CN104942284A - Modified copper powder and preparation method thereof and electronic paste - Google Patents
Modified copper powder and preparation method thereof and electronic paste Download PDFInfo
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Abstract
The invention provides modified copper powder and a preparation method thereof and electronic paste. The modified copper powder comprises copper powder and a modifying agent coated on the surface of the copper powder, and the modifying agent is polyvinylpyrrolidone and/or a polyvinylpyrrolidone derivative. According to the modified copper powder and the preparation method thereof and the electronic paste, the oxidation rate of the copper powder is low, and both resistance and resistivity of the electronic paste prepared by the modified copper powder are lower than the resistance and the resistivity of the electronic paste of the embodiment.
Description
Technical field
The invention belongs to field of electronic materials, particularly relate to a kind of modification copper powder and preparation method thereof and electric slurry.
Background technology
Along with the mankind at a quick pace march toward informationized society, the process such as miniaturization, chip type, multiple stratification of various electronic component is accelerated day by day, to the metal dust such as silver, gold, nickel, copper for the demand of the electric slurry of major function phase also gets more and more.Electric slurry as the electrode of resistance, electric capacity, inductance etc., and is all widely used in the curtain coating etc. of anti-electromagnetic interference.The electrode of electronic ceramic component is raw material mainly with the noble metal such as gold, silver, palladium, and golden palladium price too expensive, relatively cheap silver affects components and parts performance again because of silver ion migration.Simultaneously along with the growth of the silver-colored valency in the world, the cost of silver slurry is also in continuous increase, and therefore conventional base metal prepares electric slurry at present.
In base metal, copper is a kind of raw material of more satisfactory making electric slurry, has every characteristic of electric slurry requirement, and cost ratio silver is low many, is the raw material that a kind of cost performance is higher.But metallic copper belongs to magnesium-yttrium-transition metal, its chemical property is very active, contact and just easily occur to be oxidized the oxide-film forming one deck and insulate, and this layer of oxide-film conducts electricity hardly, and copper powder practical degree is reduced greatly under normal temperature state with air; In addition, if by copper powder long-term storage or prevent in higher in temperature, that humidity is larger environment, then problem of oxidation is even more serious.Therefore, the problem of oxidation of copper powder greatly limit the application of copper powder in electric slurry field.
At present, the method adopted to prevent oxidization of copper powder has: 1, plate one deck silver or nickel at Copper Powder Surface, and to protect metal powder not oxidized, the method can volume protection metal powder be not oxidized very well; 2, using hydrazine hydrate as antioxidant, hydrazine hydrate is strong reductant, and copper powder can be protected not oxidized; 3, a large amount of bonding ensure mutually shaping after form, improve the intensity of shaping rear circuit; 4, metal powder and epoxy-resin systems, the good coated copper powder of epoxy resin energy, anti-oxidation.Although said method can prevent copper powder oxidized, but there is following problem: 1, plate one deck silver or nickel, to protect metal powder not oxidized, though the method can protect metal powder not oxidized well at metal powder surface, but complex process, cost is high; 2, using hydrazine hydrate as antioxidant, but hydrazine hydrate belongs to extremely toxic substance, dangerous, protection difficulty; 3, a large amount of bonding ensure mutually shaping after form, but increase mutually due to bonding, the bridge joint decreased effectiveness of metal powder, have impact on shaping after electrical conductivity; 4, metal powder and epoxy-resin systems, standing time is not long, needs matching while using, and technological level cannot ensure.
Summary of the invention
The present invention, for solving the easy oxidized technical problem of existing copper powder, provides a kind of not easily oxidized modification copper powder and preparation method thereof and electric slurry.
The invention provides a kind of modification copper powder, described modification copper powder comprises copper powder and the coated modifier of described Copper Powder Surface, and described modifier is polyvinylpyrrolidone and/or polyvinylpyrrolidone derivative.Present invention also offers a kind of preparation method of modification copper powder, modifier be dissolved in absolute ethyl alcohol and form solution, then copper powder and solution are mixed in oxygen-free environment, after dispersed with stirring drying obtain modification copper powder.
In the present invention; use polyvinylpyrrolidone (PVP) or its derivative modified copper powder, polyvinylpyrrolidone or its derivative effectively can wrap up copper powder, form layer protecting film at Copper Powder Surface; copper powder is protected, reaches the effect stoping copper powder oxidized.
