CN104892901A - Phosphorus-nitrogen epoxy resin with single aromatic ring phenolic groups, flame-retardant combination, and composite metal substrate - Google Patents
Phosphorus-nitrogen epoxy resin with single aromatic ring phenolic groups, flame-retardant combination, and composite metal substrate Download PDFInfo
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- CN104892901A CN104892901A CN201510240708.9A CN201510240708A CN104892901A CN 104892901 A CN104892901 A CN 104892901A CN 201510240708 A CN201510240708 A CN 201510240708A CN 104892901 A CN104892901 A CN 104892901A
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Abstract
The invention discloses a phosphorus-nitrogen epoxy resin with single aromatic ring phenolic groups, a flame-retardant combination, and a composite metal substrate. The phosphorus-nitrogen epoxy resin is an epoxy resin product obtained via reaction of a phosphorus-nitrogen compound with single aromatic ring phenolic groups with a halogen-free epoxy resin; the molecular structure of the phosphorus-nitrogen epoxy resin comprises single aromatic ring phenolic groups which are connected with each other, and a group M which possesses a phosphorus-nitrogen skeleton composed of unsaturated phosphorus and nitrogen atoms, wherein M comprises at least 50wt% of a group M1 with a ringlike phosphorus-nitrogen skeleton which is composed of three phosphorus and nitrogen atoms, at most 30wt% of a group M2 with a chain-shaped phosphorus-nitrogen skeleton which is composed of at most two phosphorus and nitrogen atoms, and at most 45wt% of a group M3 with a ringlike phosphorus-nitrogen skeleton which is composed of at least four phosphorus and nitrogen atoms; so that the flame-retardant combination possesses excellent flame resistance, a cured product of the flame-retardant combination possesses excellent heat resistance, water resistance, cohesiveness, mechanical properties, and electrical properties; and the phosphorus-nitrogen epoxy resin possesses excellent economic performance, and is friendly to the environment.
Description
Technical field
The present invention relates to the technical field of fire retardant matter, particularly relate to band single aromatic ring phenolic group phosphorus azo-cycle epoxy resins, fire-retardant combination, composite metal substrate.
Background technology
The electronic product being representative with mobile phone, computer, pick up camera, electronic game machine, the various products used be representative family expenses, office electric equipment products and the other field such as air-conditioning, refrigerator, television image, sound equipment articles for use, in order to safety, very most product all requires that it possesses flame retardant properties in various degree.
Required flame retardant properties or grade is reached in order to make product, traditional technology usually uses adds as aluminium hydroxide hydrate in material system, the inorganic fire-retarded material of the classes such as the metal hydroxides containing crystal water such as magnesium hydroxide hydrate, add as brominated bisphenol A with in system material, the brominated amount such as brominated bisphenol a type epoxy resin higher or organic chemicals that halogen-containing amount is higher, in order to improve the flame retardant resistance that these contain the organic chemicals of halogen, also usually add again in system if antimonous oxide etc. is to environment disagreeableness inorganic chemistry fire retardant material.
Owing to using halogen-containing fire retardant matter, can produce during its burning toxic substance without degradation property or difficult degradation as dioxin organic halogen chemical contamination environment, affect the mankind and animal health.
For the object of protection of the environment; the not halogen-containing compound such as phosphorous, nitrogenous is used to replace halogen contained compound as fire retardant; particularly at electronics, electrically, on Electric Industrial; employing has reactive simple function (only having an active reactive group in a molecule) 9; assorted-10-phospho hetero phenanthrene-10-the oxide compound of 10-dihydro-9-oxy is hereinafter referred to as DOPO); more adopt the derivative compound of DOPO as flame-retardant composition, add or do not add aluminium hydroxide hydrate, magnesium hydroxide hydrate reaches fire-retardant effect.
At electronic applications, resultant (the being called for short DOPO epoxy resin) widespread use usually using high cost, polyfunctional epoxy resin and the DOPO such as DOPO and novolac type epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic type epoxy resin to react is as the epoxide resin material of copper-clad plate purposes.
