CN104882557A - Organic light-emitting diode apparatus - Google Patents
Organic light-emitting diode apparatus Download PDFInfo
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- CN104882557A CN104882557A CN201410069506.8A CN201410069506A CN104882557A CN 104882557 A CN104882557 A CN 104882557A CN 201410069506 A CN201410069506 A CN 201410069506A CN 104882557 A CN104882557 A CN 104882557A
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- laser
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- colloid
- presintering
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Abstract
The invention discloses an organic light-emitting diode apparatus. The apparatus comprises a first substrate provided with an organic light-emitting diode element; a second substrate opposed to the first substrate; and a frit rubber mass arranged between the first substrate and the second substrate, having a laser pre-sintering starting/ending zone and forming an enclosed space with the first substrate and the second substrate through laser sintering sealing. At least one side of the laser pre-sintering starting/ending zone is provided with a notch. The width of the notch is no more than 30% that of the frit rubber mass.
Description
Technical field
The present invention relates to frit (frit) Sealing Technology of oled device, and particularly relate to and to have with laser presintering (pre-sinter) and with the oled device of the frit-sealed structure of laser sintered sealing.
Background technology
Frit (frit) Sealing Technology be used for by the electronic component encapsulation between two substrates in an enclosure space to prevent the invasion of water gas and oxygen, it mainly utilizes laser directly to heat to coat the frit colloid of glazing on a substrate, make frit colloid again melting with seal this substrate and another substrate (backboard) and between form an enclosure space.Figure 1 shows that the schematic diagram of the oled device according to prior art.Oled device comprises and is provided with an Organic Light Emitting Diode (Organic LightEmitting Diode, OLED) first substrate 12 of element 13 and first substrate 12 be oppositely arranged second substrate 10, be arranged at the frit colloid 11 between first substrate 12 and second substrate 10 and be arranged at thin-film transistor (Thin Film Transistor, the TFT) element 14 on first substrate 12.Frit colloid 11 carries out laser sintered sealing via laser as shown by arrows in FIG. and forms an enclosure space with first substrate 12 and second substrate 10, and organic light-emitting diode element 13 and thin-film transistor element 14 are configured on the substrate 12 in this enclosure space.
In an existing frit-sealed technology, first frit colloid is coated on plain glass (bareglass) cover plate, and put cover plate into baking box through high temperature glazing (glaze) the frit colloid of such as 500 DEG C together with frit colloid, then will there is the cover plate of glazing frit colloid and be configured with the substrate involution of the semiconductor elements such as such as organic illuminated display element again, then laser sintered seal cover board and substrate is utilized, in the enclosure space that semiconductor element encapsulation is formed in frit, cover plate and substrate.But this kind of frit-sealed technology is only applicable to the situation that cover plate is plain glass, and baking box glazing frit colloid is utilized to have the problems such as heating and cooling are consuming time, non-uniform temperature to produce.Therefore, presintering (pre-sinter) is carried out with glazing frit colloid with laser part heated frit colloid in another existing frit-sealed technology, replace with the manufacture craft of baking box glazing thus, not only can save the manufacture craft production time (tact time) thus also can be applied to sealing manufacture craft cover plate being configured with temperature influence element (such as color filter array etc.).
Fig. 2 A is depicted as the schematic diagram operated according to the laser presintering of prior art.As shown in Figure 2 A, the frit colloid 200 closed is coated on substrate (cover plate) 20, laser beam from laser initial/end zone 210 widdershins presintering is carried out to frit colloid 200 along the direction in figure shown in arrow, and laser initial/presintering of laser beam to frit colloid 200 is terminated in end zone 210.Fig. 2 B is depicted as the schematic diagram of the frit colloid 201 of the presintering of laser according to prior art, Fig. 2 C be the laser presintering of the frit colloid 201 of the presintering of laser of Fig. 2 B initial/enlarged diagram of end zone 220.The laser presintering of the frit colloid 201 of laser presintering initial/end zone 220 correspond to laser presintering operation laser initial/end zone 210, as shown in figs. 2 b and 2 c, the laser presintering of the frit colloid 201 of laser presintering initial/end zone 220 has an arcuation breach, cause sealing unsuccessfully in post laser sintering seal operation.Therefore, can the frit-sealed structure through laser presintering and laser sintered sealing keep closing the key into Sealing Technology.
