CN104953397B - The USB3.1 connector bodies and its assembling preparation method of a kind of full-automatic processing procedure - Google Patents

Abstract

The present invention discloses the USB3.1 connector bodies and its assembling preparation method of a kind of full-automatic processing procedure, the connector body includes SMT terminals module, DIP terminals module, dividing plate module, upper EMI pieces, lower EMI pieces and shielding case, SMT terminals module, DIP terminals module, dividing plate module are stacked up and down, realize that SMT terminals module, DIP terminals module, dividing plate module are assembled into positioning together forms an inner core entirety using upper EMI pieces, lower EMI pieces make-up, shielding case is coated on outside inner core entirety again, that is, forms connector body product；Its simple structure, design are ingenious rationally effectively to realize the full-automatic processing procedure of whole connector body product, and processing quality is easy to management and control in substantially increasing production efficiency, and its processing procedure, improves product quality and yield；And, the special construction design of EMI pieces, lower EMI pieces, dividing plate thereon ensure that firm assembling positioning, in turn ensures that and well electrically conducts, and its EMI suppression effect is more preferable than the connector of conventional art.

Description

The USB3.1 connector bodies and its assembling preparation method of a kind of full-automatic processing procedure

Technical field

The present invention relates to field of connectors technology, refer in particular to a kind of full-automatic processing procedure USB3.1 connector bodies and Its assembling preparation method.

Background technology

Connector is widely used in electronic product, and it is used as the functions such as data transfer, charging and image transmission.At present, The full-automation truly difficult to realize of the processing procedure of connector, its some operation needs artificial treatment, though some are designed as entirely Automated process, it has been found that management and control its processing quality is difficult in some operations, causes processing yield reduction, undoubtedly increased enterprise Industry processing cost.

Therefore, it is badly in need of working out a kind of new connector construction and manufacture assembling preparation method is full-automatic to obtain one kind Change processing procedure and be easy to the connector of management and control processing quality.

The content of the invention

In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide a kind of full-automatic system to the present invention The USB3.1 connector bodies and its assembling preparation method of journey, its simple structure, design are ingenious rationally, effectively realize product complete Automated process, processing quality is easy to management and control in improve production efficiency, and processing procedure, improves product quality and yield.

To achieve the above object, the present invention is using following technical scheme：

A kind of USB3.1 connector bodies of full-automatic processing procedure, include

One SMT terminal modules, the SMT terminal modules include the first terminal port and produced by insert molding in the first terminal port Some SMT terminals, the SMT terminal leading portions have contact site, and the SMT terminal back segments are formed with SMT legs, and its contact site is from first Terminal port front end is stretched out, and its SMT leg extends perpendicularly out the first terminal port bottom and horizontal buckling extension is exposed to the first terminal port bottom Portion outside, and SMT terminals be after aforementioned contact portion, SMT legs is formed again direct produced by insert molding in the first terminal port；With And, left and right end position offers the upper embedded groove for upper EMI pieces setting-in respectively on the first terminal port；

One DIP terminal modules, the DIP terminal modules include Second terminal port and produced by insert molding in Second terminal port Some DIP terminals, the DIP terminal leading portions have contact site, and the DIP terminal back segments are formed with DIP legs；And, second end Left and right end position offers hold caulking groove for upper and lower EMI pieces are embedding respectively on sub- port；

One dividing plate module, the dividing plate module includes hyoplastron body and produced by insert molding in the intrinsic dividing plate of hyoplastron；The hyoplastron Body is at least coated on the leading portion position of dividing plate, and hyoplastron body has upper and lower insulation respectively positioned at dividing plate leading portion upper and lower Portion, the both side edges of the upper and lower insulation division are consistent with dividing plate respective lateral edge shape, and dividing plate leading portion both side edges are respectively formed with and plug The recess that mutually latches of hook, the both side edges of upper and lower insulation division are also formed with corresponding recess, and the recess inwall of dividing plate convex is exposed to Outside hyoplastron recess inwall；Insulation division is concavely provided with some upper end pilot trench on this, and the lower insulation division is concavely provided with some lower terminals Groove；Foregoing SMT terminals module, dividing plate module and DIP terminals module are stacked up and down successively, and the contact site of foregoing SMT terminals is stretched into Corresponding upper end pilot trench is interior and is exposed to insulation division upper surface, and the contact site of foregoing DIP terminals is stretched into corresponding lower end pilot trench and revealed In lower insulation lower surface；And, aforementioned separator plate stage casing position both side edges are formed with the middle caulking groove for upper and lower EMI pieces setting-in；

EMI pieces on one, EMI pieces include upper substrate portion and are bent towards upper insulation division one from upper substrate portion both sides on this The upper buckle kink for extending；Baseplate part is overlying on insulation division thereon, and buckle kink is sequentially embedded from top to bottom thereon Caulking groove, middle caulking groove and lower caulking groove；

Once EMI pieces, the lower EMI pieces include infrabasal plate portion and are bent towards lower insulation division one from infrabasal plate portion both sides The lower buckle kink for extending；Its infrabasal plate portion is overlying on lower insulation division, and its lower buckle kink is sequentially embedded down from bottom to top Caulking groove, middle caulking groove and upper embedded groove；Foregoing upper EMI pieces and lower EMI pieces are by SMT terminals module, dividing plate module, DIP terminals module one Play assembling and be positioned to an inner core entirety, and upper EMI pieces, lower EMI pieces and dividing plate electrical communication；

One shielding case, the shielding case is coated on foregoing inner core integral outer, the foregoing upper EMI pieces of the shielding case electrical communication, Lower EMI pieces and dividing plate, are formed with the slot docked for plug between foregoing hyoplastron body outer wall and shielding case inwall.