Present invention also offers a kind of electric slurry, described electric slurry comprises conductive agent, binding agent and organic carrier; Described conductive agent is modification copper powder of the present invention.The good in oxidation resistance of electric slurry of the present invention.
Detailed description of the invention
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides a kind of modification copper powder, described modification copper powder comprises copper powder and the coated modifier of described Copper Powder Surface, and described modifier is polyvinylpyrrolidone and/or polyvinylpyrrolidone derivative.According to modification copper powder provided by the present invention, preferably, described polyvinylpyrrolidone derivative is at least one in hydrazine hydrate modified polyvinyl pyrrolidone, salicylyl hydrazine modified polyvinyl pyrrolidone and semicarbazides modified polyvinyl pyrrolidone.Described acylhydrazone structure-CH=NNHCO-has very strong reproducibility and coordination ability, can further reach oxidation resistant effect.
According to modification copper powder provided by the present invention, in order to coated as much as possible copper powder, place copper powder oxidized, save the consumption of modifier simultaneously, preferably, the mass ratio 2-8:100 of described modifier and copper powder, more preferably 4:100.The present inventor finds through great many of experiments, and when modifier and copper powder mass ratio reach 4:100, oxidization of copper powder rate has reached minimum, then the content improving modifier further can not reduce the oxidation of copper powder.
Present invention also offers the preparation method of above-mentioned modification copper powder, the method forms solution for be dissolved in absolute ethyl alcohol by modifier, then copper powder and solution are mixed in oxygen-free environment, after dispersed with stirring drying obtain modification copper powder.
The preparation method of modification copper powder provided by the invention, described stirring refers to uses ultrasonic wave process, and the time of process, for allow modifier and copper powder fully contact as far as possible, is generally 15-30min.
The polyvinylpyrrolidone that the present invention is used and polyvinylpyrrolidone derivative can be purchased also can oneself preparation.The present invention's polyvinylpyrrolidone used is bought in (Aladdin Reagent Company); The present invention's polyvinylpyrrolidone derivative used adopts above-mentioned polyvinylpyrrolidone to prepare.
The preparation method of polyvinylpyrrolidone derivative is: the PVP getting 20g is dissolved in the toluene solution of 1000ml, and ultrasonic wave process 30min obtains finely dispersed PVP solution; Getting 20g modifier is dissolved in PVP solution, and ultrasonic disperse 15min, obtains mixed solution; By gained mixed solution heating water bath mode process 2h, water temperature 90 DEG C; Then steam toluene, cooling and stirring produces precipitation, and suction filtration drying obtains PVP modification derivant.Described modifier is hydrazine hydrate, salicyloyl or semicarbazides.Hydrazine hydrate modification PVP derivative R
1r
2c=NNH
2, structural formula is:
salicylyl hydrazine modification PVP derivative R
1r
2c=NNHCOC
6h
4oH, structural formula is
.Semicarbazides modification PVP derivative R
1r
2c=NNHC
6h
5, structural formula is
.PVP is R
1r
2c=, structural formula is
.
Present invention also offers a kind of electric slurry, described electric slurry comprises conductive agent, binding agent and organic carrier; Described conductive agent is modification copper powder of the present invention.
According to electric slurry provided by the present invention, in order to improve the performance of electric slurry further, preferably, the mass ratio of described conductive agent, described binding agent and described organic carrier is 50-80:0.5-4:100.
According to electric slurry provided by the present invention, preferably, described binding agent contains B
2o
3, SiO
2and ZnO, described B
2o
3, SiO
2be 1-2:1:0.5-1 with the mass ratio of ZnO.
According to electric slurry provided by the present invention, preferably,
Described organic carrier comprises solvent, thickener and additive; Described solvent is at least one in terpinol, diethylene glycol, butyl, turpentine oil and isopropyl alcohol; Described thickener is at least one in ethyl cellulose, NC Nitroncellulose, polyvinyl alcohol and polyvinyl alcohol acetate; Described additive is at least one in furancarboxylic acid, mountain oleic acid sorbitol ester, lauryl aldehyde and ammonium sulfate.
According to electric slurry provided by the present invention, in order to solvent volatilization progressively can be ensured, avoid causing because volatilization concentrated by solvent and causing the unfavorable conditions such as printed layers cracking, preferably, the mass ratio of described terpinol, diethylene glycol, butyl is 10-18:2-4:1-3.
