CN104955314A - Method for controlling electronic equipment shell temperature and electronic equipment - Google Patents
Method for controlling electronic equipment shell temperature and electronic equipment Download PDFInfo
- Publication number
- CN104955314A CN104955314A CN201510282706.6A CN201510282706A CN104955314A CN 104955314 A CN104955314 A CN 104955314A CN 201510282706 A CN201510282706 A CN 201510282706A CN 104955314 A CN104955314 A CN 104955314A
- Authority
- CN
- China
- Prior art keywords
- electronic equipment
- temperature
- described electronic
- sensitive element
- threshold value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 66
- 230000008569 process Effects 0.000 claims description 47
- 230000020169 heat generation Effects 0.000 claims description 27
- 230000008859 change Effects 0.000 claims description 22
- 230000009467 reduction Effects 0.000 claims description 18
- 238000001514 detection method Methods 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 230000006854 communication Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Studio Devices (AREA)
Abstract
An embodiment of the invention discloses a method for controlling electronic equipment shell temperature and electronic equipment. The method includes: acquiring the temperature sensed by a thermosensitive element, wherein the thermosensitive element is disposed at a prearranged position, easy to emit heat, on the inner surface of an electronic equipment shell; when the temperature exceeds a preset threshold value, controlling a running status of the electronic equipment based on a set shell temperature protection algorithm so as to cool the electronic equipment shell. According to the technical scheme, the method for controlling the electronic equipment shell temperature and the electronic equipment have the advantages that an existing temperature detecting scheme can be optimized, and electronic shell temperature detection is achieved.
Description
Technical field
The embodiment of the present invention relates to field of computer technology, particularly relates to a kind of method and the electronic equipment that control electronic equipment casing temperature.
Background technology
At present, various electronic equipment is swarmed and shows, as smart mobile phone, panel computer, personal digital assistant etc.Electronic equipment greatly facilitates the life of people, and people use electronic equipment can surf the Net, read a book, listen to the music, play games.
Along with the speed of sending out of electronic technology develops, the performance of electronic equipment is also become better and better, and the processing speed of such as processor is more and more faster, and take the image definition obtained also more and more higher, the charging interval is also shorter and shorter.But the side effect that the raising of performance produces is that electronic equipment very easily generates heat in running.And in the prior art, only have the temperature detection scheme of PCB (Printed Circuit Board, printed circuit board) plate to electronic equipment or built-in chip, can not detect the temperature of electronic equipment casing.
Summary of the invention
The embodiment of the present invention provides a kind of method and the electronic equipment that control electronic equipment casing temperature, to be optimized existing temperature detection scheme, realizes the detection to electronic shell temperature.
On the one hand, embodiments provide a kind of method controlling electronic equipment casing temperature, the method comprises:
Obtain the temperature that temperature-sensitive element senses, wherein said temperature-sensitive element is by the easy sites of heat generation place preset on electronic equipment casing inner surface that purchases;
After described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, to lower the temperature to described electronic equipment casing.
Further, described easy sites of heat generation comprises position, following at least one place: the primary importance of process chip upright projection on described electronic equipment casing inner surface of described electronic equipment, the second place of charging chip upright projection on described electronic equipment casing inner surface of described electronic equipment, and, described electronic equipment casing inner surface is close to the camera of described electronic equipment and the 3rd position not within the scope of described camera shooting angle.
Further, after described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, comprising:
In the temperature sensed at the temperature-sensitive element of described first position of purchasing, after exceeding the first default threshold value, change the running parameter of the process chip of described electronic equipment, to make the handling property of the described electronic equipment of reduction.
Further, after described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, comprising:
In the temperature sensed at the temperature-sensitive element of described second position of purchasing, after exceeding the second default threshold value, change the charge parameter of described electronic equipment, to make the charging performance of the described electronic equipment of reduction.
Further, after described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, comprising:
In the temperature sensed at the temperature-sensitive element of described 3rd position of purchasing, after exceeding the 3rd default threshold value, change the image acquisition parameter of described camera, to make the shooting performance of the described electronic equipment of reduction.