Used as a kind of preferred scheme, the upper and lower buckle kink is respectively provided with overhead kick portion, the overhead kick of buckle kink on this Portion is up buckled in dividing plate lower surface, and the overhead kick portion of the lower buckle kink is down buckled in dividing plate upper surface；

Upper limit convex portion is convexly equipped with front side of the upper buckle kink, use is convexly equipped with rear side of the upper buckle kink In the upper salient point for strengthening upper bonding tightness between buckle kink and upper insulation division；The rear side projection of the lower buckle kink There is lower limit convex portion, be convexly equipped with front side of the lower buckle kink for strengthening being tied between lower buckle kink and lower insulation division Close the lower salient point of tight ness rating；

The L-shaped structure of the upper embedded groove, the upper embedded groove includes vertical slot and upper transverse groove, on this after transverse groove Section is communicated in the bottom of vertical slot；The lower caulking groove includes lower vertical slot and lower transverse groove, the leading portion connection of the lower transverse groove In the upper end of lower vertical slot；

Foregoing upper buckle kink lower end is stretched into inside lower transverse groove back segment, and upper limit convex portion of buckle kink is supported on this In in upper transverse groove inner top wall, upper salient point of buckle kink is tight with vertical slot inner back side wall on this；

Foregoing lower buckle kink upper end is stretched into inside transverse groove leading portion, and the lower limit convex portion of the lower buckle kink is supported In in lower transverse groove interior bottom wall, the lower salient point of the lower buckle kink is tight with the front side wall inside lower vertical slot.

Used as a kind of preferred scheme, the first terminal port bottom is convexly equipped with the post that is located by connecting, and it is fixed to be offered on the dividing plate Position through hole, Second terminal port top is arranged with the groove that is located by connecting, and the post that is located by connecting sequentially passes through positioning through hole, is located by connecting In groove；

The first terminal port top is convexly equipped with the upper locating convex block for upper EMI pieces positioning, is accordingly opened on foregoing upper EMI pieces Locating slot is provided with, locating convex block is snapped in locating slot on this；Second terminal port bottom is convexly equipped with for lower EMI pieces positioning Lower locating convex block.Lower locating slot is accordingly offered on foregoing lower EMI pieces, the lower locating convex block is snapped in lower locating slot.

Used as a kind of preferred scheme, the DIP legs are protruded horizontally up and down bent again backward from Second terminal port rear end face Extend vertically, its horizontal position for being exposed to Second terminal port rear end face is defined as horizontal part, its vertical extension after down bending Position is defined as vertical portion；

The positioning seat being easy to DIP legs positioning is further assembled with Second terminal port rear end outside, on the positioning seat Offer the L-shaped groove that the foregoing DIP legs of some correspondences are set, its L-shaped groove include the recessed level trough in positioning seat top surface and The vertical slots of level trough rear end are communicated in, the downward insertion positioning seat bottom of the vertical slots；The horizontal position of foregoing DIP legs is in phase In the level trough answered, and its vertical portion is stretched out from corresponding vertical slots.

Used as a kind of preferred scheme, the Second terminal port rear end face both sides extension is formed with installing arm, foregoing DIP legs Between two installing arms, the left and right medial surface of the installing arm is arranged with T-shaped stopper slot, and T-shaped stopper slot includes vertical spacing Groove and cross spacing groove, the vertical spacing groove up/down perforation installing arm top and bottom ends face, cross spacing groove run through vertical spacing Groove stage casing position and installing arm rear end face；The left and right lateral surface of foregoing positioning seat is accordingly convexly equipped with T-shaped stopper protrusion, T-shaped limit Position convex portion includes the vertical spacing convex portion of vertically extending setting and is laterally connected in vertical spacing convex portion stage casing position and one The cross spacing convex portion for extending backward；Vertical spacing convex portion top, cross spacing convex portion top are provided with and are easy to what is snapped in Guiding face, the positioning seat is installed between two installing arms from bottom to top, and its vertical spacing convex portion is snapped in vertical spacing groove, and it is horizontal Snapped in cross spacing groove to stopper protrusion.

Used as a kind of preferred scheme, the DIP terminals are directly set into again after aforementioned contact portion, DIP legs is formed In in Second terminal port, its contact site stretches out type from Second terminal port front end, and its DIP leg hangs down directly from Second terminal port bottom Directly stretch out.

Used as a kind of preferred scheme, the first terminal port bottom is convexly equipped with some for precise positioning SMT legs position Fixing location division；The first terminal port lower portion that extends perpendicularly out of foregoing SMT legs is defined as vertical portion, and its horizontal buckling prolongs Extending portion position is defined as horizontal part；The fixing location division includes and covers left holding parts in vertical portion left and right side, right solid respectively Hold portion and be supported in the rear holding parts of horizontal part bottom surface, the rear holding parts, left holding parts and right holding parts are integrally formed connection, and Holding parts brace type is contacted with vertical portion trailing flank afterwards；It is formed between adjacent fixing location division and is easy to determining for mould molding positioning Interdigit groove.

Used as a kind of preferred scheme, the shielding case includes roof, left side wall, right side wall, bottom wall and rear wall, wherein, The bottom wall back segment position is formed with the resigning window exposed for foregoing SMT legs, DIP legs；

From roof left and right side edge, one bending extension is formed the left and right side wall respectively respectively；The bottom wall is included spells each other Connect first splicing plate portion and second splicing plate portion, this first and second splicing plate part not from left and right side wall accordingly bend extension and Into；The rear wall is formed from the one bending extension of roof end edge, and the left and right lateral margin one bending extension forward of the rear wall is formed with Left and right side lapping plate, offers overlap joint hole on the left and right side lapping plate, be correspondingly formed on foregoing left and right side wall toward evagination If shell fragment, the shell fragment is stuck in corresponding overlap joint hole；

And, button hole is offered on the left and right side wall respectively, the left and right side at the sub- port of aforementioned first ends is accordingly convexly equipped with button Block, the button block is stuck in corresponding button hole.

