CN104911385A - A kind of ultrafine ceramic particle ultrafine Cu-based composite material with Ti2SnC as precursor and preparation method thereof - Google Patents
A kind of ultrafine ceramic particle ultrafine Cu-based composite material with Ti2SnC as precursor and preparation method thereof Download PDFInfo
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- 239000002131 composite material Substances 0.000 title claims abstract description 39
- 239000000919 ceramic Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000002245 particle Substances 0.000 title abstract description 42
- 239000002243 precursor Substances 0.000 title abstract description 10
- 229910010013 Ti2SnC Inorganic materials 0.000 title description 6
- 239000000843 powder Substances 0.000 claims abstract description 27
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 9
- 229910052786 argon Inorganic materials 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 239000013078 crystal Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 238000000498 ball milling Methods 0.000 claims description 2
- 239000012467 final product Substances 0.000 claims description 2
- 239000011812 mixed powder Substances 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 238000005056 compaction Methods 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 239000011257 shell material Substances 0.000 abstract description 2
- 239000007858 starting material Substances 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 47
- 125000004429 atom Chemical group 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
一种以Ti2SnC为前驱体的超细陶瓷颗粒超细化Cu基复合材料及其制备方法。该复合材料采用体积含量为3~50%的微米级Ti2SnC和微米级的Cu为起始原料,反应后生成超细TiC0.5颗粒均匀分散在Cu(Sn)基体中,而Cu晶粒也被细化为亚微米级。该复合材料的制备方法如下:将Ti2SnC粉与Cu粉在球磨机上均匀混合后,在120~250MPa的压力下成型,放入高温炉中,氩气保护,将炉温升至1100~1250℃,保温30~60min,冷却后即得到超细陶瓷颗粒超细化Cu基复合材料。本发明的制备方法具有工艺简单、操作方便等显著特点;本发明的超细陶瓷颗粒超细化Cu基复合材料具有高强、高延展性、耐磨损、抗侵蚀的特点,可广泛应用于军工装备、高速铁路、航空航天等领域,如高强箱壳材料等。
An ultra-fine Cu-based composite material with ultra-fine ceramic particles using Ti 2 SnC as a precursor and a preparation method thereof. The composite material uses micron-sized Ti 2 SnC with a volume content of 3-50% and micron-sized Cu as starting materials. After the reaction, ultrafine TiC 0.5 particles are uniformly dispersed in the Cu(Sn) matrix, and the Cu grains are also are refined to the submicron level. The preparation method of the composite material is as follows: uniformly mix Ti 2 SnC powder and Cu powder on a ball mill, shape it under a pressure of 120-250 MPa, put it into a high-temperature furnace, protect it with argon, and raise the furnace temperature to 1100-1250 ℃, keep warm for 30-60 minutes, and after cooling, ultra-fine ceramic particles and ultra-fine Cu-based composite materials can be obtained. The preparation method of the present invention has the remarkable characteristics of simple process and convenient operation; the superfine Cu-based composite material of ultrafine ceramic particles of the present invention has the characteristics of high strength, high ductility, wear resistance and corrosion resistance, and can be widely used in military industry Equipment, high-speed railway, aerospace and other fields, such as high-strength box shell materials, etc.
Description
技术领域technical field
本发明涉及一种以Ti2SnC为前驱体的超细陶瓷颗粒超细化Cu基复合材料及其制备方法。The invention relates to an ultrafine Cu - based composite material with ultrafine ceramic particles using Ti2SnC as a precursor and a preparation method thereof.