According to electric slurry provided by the present invention, preferably, with the gross mass of described organic carrier for benchmark, the content of described terpinol is 50-90wt%, and the content of described diethylene glycol is 0-30wt%, the content of described butyl is 0-30wt%, the content of described ethyl cellulose is 5-10wt%, and the content of described furancarboxylic acid is 0-2wt%, and the content of described mountain oleic acid sorbitol ester is 0-2wt%, the content of described lauryl aldehyde is 0-2wt%, and the content of described ammonium sulfate is 0-2wt%.
According to electric slurry provided by the present invention, preferably, also containing dibutyl phthalate in described organic carrier, with the gross mass of organic carrier for benchmark, the content of described dibutyl phthalate is 0-10wt%.The ester group that two polarity is very strong is had in dibutyl phthalate molecule, form hydrogen bond with the hydroxyl on ethyl cellulose chain and be difficult to volatilize, if therefore the ratio of dibutyl phthalate is appropriate, the viscosity of slurry can be improved on the one hand, the volatility of slurry can be regulated on the other hand.
According to electric slurry provided by the present invention, in order to improve the viscosity of electric slurry further, preferably, the mass ratio of described dibutyl phthalate and described ethyl cellulose is 1:2-5.
The preparation method of electronic conduction slurry of the present invention, namely described method obtains described electric slurry for mixed liquor, binding agent and organic carrier being mixed, stirring, grind.
Below by specific embodiment, the present invention is described in further detail.
Embodiment 1
1, PVP derivative is prepared
The PVP getting 20g is dissolved in the toluene solution of 1000ml, ultrasonic wave process 30min, obtains finely dispersed PVP solution; Get in the molten PVP solution of 20g salicylyl hydrazine, ultrasonic disperse 15min, obtains mixed solution; By mixed solution heating water bath mode process 2h, water temperature 90 DEG C; Then steam toluene, cooling and stirring is shown in has precipitation to produce, and suction filtration drying obtains salicylyl hydrazine modification PVP;
2, modification copper powder is prepared
(1), get PVP modification derivant 2 grams and be dissolved in 200 grams of absolute ethyl alcohols formation solution, being positioned over after ultrasonic process 30min is full of in the glove box of nitrogen, gets the Cu powder do not broken a seal, opens in glove box, and claim the Cu powder of 100 grams to be positioned in the solution of PVP modification derivant, obtain mixed liquor;
(2), by step (1) gained mixed liquor plastic foil seal and put rubber ring, ultrasonic wave process 30min after taking out from glove box, suction filtration drying obtains modification copper powder A1;
3, electric slurry is prepared
(1) according in table 1 containing measuring terpinol, diethylene glycol, butyl, dibutyl phthalate, mountain oleic acid sorbitol ester, lauryl aldehyde, ammonium sulfate, furancarboxylic acid put in beaker, seal rear 80 DEG C of heating water baths, stir 1h with electric mixer;
(2) add modification copper powder A1 and binding agent according to the content of each material in table 1, continue to stir 1h, grind with ceramic three-roll grinder after taking out beaker cooling, control the gap between rotating speed and each roller, after grinding 2h, obtain electric slurry B1.
Table 1
。
Remarks: unit, g.
Embodiment 2
1, modification copper powder is prepared
(1), get PVP 4 grams and be dissolved in 200 grams of absolute ethyl alcohols formation solution, being positioned over after ultrasonic process 30min is full of in the glove box of nitrogen, gets the Cu powder do not broken a seal, opens in glove box, and claim the Cu powder of 100 grams to be positioned in the solution of PVP modification derivant, obtain mixed liquor;
(2), by step (1) gained mixed liquor plastic foil seal and put rubber ring, ultrasonic wave process 30min after taking out from glove box, suction filtration drying obtains modification copper powder A2.
Prepare electric slurry B2 according to the method according to embodiment 1 step 3, difference is: the content of each material is in table 1.
Embodiment 3
1, modification copper powder is prepared
(1), get PVP 8 grams and be dissolved in 200 grams of absolute ethyl alcohols formation solution, being positioned over after ultrasonic process 30min is full of in the glove box of nitrogen, gets the Cu powder do not broken a seal, opens in glove box, and claim the Cu powder of 100 grams to be positioned in the solution of PVP modification derivant, obtain mixed liquor;
(2), by step (1) gained mixed liquor plastic foil seal and put rubber ring, ultrasonic wave process 30min after taking out from glove box, suction filtration drying obtains modification copper powder A3.
