CN104927732B - A kind of light heat is double to trigger rapid curing adhesive - Google Patents
A kind of light heat is double to trigger rapid curing adhesive Download PDFInfo
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- CN104927732B CN104927732B CN201510295347.8A CN201510295347A CN104927732B CN 104927732 B CN104927732 B CN 104927732B CN 201510295347 A CN201510295347 A CN 201510295347A CN 104927732 B CN104927732 B CN 104927732B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 230000000977 initiatory effect Effects 0.000 claims abstract description 26
- 239000002131 composite material Substances 0.000 claims abstract description 17
- RAXXELZNTBOGNW-UHFFFAOYSA-N 1H-imidazole Chemical compound C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 15
- 230000000284 resting effect Effects 0.000 claims abstract description 13
- 239000004593 Epoxy Substances 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 238000007711 solidification Methods 0.000 claims abstract description 9
- 230000008023 solidification Effects 0.000 claims abstract description 9
- 150000002460 imidazoles Chemical class 0.000 claims abstract description 7
- 230000001235 sensitizing effect Effects 0.000 claims abstract description 6
- 239000000945 filler Substances 0.000 claims abstract description 5
- 239000012745 toughening agent Substances 0.000 claims abstract description 4
- 230000009471 action Effects 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 230000001960 triggered effect Effects 0.000 claims description 4
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 3
- 239000006232 furnace black Substances 0.000 claims description 3
- YCWSUKQGVSGXJO-NTUHNPAUSA-N nifuroxazide Chemical group C1=CC(O)=CC=C1C(=O)N\N=C\C1=CC=C([N+]([O-])=O)O1 YCWSUKQGVSGXJO-NTUHNPAUSA-N 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 125000003748 selenium group Chemical class *[Se]* 0.000 claims description 3
- IHDKBHLTKNUCCW-UHFFFAOYSA-N 1,3-thiazole 1-oxide Chemical compound O=S1C=CN=C1 IHDKBHLTKNUCCW-UHFFFAOYSA-N 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- 241000790917 Dioxys <bee> Species 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims description 2
- 239000004568 cement Substances 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical group O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- 235000013312 flour Nutrition 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000005060 rubber Substances 0.000 claims description 2
- 229920000260 silastic Polymers 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 125000005409 triarylsulfonium group Chemical group 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- 235000015511 Liquidambar orientalis Nutrition 0.000 claims 1
- 239000004870 Styrax Substances 0.000 claims 1
- 244000028419 Styrax benzoin Species 0.000 claims 1
- 235000000126 Styrax benzoin Nutrition 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- 239000005864 Sulphur Substances 0.000 claims 1
- XAKBSHICSHRJCL-UHFFFAOYSA-N [CH2]C(=O)C1=CC=CC=C1 Chemical group [CH2]C(=O)C1=CC=CC=C1 XAKBSHICSHRJCL-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 150000003851 azoles Chemical class 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000004913 activation Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000004513 sizing Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- CWXZAJNUTOBAOI-UHFFFAOYSA-N 1-(2,3-dimethoxyphenyl)-2-hydroxy-2-phenylethanone Chemical compound COC1=CC=CC(C(=O)C(O)C=2C=CC=CC=2)=C1OC CWXZAJNUTOBAOI-UHFFFAOYSA-N 0.000 description 2
- 239000011157 advanced composite material Substances 0.000 description 2
- 229920013657 polymer matrix composite Polymers 0.000 description 2
- 239000011160 polymer matrix composite Substances 0.000 description 2
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 2
- VMJXNOKTPKNUJR-MTJSOVHGSA-N 1-[2-[(z)-(9-hydroxy-10-methoxy-2,2,4-trimethyl-1h-chromeno[3,4-f]quinolin-5-ylidene)methyl]thiophen-3-yl]ethanone Chemical compound C1=CC=2NC(C)(C)C=C(C)C=2C2=C1C=1C(OC)=C(O)C=CC=1O\C2=C/C=1SC=CC=1C(C)=O VMJXNOKTPKNUJR-MTJSOVHGSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012690 ionic polymerization Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention provides a kind of light heat double initiation rapid curing adhesives, and each component mass fraction is as follows：40 ~ 70 parts of epoxy resin-base, 20 ~ 40 parts of resting form thermal initiation curing agent, light-initiated 0.5 ~ 5 part of curing agent, 0.1 ~ 2.5 part of sensitising agent, 15 ~ 35 parts of toughener, 20 ~ 40 parts of filler.Light heat provided by the invention is double to trigger rapid curing adhesive light-initiated curing agent first under action of ultraviolet light to trigger part epoxy curing reaction, in the presence of curing reaction heat release and external heat source, cure sites temperature reaches 70 ~ 90 DEG C of resting form imidazoles initiation reaction temperature, resting form imidazol complex is activated, trigger rapid curing in epoxy resin 3min, meet automotive composite material automation, high quality, be quickly glued connection request, solve traditional adhesive solidification initiation conditions and the technical barriers such as operating mode mismatch are connected with automotive composite material.