背景技术Background technique
具有高屈服强度高延展性、耐磨损、抗侵蚀的铜基材料,因其高的特性和易于加工成型,在军工装备、高速铁路、航空航天等领域有很大的应用,如高强箱壳材料等。然而对于一般铜基材料来说,高强度与高延展性往往不能同时得到。铜具有很好的塑性变形能力,但是其屈服强度较低。一般采用加工硬化和晶界强化等手段,即通过阻碍位错运动和增加位错障碍的密度,来提高强度。近些年,通过陶瓷相颗粒增强Cu基复合材料的手段大大提高了铜材料的强度和硬度。但是,这些方法往往以牺牲铜基体的塑韧性为代价。而采用减小陶瓷颗粒尺寸、细化Cu基体和原位生成陶瓷颗粒增强相而获得与金属材料的强界面结合的方法是对改善颗粒增强Cu基复合材料塑韧性比较有效的方法。Copper-based materials with high yield strength, high ductility, wear resistance and corrosion resistance, because of their high characteristics and easy processing and molding, they have great applications in military equipment, high-speed railways, aerospace and other fields, such as high-strength box shells materials etc. However, for general copper-based materials, high strength and high ductility cannot be obtained at the same time. Copper has good plastic deformation ability, but its yield strength is low. Generally, work hardening and grain boundary strengthening are used to improve the strength by hindering the movement of dislocations and increasing the density of dislocation barriers. In recent years, the strength and hardness of copper materials have been greatly improved by means of ceramic phase particles to reinforce Cu-based composites. However, these methods often come at the cost of sacrificing the ductility and ductility of the copper substrate. The method of reducing the size of ceramic particles, refining the Cu matrix and in-situ generating ceramic particle reinforcement phase to obtain a strong interface with metal materials is a more effective method for improving the plasticity and toughness of particle-reinforced Cu-based composites.
Ti2SnC是一种新型的三元碳化物陶瓷,它同时含有共价键和金属键,集成了陶瓷和金属的优点,如高的机械强度、优异的抗热震性、良好的导电性和易加工性等。Ti2SnC属于分层的六方晶体结构,其近乎密排的各个Ti层与Sn原子层交叉,C原子填充Ti层之间的八面体位置,Sn原子位于具有较大空间的三方柱的中心,Ti6C八面体棱边共享。在它们的结构中,Ti原子与C原子之间的结合(即纳米尺度TiC0.5基团)为强共价键,而Ti原子与Sn原子之间为弱结合,类似于层状石墨,层间由范德华力结合。由于这个原因,垂直于c轴的层与层之间在外力的作用下容易发生滑动,Sn原子更容易从其所在位置逃逸。这些特有的纳米层状晶体结构、高温分解和外力溶解行为,使我们想到,可以采用Ti2SnC陶瓷作为先驱体加入Cu熔体中,由于Cu与Ti2SnC中的Sn有强固溶结合力,能将Sn原子溶出,得到纳米TiC0.5基团,并且TiC0.5与Cu有很好的润湿性,能作为Cu合金的形核剂或细化剂。这样纳米TiC0.5基团,既可作为形核剂细化Cu基体晶粒,又能作为有效的纳米增强体增强Cu基复合材料,这样制备的复合材料将同时具有高强度和高延展性。而目前这方面的工作还未见报道。Ti 2 SnC is a new type of ternary carbide ceramic, which contains both covalent bonds and metal bonds, and integrates the advantages of ceramics and metals, such as high mechanical strength, excellent thermal shock resistance, good electrical conductivity and Ease of processing etc. Ti 2 SnC belongs to a layered hexagonal crystal structure, in which nearly densely packed Ti layers intersect with Sn atomic layers, C atoms fill the octahedral positions between Ti layers, and Sn atoms are located in the center of trigonal columns with large spaces, Ti 6 C octahedral edge sharing. In their structures, the bonding between Ti atoms and C atoms (i.e., nanoscale TiC 0.5 groups) is a strong covalent bond, while the bonding between Ti atoms and Sn atoms is weak, similar to layered graphite, and the interlayer combined by van der Waals forces. For this reason, the sliding between layers perpendicular to the c-axis is easy to occur under the action of external force, and the Sn atoms are more likely to escape from their positions. These unique nano-layered crystal structures, pyrolysis and external force dissolution behaviors make us think that Ti 2 SnC ceramics can be used as a precursor to add to Cu melt, because Cu has a strong solid solution binding force with Sn in Ti 2 SnC, Sn atoms can be dissolved out to obtain nano-TiC 0.5 groups, and TiC 0.5 has good wettability with Cu, and can be used as a nucleating agent or refiner for Cu alloys. In this way, the nano-TiC 0.5 group can not only serve as a nucleating agent to refine the grains of the Cu matrix, but also act as an effective nano-reinforcement to strengthen the Cu-based composite material. The composite material prepared in this way will have both high strength and high ductility. But the work in this area has not been reported yet.
