CN104896329A - High-power LED bulb capable of achieving quick cooling - Google Patents
High-power LED bulb capable of achieving quick cooling Download PDFInfo
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- CN104896329A CN104896329A CN201510276958.8A CN201510276958A CN104896329A CN 104896329 A CN104896329 A CN 104896329A CN 201510276958 A CN201510276958 A CN 201510276958A CN 104896329 A CN104896329 A CN 104896329A
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- led
- heat
- fluorescence
- radiator
- substrate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
Abstract
The invention relates to the field of illumination lamps, and provides a high-power LED bulb capable of achieving quick cooling. The bulb comprises a lamp cap, a glass lamp shell and an LED lamp body. A containing cavity and a glass stem are arranged in the glass lamp shell, the LED lamp body comprises an LED light source and a connection pin, the LED light source is arranged on the glass stem and comprises an LED lamp wick and a fluorescent heat conduction part, the fluorescent heat conduction part is disposed on the periphery of the LED lamp wick, the LED lamp wick comprises a plurality of LED wafers or an LED chip and a heat conduction substrate, the periphery of the glass stem is sleeved with a radiator located in the containing cavity, a plurality of cooling fins are arranged on the periphery of the radiator, the top of the radiator is a heat conduction plane making close contact with the bottom of the heat conduction substrate, the radiator is additionally disposed on the periphery of the glass stem, and accordingly heat generated by the LED wafers or the LED chip can be directly transferred to the radiator through a heat conduction mode, and the quick cooling effect can be achieved.
Description
Technical field
The present invention relates to field of illuminating lamps, be specifically related to the high-power LED bulb of quick heat radiating.
Background technology
The power consumption of LED bulb is lower than traditional incandescent lamp bulb and the life-span is long, the raising that the energy-conserving and environment-protective due to demander are realized, and as one of strategy of Saving Energy, therefore its scope of application expands rapidly.
LED bulb is by lamp holder, glass lamp housing and LED lamp bar are formed, the applicant have submitted in March, 2015 Chinese invention patent application that a invention and created name is " high-power heat-dissipation type LED lamp bar and LED bulb ", the luminous power of LED lamp can be improved while it does not gather heat, LED lamp bar is enable to make powerful structure, LED bulb is made also to have high heat radiation and powerful advantage, the service life of LED bulb can be increased simultaneously, but also there is following defect in this structure: 1) main body holder is only for fixed L ED lamp main body, the heat that LED lamp is produced can not conduct downwards, can only be dispelled the heat by the heat dissipation channel of LED lamp bar, 2) due to quantitative limitation of being heated, the heat of its inside can not conduct downwards, thus affects the whole lighting efficiency of bulb, and the LED bulb luminous power of traditional structure is 10 ~ 15W, can not improve luminous efficiency further again, restricted application, 3) can only dispel the heat in the inner passage of LED lamp bar, Long-Time Service can gather too high heat, affects service life.
Summary of the invention
The object of the invention is to solve above defect, providing can the high-power LED bulb of quick heat radiating, and it can dispel the heat further, thus can improve luminous power.
The object of the invention is to realize in the following manner:
The high-power LED bulb of quick heat radiating, comprises lamp holder, glass lamp housing and LED main body, wherein, includes LED drive circuit in lamp holder; Glass lamp housing is located on lamp holder, comprises receiving cavity and glass stem in glass lamp housing.
Glass lamp housing of the present invention can be designed to transparent lamp case or opaque lamp housing, and the lamp housing as manufactured by frosting technology is opaque structure.
LED main body is arranged in the receiving cavity of glass lamp housing, and be fixed on glass stem, LED main body of the present invention is connected with the processing sealing process being through fire between glass lamp housing, connecting after combining makes LED main body be positioned at receiving cavity, LED main body comprises LED light source and wiring pin, the top of wiring pin is electrically connected with LED light source, and the bottom of wiring pin is electrically connected to downward-extension with lamp holder, and LED light source is arranged on glass stem.LED light source comprises LED lamp and fluorescence conducting-heat elements, fluorescence conducting-heat elements is arranged on the periphery of LED lamp, for promoting the luminous efficiency of visible ray, LED lamp is made up of some LED wafer or LED chip and heat-conducting substrate, LED wafer or LED chip are evenly distributed on the surface of heat-conducting substrate, are electrically connected after some LED wafer or LED chip series connection with the top of wiring pin.
