CN104928836A - Piezoelectric ceramics driving piece - Google Patents

Piezoelectric ceramics driving piece Download PDF

Info

Publication number
CN104928836A
CN104928836A CN201510390642.1A CN201510390642A CN104928836A CN 104928836 A CN104928836 A CN 104928836A CN 201510390642 A CN201510390642 A CN 201510390642A CN 104928836 A CN104928836 A CN 104928836A
Authority
CN
China
Prior art keywords
piezoelectric ceramics
driving piece
substrate
arc groove
aluminium chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510390642.1A
Other languages
Chinese (zh)
Inventor
臧建虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU BAIFU ELECTRONICS Co Ltd
Original Assignee
CHANGZHOU BAIFU ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU BAIFU ELECTRONICS Co Ltd filed Critical CHANGZHOU BAIFU ELECTRONICS Co Ltd
Priority to CN201510390642.1A priority Critical patent/CN104928836A/en
Publication of CN104928836A publication Critical patent/CN104928836A/en
Pending legal-status Critical Current

Links

Abstract

The invention discloses a piezoelectric ceramics driving piece. The piezoelectric ceramics driving piece comprises a substrate and piezoelectric ceramics chips, wherein a plurality of arc-shaped grooves are formed in the two side faces of the substrate, aluminum chips are arranged in the arc-shaped grooves, the aluminum chips and the arc-shaped grooves are correspondingly arranged, the aluminum chips are embedded into the arc-shaped grooves, thermal insulation pads are further arranged on the bottoms of the aluminum chips, the tops of the aluminum chips are arranged to protrude out of the surface of the substrate, and the piezoelectric ceramics chips are attached to the two side end faces of the substrate. Through the mode, the piezoelectric ceramics driving piece can have the advantages that the heat dissipation performance is better, the stability is improved, and the service life is prolonged.

Description

Piezoelectric ceramics driving piece
Technical field
The present invention relates to piezoelectric ceramics driving piece field, particularly relate to the piezoelectric ceramics driving piece that a kind of thermal diffusivity is superior.
Background technology
Piezoelectric ceramics driving piece is the conversion element of piezoelectric ceramic type slide cam selector, and piezoelectric ceramics driving piece, by inverse piezoelectric effect, makes piezoelectric ceramics driving piece generation deflection displacement and bending moment to control needle selection.And traditional piezoelectric ceramics driving piece is all adhered on substrate by piezoelectric ceramic wafer to form.But because the substrate of carbon fiber board material generates heat in the process of conduction, and traditional piezoelectric ceramics driving piece poor radiation, thus cause piezoelectric ceramics driving piece temperature to raise, can service life be affected.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of piezoelectric ceramics driving piece, and piezoelectric ceramics driving piece thermal diffusivity can be made better, improves stability, increases the service life.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of piezoelectric ceramics driving piece, comprise substrate and piezoelectric ceramic wafer, described substrate two sides offer multiple arc groove, aluminium chip is set in described arc groove, described aluminium chip is corresponding with described arc groove to be arranged, described aluminium chip embeds in described arc groove, described aluminium chip bottom is also provided with heat insulating mattress, described aluminium chip top protrudes from described substrate surface and arranges, and described piezoelectric ceramic wafer is attached on the end face of described substrate both sides.
In a preferred embodiment of the present invention, described heat insulating mattress is arranged between described aluminium chip and described arc groove.
In a preferred embodiment of the present invention, described heat insulating mattress is corresponding with described aluminium chip and described arc groove to be arranged in circular arc.
In a preferred embodiment of the present invention, it is 10 microns-20 microns that described aluminium chip protrudes from described substrate surface thickness.
In a preferred embodiment of the present invention, described substrate is glass mat or carbon fiber board.
The invention has the beneficial effects as follows: the present invention can improve piezoelectric ceramics driving piece thermal diffusivity by setting up aluminium chip, and then improving stability, increases the service life.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of piezoelectric ceramics driving piece one of the present invention preferred embodiment;
In accompanying drawing, the mark of each parts is as follows: 1, substrate; 2, piezoelectric ceramic wafer; 3, arc groove; 4, aluminium chip; 5, heat insulating mattress.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the embodiment of the present invention comprises:
A kind of piezoelectric ceramics driving piece, comprise substrate 1 and piezoelectric ceramic wafer 2, described substrate 1 two sides offer multiple arc groove 3, in described arc groove 3, aluminium chip 4 is set, described aluminium chip 4 is corresponding with described arc groove 3 to be arranged, and described aluminium chip 4 embeds in described arc groove 3, is also provided with heat insulating mattress 5 bottom described aluminium chip 4, described aluminium chip 4 top protrudes from described substrate 1 surface and arranges, and described piezoelectric ceramic wafer 2 is attached on the end face of described substrate 1 both sides.
In addition, described heat insulating mattress 5 is arranged between described aluminium chip 4 and described arc groove 3.
In addition, described heat insulating mattress 5 is corresponding with described aluminium chip 4 and described arc groove 3 is arranged in circular arc.
In addition, described aluminium chip 4 protrudes from described substrate 1 surface thickness is 10 microns-20 microns.
In addition, described substrate 1 is glass mat or carbon fiber board.
Operation principle of the present invention for offer multiple arc groove 3 on substrate 1 two sides, aluminium chip 4 is set in arc groove 3, aluminium chip 4 is corresponding with arc groove 3 to be arranged, aluminium chip 4 embeds in arc groove 3, heat insulating mattress 5 is also provided with bottom aluminium chip 4, heat insulating mattress 5 is arranged between aluminium chip 4 and arc groove 3, heat insulating mattress 5 is corresponding with aluminium chip 4 and arc groove 3 to be arranged in circular arc, aluminium chip 4 top protrudes from substrate 1 surface and arranges, it is 10 microns-20 microns that aluminium chip 4 protrudes from substrate 1 surface thickness, piezoelectric ceramic wafer 2 is attached on the end face of substrate 1 both sides, because the substrate 1 of carbon fiber board material generates heat in the process of conduction, thus cause piezoelectric ceramics driving piece temperature to raise, service life can be affected, and be embedded in aluminium chip 4 due to substrate 1, when substrate 1 is heating up, first heat insulating mattress 5 can intercept partial heat, aluminium chip 4 simultaneously in arc groove 3 can absorb heat, piezoelectric ceramic wafer 2 is avoided, and temperature is too high affects performance.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.