发明内容Contents of the invention
本发明的目的在于提供一种以Ti2SnC为前驱体的超细陶瓷颗粒细化Cu基复合材料及其制备方法。The object of the present invention is to provide a Cu-based composite material refined with ultrafine ceramic particles using Ti 2 SnC as a precursor and a preparation method thereof.
本发明的技术方案:Technical scheme of the present invention:
1.本发明以Ti2SnC为前驱体的超细陶瓷颗粒超细化Cu基复合材料,其特征在于:初始原料为微米级的Ti2SnC其体积含量为3~50%,其余为微米级的Cu;最终产物为亚微米级或纳米级TiC0.5颗粒均匀分散在Cu(Sn)基体中,而Cu晶粒也被细化为亚微米级水平;1. The present invention uses Ti 2 SnC as the precursor ultra-fine ceramic particle ultra-fine Cu-based composite material, which is characterized in that: the initial raw material is micron-sized Ti 2 SnC with a volume content of 3-50%, and the rest is micron-sized Cu; the final product is sub-micron or nano-sized TiC 0.5 particles uniformly dispersed in the Cu(Sn) matrix, and the Cu grains are also refined to the sub-micron level;
2.一种以Ti2SnC为前驱体的超细陶瓷颗粒超细化Cu基复合材料的制备方法,其特征在于:该方法包括以下步骤:2. A method for preparing an ultrafine ceramic particle ultrafine Cu - based composite material using Ti2SnC as a precursor, characterized in that: the method comprises the following steps:
步骤1,配料:将Ti2SnC粉和Cu粉按以下比例配料:Step 1, batching: batching Ti 2 SnC powder and Cu powder according to the following ratio:
Ti2SnC=3~50vol.%,Ti2SnC= 3 ~50vol.%,
Cu=97~50vol.%;Cu=97~50vol.%;
其中Ti2SnC粉的粒度为5~10μm,Cu粉的粒度为50~70μm;Among them, the particle size of Ti 2 SnC powder is 5-10 μm, and the particle size of Cu powder is 50-70 μm;
步骤2,混料:每100克上述配料中加入200~400克的玛瑙球,球磨2~4小时;Step 2, mixing ingredients: adding 200-400 grams of agate balls to every 100 grams of the above ingredients, and ball milling for 2-4 hours;
步骤3,预压成型:将一定质量的混合粉料装入钢模具中,并施加120~250MPa的压强,使模具中的粉料压实成型;Step 3, pre-press molding: put a certain quality of mixed powder into a steel mold, and apply a pressure of 120-250MPa to compact the powder in the mold;
步骤4,烧结:将成型后的块体放入高温炉中,在氩气保护下,按10~30℃/min的升温速率,将炉温升至1100~1250℃,保温30~60min,然后以10~30℃/min的速率降温,冷却后,即得到超细陶瓷颗粒超细化Cu基复合材料。Step 4, sintering: Put the formed block into a high-temperature furnace, and under the protection of argon, raise the temperature of the furnace to 1100-1250°C at a heating rate of 10-30°C/min, keep it warm for 30-60min, and then The temperature is lowered at a rate of 10-30° C./min, and after cooling, an ultrafine Cu-based composite material with ultrafine ceramic particles is obtained.