These use the copper-clad plate manufactured by DOPO epoxy resin, there is good flame retardant properties, but there is many defects in agglutinating value(of coal), thermotolerance, processibility etc., be not suitable for the needs of the high multilayer of manufacture modern communications needs, high reliability, high agglutinating value(of coal), good processing characteristics, and due to high cost, be unfavorable for spreading to and require the civil goods fields such as the consumer electronics of low cost as mobile phone etc.
Along with electronic industry is to the requirement of the factor such as pressure of the universal use of the further raising of short, little, thin, high multiple stratification, high reliability request, civilian consumer electronics and more and more severeer environmental pollution, market has the flame retardant resistance material of good flame retardant resistance, thermotolerance, good mechanical property in the urgent need to material.
Summary of the invention
In view of this, one aspect of the present invention provides a kind of band list aromatic ring phenolic group phosphorus azo-cycle epoxy resins with good flame-retardance, thermotolerance, good mechanical property.
The single aromatic ring phenolic group phosphorus azo-cycle epoxy resins of a kind of band, for by the single aromatic ring phenolic group phosphorus-nitrogen compound of band and the non-halogen system epoxy resin condition in epoxy resin functional group surplus, by the epoxy resin resultant be obtained by reacting.
The single aromatic ring phenolic group group be connected with each other and the group (M) being with the phosphorus nitrogen skeleton be made up of unsaturated phosphorus, nitrogen-atoms is comprised, the group (M of the ring-type phosphorus nitrogen skeleton that the band that M comprises at least 50wt% is made up of three phosphorus, nitrogen-atoms in the molecular structure of wherein said band single aromatic ring phenolic group phosphorus-nitrogen compound
1), the group (M of chain phosphorus nitrogen skeleton that is made up of two phosphorus, nitrogen-atoms at the most of the band of 30wt% at the most
2) and the group (M of the ring-type phosphorus nitrogen skeleton be made up of at least four phosphorus, nitrogen-atoms of 45wt% at the most
3).
" epoxy resin functional group is superfluous " is as the criterion at below 3585g/eq, more preferably at below 1520g/eq with the epoxy equivalent (weight) of epoxy resin resultant.
Above-mentioned M base refers to the phosphazenium groups with anti-flaming function.M
1i.e. ring three phosphonitrile base; M
2specific examples have single phosphonitrile and two phosphonitrile, it can adopt the conventional method in this area to synthesize; M
3specific examples have ring four phosphonitrile, ring five phosphonitrile and ring six phosphonitrile etc.Preferably, M
1accounting for more than the 80wt% of M total mass, particularly well, is 90 ~ 100wt%.
Have such as formula the molecular structure shown in I with single aromatic ring phenolic group phosphorus-nitrogen compound:
In formula I, R represents aliphatic group containing at least one carbon atom or aromatic base; A, b, c are the integer being more than or equal to 1, b and c sum is more than or equal to 2, a, b and c three sum be more than or equal to 6, n be more than or equal to zero integer.
In above-mentioned phosphorus-nitrogen compound, if M
1content is less than 50wt%, or M
2more than 30wt%, then reacted resultant in use will damage the necessary performance such as thermotolerance, water tolerance and mechanical property with epoxy resin.M
3content accounts for 45% of phosphazenium groups total mass at the most.If exceed this content, then reacted resultant in use will likely because viscosity is excessive, use inconvenience with epoxy resin, and make the bad results such as its performance suffers damage because molecular weight is excessive.
The preparation method of phosphorus-nitrogen compound, is specially, and the muriate of above-mentioned M and single aromatic ring phenol being reacted through reacting to pass through, obtaining flame retardant.The concrete structure of M here and composition see above described in the structure of flame retardant resistance thing.The concrete reaction adopted can adopt method well known in the art, as phosphonitrilic chloride compound is having under solvent or solvent-free condition, use, is obtained by reacting with single aromatic ring phenol or its metal-salt for catalyzer in the basic conditions with the metal chlorides such as zinc chloride, magnesium chloride, aluminum chloride, boron trifluoride and complex compound thereof etc.These catalyzer can one or more be used in combination, there is no special regulation in the present invention.Muriatic example as M has conventional hexachlorocyclotriphosphazene, known solvent, catalyzer can be used to synthesize, also phosphorus pentachloride and ammonium chloride can be used to be synthesized after phosphorus chloride cyanogen compound according to known method, and purifying through physical method process or do not purify directly manufactures.