The radiator being positioned at receiving cavity is housed in the outer race of glass stem, the center of radiator is for matching the mesopore penetrating glass stem, the outer of radiator is arranged with some pieces of fin, heat radiation gap is left between adjacent two pieces of fin, the top of radiator is that the heat that LED wafer or LED chip are produced carries out quick heat radiating by heat transfer to radiator for carrying out the heat transfer plane of close contact with the bottom of heat-conducting substrate.
In above-mentioned explanation, as preferred scheme, described heat-conducting substrate is bar shape structure, thus form cylinder substrate, two ends of cylinder substrate are provided with conductive contact, the conductive contact of cylinder substrate bottom is vertically welded in the heat transfer plane of radiator, LED wafer or LED chip are arranged on the side of cylinder substrate, described fluorescence conducting-heat elements is set to the fluorescence heat pipe of tubulose, two ends of fluorescence heat pipe are lead-through opening, along lead-through opening, fluorescence heat pipe is sleeved on the periphery of LED lamp, two conductive contacts of cylinder substrate extend out from two lead-through openings respectively, conducting is formed and heat dissipation channel for dispelling the heat between the internal cavities of lead-through opening and fluorescence heat pipe.
The hollow structure of heat radiation is formed between LED lamp and fluorescence heat pipe, do not form package status, heat scatters from the hollow of fluorescence heat pipe, increase area of dissipation, improve radiating efficiency, LED bulb also has high heat radiation and powerful advantage, can increase the service life of LED bulb simultaneously, make its scope of application more extensive, be more convenient for promoting.
In above-mentioned explanation, preferred scheme, the fluorescent cover that two conductive contacts of cylinder substrate are all coated with, fluorescent cover penetrates conductive contact and lays respectively at the front of two lead-through openings, also leaves the through hole for dispelling the heat between fluorescent cover and lead-through opening.
In above-mentioned explanation, preferred scheme, described fluorescent cover is arc cap-like structure, and the medial surface edge of fluorescent cover is provided with plural socle, socle for match penetrate fluorescence heat pipe top lead-through opening in.
In above-mentioned explanation, preferred scheme, described fluorescence heat pipe is the silica gel pipe doped with fluorescent material, and fluorescent cover is the silica gel lid doped with fluorescent material.
In above-mentioned explanation, preferred scheme, described fluorescence heat pipe is the glass round tube being provided with fluorescence coating.
In above-mentioned explanation, as preferred scheme, described LED light source be provided with altogether one or be set to altogether 2 doubly several.
In above-mentioned explanation, as preferred scheme, described heat-conducting substrate is disc-shaped structure, thus form disk substrate, the bottom surface of disk substrate is adjacent in heat transfer plane, and LED wafer or LED chip are arranged on the end face of disk substrate, and described fluorescence conducting-heat elements is set to the fluorescence conducting strip of round sheet, fluorescence conducting strip covers the end face of disk substrate and is positioned at the top of LED wafer or LED chip, leaves the radiating opening for dispelling the heat between the end face of fluorescence conducting strip and disk substrate.
In above-mentioned explanation, more preferred scheme, it is same that described fluorescence conducting strip can make lid-like, directly covers the end face at disk substrate, and be positioned at the top of LED wafer or LED chip.
In above-mentioned explanation, as preferred scheme, described fin is circular configuration, and the diameter of the fin of radiator bottom is less than the diameter of the fin on top.
In above-mentioned explanation, the scheme more selected, described radiator is made up of metal material or is made up of ceramic material.
In above-mentioned explanation, as preferred scheme, described heat-conducting substrate is made up of metal material or is made up of ceramic material.
The beneficial effect that the present invention produces is as follows:
1) have additional radiator in the periphery of glass stem, the heat that LED wafer or LED chip are produced directly by heat conducting mode going down to radiator, thus the effect of quick heat radiating can be reached;
2) problem that radiator can solve the inner heat radiation further of LED bulb is had additional; LED bulb is enable to make powerful structure; thus the luminous efficiency of LED bulb can be improved, make its scope of application more extensive, the luminous power of LED bulb of the present invention can reach 15 ~ 30W;
3) heat of LED lamp can be carried out concentrated distributing by fluorescence conducting-heat elements, and form the heat dissipation channel for dispelling the heat, coefficient of heat transfer is high, guarantees that the heat of LED lamp can comprehensively distribute fast, does not gather too high heat, improves service life.