Summary of the invention
For solving the problem, one embodiment of the invention provides a kind of oled device, comprising: a first substrate, is provided with an organic light-emitting diode element; One second substrate, is oppositely arranged with this first substrate; And a frit colloid, be arranged between this first substrate and this second substrate, have a laser presintering initial/end zone, an enclosure space is formed through laser sintered sealing and this first substrate and this second substrate, wherein this laser presintering initial/at least side of end zone has a breach, the width of this breach is no more than 30% of the width of this frit colloid.
Accompanying drawing explanation
Figure 1 shows that the schematic diagram of the oled device according to prior art.
Fig. 2 A is depicted as the schematic diagram operated according to the laser presintering of the oled device of prior art.
Fig. 2 B is depicted as the schematic diagram of the frit colloid of the presintering of laser according to prior art.
The enlarged diagram of Fig. 2 C is depicted as the laser presintering of the frit colloid of the presintering of laser according to prior art initial/end zone.
Figure 3 shows that the schematic diagram of the laser presintering operation of oled device according to an embodiment of the invention.
Fig. 4 A to 4E is depicted as the schematic diagram of the mask according to the embodiment of the present invention.
The enlarged diagram of Fig. 5 A and 5B is depicted as the laser presintering of the frit colloid of the presintering of laser according to the embodiment of the present invention initial/end zone.
Figure 6 shows that the laser presintering of the frit colloid of laser sintered according to an embodiment of the invention sealing initial/enlarged diagram of end zone.
Symbol description
10 ~ second substrate;
11 ~ frit colloid;
12 ~ first substrate;
13 ~ organic light-emitting diode element;
14 ~ thin-film transistor element;
20,30 ~ substrate;
200,300 ~ frit colloid;
The frit colloid of 201,301A, 301B ~ laser presintering;
210,310 ~ laser initial/end zone;
220,320,320A, 320B ~ laser presintering initial/end zone;
The frit colloid of 303 ~ laser sintered sealing;
330,430A, 430B, 430C, 430D, 430E ~ mask;
BA, BB ~ breach;
DA, DB ~ degree of depth;
G1, G2, G3, G4 ~ gap width;
I1A, I1B ~ first covers interface;
I2A, I2B ~ second contact surface;
The width of W ~ frit colloid;
W1, W2, W3 ..., W10 ~ width;
WA, WB ~ width.
Embodiment
Below be illustrated as embodiments of the invention.Its objective is and will illustrate the general principle of the present invention, should not be considered as restriction of the present invention, scope of the present invention is when being as the criterion with the claim person of defining.
It should be noted that following disclosed content can provide multiple embodiment in order to put into practice different characteristics of the present invention or example.The special element example of the following stated and arrangement only in order to set forth spirit of the present invention in brief, and are not used to limit scope of the present invention.In addition, following specification may reuse identical component symbol or word in multiple example.But reusable object only simplifies to provide and clearly illustrates, and be not used to limit the relation between multiple embodiment discussed below and/or configuration.In addition, a feature described in following specification is connected to, is coupled to and/or is formed at the first-class description of another feature, actually comprise multiple different embodiment, comprise these features directly to contact, or comprise other extra feature to be formed between these features etc., make these features and non-direct contact.