There is no special regulation to non-halogen system epoxy resin in the present invention, " non-halogen system epoxy resin " refers to the epoxy resin not containing halogen atom here, or the epoxy resin that content of halogen is very low.Such as with the difunctional epoxy resin that liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, solid-state bisphenol A type epoxy resin, solid-state bisphenol f type epoxy resin, bisphenol-s epoxy resin, biphenyl type epoxy resin are representative, the above epoxy resin of trifunctional being representative with solid-state, liquid or semi-solid state novolac type epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin, acyclic isoprenoid type epoxy resin.Here, those skilled in the art it is easily understood that, when being certainly necessary, also the epoxy resin that the viscosity ratio such as alicyclic epoxy resin, chain type aliphatics type epoxy resin or ester formula epoxy resin are lower can be used, these epoxy resin can be used alone and also can two or more use together, and the present invention there is no special regulation to this.Above-mentioned epoxy resin both can a part or major part first participate in reaction, question response to a certain extent or add again after complete reaction other composition epoxy resin participate in reaction, also all required epoxy resin segmentations reaction or the reaction of disposable input can be dropped into, the present invention does not do special regulation, to obtain object under the prerequisite guaranteeing safety, environmental protection.
In order to fast reaction speed, save time and the energy, general needs add catalyzer in reaction system, the number of the present invention to the kind of catalyzer and add-on there is no special regulation, usually as imidazoles, triphenylphosphine and derivatives class thereof, tertiary amines, the General Catalyst that the epoxy resin such as quaternary ammonium salts and aldehydes matter react can use, these catalyzer both can be used alone, also can two or more be used in combination, usage quantity is reactive material whole between 100 ~ 20000ppm in contrast system generally, be more typically between 200 ~ 5000ppm.
Can according to the difference of viscosity in reactive system with other condition, adopt the method for solvent-free reaction or adopt the method adding solvent reaction in reaction system, the present invention there is no special regulation to reaction solvent, such as acetone, butanone, the ketones solvents such as pimelinketone, benzene, toluene, dimethylbenzene, the aromatic solvents such as xylol, methylene dichloride, trichloromethane, chlorobenzenes etc. are containing chlorinated solvents, ether, butyl ether, the ethers such as ethylene glycol monomethyl ether or ether alcohol kind solvent, petroleum solvent oil, butanols, the alcoholic solvents etc. such as isopropylcarbinol all can use, these solvents can be used alone, also can two kinds or several are used in combination, the number of usage quantity, can determine according to practical situation, be generally can make fire-retarded epoxy resin solid content be 5 ~ 100% consumption, particularly preferred for can make fire-retarded epoxy resin solid content be 20 ~ 100% consumption.
In order to fast reaction speed, generally carry out under the condition of heating, temperature of reaction is generally the scope of 40 ~ 250 DEG C, be more preferably the scope at 60 ~ 180 DEG C, the present invention does not do special regulation, with under the prerequisite guaranteeing safety and environmental protection, obtains object and selects to be as the criterion.
Further aspect of the present invention provides a kind of fire-retardant combination with good flame-retardance, thermotolerance, good mechanical property.
A kind of fire-retardant combination, comprises the single aromatic ring phenolic group phosphorus azo-cycle epoxy resins epoxy resin of band described above.
Can only containing fire-retarded epoxy resin in above-mentioned fire-retardant combination, that also can add other has flame retardant resin, such as DOPO type epoxy resin, containing phosphorous epoxy resin, nitrogenous type epoxy resin, nitrogenous containing phosphorous epoxy resin, phosphorus containing phenolic resin, nitrogenous containing phosphorous resol, silicon-contained type epoxy resin and sulfur-type epoxy resin.Certainly also as required, the filler of solidifying agent, auxiliary agent, curing catalyst and halogen-free flame-retardance can be added.