Accompanying drawing explanation
Fig. 1 is the structural representation of glass lamp housing inside in the embodiment of the present invention one;
Fig. 2 is the structural representation of LED bulb in the embodiment of the present invention one;
Fig. 3 is the structural representation of glass lamp housing inside in the embodiment of the present invention two;
Fig. 4 is the structural representation of LED bulb in the embodiment of the present invention two;
In figure, 1 is lamp holder, and 2 is glass lamp housing, and 3 is glass stem, and 4 is fluorescence heat pipe, and 5 is conductive contact, and 6 is fluorescent cover, and 7 is radiator, and 8 is disk substrate, and 9 is fluorescence conducting strip, and 10 is LED chip.
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is described in further detail.
embodiment one
The present embodiment, sees figures.1.and.2, and the high-power LED bulb of its quick heat radiating specifically implemented comprises lamp holder 1, glass lamp housing 2 and LED main body, includes LED drive circuit in lamp holder 1; Glass lamp housing 2 is located on lamp holder 1, receiving cavity and glass stem 3 is comprised in glass lamp housing 2, LED main body is arranged in the receiving cavity of glass lamp housing 2, and be fixed on glass stem 3, LED main body comprises LED light source and wiring pin, the top of wiring pin is electrically connected with LED light source, and the bottom of wiring pin is electrically connected to downward-extension with lamp holder 1, and LED light source is arranged on glass stem 3.
In the present embodiment, LED light source is provided with two altogether, LED light source comprises the fluorescence heat pipe 4 of LED lamp and tubulose, fluorescence heat pipe 4 is the silica gel pipe doped with fluorescent material, two ends of fluorescence heat pipe 4 are lead-through opening, along lead-through opening, fluorescence heat pipe 4 is sleeved on the periphery of LED lamp, for promoting the luminous efficiency of visible ray, LED lamp is made up of some LED chip 10 and cylinder substrate, some LED chip 10 are electrically connected with the top of wiring pin after connecting, LED chip 10 is arranged on the side of cylinder substrate, two ends of cylinder substrate are provided with conductive contact 5, two conductive contacts 5 extend out from two lead-through openings respectively, conducting is formed and heat dissipation channel for dispelling the heat between the internal cavities of lead-through opening and fluorescence heat pipe 4.
In order to increase radiating effect further, the radiator 7 being positioned at receiving cavity is housed in the outer race of glass stem 3, the radiator 7 of the present embodiment is made up of aluminum alloy materials, the center of radiator 7 is for matching the mesopore penetrating glass stem 3, the outer of radiator 7 is arranged with some pieces of fin, heat radiation gap is left between adjacent two pieces of fin, the top of radiator 7 is for carrying out the heat transfer plane of close contact with the bottom of cylinder substrate, the conductive contact 5 of the cylinder substrate bottom of the present embodiment is vertically welded in the heat transfer plane of radiator 7, heat transfer can be carried out after making conductive contact 5 and heat transfer plane compact siro spinning technology, guarantee that the heat that LED chip 10 produces can carry out quick heat radiating by heat transfer to radiator 7.
In addition, the fluorescent cover 6 that two conductive contacts 5 of cylinder substrate are all coated with, fluorescent cover 6 is the silica gel lid doped with fluorescent material, fluorescent cover 6 penetrates conductive contact 5 and lays respectively at the front of two lead-through openings, the through hole for dispelling the heat also is left between fluorescent cover 6 and lead-through opening, fluorescent cover 6 is arc cap-like structure, and the medial surface edge of fluorescent cover 6 is provided with two socles, socle for match penetrate fluorescence heat pipe 4 top lead-through opening in.
embodiment two
The present embodiment, with reference to Fig. 3 and Fig. 4, the high-power LED bulb of its quick heat radiating specifically implemented comprises lamp holder 1, glass lamp housing 2 and LED main body, includes LED drive circuit in lamp holder 1; Glass lamp housing 2 is located on lamp holder 1, receiving cavity and glass stem 3 is comprised in glass lamp housing 2, LED main body is arranged in the receiving cavity of glass lamp housing 2, and be fixed on glass stem 3, LED main body comprises LED light source and wiring pin, the top of wiring pin is electrically connected with LED light source, and the bottom of wiring pin is electrically connected to downward-extension with lamp holder 1, and LED light source is arranged on glass stem 3.