本发明所具有的有益效果:The beneficial effects that the present invention has:
本发明以Ti2SnC为前驱体的超细陶瓷颗粒超细化Cu基复合材料,其产物为亚微米级或纳米级TiC0.5颗粒均匀分散在Cu(Sn)基体中,而Cu晶粒也被细化为亚微米级水平,其复合材料同时具有高强、高延展性和耐磨耐腐蚀的特点。本发明制备的超细陶瓷颗粒超细化Cu基复合材料,其强度和耐磨性随初始Ti2SnC含量的增加而增加,延展性随初始Ti2SnC含量的增加而降低;对于本发明的复合材料的应用,可根据实际使用要求选取适当的Ti2SnC与Cu的原料配比;本发明的制备方法具有工艺简单、操作方便、成本低等显著特点。The present invention uses Ti2SnC as the precursor of the ultrafine ceramic particle ultrafine Cu - based composite material, and its product is submicron or nanometer TiC 0.5 particles uniformly dispersed in the Cu(Sn) matrix, and the Cu crystal grains are also Refined to the sub-micron level, its composite material has the characteristics of high strength, high ductility, wear resistance and corrosion resistance. The superfine ceramic particle superfine Cu-based composite material prepared by the present invention, its strength and wear resistance increase with the increase of the initial Ti 2 SnC content, and the ductility decreases with the increase of the initial Ti 2 SnC content; for the present invention For the application of composite materials, an appropriate raw material ratio of Ti 2 SnC and Cu can be selected according to actual use requirements; the preparation method of the present invention has the remarkable characteristics of simple process, convenient operation, and low cost.
本发明的以Ti2SnC为前驱体的超细陶瓷颗粒超细化Cu基复合材料具有高强高延展、耐磨损、抗侵蚀等特点,可广泛应用于军工装备、高速铁路、航空航天等领域,如高强箱壳材料等。The ultra-fine ceramic particle ultra-fine Cu-based composite material with Ti 2 SnC as the precursor of the present invention has the characteristics of high strength and high ductility, wear resistance, corrosion resistance, etc., and can be widely used in military equipment, high-speed railway, aerospace and other fields , such as high-strength box shell materials, etc.
附图说明Description of drawings
图1是本发明的以Ti2SnC为前驱体的超细陶瓷颗粒TiC0.5增强Cu基复合材料的扫描电镜照片,图2是将陶瓷颗粒腐蚀后露出的超细Cu晶粒基体的扫描电镜照片。Fig. 1 is the SEM photograph of the ultrafine ceramic particles TiC 0.5 reinforced Cu-based composite material with Ti2SnC as the precursor of the present invention, and Fig . 2 is the SEM photograph of the ultrafine Cu grain matrix exposed after the ceramic particles are corroded .
具体实施方式Detailed ways
实施方式一Implementation Mode 1
称取纯度为98.5%、粒度为5μm的Ti2SnC粉2.2克、纯度为99.8%、粒度为50μm的Cu粉97.8克,混合后加入200克玛瑙球,球磨混料2小时,将混合粉料装入Φ50的钢模具中,并施加120MPa的压强,使模具中的粉料压实成型,将上述块体放入高温炉中,在氩气保护下,按10℃/min的升温速率,将炉温升至1100℃,保温30min,然后以10℃/min的速率降温,冷却后,即得到超细陶瓷颗粒超细化Cu基复合材料。Weigh 2.2 grams of Ti 2 SnC powder with a purity of 98.5% and a particle size of 5 μm, and 97.8 grams of Cu powder with a purity of 99.8% and a particle size of 50 μm, add 200 grams of agate balls after mixing, and ball mill the mixture for 2 hours. Put it into a Φ50 steel mold, and apply a pressure of 120MPa to compact the powder in the mold. Put the above block into a high-temperature furnace, and under the protection of argon, press a heating rate of 10°C/min. The temperature of the furnace was raised to 1100° C., kept for 30 minutes, and then cooled at a rate of 10° C./min. After cooling, an ultrafine Cu-based composite material with ultrafine ceramic particles was obtained.