Solidifying agent there is no special regulation in the present invention, and the material being typically used as epoxy curing agent all can be used as the solidifying agent of epoxy resin composition of the present invention.Specific examples can be aliphatic amide or the aromatic amines such as aminocompound, such as Dyhard RU 100, diethyl triamine, diaminodiphenylmethane, diaminodiphenylsulfone(DDS); Can also be two or more phenol-based compounds or mixture, such as, containing benzoxazine colophony, acid anhydrides, polyprotonic acid, boron trifluoride and complex compound thereof etc. in molecule such as dihydroxyphenyl propane, Bisphenol F, bisphenol S, linear phenolic resin, bisphenol A phenolic resin, these epoxy curing agents can be used alone, also can two kinds or several are used in combination, usage quantity is usually between the equivalence ratio 0.4 ~ 1.5 (eq) of contrast epoxy resin.
In order to fast setting, usually need to add curing catalyst.The present invention to used curing catalyst without special regulation, use the normally used curing catalyst of epoxy resin, such as imidazoles, triphenylphosphine and derivatives class thereof, tertiary amines, quaternary ammonium salts, the General Catalyst of the epoxy curing agent such as boron trifluoride and derivatives class thereof curing reaction, these promotor both can be used alone, also can two or more be used in combination, the number of usage quantity, can be as required, with safety, environmental protection obtains object and is as the criterion, the present invention not specially provided for, usually, epoxy resin ingredient in contrast curing system, proper with 0.001% ~ 2.5%, more suitably scope is between 0.03% ~ 1.2%.
Filler is to increase its some function, character or reducing costs, can add as mineral fillers such as silicon-dioxide, diatomite, kaolin, calcium carbonate, mica, titanium dioxide, magnesium hydroxide, aluminium hydroxides in curing system, these mineral fillers can be used alone, also can two kinds or several are used in combination, usage quantity is generally advisable with the 500phr (phr represents the number contained by every hectogram) being no more than epoxy resin ingredient.
In above-mentioned fire-retardant combination, can be according to actual needs, some are added general in or special materials such as defoamer, coupling agent, toughner, flow agents in system, the present invention does not do special regulation to the kind and addition of adding auxiliary agent, as required, object can be obtained with safety, environmental protection and is as the criterion.
A kind of pre-impregnated sheet, it is by fire-retardant combination impregnation described above or coat base material and form.Base material can be fiberglass substrate, polyester base material, polyimide base material, ceramic base material or carbon fiber base material etc.Here, the concrete technology condition of its impregnation or coating is not particularly limited." bonding sheet " that " pre-impregnated sheet " is also well known to those skilled in the art.
A kind of composite metal substrate, it comprises more than one as above-mentioned pre-impregnated sheet is overlapping, pressing forms.Composite metal substrate is but is not limited to copper-clad plate or the aluminium base of CEM-1, CEM-3, FR-4, FR-5.
A kind of wiring board, the surface working circuit in above-mentioned composite metal substrate forms.This wiring board is in such as electronic industry, electrically, Electric Industrial, communications and transportation, aerospace, toy industry etc. need the widespread use of the industry such as machine, equipment, instrument, instrument of wiring board.
Above-mentioned term " single aromatic ring phenol " refers to the phenol containing an aromatic ring in molecular structure, and " aromatic ring " contains phenyl ring and thick aromatic ring (such as naphthalene nucleus, anthracene nucleus etc.) here.Opposed with " single aromatic ring phenol " is " many aromatic rings phenol ", namely multiple phenyl ring or thick aromatic ring (such as naphthalene nucleus, anthracene nucleus etc.) are connected by singly-bound or other atom (such as carbon atom), such as dihydroxyphenyl propane, Bisphenol F, bisphenol S and '-biphenyl diphenol.
Above-mentioned term " ××× base or group " refers to slough in ××× molecular structure of compounds remaining part after one or more hydrogen atom.
Band of the present invention single aromatic ring phenolic group phosphorus azo-cycle epoxy resins is by the single aromatic ring phenolic group phosphorus-nitrogen compound of band and the epoxy resin resultant of non-halogen system epoxy resin by being obtained by reacting, the single aromatic ring phenolic group group be connected with each other and the group (M) being with the phosphorus nitrogen skeleton be made up of unsaturated phosphorus, nitrogen-atoms is comprised, the group (M of the ring-type phosphorus nitrogen skeleton that the band that M comprises at least 50wt% is made up of three phosphorus, nitrogen-atoms in this its molecular structure
1), the group (M of chain phosphorus nitrogen skeleton that is made up of two phosphorus, nitrogen-atoms at the most of the band of 30wt% at the most
2) and the group (M of the ring-type phosphorus nitrogen skeleton be made up of at least four phosphorus, nitrogen-atoms of 45wt% at the most
3), make this flame retardant have good flame retardant resistance thus, its cured article has good thermotolerance, water tolerance, agglutinating value(of coal) and mechanical property, is a kind of epoxy resin also with larger economy and environmental protection friendly.