In the present embodiment, LED light source comprises the fluorescence conducting strip 9 of LED lamp and round sheet, LED lamp is made up of some LED chip 10 and disk substrate 8, some LED chip 10 are electrically connected with the top of wiring pin after connecting, LED chip 10 is evenly arranged on the end face of disk substrate 8, some LED chip 10 are combined into circular distribution, fluorescence conducting strip 9 covers the end face of disk substrate 8 and is positioned at the top of LED chip 10, leaves the radiating opening for dispelling the heat between the end face of fluorescence conducting strip 9 and disk substrate 8.
In order to increase radiating effect further, the radiator 7 being positioned at receiving cavity is housed in the outer race of glass stem 3, the radiator 7 of the present embodiment is made up of ceramic material, the center of radiator 7 is for matching the mesopore penetrating glass stem 3, the outer of radiator 7 is arranged with some pieces of fin, heat radiation gap is left between adjacent two pieces of fin, the top of radiator 7 is for carrying out the heat transfer plane of close contact with the bottom surface of disk substrate 8, the bottom surface of disk substrate 8 is adjacent in heat transfer plane, guarantee that the heat that the LED chip 10 of disk substrate 8 end face produces directly can carry out quick heat radiating by heat transfer to radiator 7.
Above content is in conjunction with concrete preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as protection scope of the present invention.
Claims (10)
1. the high-power LED bulb of quick heat radiating, comprises lamp holder, glass lamp housing and LED main body, wherein,
LED drive circuit is included in lamp holder;
Glass lamp housing is located on lamp holder, comprises receiving cavity and glass stem in glass lamp housing;
LED main body is arranged in the receiving cavity of glass lamp housing, and be fixed on glass stem, LED main body comprises LED light source and wiring pin, the top of wiring pin is electrically connected with LED light source, the bottom of wiring pin is electrically connected to downward-extension with lamp holder, LED light source is arranged on glass stem, it is characterized in that: LED light source comprises LED lamp and fluorescence conducting-heat elements, fluorescence conducting-heat elements is arranged on the periphery of LED lamp, for promoting the luminous efficiency of visible ray, LED lamp is made up of some LED wafer or LED chip and heat-conducting substrate, LED wafer or LED chip are evenly distributed on the surface of heat-conducting substrate, be electrically connected with the top of wiring pin after some LED wafer or LED chip series connection, the radiator being positioned at receiving cavity is housed in the outer race of glass stem, the center of radiator is for matching the mesopore penetrating glass stem, the outer of radiator is arranged with some pieces of fin, heat radiation gap is left between adjacent two pieces of fin, the top of radiator is for carrying out the heat transfer plane of close contact with the bottom of heat-conducting substrate, the heat that LED wafer or LED chip are produced carries out quick heat radiating by heat transfer to radiator.
2. the high-power LED bulb of quick heat radiating according to claim 1, it is characterized in that: described heat-conducting substrate is bar shape structure, thus form cylinder substrate, two ends of cylinder substrate are provided with conductive contact, the conductive contact of cylinder substrate bottom is vertically welded in the heat transfer plane of radiator, LED wafer or LED chip are arranged on the side of cylinder substrate, described fluorescence conducting-heat elements is set to the fluorescence heat pipe of tubulose, two ends of fluorescence heat pipe are lead-through opening, along lead-through opening, fluorescence heat pipe is sleeved on the periphery of LED lamp, two conductive contacts of cylinder substrate extend out from two lead-through openings respectively, conducting is formed and heat dissipation channel for dispelling the heat between the internal cavities of lead-through opening and fluorescence heat pipe.