Prepare electric slurry B3 according to the method according to embodiment 1 step 3, difference is: the content of each material is in table 1.
Embodiment 4
1, PVP derivative is prepared
The PVP getting 20g is dissolved in the toluene solution of 1000ml, ultrasonic wave process 30min, obtains finely dispersed PVP solution; Get in the molten PVP solution of 20g hydrazine hydrate, ultrasonic disperse 15min, obtains mixed solution; By mixed solution heating water bath mode process 2h, water temperature 90 DEG C; Then steam toluene, cooling and stirring is shown in has precipitation to produce, and suction filtration drying obtains hydrazine hydrate modification PVP;
2, modification copper powder is prepared
(1), get hydrazine hydrate modification PVP8 gram that step 1 prepares to be dissolved in 200 grams of absolute ethyl alcohols and to form solution, being positioned over after ultrasonic process 30min is full of in the glove box of nitrogen, get the Cu powder do not broken a seal, open in glove box, and claim the Cu powder of 100 grams to be positioned in the solution of PVP modification derivant, obtain mixed liquor;
(2), by step (1) gained mixed liquor plastic foil seal and put rubber ring, ultrasonic wave process 30min after taking out from glove box, suction filtration drying obtains modification copper powder A4.
Prepare electric slurry B4 according to the method according to embodiment 1 step 3, difference is: the content of each material is in table 1.
Embodiment 5
1, PVP derivative is prepared
The PVP getting 20g is dissolved in the toluene solution of 1000ml, ultrasonic wave process 30min, obtains finely dispersed PVP solution; Get in the molten PVP solution of 20g semicarbazides, ultrasonic disperse 15min, obtains mixed solution; By mixed solution heating water bath mode process 2h, water temperature 90 DEG C; Then steam toluene, cooling and stirring is shown in has precipitation to produce, and suction filtration drying obtains semicarbazides modification PVP;
2, modification copper powder is prepared
(1) 6 grams, the PVP derivative, getting PVP 4 grams and step 1 preparation is dissolved in 200 grams of absolute ethyl alcohols and forms solution, being positioned over after ultrasonic process 30min is full of in the glove box of nitrogen, gets the Cu powder do not broken a seal, opens in glove box, and claim the Cu powder of 100 grams to be positioned in solution, obtain mixed liquor;
(2), by step (1) gained mixed liquor plastic foil seal and put rubber ring, ultrasonic wave process 30min after taking out from glove box, suction filtration drying obtains modification copper powder A5.
Prepare electric slurry B5 according to the method according to embodiment 1 step 3, difference is: the content of each material is in table 1.
Embodiment 6
1, modification copper powder is prepared
(1), get PVP 1 gram and be dissolved in 200 grams of absolute ethyl alcohols formation solution, being positioned over after ultrasonic process 30min is full of in the glove box of nitrogen, gets the Cu powder do not broken a seal, opens in glove box, and claim the Cu powder of 100 grams to be positioned in the solution of PVP modification derivant, obtain mixed liquor;
(2), by step (1) gained mixed liquor plastic foil seal and put rubber ring, ultrasonic wave process 30min after taking out from glove box, suction filtration drying obtains modification copper powder A6.
Prepare electric slurry B6 according to the method according to embodiment 1 step 3, difference is: the content of each material is in table 1.
Embodiment 7
1, modification copper powder is prepared
(1) 4 grams, the PVP derivative that, Example 1 prepares is dissolved in 200 grams of absolute ethyl alcohols and forms solution, being positioned over after ultrasonic process 30min is full of in the glove box of nitrogen, get the Cu powder do not broken a seal, open in glove box, and claim the Cu powder of 100 grams to be positioned in the solution of PVP modification derivant, obtain mixed liquor;
(2), by step (1) gained mixed liquor plastic foil seal and put rubber ring, ultrasonic wave process 30min after taking out from glove box, suction filtration drying obtains modification copper powder A7.
Prepare electric slurry B7 according to the method according to embodiment 1 step 3, difference is: the content of each material is in table 1.
Embodiment 8
Modification copper powder A8 is prepared according to the method for embodiment 7.
Prepare electric slurry B8 according to the method according to embodiment 1 step 3, difference is: the content of each material is in table 1.