Embodiment
Technical scheme of the present invention is further illustrated below in conjunction with embodiment.
Embodiment 1
Chlordene ring three phosphorus cyanogen 173.83g (0.5mol), acetone 250ml, phenol 188.0g (2.0mol) and xenol 409.2g (2.2mol) is dropped into in three mouthfuls of 2000ml glass reactors of whipping appts, stir and lead to nitrogen while be warmed up to 45 DEG C, 20% sodium hydroxide solution 400g is instilled with 60min, keep 45 DEG C of temperature, stirring reaction 15 hours.After reaction, with the moisture in physical method removal system, refilter the insoluble substance in removal system, distill solvent in system, obtain flame retardant 644.0g, recording its phenolic group equivalent is 195.5g/eq, by this object resultant called after A.
With the triphenylphosphine dropping into liquid bisphenol A type epoxy resin 374g that epoxy equivalent (weight) is 187g/eq and above-mentioned A material 125g and 0.05g in three mouthfuls of 500ml glass reactors of whipping appts, be warmed up to 100 DEG C, react 8 hours, obtain the object epoxy resin 499.0g that epoxy equivalent (weight) is 368.0g/eq, add the epoxy resin solution that acetone is modulated into 60% again, by this object called after B.
Get the solution 100g (solids component is 60g) of above-mentioned B substance, add the Dyhard RU 100 of 3.1g and appropriate DMF again, stir homogeneous after, add the glyoxal ethyline of 0.08g, wiring solution-forming, then obtains the standard copper-clad plate sample meeting the standard such as GB, UL, called after a copper-clad plate according to general copper-clad plate production process, the performance of test a copper-clad plate, its result represents in table-1.
Embodiment 2
Ethylene dichloride 180g, phosphorus pentachloride 104.11g (0.5mol), ammonium chloride 26.75g (0.5mol) and magnesium chloride 20g is dropped into in three mouthfuls of 2000ml glass reactors of whipping appts.Stir and lead to nitrogen while be warmed up to 60 DEG C, and react under 60 DEG C of temperature condition after 6 hours, add sodium methylate 54.02g (1.0mol), phenol 94.0g again and xenol 409.2g (2.2mol) continues reaction 12 hours, add solvent 300g, cross and filter insoluble substance, then solvent evaporated, obtain flame retardant 489.2g, recording its phenolic group equivalent is 196.2g/eq, by this object resultant called after C.
Be the liquid bisphenol A type epoxy resin 374g of 187g/eq and the triphenylphosphine of above-mentioned B substance 125.1g and 0.05g with dropping into epoxy equivalent (weight) in three mouthfuls of 500ml glass reactors of whipping appts, be warmed up to 100 DEG C, react 10 hours, obtain the object epoxy resin 499.1g that epoxy equivalent (weight) is 331.2g/eq, by this object called after D.
Get the solution 100g (solids component is 60g) of above-mentioned D material, the phenolic group equivalent adding 19.0g is again the lacquer resins of 105g/eq and appropriate acetone solution, stir homogeneous after, add the glyoxal ethyline of 0.08g, wiring solution-forming, then obtains the standard copper-clad plate sample meeting the standard such as GB, UL, called after b copper-clad plate according to general copper-clad plate production process, the performance of test b copper-clad plate, its result represents in table-1.
Embodiment 3
Chlordene ring three phosphorus cyanogen 173.83g (0.5mol), acetone 250ml, sodium methylate 54.02g (1.0mol), phenol 94.0g (1.0mol) and xenol 409.2g (2.2mol) is dropped into in three mouthfuls of 2000ml glass reactors of whipping appts, stir and lead to nitrogen while be warmed up to 40 DEG C, 20% sodium hydroxide solution 400g is instilled with 60min, keep 45 DEG C of temperature, stirring reaction 15 hours.After reaction, with the moisture in physical method removal system, refilter the insoluble substance in removal system, distill solvent in system, obtain flame retardant 601.2g, recording its phenolic group equivalent is 177.0g/eq, by this object resultant called after E.