A kind of assembling preparation method of the USB3.1 connector bodies of full-automatic processing procedure, comprises the following steps：

（1）Independent produced by insert molding goes out SMT terminal modules, is first first punched SMT terminals, is bent to form with contact site, SMT Welding leg, then by the direct produced by insert molding of SMT terminals in formation SMT terminal modules in the first terminal port；

Independent produced by insert molding goes out DIP terminal modules, is first first punched DIP terminals, is bent to form with contact site, DIP welderings Leg structure, then by the direct produced by insert molding of DIP terminals in formation DIP terminal modules in Second terminal port；

Independent produced by insert molding goes out dividing plate module：By dividing plate produced by insert molding in formation dividing plate module in hyoplastron body；And, it is single Solely punching makes upper EMI pieces, lower EMI pieces and shielding case；

（2）SMT terminals module, dividing plate module, DIP terminals module are stacked up and down successively；Upper EMI pieces are arranged at the first terminal Buckle kink is sequentially embedded upper embedded groove, middle caulking groove and lower caulking groove from top to bottom on port and thereon；Lower EMI pieces are arranged at the second end Simultaneously its lower buckle kink is sequentially embedded lower caulking groove, middle caulking groove and upper embedded groove from bottom to top for Zi Bu bottom surfaces；Upper and lower EMI pieces are by SMT Terminal module, dividing plate module, DIP terminals module assemble be positioned to an inner core entirety together, and upper EMI pieces, lower EMI pieces and every Plate electrical communication；

（3）Shielding case is coated on foregoing inner core integral outer, the foregoing upper EMI pieces of the shielding case electrical communication, lower EMI pieces And dividing plate.

As a kind of preferred scheme, abovementioned steps（1）In, after its independent produced by insert molding goes out DIP terminal modules, its DIP welderings Pin is protruded horizontally up down to bend again and extended vertically backward from Second terminal port rear end face, and Second terminal port rear end is exposed to herein The horizontal position in face is defined as horizontal part, its down bend after vertically extending part be defined as vertical portion；In behind Second terminal port End outside is further assembled with the positioning seat being easy to DIP legs positioning, and the foregoing DIP welderings of some correspondences are offered on the positioning seat The L-shaped groove that pin is set, its L-shaped groove includes the recessed level trough in positioning seat top surface and is communicated in the vertical of level trough rear end Groove, the downward insertion positioning seat bottom of the vertical slots；Positioning seat is assembled in Second terminal port rear side, the level of foregoing DIP legs Portion is located in corresponding level trough, and its vertical portion is stretched out from corresponding vertical slots.

The present invention has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technical proposal Understand, its be mainly by SMT terminals module, DIP terminals module, dividing plate module, upper EMI pieces, lower EMI pieces, shielding case list Only module design, SMT terminals module, DIP terminals module, dividing plate module is stacked up and down, using upper EMI pieces, lower EMI pieces make-up Realize that SMT terminals module, DIP terminals module, dividing plate module are assembled into positioning together forms an inner core entirety, then by shielding case It is coated on inner core overall outer, that is, forms connector body product；Its simple structure, design are ingenious rationally, effectively realize whole The full-automatic processing procedure of connector body product, processing quality is easy to management and control in substantially increasing production efficiency, and its processing procedure, carries High product quality and yield；And, the special construction design of EMI pieces, lower EMI pieces, dividing plate, that is, ensure that firm assembling thereon Positioning, in turn ensures that and well electrically conducts, its EMI suppression effect is more preferable than the connector of conventional art.

More clearly to illustrate architectural feature of the invention and effect, come to this hair with specific embodiment below in conjunction with the accompanying drawings It is bright to be described in detail.

Brief description of the drawings

Fig. 1 is the first assembling schematic perspective view of embodiments of the present invention one；

Fig. 2 is one second assembling schematic perspective view of embodiments of the present invention；

Fig. 3 is the 3rd assembling schematic perspective view of embodiments of the present invention one；

Fig. 4 is the first decomposition texture schematic diagram of embodiments of the present invention one；

Fig. 5 is the second decomposition texture schematic diagram of embodiments of the present invention one；

Fig. 6 is the 3rd decomposition texture schematic diagram of embodiments of the present invention one；

Fig. 7 is the 4th decomposition texture schematic diagram of embodiments of the present invention one；

Fig. 8 is the mplifying structure schematic diagram of modules A in Fig. 6；

Fig. 9 is the mplifying structure schematic diagram of module B in Fig. 7；

Figure 10 is partial cross section's structural representation of SMT legs in the present embodiment one；

Figure 11 is the partial rear view of SMT legs in the present embodiment one（As in Fig. 6 K to）；

Figure 12 is the cross section structure schematic diagram of embodiments of the present invention one；

Figure 13 is another cross section structure schematic diagram of embodiments of the present invention one；

Figure 14 is the close-up schematic view of Figure 12（Not shown upper and lower EMI pieces）；

Figure 15 is the structural representation of upper and lower EMI pieces in the present embodiment one；

Figure 16 is the structural representation of shielding case in the present embodiment one；

Figure 17 is the stereo dissected figure of shielding case in the present embodiment one（Two parts diagram containing institute's subdivision）；

Figure 18 is the decomposition texture schematic diagram of embodiments of the present invention two；

Figure 19 is the decomposition texture schematic diagram of DIP terminal modules in embodiments of the present invention two；

Figure 20 is the cross section structure schematic diagram of DIP terminal modules in embodiments of the present invention two.

Accompanying drawing identifier declaration：

10th, SMT terminals module 101, the first terminal port

102nd, SMT terminals 11, contact site

12nd, SMT legs 121, vertical portion

122nd, horizontal part 13, fixing location division

131st, left holding parts 132, right holding parts

133rd, groove between rear holding parts 14, positioning

15th, upper embedded groove 151, upper vertical slot

152nd, upper transverse groove 16, button block

17th, be located by connecting post 18, upper locating convex block

19th, positioning convex column

20th, DIP terminals module 201, Second terminal port

202nd, DIP terminals 21, contact site

22nd, DIP legs 23, lower caulking groove

231st, lower vertical slot 232, lower transverse groove

24th, be located by connecting groove 25, lower locating convex block

30th, dividing plate module 301, hyoplastron body

302nd, dividing plate 31, upper insulation division

32nd, lower insulation division 33, recess

34th, upper end pilot trench 35, lower end pilot trench

36th, middle caulking groove 37, positioning through hole

40th, upper EMI pieces 401, upper substrate portion

402nd, upper buckle kink 41, overhead kick portion

42nd, upper limit convex portion 43, upper salient point

44th, upper locating slot

50th, lower EMI pieces 501, infrabasal plate portion

502nd, lower buckle kink 51, overhead kick portion

52nd, lower limit convex portion 53, lower salient point

54th, lower locating slot

60th, shielding case 61, roof

62nd, left side wall 63, right side wall

64th, the splicing of bottom wall 641, first plate portion

642nd, the second splicing plate portion 65, rear wall

66th, resigning window 651, left side lapping plate

652nd, right side lapping plate 653, overlap joint hole

66th, shell fragment 67, button hole

68th, location pins

71st, horizontal part 72, vertical portion

80th, positioning seat 81, L-shaped groove

811st, level trough 812, vertical slots

82nd, T-shaped stopper protrusion 821, vertical spacing convex portion

822nd, cross spacing convex portion 823, guiding face

90th, installing arm 91, T-shaped stopper slot

911st, vertical spacing groove 912, cross spacing groove.