Embodiment 9
Modification copper powder A9 is prepared according to the method for embodiment 7.
Prepare electric slurry B9 according to the method according to embodiment 1 step 3, difference is: the content of each material is in table 1.
Embodiment 10
Modification copper powder A10 is prepared according to the method for embodiment 7.
Prepare electric slurry B10 according to the method according to embodiment 1 step 3, difference is: the content of each material is in table 1.
Comparative example 1
Commercial copper powder (Nanjing Ding Kai Science and Technology Ltd., particle mean size 2-10 μm) CA1.
Electric slurry CB1 is prepared according to the method for embodiment 1 step 3.
Performance test
1, oxygenation efficiency
Placed by copper powder A1-A10 and CA1 after two weeks and carry out TG-DSC test, copper powder quality before not carrying out TG-DSC test is m, and atmospheric condition is air atmosphere, if the copper powder before test does not have oxidative phenomena completely, then after test, quality is 80/64m=1.25m.If the oxygenation efficiency of 1 gram mass is X.Then carrying out the rear quality of TG-DSC test is Xm+1.25(1-X) m=m1.Because m1 and m all directly can read from TG-DSC resolution chart, so the quality oxide percentage X of copper powder can be drawn.
2, line resistance rate test
By the electric slurry B1-B10 of embodiment and the electric slurry CB1 of comparative example 200 object silk screens; be printed on surperficial alumina wafer of having polished; obtain product Y1-Y10 and CY1; shape is the rectangle of rule; with the speed of 10 DEG C/min, 660 DEG C of insulation 90min burning infiltration in protective atmosphere.After cooling, measure the length and width, thick obtaining electronic circuit, re-use the size of QJ23 type direct-current bridge (Shanghai electrical instrument factory product) test resistance rate.The results are shown in Table 3.
3, adhesive force test
Adopt the adhesive force size according to GB GBT9286-1998 hundred lattice method of testing test products Y1-Y10 and CY1, the results are shown in Table 3.
Table 2
。
Table 3
。
As can be seen from table 2-3, the oxygenation efficiency of copper powder of the present invention is low, and the resistance of the electric slurry prepared with copper powder of the present invention and resistivity are all lower than resistance and the resistivity of the electric slurry of comparative example.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (12)
1. a modification copper powder, is characterized in that, described modification copper powder comprises copper powder and the coated modifier of described Copper Powder Surface, and described modifier is polyvinylpyrrolidone and/or polyvinylpyrrolidone derivative.
2. modification copper powder according to claim 1, is characterized in that, described polyvinylpyrrolidone derivative is at least one in hydrazine hydrate modified polyvinyl pyrrolidone, salicylyl hydrazine modified polyvinyl pyrrolidone and semicarbazides modified polyvinyl pyrrolidone.
3. modification copper powder according to claim 1 and 2, is characterized in that, the mass ratio 2-8:100 of described modifier and copper powder.
4. the preparation method of modification copper powder described in claim 1-3 any one, is characterized in that, the method forms solution for be dissolved in absolute ethyl alcohol by modifier, then copper powder and solution are mixed in oxygen-free environment, after dispersed with stirring drying obtain modification copper powder.
5. an electric slurry, is characterized in that, described electric slurry comprises conductive agent, binding agent and organic carrier; Described conductive agent is the modification copper powder described in any one of claim 1-3.
6. electric slurry according to claim 5, is characterized in that, the mass ratio of described conductive agent, described binding agent and described organic carrier is 50-80:0.5-4:100.
7. electric slurry according to claim 5, is characterized in that, described binding agent contains B
2o
3, SiO
2and ZnO, described B
2o
3, SiO
2be 1-2:1:0.5-1 with the mass ratio of ZnO.
8. electric slurry according to claim 5, is characterized in that, described organic carrier comprises solvent, thickener and additive; Described solvent is at least one in terpinol, diethylene glycol, butyl, turpentine oil and isopropyl alcohol; Described thickener is at least one in ethyl cellulose, NC Nitroncellulose, polyvinyl alcohol and polyvinyl alcohol acetate; Described additive is at least one in furancarboxylic acid, mountain oleic acid sorbitol ester, lauryl aldehyde and ammonium sulfate.