Claims (5)

1. a piezoelectric ceramics driving piece, comprise substrate and piezoelectric ceramic wafer, it is characterized in that, described substrate two sides offer multiple arc groove, arranges aluminium chip in described arc groove, described aluminium chip is corresponding with described arc groove to be arranged, described aluminium chip embeds in described arc groove, described aluminium chip bottom is also provided with heat insulating mattress, and described aluminium chip top protrudes from described substrate surface and arranges, and described piezoelectric ceramic wafer is attached on the end face of described substrate both sides.
2. piezoelectric ceramics driving piece according to claim 1, is characterized in that, described heat insulating mattress is arranged between described aluminium chip and described arc groove.
3. piezoelectric ceramics driving piece according to claim 2, is characterized in that, described heat insulating mattress is corresponding with described aluminium chip and described arc groove to be arranged in circular arc.
4. piezoelectric ceramics driving piece according to claim 1, is characterized in that, it is 10 microns-20 microns that described aluminium chip protrudes from described substrate surface thickness.
5. piezoelectric ceramics driving piece according to claim 1, is characterized in that, described substrate is glass mat or carbon fiber board.
CN201510390642.1A 2015-07-07 2015-07-07 Piezoelectric ceramics driving piece Pending CN104928836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510390642.1A CN104928836A (en) 2015-07-07 2015-07-07 Piezoelectric ceramics driving piece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510390642.1A CN104928836A (en) 2015-07-07 2015-07-07 Piezoelectric ceramics driving piece

Publications (1)

Publication Number Publication Date
CN104928836A true CN104928836A (en) 2015-09-23

Family

ID=54116251

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510390642.1A Pending CN104928836A (en) 2015-07-07 2015-07-07 Piezoelectric ceramics driving piece

Country Status (1)