Specific embodiment

Refer to shown in Fig. 1 to Figure 20, that show the preferred embodiments of the invention（This is sentenced as a example by two kinds of embodiments Explain）Concrete structure, wherein, Fig. 1 to Figure 17 shows the structure of the first embodiment, and it includes SMT terminal modules 10th, DIP terminals module 20, dividing plate module 30, upper EMI pieces 40, lower EMI pieces 50 and shielding case 60.

Wherein, the SMT terminals module 10 includes the first terminal port 101 and produced by insert molding in the first terminal port 101 Some SMT terminals 102, left and right end position offers the upper embedded groove for upper EMI pieces 40 setting-in respectively on the first terminal port 101 15；The leading portion of SMT terminals 102 has contact site 11, and the back segment of SMT terminals 102 is formed with SMT legs 12, and its contact site 11 is certainly The front end of the first terminal port 101 is stretched out, and its SMT leg 12 extends perpendicularly out the bottom of the first terminal port 101 and horizontal buckling extension is exposed to The bottom outside of the first terminal port 101, and SMT terminals 102 are directly inlayed again after aforementioned contact portion 11, SMT legs 12 is formed Take shape in the first terminal port 101, so, eliminate the bending operation after MOLDING, be conducive to automated process and pair plus The management and control of work quality；

Herein, in order to be accurately positioned to SMT legs, prevent SMT legs from the bad phenomenon such as skew, crooked occur, there is spy Location division structure She Ji not be held, specifically：As shown in Figs. 8 to 11, foregoing SMT legs 12 extend perpendicularly out the first terminal The lower portion of port 101 is defined as vertical portion 121, and its horizontal buckling extending part is defined as horizontal part 122；The fixing location division 13 Include and cover left holding parts 131 in the left and right side of vertical portion 121, right holding parts 132 respectively and be supported in horizontal part 122 The rear holding parts 133 of bottom surface, the rear holding parts 133, left holding parts 131 and right holding parts 132 are integrally formed connection, and rear fixing The brace type of portion 133 is contacted with the trailing flank of vertical portion 121；It is formed between adjacent fixing location division 13 and is easy to what mould molding was positioned Groove 14 between positioning；In the present embodiment, the left and right holding parts are set respectively at vertical portion left and right side in symmetrical structure；Both Vertical cross-section is in triangular structure gradually big from top to bottom.

The DIP terminals module 20 includes Second terminal port 201 and produced by insert molding in some in Second terminal port 201 DIP terminals 202, the leading portion of DIP terminals 201 has contact site 21, and the back segment of DIP terminals 202 is formed with DIP legs 22, and it connects Contact portion 21 is stretched out from the front end of Second terminal port 201, and its DIP leg 22 is extended perpendicularly out from the bottom of Second terminal port 201, and DIP ends Son 202 be after aforementioned contact portion 21, DIP legs 22 is formed again direct produced by insert molding in Second terminal port 201；And, should Left and right end position offers hold caulking groove 23 for upper and lower EMI pieces are embedding respectively on Second terminal port 201.

The dividing plate module 30 includes hyoplastron body 301 and produced by insert molding in the dividing plate 302 in hyoplastron body 301；The hyoplastron Body 301 is at least coated on the leading portion position of dividing plate 302, and hyoplastron body 301 has respectively positioned at the leading portion upper and lower of dividing plate 302 Upper insulation division 31, lower insulation division 32, the both side edges of the upper and lower insulation division are consistent with dividing plate respective lateral edge shape, dividing plate leading portion Both side edges are respectively formed with the recess 33 mutually latched with plug hook, and the both side edges of upper and lower insulation division are also formed with corresponding recessed Portion, and the inwall of recess 33 of dividing plate 302 convex is exposed to outside hyoplastron recess inwall；Insulation division 31 is concavely provided with some upper terminals on this Groove 34, the lower insulation division 32 is concavely provided with some lower end pilot trench 35；Foregoing SMT terminals module 10, dividing plate module 30 and DIP terminals Module 20 is stacked up and down successively, and the contact site 11 of foregoing SMT terminals 102 is stretched into corresponding upper end pilot trench 34 and is exposed to insulation division 31 upper surfaces, the contact site 21 of foregoing DIP terminals 202 is stretched into corresponding lower end pilot trench 35 and is exposed to the lower surface of lower insulation division 32； And, the stage casing position both side edges of aforementioned separator plate 302 are formed with the middle caulking groove 36 for upper and lower EMI pieces setting-in.

EMI pieces 40 include upper substrate portion 401 and are bent towards the one of upper insulation division 31 from the both sides of upper substrate portion 401 on this The upper buckle kink 402 for extending；Baseplate part 401 is overlying on insulation division 31 thereon, and buckle kink 402 is from top to bottom thereon It is sequentially embedded upper embedded groove 15, middle caulking groove 36 and lower caulking groove 23.

The lower EMI pieces 50 include infrabasal plate portion 501 and curved towards the one of lower insulation division 532 from the both sides of infrabasal plate portion 501 Roll over the lower buckle kink 502 for extending；Its infrabasal plate portion 501 is overlying on lower insulation division 32, and its lower buckle kink 502 is from lower On be sequentially embedded lower caulking groove 23, middle caulking groove 36 and upper embedded groove 15；Foregoing upper EMI pieces 40 and lower EMI pieces 50 are by SMT terminal modules 10th, make-up assembling is positioned to an inner core entirety, and upper EMI pieces 40, lower EMI pieces together for dividing plate module 30, DIP terminals module 20 50 and the electrical communication of dividing plate 302.

