CN104961865A - High temperature resistance composite release film - Google Patents
High temperature resistance composite release film Download PDFInfo
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- CN104961865A CN104961865A CN201510284426.9A CN201510284426A CN104961865A CN 104961865 A CN104961865 A CN 104961865A CN 201510284426 A CN201510284426 A CN 201510284426A CN 104961865 A CN104961865 A CN 104961865A
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- release film
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Abstract
The present invention provides a high temperature resistance composite release film, which comprises a thin film layer, wherein the thin film layer comprises, by weight, 100 parts of polyimide, 5-10 parts of nanometer silica, 3-5 parts of 3-aminopropyltriethoxysilane, 10-16 parts of butyl acrylate, 15-20 parts of methyl methacrylate, 1-2 parts of octadecyl methylacrylate, 5-10 parts of natural latex, 0.3-0.5 part of a defoamer, and 0.3-0.5 part of a thickener. According to the present invention, the thin film layer of the release film adopts the composite film of polyimide and nanometer silica, such that the high temperature resistance and the mechanical property are excellent, and the application range is wide compared with the conventional release film.
Description
Technical field
The present invention relates to a kind of release film, especially a kind of high temperature resistant compound release film.
Background technology
Release film, also known as stripping film, barrier film, separatory membrane, adhesive block film, fractal film, film, plastics film, covers pore membrane, silicon oil membrane, silicone oil paper, antiadhesion barrier, skidding film, that paper of sky, separate-type paper, silliconfilm, release film, release.Under normal circumstances in order to increase the off-type force of plastics film, plastics film can be done plasma treatment, or be coated with fluorine process, or be coated with silicon (silicone) parting agent on the top layer of film material, as PET, PE, OPP, etc.; Allow it can show extremely light and stable off-type force for various different organic pressure sensitive adhesive (pressure sensitive adhesive as hot melt adhesive, acrylic glue and rubber series).
Because release film has isolation, fills, protects, is easy to the advantages such as stripping, be therefore widely used in the fields such as various electronics, communication, machinery.
Along with the progress of Development of Human Civilization and science and technology, increasing electronics produces, product are used to the every field of society, and the external strategic shift of electronic industry to China and the fast development of home communications and electronic industry, make semicon industry be in gold developing period, also will drive developing rapidly of its subsidiary industrial chain simultaneously.When manufacture printed circuit board (PCB), ceramic electronic components, thermoset resin article, decorative sheet etc., release film makes again mold release film often be sandwiched in operation between metal sheet, or use between resin, to avoid the bonding between metal sheet or between resin, and these techniques all need to complete under certain hot conditions.And its high thermal resistance of release film conventional is at present lower, and the unicity release film of routine its performance usual can not meet the requirement of producing increasingly stringent above.
Therefore, in order to expanding economy, be necessary to develop a kind of high temperature resistant compound release film.
Summary of the invention
Goal of the invention: the object of the invention is to solve the deficiencies in the prior art, provides a kind of high temperature resistant compound release film.
Technical scheme: in order to realize above object, one of the present invention is high temperature resistant compound release film, comprise thin film layer, described thin film layer comprises following component by weight ratio:
Polyimide 100 parts;
Nano silicon 5-10 part;
3-aminopropyl triethoxysilane 3-5 part;
Butyl acrylate 10-16 part;
Methyl methacrylate 15-20 part;
Methacrylic acid octadecyl 1-2 part;
Natural emulsion 5-10 part;
Defoamer 0.3-0.5 part;
Thickening material 0.3-0.5 part.
It is 100-110 object polyimide particles sized by described polyimide.If the particle of polyimide is excessive, be not easily uniformly dispersed, the performance of film can be had influence on, therefore select the polyimide that particle is less.
Described defoamer is defoamer S12.Suppress, eliminate the generation of bubble, strengthen the over-all properties of product.
Described thickening material is methyl hydroxyethylcellulose.
The preparation method of described film layer material is specific as follows: take desired raw material according to weight proportion, then under nitrogen protection, by the 3-aminopropyl triethoxysilane taken, butyl acrylate, methyl methacrylate, methacrylic acid octadecyl stirs, and then add nano silicon, stirring at room temperature 40-60min, then polyimide particles is added, then 60-80 DEG C is heated to, stir 2-4h, then temperature reduces 40-50 DEG C, add natural emulsion, defoamer and thickening material, continue to stir 40-60min, finally be cooled to room temperature and can obtain required film layer material.
