/WO2014105595A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1026337C (en) * | 1990-01-05 | 1994-10-26 | 诺顿公司 | Low melting point copper-manganese-zine alloy for infiltration binder in matrix body rock drill bits |
| EP0967293A2 (en) * | 1998-06-26 | 1999-12-29 | Kiyohito Ishida | Functionally graded alloy, use thereof and method for producing the same |
| EP1077268A1 (en) * | 1999-08-12 | 2001-02-21 | Smith International, Inc. | Composition for binder material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110643880A (en) * | 2019-11-07 | 2020-01-03 | 广东省材料与加工研究所 | Drill bit matrix material and preparation method thereof |
| CN110643880B (en) * | 2019-11-07 | 2020-11-13 | 广东省材料与加工研究所 | Drill bit matrix material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014105595A1 (en) | 2014-07-03 |
| US20140182948A1 (en) | 2014-07-03 |
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