Description
Technical field
The invention belongs to interconnection technique field, and in particular to a kind of light heat is double to trigger rapid curing adhesive.
Background technology
It is glued interconnection technique, has been completely free of nail, riveting, bolt, flange or welding etc. in orthodox car manufacturing process and has connected
Manufacturing process is met, has the advantages that structure is light, joint efficiency is high, antifatigue, is promoting Global Auto manufacturing industry one new
Revolution.This brand-new connection mode turns into the light composite material key point that mass is applied on automobile, also turns into the whole world
The developing direction of auto industry lightweight manufacture.
Composite material for vehicle is glued attachment structure and the safety of vehicle is had a very important role with reliability.Due to multiple
The features such as anisotropy of condensation material strength and stiffness, and composite interlayer intensity are relatively low, and ductility is small, causes composite
Connection is more complicated than metal connection, and new requirement is it is also proposed with adhesive to composite connection.
In polymer matrix composites automobile component connection procedure, adhesive typically using the contactless initiation of thermal source and is wanted
Seek quickness fast sizing and solidifying, traditional thermal initiation curing adhesive can not meet auto industry advanced composite material (ACM) glue-joint technique
Automation, fast beat production requirement.
The content of the invention
The present invention is for the requirement of auto industry polymer matrix composites components connecting process, there is provided a kind of light heat is double to be triggered
Rapid curing adhesive and preparation method thereof, meet automotive composite material automation, high quality, be quickly glued connection request, solve
Certainly traditional adhesive solidification initiation conditions are glued the technical barriers such as connection operating mode mismatch with automotive composite material part.
The present invention provides a kind of light heat double initiation rapid curing adhesives, and each component mass fraction is as follows：Epoxy resin-matrix
40 ~ 70 parts of body, 20 ~ 40 parts of resting form thermal initiation curing agent, light-initiated 0.5 ~ 5 part of curing agent, 0.1 ~ 2.5 part of sensitising agent, toughness reinforcing
15 ~ 35 parts of agent, 20 ~ 40 parts of filler.
The time required to the solidification of the double initiation rapid curing adhesives of described light heat≤3 minutes, including three phases：
(1) first stage：Light-initiated curing agent triggers part epoxy curing reaction, this time under action of ultraviolet light
Curing reaction is triggered to occupy an leading position, 3 ~ 20 seconds duration;
(2) second stage：In the presence of curing exotherm and external heat source, cementing position temperature reach be pre-designed it is latent
70 ~ 90 DEG C of volt type imidazole curing agent initiation reaction temperature, 10 ~ 30 seconds duration；
(3) phase III：Thermal initiation curing agent resting form imidazol complex is activated, and thermal initiation curing reaction is predominantly
Position, fast epoxy resin curing is triggered to realize that automotive composite material part is glued connection, 30 seconds ~ 120 seconds duration.