On the other hand, the embodiment of the present invention additionally provides a kind of electronic equipment, and this equipment comprises: process chip, shell and temperature-sensitive element;
Wherein, described temperature-sensitive element is purchased the easy sites of heat generation place preset on described inner surface of outer cover, and is connected with described process chip;
Described process chip, for: obtain the temperature that temperature-sensitive element senses; After described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, to lower the temperature to described electronic equipment casing.
Further, described electronic equipment also comprises: camera and charging chip;
Described easy sites of heat generation comprises position, following at least one place: the primary importance of process chip upright projection on described electronic equipment casing inner surface of described electronic equipment, the second place of charging chip upright projection on described electronic equipment casing inner surface of described electronic equipment, and, described electronic equipment casing inner surface is close to the camera of described electronic equipment and the 3rd position not within the scope of described camera shooting angle.
Further, described process chip, for:
In the temperature sensed at the temperature-sensitive element of described first position of purchasing, after exceeding the first default threshold value, change the running parameter of the process chip of described electronic equipment, to make the handling property of the described electronic equipment of reduction.
Further, described process chip, for:
In the temperature sensed at the temperature-sensitive element of described second position of purchasing, after exceeding the second default threshold value, change the charge parameter of described electronic equipment, to make the charging performance of the described electronic equipment of reduction.
Further, described process chip, for:
In the temperature sensed at the temperature-sensitive element of described 3rd position of purchasing, after exceeding the 3rd default threshold value, change the image acquisition parameter of described camera, to make the shooting performance of the described electronic equipment of reduction.
The technical scheme that the embodiment of the present invention provides, by arranging temperature-sensitive element at the easy sites of heat generation place of electronic equipment casing inner surface, accurately detecting case surface temperature, then coordinating software process, reach and optimize electronic equipment surface temperature rise, promote the value of electronic equipment performance and Consumer's Experience.
Accompanying drawing explanation
Fig. 1 is a kind of schematic flow sheet controlling the method for electronic equipment casing temperature that the embodiment of the present invention one provides;
Fig. 2 is the position view of a kind of temperature-sensitive element be arranged on smart mobile phone inner surface of outer cover that the embodiment of the present invention two provides.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, illustrate only part related to the present invention in accompanying drawing but not entire infrastructure.
Before in further detail exemplary embodiment being discussed, it should be mentioned that some exemplary embodiments are described as the process or method described as flow chart.Although operations (or step) is described as the process of order by flow chart, many operations wherein can be implemented concurrently, concomitantly or simultaneously.In addition, the order of operations can be rearranged.Described process can be terminated when its operations are completed, but can also have the additional step do not comprised in the accompanying drawings.Described process can correspond to method, function, code, subroutine, subprogram etc.
Embodiment one
Fig. 1 is a kind of schematic flow sheet controlling the method for electronic equipment casing temperature that the embodiment of the present invention one provides.The method can be performed by the device of the method controlling electronic equipment casing temperature, and described device, by software simulating, is stored in the memory of electronic equipment, is performed by the process chip of electronic equipment.
See Fig. 1, the method for the control electronic equipment casing temperature that the present embodiment provides specifically comprises the steps S110 and step S120.
The temperature that step S110, acquisition temperature-sensitive element sense, wherein temperature-sensitive element is by the easy sites of heat generation place preset on electronic equipment casing inner surface that purchases.
In the present embodiment, electronic equipment can be the chlamydate handheld device of tool of such as smart mobile phone, panel computer or personal digital assistant and so on.Preferably, described electronic equipment is smart mobile phone.The sensitive material that temperature-sensitive element is varied with temperature by physical property and changes is made, such as: fusible alloy or temperature-sensitive insulating material, bimetal leaf, thermocouple, thermistor, semi-conducting material etc.Temperature-sensitive element can in real time according to the variable quantity determination Current Temperatures of the sensitive material be currently sensed.
Easy sites of heat generation is the position that on electronic equipment casing, any heating is comparatively serious, such as, can be: be positioned at electronic equipment casing inner surface, and the position of contiguous process chip, the position of charging chip, the position etc. of camera.Described easy sites of heat generation can be set according to all parts quantity of heat production operationally of electronic equipment in advance flexibly by developer.Different electronic equipments, default easy sites of heat generation may be different.
Step S120, after described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of electronic equipment, to lower the temperature to electronic equipment casing.