Country Link
CN (1) CN104928836A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216997A (en) * 2004-01-28 2005-08-11 Kyocera Corp Manufacturing method for laminated electronic component
CN201206190Y (en) * 2008-05-09 2009-03-11 郑依福 Jacquard guide chase needle displacement apparatus for warp knitting machine
CN101458050A (en) * 2008-12-22 2009-06-17 中国航天科技集团公司第五研究院第五一○研究所 Variable heat radiator and method for producing the same
EP2230029A1 (en) * 2009-03-18 2010-09-22 Medison Co., Ltd. Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
CN202644095U (en) * 2012-06-18 2013-01-02 芮国林 Double driving systems of piezoelectric ceramics driving pieces of needle-selecting machine
CN203339227U (en) * 2013-06-19 2013-12-11 江苏亿隆新能源科技发展有限公司 Piezoelectric ceramic drive piece
JP2015106569A (en) * 2013-11-28 2015-06-08 京セラ株式会社 Piezoelectric actuator and mass flow controller including the same
CN204407366U (en) * 2014-08-19 2015-06-17 昆山攀特电陶科技有限公司 Novel warp knitting machine piezoelectric jacquard element
CN204825245U (en) * 2015-07-07 2015-12-02 常州百富电子有限公司 Piezoceramics drives piece

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216997A (en) * 2004-01-28 2005-08-11 Kyocera Corp Manufacturing method for laminated electronic component
CN201206190Y (en) * 2008-05-09 2009-03-11 郑依福 Jacquard guide chase needle displacement apparatus for warp knitting machine
CN101458050A (en) * 2008-12-22 2009-06-17 中国航天科技集团公司第五研究院第五一○研究所 Variable heat radiator and method for producing the same
EP2230029A1 (en) * 2009-03-18 2010-09-22 Medison Co., Ltd. Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
CN202644095U (en) * 2012-06-18 2013-01-02 芮国林 Double driving systems of piezoelectric ceramics driving pieces of needle-selecting machine
CN203339227U (en) * 2013-06-19 2013-12-11 江苏亿隆新能源科技发展有限公司 Piezoelectric ceramic drive piece
JP2015106569A (en) * 2013-11-28 2015-06-08 京セラ株式会社 Piezoelectric actuator and mass flow controller including the same
CN204407366U (en) * 2014-08-19 2015-06-17 昆山攀特电陶科技有限公司 Novel warp knitting machine piezoelectric jacquard element
CN204825245U (en) * 2015-07-07 2015-12-02 常州百富电子有限公司 Piezoceramics drives piece

Similar Documents

Publication Publication Date Title
CN103380495A (en) Pressure contact type semiconductor device and method for fabricating same
CN102135248A (en) Liquid metal heat dissipation-based high-power LED (Light Emitting Diode) light source with threaded connection structure
CN104157628B (en) A kind of novel electric power electric module
JP2015095545A5 (en)
RU2013131771A (en) FACTORY MANUFACTURING PLATE HAVING A HEATING WIRE
CN105024003B (en) Electronic packaging structure and ceramic substrate thereof
CN202466941U (en) Energy-storage brick
CN203867136U (en) Floor heating floor structure
CN204825245U (en) Piezoceramics drives piece
CN104928836A (en) Piezoelectric ceramics driving piece
CN104567350A (en) Low-heat-conductivity refractory brick
CN102012183A (en) Heat radiator and manufacturing method thereof
CN204510711U (en) Ground heating floor
CN103344142A (en) Vapour chamber evaporation imbibition core of fractal groove-hole structure and manufacturing method
CN204836571U (en) Heat dissipation stable state piezoceramics drive piece
CN104347565A (en) Transient voltage suppression diode packaging structure
CN209389057U (en) A kind of semiconductor devices
CN104936113A (en) Radiating steady-state piezoelectric ceramic drive vane
CN211058197U (en) Heating ceramic tile
CN205081146U (en) COB -LED area source encapsulation module
CN204237715U (en) A kind of low heat conduction zirconium not composite brick
CN207018896U (en) A kind of aluminium nitride substrate for Projecting Lamp
CN206918729U (en) A kind of arch bridge structure LED backlight lamp bar
CN207925461U (en) A kind of LED light emission device
CN209882231U (en) Composite high heat conduction circuit board

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150923