3. the high-power LED bulb of quick heat radiating according to claim 2, it is characterized in that: the fluorescent cover be all coated with on two conductive contacts of cylinder substrate, fluorescent cover penetrates conductive contact and lays respectively at the front of two lead-through openings, also leaves the through hole for dispelling the heat between fluorescent cover and lead-through opening.
4. the high-power LED bulb of quick heat radiating according to claim 3, it is characterized in that: described fluorescent cover is arc cap-like structure, the medial surface edge of fluorescent cover is provided with plural socle, socle for match penetrate fluorescence heat pipe top lead-through opening in.
5. the high-power LED bulb of quick heat radiating according to claim 4, it is characterized in that: described fluorescence heat pipe is the silica gel pipe doped with fluorescent material, fluorescent cover is the silica gel lid doped with fluorescent material.
6. the high-power LED bulb of quick heat radiating according to claim 4, is characterized in that: described fluorescence heat pipe is the glass round tube being provided with fluorescence coating.
7. the high-power LED bulb of quick heat radiating according to claim 2 ~ 6 any one, is characterized in that: described LED light source be provided with altogether one or be set to altogether 2 doubly several.
8. the high-power LED bulb of quick heat radiating according to claim 1, it is characterized in that: described heat-conducting substrate is disc-shaped structure, thus form disk substrate, the bottom surface of disk substrate is adjacent in heat transfer plane, LED wafer or LED chip are arranged on the end face of disk substrate, described fluorescence conducting-heat elements is set to the fluorescence conducting strip of round sheet, fluorescence conducting strip covers the end face of disk substrate and is positioned at the top of LED wafer or LED chip, leaves the radiating opening for dispelling the heat between the end face of fluorescence conducting strip and disk substrate.
9. the high-power LED bulb of quick heat radiating according to claim 1,2,3,4,5,6 or 8, it is characterized in that: described fin is circular configuration, the diameter of the fin of radiator bottom is less than the diameter of the fin on top.
10. the high-power LED bulb of quick heat radiating according to claim 9, is characterized in that: described radiator is made up of metal material or is made up of ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510276958.8A CN104896329B (en) | 2015-05-27 | 2015-05-27 | High-power LED bulb capable of achieving quick cooling |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510276958.8A CN104896329B (en) | 2015-05-27 | 2015-05-27 | High-power LED bulb capable of achieving quick cooling |
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| CN104896329A true CN104896329A (en) | 2015-09-09 |
| CN104896329B CN104896329B (en) | 2017-05-24 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106015984A (en) * | 2016-06-30 | 2016-10-12 | 浙江生辉照明有限公司 | Heat sink and LED lamp |
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| CN103759149A (en) * | 2013-12-31 | 2014-04-30 | 深圳市恒睿智达科技有限公司 | Columnar LED (light emitting diode) lighting |
| CN104110599A (en) * | 2014-07-21 | 2014-10-22 | 福建永德吉灯业股份有限公司 | Led light source |
| CN204201550U (en) * | 2014-10-29 | 2015-03-11 | 中山市名派照明电器有限公司 | A kind of LED bulb |
| CN204729967U (en) * | 2015-05-27 | 2015-10-28 | 胡丽 | The high-power LED bulb of quick heat radiating |
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2015
- 2015-05-27 CN CN201510276958.8A patent/CN104896329B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102252192A (en) * | 2011-06-20 | 2011-11-23 | 苏州红壹佰照明有限公司 | YAG (yttrium aluminum garnet) fluorescent LED (light emitting diode) bulb lamp |
| CN103759149A (en) * | 2013-12-31 | 2014-04-30 | 深圳市恒睿智达科技有限公司 | Columnar LED (light emitting diode) lighting |
| CN104110599A (en) * | 2014-07-21 | 2014-10-22 | 福建永德吉灯业股份有限公司 | Led light source |
| CN204201550U (en) * | 2014-10-29 | 2015-03-11 | 中山市名派照明电器有限公司 | A kind of LED bulb |
| CN204729967U (en) * | 2015-05-27 | 2015-10-28 | 胡丽 | The high-power LED bulb of quick heat radiating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106015984A (en) * | 2016-06-30 | 2016-10-12 | 浙江生辉照明有限公司 | Heat sink and LED lamp |
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| CN104896329B (en) | 2017-05-24 |
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