If the temperature got is higher, exceedes the threshold value preset, then needed to be controlled the running status of electronic equipment, make the temperature of electronic equipment casing lower than this threshold value.Such as, can close and electronic equipment not be in front stage operation pattern and the higher application of power consumption; Or, to electronic equipment being in running status and the operational factor of the higher application of power consumption is adjusted, with the runnability by sacrificing application, reducing electronic equipment and running the heat that this application produces.
In the present embodiment, easy sites of heat generation can be a place, two places or many places.Often locate the temperature-sensitive element set by easy sites of heat generation can be one, two or more.After getting the temperature that all temperature-sensitive elements of being arranged on everywhere easily sites of heat generation sense; calculate the mean value of these temperature; this mean value is compared with the threshold value preset; and then according to comparative result; skin temperature protection algorism based on setting controls the running status of electronic equipment, to lower the temperature to electronic equipment casing.
For more accurate, skin temperature is controlled, can be the easy sites of heat generation do not existed together, distribute different threshold values.After getting the temperature that all temperature-sensitive elements of being arranged on the easy sites of heat generation in certain sense, calculate the mean value of these temperature, if this mean value exceedes the default threshold value for the easy sites of heat generation distribution in this place, then control the running status of the application of the easy sites of heat generation in this place contiguous on electronic equipment, to lower the temperature to the easy sites of heat generation in this place of electronic equipment casing.
The technical scheme that the present embodiment provides, by arranging temperature-sensitive element at the easy sites of heat generation place of electronic equipment casing inner surface, accurately detecting case surface temperature, then coordinating software process, reach and optimize electronic equipment surface temperature rise, promote the value of electronic equipment performance and Consumer's Experience.
Embodiment two
The present embodiment, on the basis of above-described embodiment one, is optimized sites of heat generation easy on electronic equipment casing inner surface, and for the easy sites of heat generation after optimization, specifically provides corresponding skin temperature protection algorism.
In the present embodiment, easy sites of heat generation comprises position, following at least one place:
The primary importance of process chip upright projection on electronic equipment casing inner surface of electronic equipment; The second place of charging chip upright projection on electronic equipment casing inner surface of electronic equipment; And,
The camera of nearby electron equipment on electronic equipment casing inner surface and the 3rd position not within the scope of camera shooting angle.
Accordingly, for the step S120 provided in embodiment one, after described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of electronic equipment, comprising:
In the temperature sensed at the temperature-sensitive element of first position of purchasing, after exceeding the first default threshold value, the running parameter of the process chip of change electronic equipment, to make the handling property of reduction electronic equipment; And/or
In the temperature sensed at the temperature-sensitive element of second position of purchasing, after exceeding the second default threshold value, the charge parameter of change electronic equipment, to make the charging performance of reduction electronic equipment; And/or
In the temperature sensed at the temperature-sensitive element of the 3rd position of purchasing, after exceeding the 3rd default threshold value, the image acquisition parameter of change camera, to make the shooting performance of reduction electronic equipment.
Wherein, the running parameter of the process chip of change electronic equipment, can specifically comprise: the work dominant frequency reducing process chip, reduces CPU check figure etc. in running order in process chip;
The charge parameter of change electronic equipment, can specifically comprise: reduce charging current etc.;
The image acquisition parameter of change camera, can specifically comprise: extend the IMAQ interval of camera under RECORD mode, reduces the resolution etc. of camera collection image.
Fig. 2 is the position view of a kind of temperature-sensitive element be arranged on smart mobile phone inner surface of outer cover that the embodiment of the present invention two provides.See Fig. 2:
First temperature-sensitive element is positioned at: the primary importance 211 of process chip 21 upright projection be connected with cell phone mainboard 20 on shell 22 inner surface of mobile phone front;
Second temperature-sensitive element is positioned at: the second place 212 of process chip 21 upright projection be connected with cell phone mainboard 20 on shell 23 inner surface of the mobile phone back side;
3rd temperature-sensitive element is positioned at: three position 241 of charging chip 24 upright projection be connected with cell phone mainboard 20 on shell 23 inner surface of the mobile phone back side;
4th temperature-sensitive element is positioned at: contiguous mobile phone camera 25 on mobile phone back skin 23 inner surface and not in the 4th position 251 of camera 25 shooting angle scope.