As shown in Figure 16 and Figure 17, the shielding case 60 is coated on foregoing inner core integral outer, the electrical communication of shielding case 60 Foregoing upper EMI pieces 40, lower EMI pieces 50 and dividing plate 302, are formed between the foregoing outer wall of hyoplastron body 301 and the inwall of shielding case 60 For the slot of plug docking；The shielding case 60 includes roof 61, left side wall 62, right side wall 63, bottom wall 64 and rear wall 65, its In, the back segment position of bottom wall 64 is formed with the resigning window 66 exposed for foregoing SMT legs 12, DIP legs 22；The left and right side From roof left and right side edge, one bending extension is formed wall respectively respectively；The bottom wall includes the first splicing plate portion spliced each other Splice plate portion with second, the first and second splicing plate part does not bend extension accordingly and forms from left and right side wall；The rear wall is from roof Integrally bending extension is formed end edge, and the left and right lateral margin one bending extension forward of the rear wall is formed with left side lapping plate 651, the right side Side lapping plate 652, offers overlap joint hole 653 on the left and right side lapping plate, be correspondingly formed outward on foregoing left and right side wall The shell fragment 66 of projection, the shell fragment 66 is stuck in corresponding overlap joint hole 653；And, button hole 67 is offered respectively on the left and right side wall, The left and right side at the sub- port 101 of aforementioned first ends is accordingly convexly equipped with button block 16, and the button block 16 is stuck in corresponding button hole 67.

As shown in FIG. 13 to 15, the assembling design structure that it show in more detail upper and lower EMI pieces；The upper and lower buckle bending Portion is respectively provided with overhead kick portion, and overhead kick portion 41 of buckle kink 402 is up buckled in the lower surface of dividing plate 302 on this, the lower buckle bending The overhead kick portion 51 in portion 502 is down buckled in the upper surface of dividing plate 302；Front side of buckle kink 401 is convexly equipped with upper limit convex portion on this 42, the rear side of the upper buckle kink 401 is convexly equipped with for strengthening being combined between upper buckle kink 402 and upper insulation division 31 The upper salient point 43 of tight ness rating；The rear side of the lower buckle kink 502 is convexly equipped with lower limit convex portion 52, the lower buckle kink 502 front side is convexly equipped with the lower salient point 53 for strengthening bonding tightness between lower buckle kink 502 and lower insulation division 32.

As shown in figure 14, the L-shaped structure of the upper embedded groove 15, the upper embedded groove 15 includes vertical slot 151 and upper horizontal stroke To groove 152, back segment of transverse groove 151 is communicated in the bottom of vertical slot 152 on this；The lower caulking groove 23 includes lower vertical slot 231 and lower transverse groove 232, the leading portion of the lower transverse groove 232 is communicated in the upper end of lower vertical slot 231；Foregoing upper buckle kink 402 lower ends are stretched into inside the back segment of lower transverse groove 232, and upper limit convex portion 42 of buckle kink 402 is butted on transverse groove 152 on this In inner top wall, upper salient point 43 of buckle kink 402 is tight with the inner back side wall of vertical slot 231 on this；Foregoing lower buckle The upper end of kink 502 is stretched into inside the leading portion of transverse groove 152, and the lower limit convex portion 52 of the lower buckle kink 502 is butted on lower horizontal stroke To in the interior bottom wall of groove 232, the lower salient point 53 of the lower buckle kink 502 is tight with the front side wall inside lower vertical slot 231；By This, foregoing upper EMI pieces 40, lower EMI pieces 50, the special construction design of dividing plate 302 ensure that firm assembling positioning, also ensure that Well electrically conduct, its EMI suppression effect is more preferable than the connector of conventional art.

As shown in Figures 4 to 7, for the group between foregoing SMT terminals module 10, dividing plate module 30 and DIP terminals module 20 Position is set, some auxiliary location structures are further devised, it is specific as follows：

The bottom of the first terminal port 101 is convexly equipped with the post 17 that is located by connecting, and positioning through hole 37 is offered on the dividing plate 302, should The top of Second terminal port 201 is arranged with the groove 24 that is located by connecting, and the post 17 that is located by connecting sequentially passes through positioning through hole 37, is located by connecting In groove 24；In the present embodiment, the post 17 that is located by connecting is provided with three in isosceles triangle, foregoing positioning through hole 37 and is located by connecting Groove 24 is also accordingly provided with three in isosceles triangle, and each post 17 that is located by connecting is embedded in corresponding positioning through hole 37, is located by connecting In groove 24.

And, the positioning of upper and lower EMI pieces can also help out by the assembled relation of locating convex block, locating slot；Should The top of the first terminal port 101 is convexly equipped with the upper locating convex block 18 for upper EMI pieces 40 positioning, is accordingly opened up on foregoing upper EMI pieces 40 There is upper locating slot 44, locating convex block 18 is snapped in locating slot 44 on this；The bottom of Second terminal port 201 is convexly equipped with confession The lower locating convex block 25 of the positioning of EMI pieces 50.Lower locating slot 54 is accordingly offered on foregoing lower EMI pieces 50, the lower locating convex block 25 Snap in lower locating slot 54.

Next, the assembling preparation method of the USB3.1 connector bodies of foregoing automated process is simply introduced, its Comprise the following steps：

（1）As shown in figure 5, individually produced by insert molding goes out SMT terminals module 10, first SMT terminals 102 are first punched, bent Into with contact site 11, the structure of SMT legs 12, then by the direct produced by insert molding of SMT terminals 102 in being formed in the first terminal port 101 SMT terminals module 10；

Independent produced by insert molding goes out DIP terminals module 20, is first first punched DIP terminals 202, is bent to form with contact site 21st, the structure of DIP legs 22, then by the direct produced by insert molding of DIP terminals 202 in formation DIP terminal modules in Second terminal port 201 20；

Independent produced by insert molding goes out dividing plate module 30：By the produced by insert molding of dividing plate 302 in formation dividing plate module in hyoplastron body 301 30；And, individually punching makes upper EMI pieces 40, lower EMI pieces 50 and shielding case 60；

