CN104955293A - Electromagnetic device encapsulation shell - Google Patents
Electromagnetic device encapsulation shell Download PDFInfo
- Publication number
- CN104955293A CN104955293A CN201410121195.5A CN201410121195A CN104955293A CN 104955293 A CN104955293 A CN 104955293A CN 201410121195 A CN201410121195 A CN 201410121195A CN 104955293 A CN104955293 A CN 104955293A
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- CN
- China
- Prior art keywords
- electromagnetic device
- device package
- package casing
- housing
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides an electromagnetic device encapsulation shell. The shell comprises a shell body which is used to accommodate electromagnetic devices. The shell body comprises a top surface, which is used to open an opening. The bottom surface, which is oppositely arranged relative to the top surface, extends brim to the periphery of the shell body. The side opposite to the opening of the bottom surface is provided with a plurality of cooling sheets, and the sheets and the shell are integrated together. As the shell body and the cooling sheets are integrated into one body, the gaps between the shell body and the cooling sheets are eliminated, and thus thermal conductive materials are not need to seal the gaps when the shell contacts the cooling sheets. The electromagnetic device encapsulation shell has the advantages of simple structure, convenient installation, better heat dissipation performance, and greatly-reduced production cost.
Description
Technical field
The present invention relates to electromagnetic device protection field, particularly relate to a kind of electromagnetic device package casing.
Background technology
IP54 class degree of protection being applied as in the industry prevents dust accumulation and waterproof to be without prejudice to protect internal electrical magnetic device.Electromagnetic device is when IP54 degree of protection works, and due to airtight space, interior environment temperature is higher, and electromagnetic device heat radiation is more difficult, and cost is higher.
In prior art, encapsulating housing is placed on the exposed surface of a segregate blade or other types radiator by user usually, is passed on fin, then shed by heat by fin by the heat of heat dissipating silicone grease by housing.Whole device needs two parts under these circumstances: encapsulating housing and radiator form.But also want heat dissipating silicone grease to ensure the heat conduction between two parts.Not only add cost, but also reduce heat-conducting effect.
Summary of the invention
In order to overcome prior art middle shell and between fin by heat sink material heat conduction, cause housing radiating effect difference and the high technical problem of cost, the invention provides a kind of electromagnetic device package casing.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
The invention provides a kind of electromagnetic device package casing, comprising the housing for holding electromagnetic device, described housing comprises one for offering the end face of opening,
The brim of a hat is extended to the surrounding of described housing in the bottom surface be oppositely arranged with described end face;
The side that described bottom surface deviates from described opening arranges multiple fin, and described fin and described housing are structure as a whole.
Furthermore, in described electromagnetic device package casing, the side that described bottom surface deviates from described opening is provided with groove, described groove surrounds into an annular, and described fin is positioned at described annular.
Furthermore, in described electromagnetic device package casing, each described fin is arranged along the Width of described bottom surface, and multiple described fin is set up in parallel along the length direction of described bottom surface.
Furthermore, in described electromagnetic device package casing, the thickness of described fin near one end of described bottom surface is greater than the thickness of the one end away from described bottom surface.
Furthermore, in described electromagnetic device package casing, described bottom surface is rectangle, and described bottom edge arranges multiple through hole.
Furthermore, in described electromagnetic device package casing, described housing is cuboid.
Furthermore, in described electromagnetic device package casing, the material of described electromagnetic device package casing is aluminium alloy.
The invention has the beneficial effects as follows: the structure of electromagnetic device package casing of the present invention by housing and heat sink design are integrated, must by smearing Heat Conduction Material to plug the gap when avoiding shell to contact with fin, the simple and convenient installation of structure, and heat dispersion is better, also greatly reduce production cost simultaneously.
Accompanying drawing explanation
Fig. 1 represents the three-dimensional appearance structural representation one of electromagnetic device package casing in the embodiment of the present invention;
Fig. 2 represents the three-dimensional appearance structural representation two of electromagnetic device package casing in the embodiment of the present invention;
Fig. 3 represents the front view of electromagnetic device package casing in the embodiment of the present invention;
Fig. 4 represents the vertical view of electromagnetic device package casing in the embodiment of the present invention;
Fig. 5 represents the left view of electromagnetic device package casing in the embodiment of the present invention;
Three-dimensional appearance structural representation when Fig. 6 represents that in the embodiment of the present invention, electromagnetic device package casing is installed and used;
Front view when Fig. 7 represents that in the embodiment of the present invention, electromagnetic device package casing is installed and used;
Vertical view when Fig. 8 represents that in the embodiment of the present invention, electromagnetic device package casing is installed and used;
Left view when Fig. 9 represents that in the embodiment of the present invention, electromagnetic device package casing is installed and used.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, describe the present invention below in conjunction with the accompanying drawings and the specific embodiments.