Beneficial effect: high temperature resistant compound release film provided by the invention compared with prior art, has the following advantages:
1, release film of the present invention, its film layer material adopts polyimide composite Nano silicon-dioxide, composite membrane can be prepared, take full advantage of the advantageous property of polyimide, make the final release film prepared, there is resistance to elevated temperatures, its use range is comparatively broad, and add nano silicon in polyimide, can make the mechanical property of the finished product, mechanical property increases substantially, the tensile strength of its product can mention original more than 150%;
2, release film of the present invention, due to its material of main part polyimide adopted substantially on be insoluble to organic solvent, therefore, in order to impel, nano silicon is uniformly dispersed in polyimide, adds 3-aminopropyl triethoxysilane coupling agent, and this coupling agent can carry out modification to nano silicon, nano silicon is uniformly dispersed in polyimide, makes the film performance prepared superior;
3, release film of the present invention, its film layer material have employed sol method and is prepared, and relative at present some adopt for polyamic acid solutions and nano silicon carry out reacting, decreases the application of organic solvent, thus decreases the pollution of environment;
4, release film of the present invention, the material of its thin film layer, have employed butyl acrylate, methyl methacrylate, the sticking materials of tool such as methacrylic acid octadecyl prepare gelatinoid, and add silane coupling agent wherein, coupling agent mixes in gel, also being convenient to next step and polyimide and nanometer is that silicon oxide is when reacting, individual component materials mixes, the thin-film material prepared is balanced, and add natural emulsion, viscosity and snappiness can be strengthened, finally add some auxiliary addition agents again as defoamer, thickening material, what make to prepare broadcasts mill material, performance is more balanced, superior,
5, release film of the present invention, its film layer material component environment-protecting asepsis used, simple, the easy operation of its preparation method, mild condition, be more suitable for suitability for industrialized production.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail; but illustrate that protection scope of the present invention is not limited to the concrete scope of the present embodiment simultaneously; based on the embodiment in the present invention; those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
embodiment 1
A kind of high temperature resistant compound release film, comprise thin film layer, described thin film layer comprises following component by weight ratio:
Polyimide 100 parts;
Nano silicon 5 parts;
3-aminopropyl triethoxysilane 3 parts;
Butyl acrylate 10 parts;
Methyl methacrylate 15 parts;
Methacrylic acid octadecyl 1 part;
Natural emulsion 5 parts;
Defoamer S12 0.3 part;
Thickening material methyl hydroxyethylcellulose 0.3 part.
The preparation method of above-mentioned film layer material is specific as follows: take desired raw material according to weight proportion, then under nitrogen protection, by the 3-aminopropyl triethoxysilane taken, butyl acrylate, methyl methacrylate, methacrylic acid octadecyl stirs, and then add nano silicon, stirring at room temperature 40min, then polyimide particles is added, then 60 DEG C are heated to, stir 2h, then temperature reduces by 40 DEG C, add natural emulsion, defoamer and thickening material, continue to stir 40min, finally be cooled to room temperature and can obtain required film layer material.
embodiment 2
A kind of high temperature resistant compound release film, comprise thin film layer, described thin film layer comprises following component by weight ratio:
Polyimide 100 parts;
Nano silicon 8 parts;
3-aminopropyl triethoxysilane 4 parts;
Butyl acrylate 13 parts;
Methyl methacrylate 17 parts;
Methacrylic acid octadecyl 1.5 parts;
Natural emulsion 8 parts;
Defoamer S12 0.4 part;
Thickening material methyl hydroxyethylcellulose 0.4 part.
The preparation method of above-mentioned film layer material is specific as follows: take desired raw material according to weight proportion, then under nitrogen protection, by the 3-aminopropyl triethoxysilane taken, butyl acrylate, methyl methacrylate, methacrylic acid octadecyl stirs, and then add nano silicon, stirring at room temperature 50min, then polyimide particles is added, then 70 DEG C are heated to, stir 3h, then temperature reduces by 45 DEG C, add natural emulsion, defoamer and thickening material, continue to stir 50min, finally be cooled to room temperature and can obtain required film layer material.
embodiment 3
A kind of high temperature resistant compound release film, comprise thin film layer, described thin film layer comprises following component by weight ratio:
Polyimide 100 parts;
Nano silicon 10 parts;
3-aminopropyl triethoxysilane 5 parts;
Butyl acrylate 16 parts;
Methyl methacrylate 20 parts;
Methacrylic acid octadecyl 2 parts;
Natural emulsion 10 parts;
Defoamer S12 0.5 part;
Thickening material methyl hydroxyethylcellulose 0.5 part.