Described epoxy resin-base is one or more of in liquid bisphenol A types epoxy resin or bisphenol f type epoxy resin
Mixture；
Described resting form thermal initiation curing agent is liquid imidazole complex compound, and preparation method is imidazoles and sulfuric acid reactant salt shape
Into polynary co-ordination complex；
Described light-initiated curing agent is diaryl group iodized salt, triaryl sulfonium salts, triaryl selenium salt, dialkyl group benzoyl first
Base sulfosalt, the cation type ultraviolet photo of one or more of mixtures composition triggers curing agent in dioxane oxyphenyl sulfosalt；
Described sensitising agent is Benzophenone, dimethoxybenzoin, thiazolone, one or more of mixed in Alpha-hydroxy ketone
Compound；
Described toughener is carboxyl LNBR, carboxyl end of the liquid acrylonitrile-butadiene rubber, polysulfide rubber, liquid silicon rubber
One or more of mixture in glue, polyethers, polysulfones, polyimides, nano-calcium carbonate, nano titanium oxide；
Described filler be talcum powder, white carbon, precipitated calcium carbonate, silica flour, titanium dioxide, furnace black, dioxy cadmium,
One or more of mixtures in silica.
Cement is quick, high intensity, high-precision sizing and solidifying are keys that automotive composite material efficiently connects.Composite
Connection procedure requires that (>=150 DEG C, ＜ 3 divides special adhesive for operable time (＞ 3 months) and high temperature rapid curing at room temperature
Clock) both well balance, at present it is common formula be epoxy/acid acid anhydride/accelerator, curing rate is slower.It is provided by the invention latent
Volt property thermal initiation curing agent imidazol complex is that imidazoles forms a polynary co-ordination complex with sulfuric acid reactant salt, and it is at room temperature
It is stable with epoxy resin solution, imidazoles can be discharged at once at a temperature of setting, the metal ion in complex compound also can be with
Epoxy radicals carries out ionic polymerization, enters in solidfied material and forms chelating body.The activation temperature point of imidazol complex of the present invention can
Adjustable range is 70-190 DEG C, has good storage stability when less than activation temperature, can solidify rapidly higher than activation temperature,
Meet composite material component glue-joint technique requirement during auto industry automated production.
Light-initiated curing agent provided by the invention is that cationic photoinitinator is used to trigger epoxy curing systems, especially
Suitable for the solidification of thick film systems and dark colour system.The addition of sensitising agent makes the present invention have remarkable extinction capability, only needs
Want minimum concentration to can be obtained by fabulous surface cure effect and speed, meet that auto industry is efficiently connected using operating mode pair
Adhesive shear strength, fatigue strength, peel strength, good media-resistant, cold-hot alternation, wet and heat ageing resistant, resistance to air are old
The requirement of the specific indexes such as change.
Light heat of the present invention is double to trigger rapid curing adhesive to have the following advantages that：
（1）Manufacturability：Each component is liquid at room temperature, and addition mixing is convenient, improves the adjustable of formula system;
（2）The controllable section of solidification temperature：The molecular structure of imidazol complex is different, and the adhesive of preparation has different
Activation temperature point, adjustable extent are 70-90 DEG C；
（3）Curing rate is fast：Adhesive provided by the invention has good storage stability when less than activation temperature, high
It can solidify rapidly in activation temperature, hardening time ＜ 3min；
（4）Intensity height is applied widely：Adhesive shear strength provided by the invention is higher（＞ 30mpa）, to various bases
Material has good adaptability, meet between composite, between composite and metal material part connection needs.
Embodiment
For a better understanding of the present invention, with reference to embodiment, the present invention will be further explained, but should be bright
True is the scope that the scope of protection of the invention is not limited to embodiment expression.
Embodiment 1
50 grams of E51 epoxy resin, 30 grams of resting form thermal initiation liquid imidazole salt, 1.2 grams of triaryl selenium salt, α-hydroxyl
1.5 grams of base ketone, 18 grams of carboxyl end of the liquid acrylonitrile-butadiene rubber, 25 grams of furnace black, each component order is added into agitator at room temperature
In, the double initiation rapid curing adhesives of light heat are uniformly obtained after mixing.