The invention provides a kind of electromagnetic device package casing, comprising the housing for holding electromagnetic device, described housing comprises one for offering the end face of opening, and the brim of a hat is extended to the surrounding of described housing in the bottom surface be oppositely arranged with described end face; The side that described bottom surface deviates from described opening arranges multiple fin, and described fin and described housing are structure as a whole.
Specifically, on the housing of electromagnetic device package casing of the present invention, offer one in end face and supply electromagnetic device to enter the opening of housing.The brim of a hat is extended to the surrounding of housing in bottom surface, and brim structure conveniently seals installation, and simplified structure design is convenient installs, and reduces the cost simultaneously.The side that bottom surface deviates from opening arranges multiple fin, and fin and housing are structure as a whole.Compared with prior art, the structure of the present invention by housing and heat sink design being integrated, must by smearing heat-conducting silicone grease to plug the gap when avoiding housing to contact with fin, the simple and convenient installation of structure, and heat dispersion is better, cost also reduces greatly simultaneously.
With reference to shown in Fig. 1, electromagnetic device package casing of the present invention, comprises the housing 1 for holding electromagnetic device, and housing 1 comprises one for offering the end face of opening 10, and the brim of a hat 2 is extended to the surrounding of housing 1 in the bottom surface 11 be oppositely arranged with end face; The side that bottom surface 10 deviates from opening 10 arranges multiple fin 3, and fin 3 and housing 1 are structure as a whole.Housing 1 has heat radiating fins 3 structures, saves a part and relevant assembly cost, without additional heat impedance; Avoiding prior art electromagnetic device package casing must be connected by smearing heat-conducting silicone grease with between separate heat sinks, saving cost simultaneously.
With reference to shown in Fig. 2, on the brim of a hat 2 that the bottom surface 11 of housing 1 is extended, offer multiple through hole 13 for installing with other parts.The side that bottom surface 11 deviates from opening is provided with groove 4.Groove 4 is arranged around fin 3.Groove 4 surrounds into an annular, and fin 3 is positioned at annular, like this when bottom surface 11 and other parts just secure fit time, sealing ring can be added in groove 4 or other encapsulant seals.Housing 1 is cuboid.The shape of certain housing is also not limited only to this, and the shape of housing also can be determined according to the shape of the electromagnetic device be received.The material of electromagnetic device package casing is aluminium alloy or some otherly has the material of better heat dissipation characteristics to make, and does not enumerate at this.Wherein aluminium alloy is as preferred material, easily processes and lower cost.
With reference to shown in Fig. 3 and Fig. 5, fin 3 is arranged along the Width of bottom surface 11, and multiple fin 3 is set up in parallel along the length direction of bottom surface 11, such arrangement, makes heat be convenient to distribute.Certainly, the arrangement of fin is not limited only to this.
The thickness of fin 3 near one end of bottom surface 11 is greater than the thickness of the one end away from bottom surface 11.The section of each fin is a wedge shape, structure like this, more advantageous heat dissipation.
With reference to shown in Fig. 4, bottom surface 11 is rectangle, and the position at each angle at its edge arranges multiple through hole 13.Carry the brim of a hat 2 that may be used for enclosed package, simplified structure design is convenient installs, and reduces the cost simultaneously.
Engage concrete applied environment below and introduce electromagnetic device package casing in the embodiment of the present invention in detail.
With reference to shown in Fig. 6, electromagnetic device is put in housing 1 inside, and then by heat-conduction epoxy resin glue or the encapsulation such as heat conductive silica gel, polyurethane pouring sealant, the lead-in wire 20 of electromagnetic device stretches out housing 1 outside.The parts installed are coordinated to comprise protective cover 5 and heat radiation rack 6 with the electromagnetic device package casing in the embodiment of the present invention.The outer cup of housing 1 and lead-in wire 20 establishes the protective cover 5 of an IP54 degree of protection.Bottom surface 11 and heat radiation rack 6 fixedly mount.The one side of heat radiation rack 6 is provided with multiple fan 7.
Heat in housing 1 is directly dispelled the heat by fin 3, without additional heat impedance.
With reference to shown in Fig. 7, Fig. 8 and Fig. 9, bottom surface 11 is fixedly connected with by bolt 21 with the one side of peace heat radiation rack 6.Fin 3 stretches out installing rack 6.Encapsulant for sealing with heat radiation rack 6 is installed in the groove of bottom surface 11.