With the triphenylphosphine dropping into liquid bisphenol A type epoxy resin 374g that epoxy equivalent (weight) is 187g/eq and above-mentioned A material 130.0g and 0.08g in three mouthfuls of 500ml glass reactors of whipping appts, be warmed up to 100 DEG C, react 8 hours, obtain the object epoxy resin 317.0g that epoxy equivalent (weight) is 398.2g/eq, add the epoxy resin solution that acetone is modulated into 60% again, by this object called after F.
Get the solution 100g (solids component is 60g) of above-mentioned F material, add linear phenolic resin and appropriate acetone that 16.0g phenolic hydroxyl equivalent is 105g/eq again, after linear phenolic resin is dissolved completely, add the glyoxal ethyline of 0.08g, wiring solution-forming, then obtains the standard copper-clad plate sample meeting the standard such as GB, UL, called after c copper-clad plate according to general copper-clad plate production process, the performance of test c copper-clad plate, its result represents in table-1.
Comparative example 1
Be the linear phenolic epoxy resin 374g of 178g/eq and the triphenylphosphine of DOPO 38g and 0.1g with dropping into epoxy equivalent (weight) in three mouthfuls of 500ml glass reactors of whipping appts, be warmed up to 120 DEG C, react 5 hours, obtain the object epoxy resin 412g that epoxy equivalent (weight) is 232g/eq, by this object called after G.
The solution (solids component is 60g) getting above-mentioned G material adds the Dyhard RU 100 of 3.0g and appropriate DMF again, stir homogeneous after, add the glyoxal ethyline of 0.08g, wiring solution-forming, then the standard copper-clad plate sample meeting the standard such as GB, UL is obtained according to general copper-clad plate production process, called after d copper-clad plate, the performance of test d copper-clad plate, its result represents in table-1.
Comparative example 2
Get above-mentioned G substance solution 100g (solids component 60g), add the glyoxal ethyline that phenolic hydroxyl equivalent is lacquer resins 27.1g and 0.05g of 105g/eq, add the homogeneous rear wiring solution-forming of suitable acetone solution, then the standard copper-clad plate sample meeting the standard such as GB, UL is obtained according to general copper-clad plate production process, called after d copper-clad plate, the performance of test d copper-clad plate, its result represents in table-1.
The test result of embodiment and comparative example is as shown in following table-1 (in view of concrete testing method is well known to those skilled in the art, no longer describing in detail method at this):
The Performance comparision of table-1, copper-clad plate
| Test event | Unit | A copper-clad plate | B copper-clad plate | C copper-clad plate | D copper-clad plate |
| Tg(DSC) | ℃ | 173 | 176 | 178 | 132 |
| T-strength of glass | kg/mm 2 | 2.1 | 2.05 | 1.98 | 0.7 |
| Interlaminar strength | kg/mm 2 | 1.89 | 1.78 | 1.91 | 0.4 |
| Saturated water absorption | ％ | 0.24 | 0.20 | 0.19 | 0.65 |
| Heat decomposition temperature (5%) | ℃ | 398 | 406 | 405 | 378 |
| Incendivity | UL-90 | V-0 | V-0 | V-0 | Perfect combustion |
The test data of above form, show that flame retardant of the present invention and derivative thereof are when being used in epoxy resin solidifying system and other system, have good flame retardant resistance, its cured article has good thermotolerance, water tolerance, agglutinating value(of coal) and mechanical property, electrical property.Flame retardant of the present invention belongs to the environment-friendly type flame-retardant material of novel environmental friendly of low cost, abundant raw material source, energy-saving and emission-reducing that properties is good.