测得上述复合材料其TiC0.5颗粒约为200~300nm,Cu晶粒约为0.8~1μm,复合材料的屈服强度为100MPa,压缩强度为295MPa,延伸率为53%。It is measured that the TiC 0.5 particles of the composite material are about 200-300nm, the Cu crystal grains are about 0.8-1μm, the yield strength of the composite material is 100MPa, the compressive strength is 295MPa, and the elongation is 53%.
实施方式二Implementation mode two
称取纯度为98.5%、粒度为10μm的Ti2SnC粉7.33克、纯度为99.8%、粒度为70μm的Cu粉92.67克,混合后加入400克玛瑙球,球磨混料2小时,将混合粉料装入Φ76的钢模具中,并施加250MPa的压强,使模具中的粉料压实成型,将上述块体放入高温炉中,在氩气保护下,按20℃/min的升温速率,将炉温升至1150℃,保温45min,然后以30℃/min的速率降温,冷却后,即得到超细陶瓷颗粒超细化Cu基复合材料。Weigh 7.33 grams of Ti 2 SnC powder with a purity of 98.5% and a particle size of 10 μm, and 92.67 grams of Cu powder with a purity of 99.8% and a particle size of 70 μm. After mixing, add 400 grams of agate balls and ball mill the mixture for 2 hours. Put it into a Φ76 steel mold, and apply a pressure of 250MPa to compact the powder in the mold, put the above block into a high-temperature furnace, and under the protection of argon, press the heating rate of 20°C/min. The temperature of the furnace was raised to 1150° C., kept for 45 minutes, and then cooled at a rate of 30° C./min. After cooling, an ultrafine Cu-based composite material with ultrafine ceramic particles was obtained.
测得上述复合材料其TiC0.5颗粒约为150~200nm,Cu晶粒约为0.3~0.5μm,复合材料的屈服强度为225MPa,压缩强度为562MPa,延伸率为46%。It is measured that the TiC 0.5 particles of the above composite material are about 150-200nm, the Cu crystal grains are about 0.3-0.5μm, the yield strength of the composite material is 225MPa, the compressive strength is 562MPa, and the elongation is 46%.
实施方式三Implementation Mode Three
称取纯度为98.5%、粒度为7μm的Ti2SnC粉15.12克、纯度为99.8%、粒度为60μm的Cu粉84.88克,混合后加入300克玛瑙球,球磨混料4小时,将混合粉料装入Φ50的钢模具中,并施加200MPa的压强,使模具中的粉料压实成型,将上述块体放入高温炉中,在氩气保护下,按30℃/min的升温速率,将炉温升至1170℃,保温60min,然后以20℃/min的速率降温,冷却后,即得到超细陶瓷颗粒超细化Cu基复合材料。Weigh 15.12 grams of Ti 2 SnC powder with a purity of 98.5% and a particle size of 7 μm, and 84.88 grams of Cu powder with a purity of 99.8% and a particle size of 60 μm. After mixing, add 300 grams of agate balls and ball mill the mixture for 4 hours. Put it into a steel mold of Φ50, and apply a pressure of 200MPa to compact the powder in the mold, put the above block into a high-temperature furnace, and under the protection of argon, press a heating rate of 30°C/min. The temperature of the furnace was raised to 1170°C, kept at a temperature of 60 minutes, and then lowered at a rate of 20°C/min. After cooling, an ultrafine Cu-based composite material with ultrafine ceramic particles was obtained.
测得上述复合材料其TiC0.5颗粒约为60~80nm,Cu晶粒约为0.1~0.2μm,复合材料的屈服强度为335MPa,压缩强度为870MPa,延伸率为38%。It is measured that the TiC 0.5 particles of the composite material are about 60-80nm, the Cu crystal grains are about 0.1-0.2μm, the yield strength of the composite material is 335MPa, the compressive strength is 870MPa, and the elongation is 38%.