The fundamental property that adhesive is obtained according to formula above is as follows:
| Test event | Testing standard | Test condition | Representative value |
| Color | - | - | It is black |
| Smell | - | - | Odorlessness after solidification |
| Density, g/cm3 | GB/T 12007.5-1989 | 20℃ | 1.20 |
| Storage at room temperature time, the moon | - | - | 3 |
| Sizing and solidifying time, min | - | 150℃ | 1 |
| Final hardening time, min | - | 150℃ | 2 |
| Shear strength, Mpa | GB/T 7124-2008 | Room temperature, 10mm/s | 35 |
| T peel strengths N/mm | GB/T 2791-1995 | Room temperature, 100mm/s | 11 |
| Impact peel strength N/mm | ISO 11343 | Room temperature, 2mm/s | 78 |
Embodiment 2
70 grams of E55 epoxy resin, 35 grams of resting form thermal initiation liquid imidazole salt, 1.3 grams of diaryl group iodized salt, thiazole
1.2 grams of ketone, 11 grams of liquid silastic, 10 grams of precipitated calcium carbonate, each component order is added in agitator at room temperature, uniformly mixing
After obtain that light heat is double to trigger rapid curing adhesives.
The fundamental property that adhesive is obtained according to formula above is as follows:
| Test event | Testing standard | Test condition | Representative value |
| Color | - | - | In vain |
| Smell | - | - | Odorlessness after solidification |
| Density, g/cm3 | GB/T 12007.5-1989 | 20℃ | 1.20 |
| Storage at room temperature time, the moon | - | - | 3 |
| Sizing and solidifying time, min | - | 150℃ | 1 |
| Final hardening time, min | - | 150℃ | 2.5 |
| Shear strength, Mpa | GB/T 7124-2008 | Room temperature, 10mm/s | 32 |
| T peel strengths N/mm | GB/T 2791-1995 | Room temperature, 100mm/s | 9 |
| Impact peel strength N/mm | ISO 11343 | Room temperature, 2mm/s | 75 |
Embodiment 3
60 grams of F76 epoxy resin, 25 grams of resting form thermal initiation liquid imidazole salt, dioxane oxyphenyl sulfosalt 0.5
Gram, 0.1 gram of dimethoxybenzoin, 35 grams of carboxyl LNBR, 40 grams of silica, each component order is added at room temperature
In agitator, the double initiation rapid curing adhesives of light heat are uniformly obtained after mixing.
The fundamental property that adhesive is obtained according to formula above is as follows:
| Test event | Testing standard | Test condition | Representative value |
| Color | - | - | It is black |
| Smell | - | - | Odorlessness after solidification |
| Density, g/cm3 | GB/T 12007.5-1989 | 20℃ | 1.23 |
| Storage at room temperature time, the moon | - | - | 3 |
| Sizing and solidifying time, min | - | 150℃ | 1.5 |
| Final hardening time, min | - | 150℃ | 3 |
| Shear strength, Mpa | GB/T 7124-2008 | Room temperature, 10mm/s | 29 |
| T peel strengths N/mm | GB/T 2791-1995 | Room temperature, 100mm/s | 10 |
| Impact peel strength N/mm | ISO 11343 | Room temperature, 2mm/s | 85 |
Claims (8)
- A kind of 1. double purposes for triggering rapid curing adhesive as composite material for vehicle cement of light heat, it is characterised in that institute The double initiation rapid curing adhesive each component mass fractions of light heat stated are as follows：40 ~ 70 parts of epoxy resin-base, resting form heat Trigger 20 ~ 40 parts of curing agent, light-initiated 0.5 ~ 5 part of curing agent, 0.1 ~ 2.5 part of sensitising agent, 15 ~ 35 parts of toughener, filler 20 ~ 40 Part；The time required to the solidification of the double initiation rapid curing adhesives of described light heat≤3 minutes, including three phases：(1) first stage：Light-initiated curing agent triggers part epoxy curing reaction under action of ultraviolet light, now light-initiated Curing reaction is occupied an leading position, 3 ~ 20 seconds duration;(2) second stage：In the presence of curing exotherm and ultraviolet radiation heat, cementing position temperature reaches what is be pre-designed Resting form imidazole curing agent initiation reaction temperature 70 C, 10 ~ 30 seconds duration；(3) phase III：Thermal initiation curing agent resting form imidazol complex is activated, and thermal initiation curing reaction is occupied an leading position, Fast epoxy resin curing is triggered to realize that automotive composite material part is glued connection, 30 seconds ~ 120 seconds duration.