Applicant states, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, namely do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (10)
1. be with a single aromatic ring phenolic group phosphorus azo-cycle epoxy resins, it is characterized in that, for by the single aromatic ring phenolic group phosphorus-nitrogen compound of band and non-halogen system epoxy resin in the condition of epoxy resin functional group surplus, by the epoxy resin resultant be obtained by reacting;
The single aromatic ring phenolic group be connected with each other and the group (M) being with the phosphorus nitrogen skeleton be made up of unsaturated phosphorus, nitrogen-atoms is comprised, the group (M of the ring-type phosphorus nitrogen skeleton that the band that M comprises at least 50wt% is made up of three phosphorus, nitrogen-atoms in the molecular structure of described band single aromatic ring phenolic group phosphorus-nitrogen compound
1), the group (M of chain phosphorus nitrogen skeleton that is made up of two phosphorus, nitrogen-atoms at the most of the band of 30wt% at the most
2) and the group (M of the ring-type phosphorus nitrogen skeleton be made up of at least four phosphorus, nitrogen-atoms of 45wt% at the most
3);
Preferably, the epoxy equivalent (weight) of described epoxy resin resultant is at below 3585g/eq; More preferably at below 1520g/eq.
2. band according to claim 1 single aromatic ring phenolic group phosphorus azo-cycle epoxy resins, is characterized in that, described band single aromatic ring phenolic group phosphorus-nitrogen compound has such as formula the molecular structure shown in I:
In formula I, Mr-OH represents single aromatic ring phenolic group, and R represents aliphatic group containing at least one carbon atom or aromatic base; A, b, c are the integer being more than or equal to 1, b and c sum is more than or equal to 2, a, b and c three sum be more than or equal to 6, n be more than or equal to zero integer.
Preferably, M
1account for more than the 80wt% of M total mass, more preferably 90 ~ 100wt%.
3. band according to claim 1 single aromatic ring phenolic group phosphorus azo-cycle epoxy resins, is characterized in that, described reaction catalyst-free or have catalyzer condition under carry out;
Preferably, described catalyzer is imidazoles, triphenylphosphine and derivatives class thereof, one in tertiary amines and quaternary ammonium salts catalyzer is used alone or multiple used in combination;
Preferably, the consumption of described catalyzer is relative to the single aromatic ring phenolic group phosphorus-nitrogen compound of band 0.01 ~ 2.5%, is more preferably 0.02% ~ 0.5%;
Preferably, the temperature of described reaction is 40 ~ 250 DEG C, more preferably 60 ~ 180 DEG C.
4. band according to claim 1 single aromatic ring phenolic group phosphorus azo-cycle epoxy resins, it is characterized in that, described reaction is carried out under condition that is solvent-free or that have solvent, and described solvent is one in ketones solvent, aromatic solvents, chlorinated solvents, ether solvent, ether alcohol kind solvent, alcoholic solvent and petroleum solvent oil or at least two kinds;
Preferably, the consumption of described solvent is to make band list aromatic ring phenolic group phosphorus azo-cycle epoxy resins solid content be the consumption of 5 ~ 100%, and band list aromatic ring phenolic group phosphorus azo-cycle epoxy resins solid content more preferably can be made to be the consumption of 20 ~ 100%.
5. band according to claim 1 single aromatic ring phenolic group phosphorus azo-cycle epoxy resins, is characterized in that, described non-halogen system epoxy resin is epoxy resin more than two senses or two senses;
Preferably, the epoxy resin of two senses is one in liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, solid-state bisphenol A type epoxy resin, solid-state bisphenol f type epoxy resin and bisphenol-s epoxy resin, biphenyl type epoxy resin or at least two kinds;
Preferably, the epoxy resin more than two senses is the one of phenol aldehyde type epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin and acyclic isoprenoid type epoxy resin or at least two kinds.
6. a fire-retardant combination, is characterized in that, comprises the single aromatic ring phenolic group phosphorus azo-cycle epoxy resins of band as claimed in claim 1.
