CN104930191A - Wafer box door improvement structure - Google Patents
Wafer box door improvement structure Download PDFInfo
- Publication number
- CN104930191A CN104930191A CN201410102080.1A CN201410102080A CN104930191A CN 104930191 A CN104930191 A CN 104930191A CN 201410102080 A CN201410102080 A CN 201410102080A CN 104930191 A CN104930191 A CN 104930191A
- Authority
- CN
- China
- Prior art keywords
- case door
- wafer case
- wafer
- box door
- wafer box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Gasket Seals (AREA)
Abstract
The invention discloses a wafer box door improvement structure comprising a wafer box door body and a sealing member. A sealing groove is formed in the port part of the wafer box body; the sealing member is disposed in the sealing groove; and the sealing member is a rubber ring. The sealing groove is directly formed in the wafer box door, so a traditional method of fixing a rubber ring via fixation of a polytetrafluorethylene layer via a screw is eliminated, so screw separation and contact to the front panel of equipment upon up and downs of the wafer box door can be avoided; and wafer production can be improved.
Description
Technical field
The present invention be more particularly directed to a kind of wafer case door modified node method.
Background technique
In prior art, the wafer case door of wafer manufacture process equipment adopts polytetrafluoroethylene floor 3 ' to fix box door rubber ring, therefore needs screw to be fixedly tightened on wafer case door 1 ' by polytetrafluoroethylene floor 3 '.
When wafer case door 1 ' dipping and heaving fluctuates, screw 2 ' departs from and the front panel of contact arrangement, and this front panel is baking vanish surface, causes front panel produce scratch and cause particle source, thus affects the output of wafer.
Summary of the invention
The object of this invention is to provide a kind of wafer case door modified node method, directly offer seal groove at wafer case door, abandon traditional mode being screwed polytetrafluoroethylene floor and fix rubber ring, when avoiding the fluctuating of wafer case door, screw departs from and the front panel of contact arrangement, and improves the output of wafer.
In order to realize above object, the present invention is achieved by the following technical solutions:
A kind of wafer case door modified node method, is characterized in, comprises:
Wafer case door body, described wafer case door body oral area is provided with a circle seal groove;
Sealing, it is arranged in seal groove.
Described Sealing is rubber ring.
The present invention compared with prior art, has the following advantages:
The present invention directly offers seal groove at wafer case door, and Sealing is equipped with in seal groove, abandon traditional mode being screwed polytetrafluoroethylene floor and fix rubber ring, when avoiding the fluctuating of wafer case door, screw departs from and the front panel of contact arrangement, and improves the output of wafer.
Accompanying drawing explanation
Fig. 1 is polytetrafluoroethylene floor and screw connecting structure schematic diagram in wafer case door in prior art;
Fig. 2 is the structural representation of a kind of wafer case door of the present invention modified node method;
Fig. 3 is the sectional view of a kind of wafer case door of the present invention modified node method.
Embodiment
Below in conjunction with accompanying drawing, by describing a preferably specific embodiment in detail, the present invention is further elaborated.
As shown in Figure 2,3, a kind of wafer case door modified node method, comprises: wafer case door body 1, and described wafer case door body 1 oral area is provided with a circle seal groove 11; Sealing 2, it is arranged in seal groove 11.Described Sealing 2 is rubber ring.Described Sealing 2 surround the shape size of framework and described seal groove 11 to offer the shape size of notch suitable.
The present invention directly offers seal groove at wafer case door, and is equipped with in seal groove 11 by Sealing 2, has abandoned traditional mode being screwed polytetrafluoroethylene floor and has fixed rubber ring; Avoid screw when wafer case door rises and falls to depart from and the front panel of contact arrangement, cause front panel produce scratch and cause particle source; And improve the output of wafer.
Although content of the present invention has done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple amendment of the present invention and substitute will be all apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (3)
1. a wafer case door modified node method, is characterized in that, comprises:
Wafer case door body (1), described wafer case door body (1) oral area is provided with a circle seal groove (11);
Sealing (2), it is arranged in seal groove (11).
2. wafer case door modified node method as claimed in claim 1, it is characterized in that, described Sealing (2) is rubber ring.
3. wafer case door modified node method as claimed in claim 1, is characterized in that, described Sealing (2) surround the shape size of framework and described seal groove (11) to offer the shape size of notch suitable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410102080.1A CN104930191A (en) | 2014-03-19 | 2014-03-19 | Wafer box door improvement structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410102080.1A CN104930191A (en) | 2014-03-19 | 2014-03-19 | Wafer box door improvement structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104930191A true CN104930191A (en) | 2015-09-23 |
Family
ID=54117499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410102080.1A Pending CN104930191A (en) | 2014-03-19 | 2014-03-19 | Wafer box door improvement structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104930191A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998001887A1 (en) * | 1996-07-09 | 1998-01-15 | Lam Research Corporation | Chamber interfacing o-rings and method for implementing same |
| US6602346B1 (en) * | 2000-08-22 | 2003-08-05 | Novellus Systems, Inc. | Gas-purged vacuum valve |
| CN101432201A (en) * | 2004-08-12 | 2009-05-13 | 爱德华·Z·蔡 | Airtight lid for container and method of use |
| CN101515538A (en) * | 2008-02-21 | 2009-08-26 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Sealing structure for processing reaction chamber by semiconductor |
| CN101685789A (en) * | 2008-09-25 | 2010-03-31 | 家登精密工业股份有限公司 | Front-open wafer box with integrally formed wafer limiting piece module |
-
2014
- 2014-03-19 CN CN201410102080.1A patent/CN104930191A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998001887A1 (en) * | 1996-07-09 | 1998-01-15 | Lam Research Corporation | Chamber interfacing o-rings and method for implementing same |
| US6602346B1 (en) * | 2000-08-22 | 2003-08-05 | Novellus Systems, Inc. | Gas-purged vacuum valve |
| CN101432201A (en) * | 2004-08-12 | 2009-05-13 | 爱德华·Z·蔡 | Airtight lid for container and method of use |
| CN101515538A (en) * | 2008-02-21 | 2009-08-26 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Sealing structure for processing reaction chamber by semiconductor |
| CN101685789A (en) * | 2008-09-25 | 2010-03-31 | 家登精密工业股份有限公司 | Front-open wafer box with integrally formed wafer limiting piece module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150923 |