Scene above as electromagnetic device package casing in the embodiment of the present invention is applied, and has wherein coordinated the protection of protective cover to electromagnetic device package casing and the auxiliary heat dissipation of heat radiation rack.In certain embodiment of the present invention, electromagnetic device package casing can also be applied to other environment, does not enumerate at this.
Above-described is the preferred embodiment of the present invention; should be understood that the ordinary person for the art; can also make some improvements and modifications not departing under principle prerequisite of the present invention, these improvements and modifications are also in protection scope of the present invention.
Claims (7)
1. an electromagnetic device package casing, comprises the housing for holding electromagnetic device, and described housing comprises one for offering the end face of opening, it is characterized in that,
The brim of a hat is extended to the surrounding of described housing in the bottom surface be oppositely arranged with described end face;
The side that described bottom surface deviates from described opening arranges multiple fin, and described fin and described housing are structure as a whole.
2. electromagnetic device package casing as claimed in claim 1, is characterized in that, the side that described bottom surface deviates from described opening is provided with groove, and described groove surrounds into an annular, and described fin is positioned at described annular.
3. electromagnetic device package casing as claimed in claim 2, it is characterized in that, each described fin is arranged along the Width of described bottom surface, and multiple described fin is set up in parallel along the length direction of described bottom surface.
4. electromagnetic device package casing as claimed in claim 1, it is characterized in that, the thickness of described fin near one end of described bottom surface is greater than the thickness of the one end away from described bottom surface.
5. electromagnetic device package casing as claimed in claim 1, it is characterized in that, described bottom surface is rectangle, and described bottom edge arranges multiple through hole.
6. electromagnetic device package casing as claimed in claim 1, it is characterized in that, described housing is cuboid.
7. electromagnetic device package casing as claimed in claim 1, it is characterized in that, the material of described electromagnetic device package casing is aluminium alloy.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410121195.5A CN104955293A (en) | 2014-03-27 | 2014-03-27 | Electromagnetic device encapsulation shell |
| PCT/CN2015/074480 WO2015144007A1 (en) | 2014-03-27 | 2015-03-18 | Enclosed housing for electromagnetic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410121195.5A CN104955293A (en) | 2014-03-27 | 2014-03-27 | Electromagnetic device encapsulation shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104955293A true CN104955293A (en) | 2015-09-30 |
Family
ID=54169525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410121195.5A Pending CN104955293A (en) | 2014-03-27 | 2014-03-27 | Electromagnetic device encapsulation shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104955293A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783056A (en) * | 2015-11-20 | 2017-05-31 | 特富特科技(深圳)有限公司 | Magnetic element, magnetic element install rack and the method for preparing magnetic element |
| CN113380669A (en) * | 2021-05-12 | 2021-09-10 | 赵赛赛 | Intelligent packaging equipment and packaging method for frequency components |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177555A (en) * | 1992-08-29 | 1994-06-24 | Robert Bosch Gmbh | Electric apparatus and method for manufacture of said electric apparatus |
| CN201986310U (en) * | 2011-02-23 | 2011-09-21 | 宁波北斗科技有限公司 | Electric vehicle controller |
| CN202836313U (en) * | 2012-09-20 | 2013-03-27 | 河南盛喜龙电子有限公司 | Cooling fin |
| CN203814080U (en) * | 2014-03-27 | 2014-09-03 | 特富特科技(深圳)有限公司 | Electromagnetic device encapsulation shell |
-
2014
- 2014-03-27 CN CN201410121195.5A patent/CN104955293A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177555A (en) * | 1992-08-29 | 1994-06-24 | Robert Bosch Gmbh | Electric apparatus and method for manufacture of said electric apparatus |
| CN201986310U (en) * | 2011-02-23 | 2011-09-21 | 宁波北斗科技有限公司 | Electric vehicle controller |
| CN202836313U (en) * | 2012-09-20 | 2013-03-27 | 河南盛喜龙电子有限公司 | Cooling fin |
| CN203814080U (en) * | 2014-03-27 | 2014-09-03 | 特富特科技(深圳)有限公司 | Electromagnetic device encapsulation shell |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783056A (en) * | 2015-11-20 | 2017-05-31 | 特富特科技(深圳)有限公司 | Magnetic element, magnetic element install rack and the method for preparing magnetic element |
| CN113380669A (en) * | 2021-05-12 | 2021-09-10 | 赵赛赛 | Intelligent packaging equipment and packaging method for frequency components |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150930 |
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| RJ01 | Rejection of invention patent application after publication |