CN104961883B - Modified epoxy that a kind of epoxy resin is engaged with alcohol and preparation method thereof - Google Patents
Modified epoxy that a kind of epoxy resin is engaged with alcohol and preparation method thereof Download PDFInfo
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- CN104961883B CN104961883B CN201410524193.0A CN201410524193A CN104961883B CN 104961883 B CN104961883 B CN 104961883B CN 201410524193 A CN201410524193 A CN 201410524193A CN 104961883 B CN104961883 B CN 104961883B
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Abstract
The modified epoxy that a kind of epoxy resin is engaged with alcohol, each component and its percentage by weight are：Epoxy resin, dihydroxylic alcohols, unsaturated double-bond unit alcohol, 1,4 naphthoquinones 0.02%, triethylamine, styrene.The modified epoxy that the present invention is made, the esterification structure of acid alcohol reaction generation is not contained, but mutually terminate generation with epoxy with alcohol, change epoxy resin solidifying system, can solidify rapidly at normal temperatures, this cure shrinkage is small, shaping change is small, can replace part epoxy, vinylite, the use of high-grade unsaturated-resin.
Description
Technical field
The present invention relates to technical field of polymer materials, specifically it be a kind of epoxy resin engaged with alcohol it is modified
Epoxy resin and preparation method thereof.
Background technology
Epoxy resin is referred to containing two or more epoxy radicals, the macromolecule with aliphatic or aromatic series as main chain
Prepolymer.Epoxy resin is a kind of material with liquid to solid-state, and it is general to only have and ring almost without single use value
The insoluble polymer of oxygen resin curing agent reaction generation tridimensional network just has application value, this to become solidification by performed polymer
Product, epoxy coating, epoxy resin stick, epoxy resin pressing plate, epoxy resin casting matrix etc. are referred to as by its purposes.
Epoxy curing agent mainly has amine and an acid anhydride type curing agent, amine it is conventional be imidazoles, diethylenetriamine, polyamide 6 50,
What anhydrides were commonly used is HHPA, methyl tetrahydro phthalic anhydride, grass acid anhydrides etc., and amine curing agent curing rate is fast in general,
But solidfied material heat resistance is relatively poor, anhydrides curing rate is slower, and solidfied material is rigidly good.Obviously, either which kind of firming body
System, has respective advantage and disadvantage.It would therefore be highly desirable to need a kind of to make up prior art not enough and defect and performance is comprehensive
Epoxy resin.
The content of the invention
It is an object of the invention to provide a kind of ambient temperature curing speed it is fast, cure shrinkage is small, shaping change small, mechanical property
The modified epoxy that superior epoxy resin is engaged with alcohol.
It is a further object of the present invention to provide a kind of preparation method of above-mentioned modified epoxy.
To achieve the above object, the technical solution adopted in the present invention is：
The modified epoxy that a kind of epoxy resin is engaged with alcohol, each component and its percentage by weight are：
Epoxy resin 45-60%;Dihydroxylic alcohols 5-8%;Unsaturated double-bond unit alcohol 8-15%;1,4- naphthoquinones 0.02%;
Triethylamine 0.05%;Styrene 20-35%.
Preferably, the dihydroxylic alcohols be propane diols, ethylene glycol, one or more of neopentyl glycol.
Preferably, the unsaturated double-bond unit alcohol be allyl alcohol, one or more of prenol.
The preparation method of the modified epoxy that above-mentioned epoxy resin is engaged with alcohol is to comprise the following steps：（1）First
45-60% epoxy resin is poured into reactor, 5-8% dihydroxylic alcohols is added afterwards, add 2/3 0.05% amines catalyst, one is small
When be warmed up to 110 DEG C, heating voluntarily exothermic heat of reaction is stopped immediately；（2）After heat release terminates, 1 is incubated between being raised again to 140-150 DEG C
Hour;（3）After insulation terminates, 0.01% polymerization inhibitor is added, cool to 85 DEG C, add the 8-15% alcohol of unit containing unsaturated bond, 1/3
0.05% amines catalyst, temperature is reacted 1 hour by system at 85-90 DEG C；（4）100-105 DEG C of reaction is raised again to, 2 hours are incubated,
Survey hydroxyl value, it is qualified after, plus 0.01% polymerization inhibitor cools to 80 DEG C, squeeze into the debugging of 20-35% styrene it is qualified after packaging.
