The micro- cleaning mechanisms for boring parameter measurement system of PCB
Technical field
The present invention relates to detection device technical field, the micro- cleaning mechanisms for boring parameter measurement system of particularly a kind of PCB.
Background technology
With the development of printed circuit board (PCB) (PCB) technology and product, to the microbit for processing printed circuit board
It is required that more and more higher.PCB is with the capillary processing work with helicla flute that microbit (the micro- brills of abbreviation PCB) is a kind of multiple of shape
Tool, is derived by traditional fluted drill.The micro- brill sizes of PCB are small, and its apex point structure will could be observed by light microscope
Arrive.
Because the micro- brill sizes of PCB are small therefore need first to clean it before detection, greasy dirt etc. is prevented, influences to examine
Survey.
The method of the micro- brills of existing cleaning PCB, typically using artificial method, the micro- brills of PCB are put into cleaning solution one by one
Row cleaning.But this method efficiency is low, and it is unfavorable for automating.
The content of the invention
Efficiency existing for the cleaning micro- brills of PCB is low by hand at present, and unfavorable the problem of automating cleaning in order to solve by the present invention
A kind of and micro- cleaning mechanisms for boring parameter measurement system of PCB provided.
To reach above-mentioned function, technical scheme provided by the invention is:
A kind of micro- cleaning mechanisms for boring parameter measurement system of PCB, including placement rack, cylinder, hot air apparatus and cleaning gas
Pipe, the placement rack are fixedly connected with the cylinder, and by cylinder driving closer or far from the hot air apparatus, it is described clear
The gas outlet of clean tracheae is arranged on before the air outlet of the hot air apparatus, is provided with the placement rack and is placed the micro- brills of PCB
Putting hole.
Preferably, the hot air apparatus is thermal chimney.
Preferably, the cleaning mechanism also includes a cleaning outer cover, and being provided with the cleaning outer cover allows the micro- drillings of PCB
The through hole gone out, the gas outlet of the cleaning tracheae and the air outlet of the hot air apparatus are arranged in the cleaning outer cover, described
Connector is provided with above cleaning outer cover.
Preferably, the cleaning mechanism also includes a buffer, after the buffer is fixedly mounted on the placement rack
End.
Preferably, it is installed with detector below the putting hole.
The beneficial effects of the present invention are:By setting hot air apparatus and cleaning tracheae, placement is bored when PCB to be cleaned is micro-
Before taking the air outlet of hot air apparatus to by cylinder on to placement rack, hot air apparatus heats against the micro- blowing hot-airs that bore of PCB to it,
The greasy dirt for making to be adhered on the micro- brills of PCB melts, and then cleans the clean gas drilling row cleaning micro- to PCB that tracheae sprays high pressure,
Remove the greasy dirt and dust on the micro- brills of PCB;Compared compared with the mode cleaned by hand, cleaning efficiency of the invention is high, and this hair
It is bright to may be mounted on detection device, realize the automation of cleaning and detection.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention;
Fig. 2 is the decomposing schematic representation of the present invention.
Embodiment
Below in conjunction with the accompanying drawings 1 and accompanying drawing 2 the present invention is further elaborated:
A kind of micro- cleaning mechanism for boring parameter measurement system of PCB as depicted in figs. 1 and 2, including placement rack 1, cylinder 2,
Hot air apparatus 3 and cleaning tracheae 4, placement rack 1 are fixedly mounted on a connecting seat 8, and the bottom of connecting seat 8 is provided with guide groove,
Guide groove is engaged with guide rail 9 so that it is guaranteed that connecting seat 8 moves along guide rail 9, and placement rack 1 is fixed by connecting seat 8 and cylinder 2
Connection, and driven by cylinder 2 and be arranged on the air-out of hot air apparatus 3 closer or far from hot air apparatus 3, the gas outlet of cleaning tracheae 4
Before mouthful, the putting hole 11 for placing the micro- brills 10 of PCB is provided with placement rack 1.
In the present embodiment, hot air apparatus 3 uses thermal chimney.
Cleaning mechanism also includes a cleaning outer cover 5, and cleaning to be provided with outer cover 5 allows the micro- through holes 51 for boring 10 disengaging of PCB,
Clean the gas outlet of tracheae 4 and the air outlet of hot air apparatus 3 is arranged in cleaning outer cover 5, the purpose for setting Clean cover is to prevent
During cleaning, greasy dirt or dust splash everywhere, cleaning outer cover 5 top be provided with connector 52, pass through connector 52, Wo Menke
With external dust exhaust apparatus with siphon away cleaning outer cover 5 in greasy dirt and dust.
Because inertia encounters other parts during in order to prevent that placement rack 1 from retreating, in the present embodiment, we are in placement rack
1 rear is provided with a buffer 6, and when being moved under driving of the placement rack 1 in cylinder 2 backward, placement rack 1 first can delay in compression
Rush device 6 and then slowly stop again.
The lower section of putting hole 11 is installed with detector 7, when detector 7 detect be placed with putting hole 11 it is to be cleaned
PCB it is micro- bore 10 when, cylinder 2 can just drive placement rack 1 move to cleaning outer cover 5 in etc. it is to be cleaned.
The occupation mode of the present invention is as follows:
When in use, the micro- brill 10 of PCB to be measured is placed on the putting hole 11 of placement rack 1, when detector 7 detects
After the micro- brills 10 of PCB are placed with putting hole 11, cylinder 2 drives placement rack 1 to move in cleaning outer cover 5, and then thermal chimney is blown out
Hot blast brill 10 micro- to PCB heats, and the micro- greasy dirts bored on 10 of PCB melt after running into hot blast, and gas blow pipe blows out gases at high pressure again
Brill 10 micro- to PCB carries out cleaning and blows away the greasy dirt and dust being adhered on the micro- brills 10 of PCB, and after cleaning, cylinder 2 drives the micro- brills of PCB
10 return to initial position, so as to complete cleaning.
Embodiment described above, simply the present invention preferred embodiments, be not limit the present invention practical range, therefore it is all according to
The equivalent change or modification that construction, feature and principle described in scope of the present invention patent are done, all should be included in the present invention
In patent claim.