7. fire-retardant combination according to claim 6, is characterized in that, also comprises the filler of epoxy fat resin, solidifying agent, auxiliary agent, curing catalyst and the halogen-free flame-retardance with flame retardant resistance;
Preferably, the resin described in flame retardant resistance is DOPO type epoxy resin, containing phosphorous epoxy resin, nitrogenous type epoxy resin, nitrogenous containing phosphorous epoxy resin, phosphorus-containing phenolic aldehyde epoxy resin, nitrogenous containing the one in phosphorous novolac epoxy, silicon-contained type epoxy resin and sulfur-type epoxy resin or at least two kinds;
Preferably, described solidifying agent is one in polyphenol based compound, amino-complex, benzoxazine colophony, acid anhydrides, polyprotonic acid and boron trifluoride and complex compound thereof or at least two kinds;
Preferably, described amino-complex is aliphatic amide or the aromatic amines such as Dyhard RU 100, diethyl triamine, diaminodiphenylmethane, diaminodiphenylsulfone(DDS);
Preferably, described polyphenol based compound is one in dihydroxyphenyl propane, Bisphenol F, bisphenol S, linear phenolic resin, o-cresol urea formaldehyde, bisphenol A phenolic resin or at least two kinds;
Preferably, the consumption of described solidifying agent and the equivalence ratio 0.4 ~ 1.5 of epoxy resin;
Preferably, described curing catalyst is one in imidazoles, triphenylphosphine and derivatives class thereof, tertiary amines, quaternary ammonium salts and boron trifluoride and derivatives class thereof or at least two kinds;
Preferably, the consumption of described curing catalyst is account for epoxy resin total mass 0.001 ~ 2.5%, more preferably 0.03 ~ 1.2%;
Preferably, described filler is one in silicon-dioxide, kaolin, calcium carbonate, mica, titanium dioxide, magnesium hydroxide, aluminium hydroxide or at least two kinds;
Preferably, the consumption of described filler is below the 500phr of epoxy resin total mass;
Preferably, described auxiliary agent is one or more in defoamer, coupling agent, toughner and flow agent.
8. a pre-impregnated sheet, is characterized in that, it is by fire-retardant combination impregnation as claimed in claim 7 or coat base material and form;
Preferably, described base material is fiberglass substrate, polyester base material, polyimide base material, ceramic base material or carbon fiber base material.
9. a composite metal substrate, is characterized in that, it comprises more than one the above surface of pre-impregnated sheet as claimed in claim 9 metal-clad, overlap, pressing and forms;
Preferably, the material of described surperficial metal-clad is the alloy of aluminium, copper, iron and arbitrary combination thereof;
Preferably, described composite metal substrate is but is not limited to CEM-1 copper-clad plate, CEM-3 copper-clad plate, FR-4 copper-clad plate, FR-5 copper-clad plate, CEM-1 aluminium base, CEM-3 aluminium base, FR-4 aluminium base or FR-5 aluminium base.
10. a wiring board, is characterized in that, the surface working circuit in composite metal substrate according to claim 9 forms.
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| CN201510240708.9A CN104892901A (en) | 2015-05-12 | 2015-05-12 | Phosphorus-nitrogen epoxy resin with single aromatic ring phenolic groups, flame-retardant combination, and composite metal substrate |
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| CN201510240708.9A CN104892901A (en) | 2015-05-12 | 2015-05-12 | Phosphorus-nitrogen epoxy resin with single aromatic ring phenolic groups, flame-retardant combination, and composite metal substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106916281A (en) * | 2015-12-28 | 2017-07-04 | 广东广山新材料股份有限公司 | Flame-retardant compound, curing agent and polyphenol base epoxy |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009084406A (en) * | 2007-09-28 | 2009-04-23 | Fushimi Pharm Co Ltd | Epoxy compound composition |
| TW200927809A (en) * | 2007-10-11 | 2009-07-01 | Fushimi Pharmaceutical Co Ltd | Epoxy compound composition |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009084406A (en) * | 2007-09-28 | 2009-04-23 | Fushimi Pharm Co Ltd | Epoxy compound composition |
| TW200927809A (en) * | 2007-10-11 | 2009-07-01 | Fushimi Pharmaceutical Co Ltd | Epoxy compound composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106916281A (en) * | 2015-12-28 | 2017-07-04 | 广东广山新材料股份有限公司 | Flame-retardant compound, curing agent and polyphenol base epoxy |
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Address after: 523000 Dongguan Port Road, Guangdong (Sha Tianduan) Humen port service center, Humen port service building on the third floor Applicant after: Guangdong Guang Shan new materials Limited by Share Ltd Address before: 523990 Dongguan Port Road, Guangdong (Sha Tianduan) Humen port service center, Humen port service building 3F Applicant before: GUANG SHAN NEW MATERIALS CO., LTD. |
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Application publication date: 20150909 |