（2）As shown in figure 4, SMT terminals module 10, dividing plate module 30, DIP terminals module 20 are stacked up and down successively；Upper EMI Piece 40 is arranged on the first terminal port 101 and buckle kink 402 is sequentially embedded upper embedded groove 15, middle caulking groove 36 from top to bottom thereon And lower caulking groove 23；Lower EMI pieces 50 are arranged at the bottom surface of Second terminal port 201 and its lower buckle kink 502 is embedding successively from bottom to top Enter lower caulking groove 23, middle caulking groove 36 and upper embedded groove 15；Upper and lower EMI pieces are by SMT terminals module 10, dividing plate module 30, DIP Terminals Dies Assembling is positioned to an inner core entirety, and upper EMI pieces 40, lower EMI pieces 50 and the electrical communication of dividing plate 302 to group 20 together；

（3）With reference to shown in Fig. 4 and Fig. 1, shielding case 60 is coated on foregoing inner core integral outer, the shielding case 60 electrically connects Logical foregoing upper EMI pieces 40, lower EMI pieces 50 and dividing plate 302；

In this way, the number of parts of its whole socket is simplified, it is not required to by other insulating base or the another interior iron for setting Shell assembles positioning, and the positioning assembling of its own is directly completed using EMI pieces, especially plays and is assembled into one to foregoing each several part Overall effect；Its whole processing procedure can realize full-automation, and processing quality is easy in substantially increasing production efficiency, and its processing procedure In management and control, so, the product quality of the USB3.1 connector bodies for being obtained is also more guaranteed than conventional art；In addition, in order to It is easy to USB3.1 connector bodies in the positioning on circuit board, can be in one is downward respectively on the left and right side wall of shielding case 60 Extension is formed with location pins 68, and, positioning convex column is convexly equipped with downwards in the back segment position bottom at the sub- port 101 of aforementioned first ends 19。

As shown in Figure 18 to Figure 20, which show second structure of embodiment, it is big with foregoing the first embodiment It is in place of part-structure all same, main difference：The positioning package assembly of DIP legs, specifically：

Its DIP leg is protruded horizontally up down to bend again and extended vertically backward from the rear end face of Second terminal port 201, herein by it The horizontal position for being exposed to Second terminal port rear end face is defined as horizontal part 71, its down bend after vertically extending part be defined as erecting Straight portion 72；The positioning seat 80 being easy to DIP legs positioning is further assembled with the rear end of Second terminal port 201 outside；

The rear end face both sides of Second terminal port 201 extension is formed with installing arm 90, and foregoing DIP legs are located at two installing arms 90 Between, the left and right medial surface of the installing arm 90 is arranged with T-shaped stopper slot 91, and T-shaped stopper slot 91 includes vertical spacing groove 911 With cross spacing groove 912, the top and bottom ends face of 911 up/down perforation installing arm of vertical spacing groove 90, it is logical that the cross spacing groove passes through 912 In the stage casing position of vertical spacing groove 911 and installing arm end face after 90s；

The L-shaped groove 81 that the foregoing DIP legs of some correspondences are set is offered on the positioning seat 80, its L-shaped groove 81 includes recessed Located at the level trough 811 and the vertical slots 812 for being communicated in the rear end of level trough 811 of the top surface of positioning seat 80, the vertical slots 812 are passed through downwards Logical positioning seat bottom 80；The horizontal part 71 of foregoing DIP legs is located in corresponding level trough 811, and its vertical portion 72 is from accordingly Vertical slots 812 stretch out；The left and right lateral surface of the positioning seat 80 is accordingly convexly equipped with T-shaped stopper protrusion 82, the T-shaped stopper protrusion 82 include the vertical spacing convex portions 821 of vertically extending setting and are laterally connected in the stage casing position of vertical spacing convex portion 821 and one The cross spacing convex portion 822 that body extends backward；The top of vertical spacing convex portion 821, the top of cross spacing convex portion 822 are provided with It is easy to the guiding face 823 for snapping in；

During assembling, positioning seat 80 is installed between two installing arms 90 from bottom to top, its vertical spacing convex portion 821 snaps in perpendicular To in stopper slot 911, its cross spacing convex portion 822 is snapped in cross spacing groove 912；Certainly, assembling when, DIP legs it is each The corresponding upper end of vertical slots 812 of the correspondence of vertical portion 72, in this way, mutually assembling positioning between the completion installing arm 90 of positioning seat 80 and two Meanwhile, DIP legs 22 are also completed in the positioning in L-shaped groove 81.

In foregoing assembling preparation method, the step of the present embodiment two（1）In, also need independent produced by insert molding to go out DIP terminals , first first be punched DIP terminals 202, be bent to form with contact site 21, the structure of DIP legs 22 by module 20, then by DIP terminals 202 Direct produced by insert molding is in formation DIP terminals module 20 in Second terminal port 201；The horizontal part of its DIP leg, vertical portion are exposed to The rear side of two-terminal port 201, positioning seat 80 is installed between two installing arms 90 from bottom to top, and its T-shaped stopper protrusion 82 snaps in T-shaped In stopper slot 91, the horizontal part 71 of DIP legs 22 is located in level trough 811, and the vertical portion 72 of DIP legs 22 is from vertical slots 812 Stretch out.

Design focal point of the invention is, its be mainly by SMT terminals module, DIP terminals module, dividing plate module, on EMI pieces, lower EMI pieces, the separate modular design of shielding case, SMT terminals module, DIP terminals module, dividing plate module are folded up and down Put, realize for SMT terminals module, DIP terminals module, dividing plate module assembling positioning together using upper EMI pieces, lower EMI pieces make-up An inner core entirety is formed, then shielding case is coated on outside inner core entirety, that is, form connector body product；Its simple structure, Design is ingenious rationally effectively to realize the full-automatic processing procedure of whole connector body product, substantially increases production efficiency, and Processing quality is easy to management and control in its processing procedure, improves product quality and yield；And, EMI pieces, lower EMI pieces, the spy of dividing plate thereon Different structure design, that is, ensure that firm assembling positioning, in turn ensures that and well electrically conducts, and its EMI suppression effect is than conventional art Connector is more preferable.

The above, is only presently preferred embodiments of the present invention, and not technical scope of the invention is imposed any restrictions, Therefore every any trickle amendment, equivalent variations and modification made to above example according to technical spirit of the invention, still Belong in the range of technical solution of the present invention.