The temperature-sensitive element that conventional mobile phone is used for temperature detection is all be placed on cell phone mainboard 20, the temperature of such detection is the temperature conditions on mainboard, be difficult to the surface temperature of reaction phone housing, therefore under the various application scenarios of mobile phone, control to be almost impossible to the accurate temperature of case surface.And the scheme using the embodiment of the present invention to propose, be mounted on by temperature-sensitive element on the inner surface of phone housing, position is just in several main heating source positions of mobile phone: on the inner surface of outer cover on the vertical corresponding inner surface of outer cover of process chip, on the vertical corresponding inner surface of outer cover of charging chip, near camera.Thus, can several places case surface temperature that accurately detection of handset temperature rise risk is the highest, then coordinate software algorithm, reach the object controlling mobile phone watch surface temperature, the Consumer's Experience of improving product.
Embodiment three
The present embodiment provides a kind of electronic equipment, and the concrete structure of this electronic equipment comprises: process chip, shell and temperature-sensitive element;
Wherein, described temperature-sensitive element is purchased the easy sites of heat generation place preset on described inner surface of outer cover, and is connected with described process chip;
Described process chip, for: obtain the temperature that temperature-sensitive element senses; After described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, to lower the temperature to described electronic equipment casing.
Further, described electronic equipment also comprises: camera and charging chip;
Described easy sites of heat generation comprises position, following at least one place: the primary importance of process chip upright projection on described electronic equipment casing inner surface of described electronic equipment, the second place of charging chip upright projection on described electronic equipment casing inner surface of described electronic equipment, and, described electronic equipment casing inner surface is close to the camera of described electronic equipment and the 3rd position not within the scope of described camera shooting angle.
Further, described process chip, for:
In the temperature sensed at the temperature-sensitive element of described first position of purchasing, after exceeding the first default threshold value, change the running parameter of the process chip of described electronic equipment, to make the handling property of the described electronic equipment of reduction.
Further, described process chip, for:
In the temperature sensed at the temperature-sensitive element of described second position of purchasing, after exceeding the second default threshold value, change the charge parameter of described electronic equipment, to make the charging performance of the described electronic equipment of reduction.
Further, described process chip, for:
In the temperature sensed at the temperature-sensitive element of described 3rd position of purchasing, after exceeding the 3rd default threshold value, change the image acquisition parameter of described camera, to make the shooting performance of the described electronic equipment of reduction.
Need stating of explanation, the electronic equipment that the present embodiment provides also comprises the power supply (such as battery) of powering to all parts.Preferably, power supply can be connected with process chip logic by power-supply management system, thus realizes the functions such as management charging, electric discharge and power managed by power-supply management system.Power supply can also comprise one or more direct current or AC power, recharging system, power failure detection circuit, power supply changeover device or the random component such as inverter, power supply status indicator.
Certainly, those of ordinary skill in the art, should understand electronic equipment and also can comprise radio circuit, bluetooth module, input unit, display unit etc. further.Wherein, radio circuit can be used for receiving and sending messages or in communication process, the reception of signal and transmission, especially, after being received by the downlink information of base station, transfer to more than one or one process chip process; In addition, base station is sent to by relating to up data.Usually, radio circuit includes but not limited to antenna, at least one amplifier, tuner, one or more oscillator, subscriber identity module (SIM) card, transceiver, coupler, LNA (Low Noise Amplifier, low noise amplifier), duplexer etc.In addition, radio circuit can also by radio communication and network and other devices communicatings.Input unit can be used for the numeral or the character information that receive input, and produces and to arrange with user and function controls relevant keyboard, mouse, action bars, optics or trace ball signal and inputs.Display unit can be used for the various graphical user interface showing information or the information being supplied to user and the electronic equipment inputted by user, and these graphical user interface can be made up of figure, text, icon, video and its combination in any.
Current electronic equipment performance is more and more higher, and caloric value is also increasing, and traditional temperature detection mode can only detect the temperature of mainboard level and chip internal, and the temperature rise for case surface is difficult to accomplish accurate control.The present embodiment utilizes temperature-sensitive element; by placing it in (the position that temperature rise risk is higher, position close to electronic shell surface; such as camera side; the enclosure location of processor and charging chip upright projection); accurate detection skin temperature; after temperature reaches predetermined threshold value, just adopt skin temperature protection algorism, the temperature on electronic equipment surface is accurately controlled in suitable scope.