The preparation method of above-mentioned film layer material is specific as follows: take desired raw material according to weight proportion, then under nitrogen protection, by the 3-aminopropyl triethoxysilane taken, butyl acrylate, methyl methacrylate, methacrylic acid octadecyl stirs, and then add nano silicon, stirring at room temperature 60min, then polyimide particles is added, then 80 DEG C are heated to, stir 4h, then temperature reduces by 50 DEG C, add natural emulsion, defoamer and thickening material, continue to stir 60min, finally be cooled to room temperature and can obtain required film layer material.
Its film layer material prepared of the above embodiment of the present invention, conventionally can carry out extruding, shaping, rolling can obtain required composite plastic film.
Release film of the present invention, its thin film layer, adopt the composite membrane of polyimide, nano silicon, its high thermal resistance and excellent in mechanical performance, compared to the release film of routine, its range of application is more extensive.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its objective is to allow and is familiar with these those skilled in the art and can understands content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalents done by spirit of the present invention or modification, all should be encompassed within protection scope of the present invention.
Claims (5)
1. a high temperature resistant compound release film, is characterized in that: comprise thin film layer, and described thin film layer comprises following component by weight ratio:
Polyimide 100 parts;
Nano silicon 5-10 part;
3-aminopropyl triethoxysilane 3-5 part;
Butyl acrylate 10-16 part;
Methyl methacrylate 15-20 part;
Methacrylic acid octadecyl 1-2 part;
Natural emulsion 5-10 part;
Defoamer 0.3-0.5 part;
Thickening material 0.3-0.5 part.
2. high temperature resistant compound release film according to claim 1, is characterized in that: be 100-110 object polyimide particles sized by described polyimide.
3. high temperature resistant compound release film according to claim 1, is characterized in that: described defoamer is defoamer S12.
4. high temperature resistant compound release film according to claim 1, is characterized in that: described thickening material is methyl hydroxyethylcellulose.
5. high temperature resistant compound release film according to claim 1, it is characterized in that: the preparation method of described film layer material is specific as follows: take desired raw material according to weight proportion, then under nitrogen protection, by the 3-aminopropyl triethoxysilane taken, butyl acrylate, methyl methacrylate, methacrylic acid octadecyl stirs, and then add nano silicon, stirring at room temperature 40-60min, then polyimide particles is added, then 60-80 DEG C is heated to, stir 2-4h, then temperature reduces 40-50 DEG C, add natural emulsion, defoamer and thickening material, continue to stir 40-60min, finally be cooled to room temperature and can obtain required film layer material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510284426.9A CN104961865A (en) | 2015-05-29 | 2015-05-29 | High temperature resistance composite release film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510284426.9A CN104961865A (en) | 2015-05-29 | 2015-05-29 | High temperature resistance composite release film |
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| CN104961865A true CN104961865A (en) | 2015-10-07 |
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| CN201510284426.9A Pending CN104961865A (en) | 2015-05-29 | 2015-05-29 | High temperature resistance composite release film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105924906A (en) * | 2016-05-15 | 2016-09-07 | 李文东 | Anti-corrosion composite release film |
| CN107778507A (en) * | 2017-09-28 | 2018-03-09 | 江苏斯瑞达新材料科技有限公司 | PET mould release membrances for OCA optical cements |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1840324A (en) * | 2005-03-30 | 2006-10-04 | 林启祥 | Method of manufacturing release film |
| CN102666094A (en) * | 2009-12-30 | 2012-09-12 | 乐金华奥斯株式会社 | Release film and method for manufacturing the same |
-
2015
- 2015-05-29 CN CN201510284426.9A patent/CN104961865A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1840324A (en) * | 2005-03-30 | 2006-10-04 | 林启祥 | Method of manufacturing release film |
| CN102666094A (en) * | 2009-12-30 | 2012-09-12 | 乐金华奥斯株式会社 | Release film and method for manufacturing the same |
Non-Patent Citations (6)
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| 刘益军: "《"现代水性涂料工艺、配方、应用》", 31 December 2013, 化学工业出版社 * |
| 吴宏富: "《中国粉体工业通鉴》", 31 December 2007, 中国建材工业出版社 * |
| 尚堆才: "《精细化学品绿色合成技术与实例》", 31 December 2011, 化学工业出版社 * |
| 山西省化工研究: "《塑料橡胶加工助剂》", 31 December 1983, 化学工业出版社 * |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105924906A (en) * | 2016-05-15 | 2016-09-07 | 李文东 | Anti-corrosion composite release film |
| CN107778507A (en) * | 2017-09-28 | 2018-03-09 | 江苏斯瑞达新材料科技有限公司 | PET mould release membrances for OCA optical cements |
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Application publication date: 20151007 |