Claims (10)

1. a kind of USB3.1 connector bodies of full-automatic processing procedure, it is characterised in that：Include

One SMT terminal modules, the SMT terminal modules include the first terminal port and produced by insert molding in some in the first terminal port SMT terminals, the SMT terminal leading portions have contact site, and the SMT terminal back segments are formed with SMT legs, and its contact site is from the first terminal Port front end is stretched out, and its SMT leg extends perpendicularly out the first terminal port bottom and horizontal buckling extension is exposed to outside the bottom of the first terminal port Side, and SMT terminals be after aforementioned contact portion, SMT legs is formed again direct produced by insert molding in the first terminal port；And, should Left and right end position offers the upper embedded groove for upper EMI pieces setting-in respectively on the first terminal port；

One DIP terminal modules, the DIP terminal modules include Second terminal port and produced by insert molding in some in Second terminal port DIP terminals, the DIP terminal leading portions have contact site, and the DIP terminal back segments are formed with DIP legs；And, the Second terminal port Upper left and right end position offers hold caulking groove for upper and lower EMI pieces are embedding respectively；

One dividing plate module, the dividing plate module includes hyoplastron body and produced by insert molding in the intrinsic dividing plate of hyoplastron；The hyoplastron body The leading portion position of dividing plate is at least coated on, hyoplastron body has upper and lower insulation division respectively positioned at dividing plate leading portion upper and lower, should The both side edges of upper and lower insulation division are consistent with dividing plate respective lateral edge shape, and dividing plate leading portion both side edges are respectively formed with and plug hook The mutually recess of lock, the both side edges of upper and lower insulation division are also formed with corresponding recess, and the recess inwall of dividing plate convex is exposed to hyoplastron Outside recess inwall；Insulation division is concavely provided with some upper end pilot trench on this, and the lower insulation division is concavely provided with some lower end pilot trench；Before State SMT terminals module, dividing plate module and DIP terminals module to be stacked up and down successively, the contact site of foregoing SMT terminals is stretched on corresponding Terminal groove is interior and is exposed to insulation division upper surface, and the contact site of foregoing DIP terminals is stretched into corresponding lower end pilot trench and is exposed to lower exhausted Edge lower surface；And, aforementioned separator plate stage casing position both side edges are formed with the middle caulking groove for upper and lower EMI pieces setting-in；

EMI pieces on one, EMI pieces include upper substrate portion and extend towards the one bending of upper insulation division from upper substrate portion both sides on this Upper buckle kink；Baseplate part is overlying on the first terminal port thereon, and buckle kink is sequentially embedded embedding from top to bottom thereon Groove, middle caulking groove and lower caulking groove；

Once EMI pieces, the lower EMI pieces include infrabasal plate portion and extend towards the one bending of lower insulation division from infrabasal plate portion both sides Lower buckle kink；Its infrabasal plate portion is overlying on Second terminal port, and its lower buckle kink is sequentially embedded down embedding from bottom to top Groove, middle caulking groove and upper embedded groove；Foregoing upper EMI pieces and lower EMI pieces by SMT terminals module, dividing plate module, DIP terminals module together Assembling is positioned to an inner core entirety, and upper EMI pieces, lower EMI pieces and dividing plate electrical communication；

One shielding case, the shielding case is coated on foregoing inner core integral outer, the foregoing upper EMI pieces of the shielding case electrical communication, lower EMI Piece and dividing plate, are formed with the slot docked for plug between foregoing hyoplastron body outer wall and shielding case inwall.

2. USB3.1 connector bodies of full-automatic processing procedure according to claim 1, it is characterised in that：It is described upper and lower Buckle kink is respectively provided with overhead kick portion, and overhead kick portion of buckle kink is up buckled in dividing plate lower surface on this, the lower buckle bending The overhead kick portion in portion is down buckled in dividing plate upper surface；

Upper limit convex portion is convexly equipped with front side of the upper buckle kink, is convexly equipped with rear side of the upper buckle kink for adding The upper salient point of strong upper bonding tightness between buckle kink and the first terminal port；It is convexly equipped with rear side of the lower buckle kink Lower limit convex portion, is convexly equipped with front side of the lower buckle kink for strengthening being tied between lower buckle kink and Second terminal port Close the lower salient point of tight ness rating；

The L-shaped structure of the upper embedded groove, the upper embedded groove includes vertical slot and upper transverse groove, and back segment of transverse groove connects on this Pass through the bottom of vertical slot；The lower caulking groove includes lower vertical slot and lower transverse groove, and the leading portion of the lower transverse groove is communicated in down The upper end of vertical slot；

Foregoing upper buckle kink lower end is stretched into inside lower transverse groove back segment, and upper limit convex portion of buckle kink is butted on this In transverse groove inner top wall, upper salient point of buckle kink is tight with vertical slot inner back side wall on this；

Foregoing lower buckle kink upper end is stretched into inside transverse groove leading portion, and the lower limit convex portion of the lower buckle kink is butted on down In transverse groove interior bottom wall, the lower salient point of the lower buckle kink is tight with the front side wall inside lower vertical slot.

3. USB3.1 connector bodies of full-automatic processing procedure according to claim 1, it is characterised in that：The first end Zi Bu bottoms are convexly equipped with the post that is located by connecting, and positioning through hole is offered on the dividing plate, and Second terminal port top is arranged with positioning and connects Access slot, the post that is located by connecting sequentially passes through positioning through hole, is located by connecting in groove；

The first terminal port top is convexly equipped with the upper locating convex block for upper EMI pieces positioning, is accordingly offered on foregoing upper EMI pieces Upper locating slot, locating convex block is snapped in locating slot on this；Second terminal port bottom is convexly equipped with lower EMI pieces positioning Locating convex block；Lower locating slot is accordingly offered on foregoing lower EMI pieces, the lower locating convex block is snapped in lower locating slot.

4. USB3.1 connector bodies of full-automatic processing procedure according to claim 1, it is characterised in that：The DIP welderings Pin is protruded horizontally up down to bend again and extended vertically backward from Second terminal port rear end face, its water for being exposed to Second terminal port rear end face Flat position is defined as horizontal part, its down bend after vertically extending part be defined as vertical portion；

The positioning seat being easy to DIP legs positioning is further assembled with Second terminal port rear end outside, is opened up on the positioning seat There is the L-shaped groove that the foregoing DIP legs of some correspondences are set, its L-shaped groove includes the recessed level trough in positioning seat top surface and connects In the vertical slots of level trough rear end, the downward insertion positioning seat bottom of the vertical slots；The horizontal position of foregoing DIP legs is in corresponding In level trough, and its vertical portion is stretched out from corresponding vertical slots.