In embodiments of the present invention, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiments.
Although it is to be further understood that and use first, second grade of term to describe each position herein, these positions should not by the restriction of these terms.These terms are only used to the position that is distinguished from each other.Such as, primary importance also can be referred to as the second place, and accordingly, the second place also can be referred to as primary importance.And do not depart from the scope of the present invention.It is to be further understood that and use in this article, unless context clearly supports exception, singulative " one " be intended to also comprise plural form.Should also be understood that the "and/or" used in this article refers to comprise any of more than one or one project listed explicitly and likely combine.
The invention described above embodiment sequence number, just to describing, does not represent the quality of embodiment.
Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and can not protection scope of the present invention be departed from.Therefore, although be described in further detail invention has been by above embodiment, the present invention is not limited only to above embodiment, when not departing from the present invention's design, can also comprise other Equivalent embodiments more, and scope of the present invention is determined by appended right.
Claims (10)
1. control a method for electronic equipment casing temperature, it is characterized in that, comprising:
Obtain the temperature that temperature-sensitive element senses, wherein said temperature-sensitive element is by the easy sites of heat generation place preset on electronic equipment casing inner surface that purchases;
After described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, to lower the temperature to described electronic equipment casing.
2. method according to claim 1, it is characterized in that, described easy sites of heat generation comprises position, following at least one place: the primary importance of process chip upright projection on described electronic equipment casing inner surface of described electronic equipment, the second place of charging chip upright projection on described electronic equipment casing inner surface of described electronic equipment, and, described electronic equipment casing inner surface is close to the camera of described electronic equipment and the 3rd position not within the scope of described camera shooting angle.
3. method according to claim 2, is characterized in that, after described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, comprising:
In the temperature sensed at the temperature-sensitive element of described first position of purchasing, after exceeding the first default threshold value, change the running parameter of the process chip of described electronic equipment, to make the handling property of the described electronic equipment of reduction.
4. method according to claim 2, is characterized in that, after described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, comprising:
In the temperature sensed at the temperature-sensitive element of described second position of purchasing, after exceeding the second default threshold value, change the charge parameter of described electronic equipment, to make the charging performance of the described electronic equipment of reduction.
5. method according to claim 2, is characterized in that, after described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, comprising:
In the temperature sensed at the temperature-sensitive element of described 3rd position of purchasing, after exceeding the 3rd default threshold value, change the image acquisition parameter of described camera, to make the shooting performance of the described electronic equipment of reduction.
6. an electronic equipment, is characterized in that, comprising: process chip, shell and temperature-sensitive element;
Wherein, described temperature-sensitive element is purchased the easy sites of heat generation place preset on described inner surface of outer cover, and is connected with described process chip;
Described process chip, for: obtain the temperature that temperature-sensitive element senses; After described temperature exceedes default threshold value, the skin temperature protection algorism based on setting controls the running status of described electronic equipment, to lower the temperature to described electronic equipment casing.
7. electronic equipment according to claim 6, is characterized in that, described electronic equipment also comprises: camera and charging chip;
Described easy sites of heat generation comprises position, following at least one place: the primary importance of process chip upright projection on described electronic equipment casing inner surface of described electronic equipment, the second place of charging chip upright projection on described electronic equipment casing inner surface of described electronic equipment, and, described electronic equipment casing inner surface is close to the camera of described electronic equipment and the 3rd position not within the scope of described camera shooting angle.
8. electronic equipment according to claim 7, is characterized in that, described process chip, for:
In the temperature sensed at the temperature-sensitive element of described first position of purchasing, after exceeding the first default threshold value, change the running parameter of the process chip of described electronic equipment, to make the handling property of the described electronic equipment of reduction.
9. electronic equipment according to claim 7, is characterized in that, described process chip, for:
In the temperature sensed at the temperature-sensitive element of described second position of purchasing, after exceeding the second default threshold value, change the charge parameter of described electronic equipment, to make the charging performance of the described electronic equipment of reduction.