- 2. purposes as claimed in claim 1, it is characterised in that wherein, described resting form thermal initiation curing agent is liquid miaow Azoles complex compound, its preparation method are the polynary co-ordination complex that imidazoles is formed with sulfuric acid reactant salt.
- 3. purposes as claimed in claim 1, it is characterised in that wherein, described light-initiated curing agent is diaryl group iodized salt, Triaryl sulfonium salts, triaryl selenium salt, dialkyl group phenacyl sulfosalt are one or more of in dioxane oxyphenyl sulfosalt Mixture composition cation type ultraviolet photo trigger curing agent.
- 4. purposes as claimed in claim 1, it is characterised in that wherein, described epoxy resin-base is liquid bisphenol A type rings One or more of mixture in oxygen tree fat or bisphenol f type epoxy resin.
- 5. purposes as claimed in claim 1, it is characterised in that wherein, described sensitising agent is Benzophenone, styrax diformazan Ether, thiazolone, one or more of mixtures in Alpha-hydroxy ketone.
- 6. purposes as claimed in claim 1, it is characterised in that wherein, described toughener is carboxyl LNBR, gathered It is one or more of in sulphur rubber, liquid silastic, polyethers, polysulfones, polyimides, nano-calcium carbonate, nano titanium oxide to mix Compound.
- 7. purposes as claimed in claim 6, it is characterised in that wherein, described carboxyl LNBR is end carboxyl liquid Body nitrile rubber.
- 8. purposes as claimed in claim 1, it is characterised in that wherein, described filler is talcum powder, white carbon, lightweight carbon One or more of mixtures in sour calcium, silica flour, titanium dioxide, furnace black, dioxy cadmium, silica.
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| CN106928893B (en) * | 2015-10-26 | 2020-07-21 | 黑龙江省科学院石油化学研究院 | Preparation method of cationic ultraviolet and heat double deep curing adhesive |
| CN107987768B (en) * | 2017-12-20 | 2020-06-02 | 广州市嵩达新材料科技有限公司 | Ultraviolet-cured self-repairing coating adhesive and preparation method and application thereof |
| CN108192288A (en) * | 2017-12-29 | 2018-06-22 | 定远县丹宝树脂有限公司 | A kind of resistance to oil epoxy resin and preparation method thereof |
| CN108329876A (en) * | 2018-02-07 | 2018-07-27 | 滕凤琴 | A kind of corrosion-resistant epoxyn and preparation method thereof |
| CN112680122A (en) * | 2020-12-22 | 2021-04-20 | 天能电池(芜湖)有限公司 | UV (ultraviolet) light-cured epoxy glue |
| CN112876998A (en) * | 2021-01-22 | 2021-06-01 | 海泰纳鑫科技(成都)有限公司 | Epoxy resin adhesive for optical electronic packaging and preparation method and application thereof |
| CN115746502B (en) | 2022-11-09 | 2024-04-12 | 华中科技大学 | Quick curing and forming process for epoxy resin based on electromagnetic induction heating |
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| US4218279A (en) * | 1977-07-05 | 1980-08-19 | Ciba-Geigy Corporation | Bonding method employing film adhesives containing an epoxide resin |
| CN101624463A (en) * | 2008-07-10 | 2010-01-13 | 山荣化学株式会社 | Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board |
| CN102516501A (en) * | 2011-11-22 | 2012-06-27 | 中国科学院上海有机化学研究所 | Photo-curing material for manufacturing light-emitting diode (LED) lens |
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| JP4163162B2 (en) * | 2003-08-29 | 2008-10-08 | 住友ベークライト株式会社 | Latency catalyst for epoxy resin, epoxy resin composition and semiconductor device |
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| US4218279A (en) * | 1977-07-05 | 1980-08-19 | Ciba-Geigy Corporation | Bonding method employing film adhesives containing an epoxide resin |
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