Figure 3 shows that the schematic diagram of the laser presintering operation of oled device according to an embodiment of the invention.Oled device comprises the second substrate that the first substrate that is provided with an organic light-emitting diode element and first substrate are oppositely arranged and the frit colloid be arranged between first substrate and second substrate.Frit colloid has a laser presintering initial/end zone, frit colloid forms an enclosure space through laser presintering and laser sintered sealing with first substrate and second substrate, and organic light-emitting diode element is configured on the second substrate in above-mentioned confined space.Below laser presintering operation is first described.As shown in Figure 3, the frit colloid 300 of wall shape is coated on substrate 30 (above-mentioned first substrate), and frit colloid 300 has height and a width.When laser beam starts to carry out laser presintering operation to frit colloid 300, mask 330 is arranged at above frit colloid 300, and mask 330 does not directly contact with frit colloid 300, scratch frit colloid 300 when avoiding mask 330 to move apart from frit colloid 300 1 predeterminable range.In some manufacture craft, such as in the manufacture craft of organic LED display device using color filter array, enough large for guaranteeing first substrate, enclosure space between second substrate and frit colloid, the height of frit colloid 300 must more than certain altitude, add that mask 330 is apart from frit colloid 300 1 predeterminable range, therefore easily cause the laser presintering of the frit colloid after laser presintering initial/the arcuation breach of end zone increases, and then reduces the sintering ratio (sealing ratio) of post laser sintering sealing.
In view of this, the mask 330 that the embodiment of the present invention provides one to have a gap penalties, and the laser presintering when laser beam starts frit colloid 300 to be carried out to laser presintering operation, mask 330 being arranged at frit colloid 300 initial/end zone above and distance frit colloid 300 1 predeterminable range.Mask 330 comprises a lightproof part and a pattern portion, the comb-tooth-like portion very pattern portion of the mask 330 of such as Fig. 3, wherein the pattern portion of mask 330 allocates in fact the energy at laser beam center, makes the Energy distribution of frit colloid Stimulated Light light beam more even.The mid portion of frit colloid is less than the light transmittance of the two side portions relative top pattern portion of frit colloid relative to the light transmittance of top pattern portion.
As shown in Figure 3, the laser of laser beam is initial/and end zone 310 corresponds to lightproof part, therefore in laser presintering operation, first laser beam is beaten at lightproof part, then to move and through pattern portion to carry out presintering through pattern portion to the frit colloid 300 that pattern portion covers along this frit colloid 300.After laser beam leaves the pattern portion of mask 330, remove mask 330 and widdershins laser presintering carried out to frit colloid 300 along the direction in figure shown in arrow, then get back to laser initial/laser presintering is terminated in end zone 310.
Fig. 4 A to 4E is depicted as the schematic diagram of the mask 430A ~ 430E according to the embodiment of the present invention, and wherein the mask 330 of Fig. 3 is identical with the mask 430A of Fig. 4 A.In Fig. 4 A to 4E, oblique line portion is light tight.Mask 430A ~ 430E only pattern portion is different, and the pattern portion of mask 430A ~ 430E has allocated all in fact the energy at laser beam center.The pattern portion of mask 430A ~ 430E can according to the width of frit, highly, the decision such as laser beam energy, distance between mask and frit, below illustrate the size of the pattern portion of mask 430A ~ 430E.