实施方式四Implementation Mode Four
称取纯度为98.5%、粒度为7μm的Ti2SnC粉23.39克、纯度为99.8%、粒度为50μm的Cu粉76.61克,混合后加入300克玛瑙球,球磨混料4小时,将混合粉料装入Φ50的钢模具中,并施加200MPa的压强,使模具中的粉料压实成型,将上述块体放入高温炉中,在氩气保护下,按20℃/min的升温速率,将炉温升至1200℃,保温40min,然后以20℃/min的速率降温,冷却后,即得到超细陶瓷颗粒超细化Cu基复合材料。Weigh 23.39 grams of Ti 2 SnC powder with a purity of 98.5% and a particle size of 7 μm, and 76.61 grams of Cu powder with a purity of 99.8% and a particle size of 50 μm. After mixing, add 300 grams of agate balls and ball mill the mixture for 4 hours. Put it into a Φ50 steel mold, and apply a pressure of 200MPa to compact the powder in the mold, put the above block into a high-temperature furnace, and under the protection of argon, press a heating rate of 20°C/min. The temperature of the furnace was raised to 1200° C., kept for 40 minutes, and then cooled at a rate of 20° C./min. After cooling, an ultrafine Cu-based composite material with ultrafine ceramic particles was obtained.
测得上述复合材料其TiC0.5颗粒约为80~100nm,Cu晶粒约为0.2~0.3μm,复合材料的屈服强度为483MPa,压缩强度为1162MPa,延伸率为29%。It is measured that the TiC 0.5 particles of the composite material are about 80-100 nm, the Cu crystal grains are about 0.2-0.3 μm, the yield strength of the composite material is 483 MPa, the compressive strength is 1162 MPa, and the elongation is 29%.
实施方式五Implementation Mode Five
称取纯度为98.5%、粒度为7μm的Ti2SnC粉41.6克、纯度为99.8%、粒度为50μm的Cu粉58.4克,混合后加入400克玛瑙球,球磨混料4小时,将混合粉料装入Φ76的钢模具中,并施加250MPa的压强,使模具中的粉料压实成型,将上述块体放入高温炉中,在氩气保护下,按15℃/min的升温速率,将炉温升至1250℃,保温30min,然后以10℃/min的速率降温,冷却后,即得到超细陶瓷颗粒超细化Cu基复合材料。Weigh 41.6 grams of Ti 2 SnC powder with a purity of 98.5% and a particle size of 7 μm, and 58.4 grams of Cu powder with a purity of 99.8% and a particle size of 50 μm, add 400 grams of agate balls after mixing, and ball mill the mixture for 4 hours. Put it into a steel mold of Φ76, and apply a pressure of 250MPa to compact the powder in the mold, put the above block into a high-temperature furnace, and under the protection of argon, press a heating rate of 15°C/min. The temperature of the furnace was raised to 1250°C, kept for 30 minutes, and then lowered at a rate of 10°C/min. After cooling, the superfine Cu-based composite material with ultrafine ceramic particles was obtained.
测得上述复合材料其TiC0.5颗粒约为150~200nm,Cu晶粒约为0.5~0.7μm,复合材料的屈服强度为662MPa,压缩强度为1080MPa,延伸率为10.2%。It is measured that the TiC 0.5 particles of the above composite material are about 150-200nm, the Cu crystal grains are about 0.5-0.7μm, the yield strength of the composite material is 662MPa, the compressive strength is 1080MPa, and the elongation is 10.2%.
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CN106278272A (en) * | 2016-07-20 | 2017-01-04 | 哈尔滨师范大学 | A kind of preparation method of Ti2SnC ceramic powder |
CN113351869A (en) * | 2021-06-02 | 2021-09-07 | 西南交通大学 | Passing through novel V2Preparation of V from SnC ceramic powder2Method for preparing C/Cu (Sn) composite material |
CN118147483A (en) * | 2024-02-04 | 2024-06-07 | 合肥工业大学 | Y element improving Cu-Ti2Preparation method and application of SnC composite material interface and performance |
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CN102242302A (en) * | 2011-06-28 | 2011-11-16 | 钢铁研究总院 | Preparation method of layered ternary ceramic reinforced copper composite material |
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