10. electronic equipment according to claim 7, is characterized in that, described process chip, for:
In the temperature sensed at the temperature-sensitive element of described 3rd position of purchasing, after exceeding the 3rd default threshold value, change the image acquisition parameter of described camera, to make the shooting performance of the described electronic equipment of reduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510282706.6A CN104955314B (en) | 2015-05-28 | 2015-05-28 | The method and electronic equipment of a kind of control electronics skin temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510282706.6A CN104955314B (en) | 2015-05-28 | 2015-05-28 | The method and electronic equipment of a kind of control electronics skin temperature |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104955314A true CN104955314A (en) | 2015-09-30 |
| CN104955314B CN104955314B (en) | 2017-10-20 |
Family
ID=54169541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510282706.6A Expired - Fee Related CN104955314B (en) | 2015-05-28 | 2015-05-28 | The method and electronic equipment of a kind of control electronics skin temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104955314B (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105245651A (en) * | 2015-10-20 | 2016-01-13 | 广东欧珀移动通信有限公司 | Mobile phone temperature control device, temperature control method and mobile phone |
| CN105354054A (en) * | 2015-10-12 | 2016-02-24 | 广东虹勤通讯技术有限公司 | Electronic product and adjusting method for performance parameter thereof |
| CN105549651A (en) * | 2015-11-06 | 2016-05-04 | 东莞酷派软件技术有限公司 | User terminal and temperature control method |
| CN105912087A (en) * | 2016-04-29 | 2016-08-31 | 北京小米移动软件有限公司 | Mobile terminal |
| CN106557403A (en) * | 2016-11-28 | 2017-04-05 | 深圳天珑无线科技有限公司 | TPE method of testings, device and equipment |
| WO2017152520A1 (en) * | 2016-03-07 | 2017-09-14 | 中兴通讯股份有限公司 | Adaptive cooling method and device for mobile terminal, and computer readable storage medium |
| CN107783563A (en) * | 2016-08-30 | 2018-03-09 | 中兴通讯股份有限公司 | A kind of terminal and the method for controlling terminal temperature |
| CN107820656A (en) * | 2016-09-29 | 2018-03-20 | 深圳市柔宇科技有限公司 | Control method for quickly charging, quick charge control system and terminal device |
| WO2018072435A1 (en) * | 2016-10-17 | 2018-04-26 | 中兴通讯股份有限公司 | Slow charging method and smart terminal |
| CN109194987A (en) * | 2018-07-23 | 2019-01-11 | 南阳师范学院 | Adjusting method, device, storage medium and the mobile terminal of Online Video resolution ratio |
| CN110727559A (en) * | 2019-10-09 | 2020-01-24 | Oppo广东移动通信有限公司 | Electronic device, electronic device control method, and storage medium |
| CN110944281A (en) * | 2019-11-29 | 2020-03-31 | 歌尔股份有限公司 | Earphone shell temperature detection method and device, wireless earphone and readable storage medium |
| CN111010469A (en) * | 2019-12-09 | 2020-04-14 | Oppo广东移动通信有限公司 | Electronic device and temperature acquisition device |
| CN111458048A (en) * | 2020-03-31 | 2020-07-28 | Oppo广东移动通信有限公司 | Method and device for determining surface temperature of terminal, terminal and storage medium |
| WO2021093394A1 (en) * | 2019-11-13 | 2021-05-20 | 中兴通讯股份有限公司 | Terminal active heat dissipating device, terminal, and terminal active heat dissipating method |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4850006A (en) * | 1986-11-18 | 1989-07-18 | Nec Corporation | Booster and charger unit used for hand-held portable telephone and having overheat protection circuit |
| CN101142734A (en) * | 2005-01-18 | 2008-03-12 | 日本电气株式会社 | Mobile terminal and battery charging method in mobile terminal |
| CN101639723A (en) * | 2008-08-02 | 2010-02-03 | 联想（新加坡）私人有限公司 | Heat dissipation system for computers |
| CN102099761A (en) * | 2008-05-30 | 2011-06-15 | 苹果公司 | Thermal management techniques in an electronic device |