9. electric slurry according to claim 8, it is characterized in that, with the gross mass of described organic carrier for benchmark, the content of described terpinol is 50-90wt%, and the content of described diethylene glycol is 0-30wt%, the content of described butyl is 0-30wt%, the content of described ethyl cellulose is 5-10wt%, and the content of described furancarboxylic acid is 0-2wt%, and the content of described mountain oleic acid sorbitol ester is 0-2wt%, the content of described lauryl aldehyde is 0-2wt%, and the content of described ammonium sulfate is 0-2wt%.
10. electric slurry according to claim 9, is characterized in that, the mass ratio of described terpinol, diethylene glycol, butyl is 10-18:2-4:1-3.
11. electric slurries according to Claim 8 described in-10 any one, is characterized in that, also containing dibutyl phthalate in described organic carrier, with the gross mass of organic carrier for benchmark, the content of described dibutyl phthalate is 0-10wt%.
12. electric slurries according to claim 11, is characterized in that, the mass ratio of described dibutyl phthalate and described ethyl cellulose is 1:2-5.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106683743A (en) * | 2016-12-02 | 2017-05-17 | 天津宝兴威科技股份有限公司 | Silver paste suitable for photo process |
| CN108097978A (en) * | 2017-12-02 | 2018-06-01 | 温州宏丰电工合金股份有限公司 | A kind of preparation method for covering copper Alpha-alumina/Graphite Composite Powder |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996024938A1 (en) * | 1995-02-08 | 1996-08-15 | Hitachi Chemical Co., Ltd. | Composite conductive powder, conductive paste, method of producing conductive paste, electric circuit and method of fabricating electric circuit |
| JP2003347102A (en) * | 2002-03-19 | 2003-12-05 | Koa Corp | Resistance element paste, resistor, and manufacturing method thereof |
| CN102151823A (en) * | 2011-01-26 | 2011-08-17 | 宁波广博纳米材料有限公司 | Antioxidation method of nano copper powder |
| CN102169739A (en) * | 2011-02-25 | 2011-08-31 | 乐山新天源太阳能电力有限公司 | Nanometer aluminum paste for solar battery and manufacturing method thereof |
| CN102773475A (en) * | 2012-07-31 | 2012-11-14 | 东南大学 | Copper oxide silver composite powder for conductive paste and preparation method thereof |
| CN102950283A (en) * | 2012-11-06 | 2013-03-06 | 昆明舒扬科技有限公司 | Preparation method for superfine silver plating copper powder used for electronic paste |
| CN103093862A (en) * | 2011-10-27 | 2013-05-08 | 比亚迪股份有限公司 | Silver electrocondution slurry for solar battery |
-
2014
- 2014-03-27 CN CN201410120509.XA patent/CN104942284A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996024938A1 (en) * | 1995-02-08 | 1996-08-15 | Hitachi Chemical Co., Ltd. | Composite conductive powder, conductive paste, method of producing conductive paste, electric circuit and method of fabricating electric circuit |
| JP2003347102A (en) * | 2002-03-19 | 2003-12-05 | Koa Corp | Resistance element paste, resistor, and manufacturing method thereof |
| CN102151823A (en) * | 2011-01-26 | 2011-08-17 | 宁波广博纳米材料有限公司 | Antioxidation method of nano copper powder |
| CN102169739A (en) * | 2011-02-25 | 2011-08-31 | 乐山新天源太阳能电力有限公司 | Nanometer aluminum paste for solar battery and manufacturing method thereof |
| CN103093862A (en) * | 2011-10-27 | 2013-05-08 | 比亚迪股份有限公司 | Silver electrocondution slurry for solar battery |
| CN102773475A (en) * | 2012-07-31 | 2012-11-14 | 东南大学 | Copper oxide silver composite powder for conductive paste and preparation method thereof |
| CN102950283A (en) * | 2012-11-06 | 2013-03-06 | 昆明舒扬科技有限公司 | Preparation method for superfine silver plating copper powder used for electronic paste |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106683743A (en) * | 2016-12-02 | 2017-05-17 | 天津宝兴威科技股份有限公司 | Silver paste suitable for photo process |
| CN108097978A (en) * | 2017-12-02 | 2018-06-01 | 温州宏丰电工合金股份有限公司 | A kind of preparation method for covering copper Alpha-alumina/Graphite Composite Powder |
| CN108097978B (en) * | 2017-12-02 | 2020-08-21 | 温州宏丰电工合金股份有限公司 | Preparation method of copper-clad alpha-alumina/graphite composite powder |
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Application publication date: 20150930 |