5. USB3.1 connector bodies of full-automatic processing procedure according to claim 4, it is characterised in that：Second end Sub- port rear end face both sides extend and are formed with installing arm, and foregoing DIP legs are located between two installing arms, the installing arm it is left and right in Side is arranged with T-shaped stopper slot, and T-shaped stopper slot includes vertical spacing groove and cross spacing groove, and the vertical spacing groove is passed through up and down Logical installing arm top and bottom ends face, the cross spacing groove runs through vertical spacing groove stage casing position and installing arm rear end face；Foregoing positioning The left and right lateral surface of seat is accordingly convexly equipped with T-shaped stopper protrusion, and the T-shaped stopper protrusion includes the vertical limit of vertically extending setting Position convex portion and the cross spacing convex portion for being laterally connected in vertical spacing convex portion stage casing position and integrally extend backward；The vertical spacing Convex portion top, cross spacing convex portion top are provided with the guiding face for being easy to snap in, and the positioning seat is installed in two peaces from bottom to top Between dress arm, its vertical spacing convex portion is snapped in vertical spacing groove, and its cross spacing convex portion is snapped in cross spacing groove.

6. USB3.1 connector bodies of full-automatic processing procedure according to claim 1, it is characterised in that：The DIP ends Son be after aforementioned contact portion, DIP legs is formed again direct produced by insert molding in Second terminal port, its contact site is from Second terminal Port front end is stretched out, and its DIP leg is extended perpendicularly out directly from Second terminal port bottom.

7. USB3.1 connector bodies of full-automatic processing procedure according to claim 1, it is characterised in that：The first end Zi Bu bottoms are convexly equipped with some fixing location divisions for precise positioning SMT legs position；Foregoing SMT legs extend perpendicularly out One terminal port lower portion is defined as vertical portion, and its horizontal buckling extending part is defined as horizontal part；The fixing location division includes There are the rear holding parts for covering left holding parts in vertical portion left and right side, right holding parts respectively and being supported in horizontal part bottom surface, should Holding parts, left holding parts and right holding parts are integrally formed connection afterwards, and rear holding parts brace type is contacted with vertical portion trailing flank；Phase Neighbour's fixing is formed with groove between the positioning for being easy to mould molding to position between location division.

8. USB3.1 connector bodies of full-automatic processing procedure according to claim 1, it is characterised in that：The shielding case Include roof, left side wall, right side wall, bottom wall and rear wall, wherein, the bottom wall back segment position be formed with for foregoing SMT legs, The resigning window that DIP legs expose；

From roof left and right side edge, one bending extension is formed the left and right side wall respectively respectively；The bottom wall includes what is spliced each other First splicing plate portion and the second splicing plate portion, the first and second splicing plate part do not bend extension accordingly and form from left and right side wall； The rear wall is formed from the one bending extension of roof end edge, and the left and right lateral margin one bending extension forward of the rear wall is formed with left and right Side lapping plate, offers overlap joint hole on the left and right side lapping plate, projection outward is correspondingly formed on foregoing left and right side wall Shell fragment, the shell fragment is stuck in corresponding overlap joint hole；

And, button hole is offered on the left and right side wall respectively, the left and right side at the sub- port of aforementioned first ends is accordingly convexly equipped with button block, should Button block is stuck in corresponding button hole.

9. the assembling preparation method of the USB3.1 connector bodies of full-automation processing procedure as claimed in claim 1, its feature exists In：Comprise the following steps：

（1）Independent produced by insert molding goes out SMT terminal modules, is first first punched SMT terminals, is bent to form with contact site, SMT legs Structure, then by the direct produced by insert molding of SMT terminals in formation SMT terminal modules in the first terminal port；

Independent produced by insert molding goes out DIP terminal modules, is first first punched DIP terminals, is bent to form with contact site, DIP leg knots Structure, then by the direct produced by insert molding of DIP terminals in formation DIP terminal modules in Second terminal port；

Independent produced by insert molding goes out dividing plate module：By dividing plate produced by insert molding in formation dividing plate module in hyoplastron body；And, individually punching Tailor the upper EMI pieces of work, lower EMI pieces and shielding case；

（2）SMT terminals module, dividing plate module, DIP terminals module are stacked up and down successively；Upper EMI pieces are arranged on the first terminal port And buckle kink is sequentially embedded upper embedded groove, middle caulking groove and lower caulking groove from top to bottom thereon；Lower EMI pieces are arranged at Second terminal port Simultaneously its lower buckle kink is sequentially embedded lower caulking groove, middle caulking groove and upper embedded groove from bottom to top for bottom surface；Upper and lower EMI pieces are by SMT terminals Module, dividing plate module, DIP terminals module assemble be positioned to an inner core entirety together, and upper EMI pieces, lower EMI pieces and dividing plate electricity Property connection；

（3）Shielding case is coated on foregoing inner core integral outer, the foregoing upper EMI pieces of the shielding case electrical communication, lower EMI pieces and every Plate.

10. the assembling preparation method of the USB3.1 connector bodies of full-automatic processing procedure according to claim 9, its feature It is：Step（1）In, after its independent produced by insert molding goes out DIP terminal modules, its DIP leg from Second terminal port rear end face backward Protrude horizontally up down to bend again and extend vertically, the horizontal position that Second terminal port rear end face is exposed to herein is defined as level Portion, its down bend after vertically extending part be defined as vertical portion；Further it is assembled with Second terminal port rear end outside and is easy to To the positioning seat of DIP legs positioning, the L-shaped groove that the foregoing DIP legs of some correspondences are set, its L-shaped groove are offered on the positioning seat Include the recessed level trough in positioning seat top surface and be communicated in the vertical slots of level trough rear end, the downward insertion positioning of the vertical slots Seat bottom；Positioning seat is assembled in Second terminal port rear side, the horizontal position of foregoing DIP legs in corresponding level trough, and Its vertical portion is stretched out from corresponding vertical slots.