| CN102141942A (en) * | 2011-04-01 | 2011-08-03 | 奇智软件（北京）有限公司 | Method and device for monitoring and protecting equipment |
| JP4793095B2 (en) * | 2006-05-18 | 2011-10-12 | 日本電気株式会社 | Mobile phone, camera operation pause method and camera operation pause control program used for the mobile phone |
| CN102789246A (en) * | 2012-06-18 | 2012-11-21 | 华为终端有限公司 | Thermal protection method and device, and equipment with thermal protection function |
| CN102812707A (en) * | 2010-03-18 | 2012-12-05 | 日本电气株式会社 | Mobile telephone set generating small amount of heat and having video-phone function |
| CN103019842A (en) * | 2012-11-29 | 2013-04-03 | 广东欧珀移动通信有限公司 | Background program finishing method and system |
| CN103378794A (en) * | 2012-04-18 | 2013-10-30 | 联想（新加坡）私人有限公司 | Rrotating mechanism, portable electric apparatus and service life extension method for fluid dynamic bearing |
| CN103576715A (en) * | 2012-07-24 | 2014-02-12 | 联想(北京)有限公司 | Method for temperature control and electronic equipment |
| CN103902335A (en) * | 2014-03-12 | 2014-07-02 | 上海天奕达电子科技有限公司 | Method and system for cleaning background programs |
| CN104636236A (en) * | 2014-12-30 | 2015-05-20 | 深圳天珑无线科技有限公司 | Terminal high-temperature abnormity detecting method and mobile terminal |
-
2015
- 2015-05-28 CN CN201510282706.6A patent/CN104955314B/en not_active Expired - Fee Related
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4850006A (en) * | 1986-11-18 | 1989-07-18 | Nec Corporation | Booster and charger unit used for hand-held portable telephone and having overheat protection circuit |
| CN101142734A (en) * | 2005-01-18 | 2008-03-12 | 日本电气株式会社 | Mobile terminal and battery charging method in mobile terminal |
| JP4793095B2 (en) * | 2006-05-18 | 2011-10-12 | 日本電気株式会社 | Mobile phone, camera operation pause method and camera operation pause control program used for the mobile phone |
| CN102099761A (en) * | 2008-05-30 | 2011-06-15 | 苹果公司 | Thermal management techniques in an electronic device |
| CN101639723A (en) * | 2008-08-02 | 2010-02-03 | 联想（新加坡）私人有限公司 | Heat dissipation system for computers |
| CN102812707A (en) * | 2010-03-18 | 2012-12-05 | 日本电气株式会社 | Mobile telephone set generating small amount of heat and having video-phone function |
| CN102141942A (en) * | 2011-04-01 | 2011-08-03 | 奇智软件（北京）有限公司 | Method and device for monitoring and protecting equipment |
| CN103378794A (en) * | 2012-04-18 | 2013-10-30 | 联想（新加坡）私人有限公司 | Rrotating mechanism, portable electric apparatus and service life extension method for fluid dynamic bearing |
| CN102789246A (en) * | 2012-06-18 | 2012-11-21 | 华为终端有限公司 | Thermal protection method and device, and equipment with thermal protection function |
| CN103576715A (en) * | 2012-07-24 | 2014-02-12 | 联想(北京)有限公司 | Method for temperature control and electronic equipment |
| CN103019842A (en) * | 2012-11-29 | 2013-04-03 | 广东欧珀移动通信有限公司 | Background program finishing method and system |
| CN103902335A (en) * | 2014-03-12 | 2014-07-02 | 上海天奕达电子科技有限公司 | Method and system for cleaning background programs |
| CN104636236A (en) * | 2014-12-30 | 2015-05-20 | 深圳天珑无线科技有限公司 | Terminal high-temperature abnormity detecting method and mobile terminal |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105354054A (en) * | 2015-10-12 | 2016-02-24 | 广东虹勤通讯技术有限公司 | Electronic product and adjusting method for performance parameter thereof |
| CN105245651A (en) * | 2015-10-20 | 2016-01-13 | 广东欧珀移动通信有限公司 | Mobile phone temperature control device, temperature control method and mobile phone |
| CN105245651B (en) * | 2015-10-20 | 2018-04-03 | 广东欧珀移动通信有限公司 | A kind of mobile phone temp control device, temprature control method and mobile phone |
| CN105549651A (en) * | 2015-11-06 | 2016-05-04 | 东莞酷派软件技术有限公司 | User terminal and temperature control method |
| WO2017152520A1 (en) * | 2016-03-07 | 2017-09-14 | 中兴通讯股份有限公司 | Adaptive cooling method and device for mobile terminal, and computer readable storage medium |