Compared with prior art, the beneficial effects of the invention are as follows：The modified epoxy that the present invention is made, does not contain acid alcohol
The esterification structure of generation is reacted, but mutually terminates generation with epoxy with alcohol, change epoxy resin solidifying system, can be at normal temperatures
Rapid solidification, this cure shrinkage is small, shaping change is small, can replace part epoxy, vinylite, high-grade unsaturated tree
The use of fat；
Specific embodiment
Some embodiments are given below, and the present invention is described in further detail：
Embodiment 1：
The triethylamine of 46.7% dihydroxylic alcohols of epoxy resin, 5.8% 14.1% 1,4- naphthoquinones of unsaturated double-bond unit alcohol 0.02%
0.05%
Styrene 33.3%
Embodiment 2：
Epoxy resin:The triethylamine of 50.6% dihydroxylic alcohols, 6% 13.3% 1,4- naphthoquinones of unsaturated double-bond unit alcohol 0.02%
0.05%
Styrene 30.1%
Embodiment 3：
The triethylamine 0.05% of 54% dihydroxylic alcohols of epoxy resin, 6.2% 12% 1,4- naphthoquinones of unsaturated double-bond unit alcohol 0.02%
Styrene 27.7%
Embodiment 4：
The triethylamine of 58.3% dihydroxylic alcohols of epoxy resin, 6.7% 10.5% 1,4- naphthoquinones of unsaturated double-bond unit alcohol 0.02%
0.05% styrene 24.4%
Examples detailed above is prepared as follows, and preparation method is as follows：
（1）First 45-60% epoxy resin is poured into reactor, 5-8% dihydroxylic alcohols is added afterwards, add 2/3 0.05% amine
Class catalyst, is warmed up to 110 DEG C in 1 hour, and heating voluntarily exothermic heat of reaction is stopped immediately；（2）After heat release terminates, 140- is raised again to
1 hour is incubated between 150 DEG C；（3）After insulation terminates, 0.01% polymerization inhibitor is added, cool to 85 DEG C, add 8-15% to contain insatiable hunger
With key unit alcohol, 1/3 0.05% amines catalyst, temperature by system 85-90 DEG C react 1 hour；（4）It is raised again to 100-105
DEG C reaction, is incubated 2 hours, surveys hydroxyl value, it is qualified after, plus 0.01% polymerization inhibitor cools to 80 DEG C, squeezes into 20-35% styrene tune
Packaging after examination is qualified.
Claims (3)
1. the modified epoxy that a kind of epoxy resin is engaged with alcohol, it is characterised in that each component and its percentage by weight are：
The triethylamine 0.05% of epoxy resin 45-60% dihydroxylic alcohols 5-8% unsaturated double-bond unit alcohol 8-15% 1,4- naphthoquinones 0.02%
Styrene 20-35%；
The preparation method of the modified epoxy that above-mentioned epoxy resin is engaged with alcohol is to comprise the following steps：（1）First by 45-
60% epoxy resin is poured into reactor, and 5-8% dihydroxylic alcohols is added afterwards, adds 2/3 0.05% amines catalyst, is risen within one hour
Temperature stops heating voluntarily exothermic heat of reaction to 110 DEG C, immediately；（2）1 is incubated after heat release terminates, between being raised again to 140-150 DEG C small
When；（3）After insulation terminates, 0.01% polymerization inhibitor is added, cool to 85 DEG C, add the 8-15% alcohol of unit containing unsaturated bond, 1/3
0.05% amines catalyst, temperature is reacted 1 hour by system at 85-90 DEG C；（4）100-105 DEG C of reaction is raised again to, 2 hours are incubated,
Survey hydroxyl value, it is qualified after, plus 0.01% polymerization inhibitor cools to 80 DEG C, squeeze into the debugging of 20-35% styrene it is qualified after packaging.
2. the modified epoxy that epoxy resin as claimed in claim 1 is engaged with alcohol, it is characterised in that the dihydroxylic alcohols
For propane diols, ethylene glycol, one or more of neopentyl glycol.
3. the modified epoxy that epoxy resin as claimed in claim 1 is engaged with alcohol, it is characterised in that the unsaturation
Double bond unit alcohol be allyl alcohol, one or more of prenol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410524193.0A CN104961883B (en) | 2014-10-09 | 2014-10-09 | Modified epoxy that a kind of epoxy resin is engaged with alcohol and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410524193.0A CN104961883B (en) | 2014-10-09 | 2014-10-09 | Modified epoxy that a kind of epoxy resin is engaged with alcohol and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104961883A CN104961883A (en) | 2015-10-07 |
| CN104961883B true CN104961883B (en) | 2017-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410524193.0A Active CN104961883B (en) | 2014-10-09 | 2014-10-09 | Modified epoxy that a kind of epoxy resin is engaged with alcohol and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0653904A2 (en) * | 1993-11-17 | 1995-05-17 | International Business Machines Corporation | Via fill compositions for direct attach of devices and methods for applying same |
| CN101831143A (en) * | 2010-05-06 | 2010-09-15 | 宁波德洲精密电子有限公司 | High-performance liquid epoxy resin composition for packaging LEDs |
| CN102985460A (en) * | 2010-10-08 | 2013-03-20 | 株式会社大赛璐 | Curing agent composition for epoxy resin, curable resin composition, and cured product thereof |
-
2014
- 2014-10-09 CN CN201410524193.0A patent/CN104961883B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0653904A2 (en) * | 1993-11-17 | 1995-05-17 | International Business Machines Corporation | Via fill compositions for direct attach of devices and methods for applying same |
| CN101831143A (en) * | 2010-05-06 | 2010-09-15 | 宁波德洲精密电子有限公司 | High-performance liquid epoxy resin composition for packaging LEDs |
| CN102985460A (en) * | 2010-10-08 | 2013-03-20 | 株式会社大赛璐 | Curing agent composition for epoxy resin, curable resin composition, and cured product thereof |
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| Publication number | Publication date |
|---|---|
| CN104961883A (en) | 2015-10-07 |
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Address after: 523000 Lang village, Changping Town, Dongguan, Guangdong Patentee after: Dongguan City Wing polymer Mstar Technology Ltd Address before: 523000 Lang village, Changping Town, Dongguan, Guangdong Patentee before: Dongguan Yingming Chemical Co., Ltd. |
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Effective date of registration: 20191223 Address after: 523000 Room 401, building 11, Ruiying international science and Technology Innovation Park, No. 9, University Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: Dongguan Biyi New Material Technology Co., Ltd Address before: 523000 Lang village, Changping Town, Dongguan, Guangdong Patentee before: Dongguan City Wing polymer Mstar Technology Ltd |