| CN105912087B (en) * | 2016-04-29 | 2019-01-18 | 北京小米移动软件有限公司 | A kind of mobile terminal |
| CN105912087A (en) * | 2016-04-29 | 2016-08-31 | 北京小米移动软件有限公司 | Mobile terminal |
| CN107783563A (en) * | 2016-08-30 | 2018-03-09 | 中兴通讯股份有限公司 | A kind of terminal and the method for controlling terminal temperature |
| CN107820656A (en) * | 2016-09-29 | 2018-03-20 | 深圳市柔宇科技有限公司 | Control method for quickly charging, quick charge control system and terminal device |
| WO2018072435A1 (en) * | 2016-10-17 | 2018-04-26 | 中兴通讯股份有限公司 | Slow charging method and smart terminal |
| CN106557403A (en) * | 2016-11-28 | 2017-04-05 | 深圳天珑无线科技有限公司 | TPE method of testings, device and equipment |
| CN109194987A (en) * | 2018-07-23 | 2019-01-11 | 南阳师范学院 | Adjusting method, device, storage medium and the mobile terminal of Online Video resolution ratio |
| CN109194987B (en) * | 2018-07-23 | 2021-07-16 | 南阳师范学院 | Method and device for adjusting resolution of online video, storage medium and mobile terminal |
| CN110727559A (en) * | 2019-10-09 | 2020-01-24 | Oppo广东移动通信有限公司 | Electronic device, electronic device control method, and storage medium |
| WO2021093394A1 (en) * | 2019-11-13 | 2021-05-20 | 中兴通讯股份有限公司 | Terminal active heat dissipating device, terminal, and terminal active heat dissipating method |
| CN110944281A (en) * | 2019-11-29 | 2020-03-31 | 歌尔股份有限公司 | Earphone shell temperature detection method and device, wireless earphone and readable storage medium |
| CN111010469A (en) * | 2019-12-09 | 2020-04-14 | Oppo广东移动通信有限公司 | Electronic device and temperature acquisition device |
| CN111458048A (en) * | 2020-03-31 | 2020-07-28 | Oppo广东移动通信有限公司 | Method and device for determining surface temperature of terminal, terminal and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104955314B (en) | 2017-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104955314A (en) | Method for controlling electronic equipment shell temperature and electronic equipment | |
| CN104243671B (en) | Volume adjusting method, device and electronic equipment | |
| CN110389640B (en) | Heat dissipation method and mobile terminal | |
| CN110212607B (en) | Charging control method and related product | |
| CN106371689B (en) | Picture joining method, apparatus and system | |
| CN104238918B (en) | List View component slippage display methods and device | |
| CN107463477A (en) | Mobile terminal and its management method, computer-readable recording medium | |
| CN107480489B (en) | unlocking control method and related product | |
| CN104899672A (en) | Article transfer apparatus, system and method | |
| CN106655381A (en) | Wireless charging method and device | |
| CN104238893A (en) | Video preview image displaying method and device | |
| CN104954159A (en) | Network information statistics method and device | |
| CN107067239B (en) | Application server and information processing method and device thereof | |
| CN103491525A (en) | Method for achieving card-free mobile phone, mobile phone and server | |
| CN104898936A (en) | Page turning method and mobile device | |
| CN104881844A (en) | Picture combination method and device and terminal equipment | |
| US9497716B2 (en) | Control method and electronic device | |
| CN104021129A (en) | Picture group display method and terminal | |
| CN107734618B (en) | Application program closing method and device, storage medium and electronic equipment | |
| CN110428782B (en) | Brightness adjusting method and related product | |
| CN105246075A (en) | Access point connecting method and device | |
| CN103955279B (en) | A kind of visual angle feedback method and terminal | |
| CN106454979B (en) | A kind of network formats switching method and mobile terminal | |
| CN103674314A (en) | Power source, electronic device and temperature detection method | |
| CN107566654B (en) | Unlocking control method and related product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171020 |