In an example, the pattern portion of mask 430A comprises middle comb teeth-shaped component, two the second comb teeth-shaped components adjacent with middle comb teeth-shaped component and adjacent with the second comb teeth-shaped component two the 3rd comb teeth-shaped components, wherein, the width W 1 of comb teeth-shaped component is 100 μm, the width W 2 of the second comb teeth-shaped component is 50 μm, the width W 3 of the 3rd comb teeth-shaped component is 25 μm, gap width G1 between middle comb teeth-shaped component and the second comb teeth-shaped component is for being 25 μm, and the gap width G2 between the second comb teeth-shaped component and the 3rd comb teeth-shaped component is for being 50 μm.In an example, the pattern portion of mask 430B and the pattern portion of mask 430A very similar, difference is only that mask 430B is also provided with 6 printing opacity breach in the middle comb teeth-shaped component of width W 1.In an example, the pattern portion of mask 430C comprises the same comb teeth-shaped component of five width, and the width W 4 of each comb teeth-shaped component is 25 μm, and clearence degree G3 is 25 μm, and clearence degree G4 is 50 μm.In an example, the pattern portion of mask 430D comprises nine sharp tooth components, and each sharp tooth component width W 7 is in a first direction 50 μm, and width W 8 is in a second direction 150 μm.The comb teeth-shaped component that middle sharp tooth component is also 25 μm with a width W 5 is combined.Be combined with the middle sharp tooth component comb teeth-shaped component that the sharp tooth component of a sharp tooth component is also 15 μm with a width W 6 of being separated by.In an example, the pattern portion of mask 430E comprises an isosceles triangle component, and isosceles triangle component width W 10 is in a first direction 450 μm, and width W 9 is in a second direction 150 μm.Should be noted, mask 430A ~ 430E and the above-listed sized data pattern portion only for illustrating for the mask of laser presintering lowers in fact laser beam central energy and is less than the light transmittance of two side portions relative to pattern portion of frit colloid to make the mid portion of frit colloid relative to the light transmittance of pattern portion, and is not used to limit the present invention.For example, mask 430A can have an odd number comb teeth-shaped component of more than three, such as 7.Width in mask 430A ~ 430D second direction may correspond to frit colloid 200 and coats closed path on substrate 20.
The enlarged diagram of Fig. 5 A and 5B is depicted as the laser presintering of frit colloid 301A and 301B of the presintering of laser according to the embodiment of the present invention initial/end zone 320A and 320B.Comprise lightproof part by using in laser presintering operation and the mask of the pattern portion of laser beam central energy can be lowered in fact, such as mask 430A ~ 430E, first of the frit colloid 301A of laser sintered sealing can be made to cover interface I 1A and second contact surface I2A is multi-curvature interface, as shown in Figure 5A, or making first of the frit colloid 301B of laser sintered sealing to cover interface I 1B and second contact surface I2B is larger radius of curvature interface, as shown in Figure 5 B, improve thus laser presintering initial/the first matching degree of covering interface and second contact surface of end zone, with improve laser presintering initial/the arcuation breach of end zone, what increase laser sintered sealing sticks together ratio.
Figure 6 shows that the laser presintering of the frit colloid 303 of laser sintered according to an embodiment of the invention sealing initial/enlarged diagram of end zone 320, the frit colloid 303 of wherein laser sintered sealing is use above-listed described mask in previous laser presintering operation.By use in laser presintering operation above-listed described mask can make the laser presintering of frit colloid initial/end zone first cover interface and second contact surface is multi-curvature interface or larger radius of curvature interface, as shown in figures 5a and 5b.In laser sintered seal operation, laser beam along the direction contrary with the laser beam direct of travel that laser presintering operates (such as with the side shown in arrow in Fig. 3 in the opposite direction), to laser presintering initial/end zone first to cover interface and second contact surface be that the frit colloid at multi-curvature interface or larger radius of curvature interface carries out laser sintered sealing.As shown in Figure 6, the laser presintering of the frit colloid 303 of laser sintered sealing initial/two sides of end zone 320 have breach BA and BB, and width W A and the WB of breach BA and BB is no more than 30% of the width W of frit colloid 303, and degree of depth DA and the DB of breach DA and DB is no more than 10% of the width W of frit colloid 303, therefore have in sintering ratio compared to prior art and significantly improve, such as sintering ratio can be greater than 80%.It is noted that, although the laser presintering of the frit colloid 303 of laser sintered sealing is in figure 6 initial/and side, end zone two is all jagged, but in another embodiment, the laser presintering of the frit colloid of laser sintered sealing is initial/and end zone may be only jagged in side, and similarly the width of this breach is no more than 30% of frit colloid width, and its degree of depth is no more than 10% of frit colloid width.
In sum, oled device of the present invention comprises the second substrate that the first substrate that is provided with an organic light-emitting diode element and first substrate are oppositely arranged and the frit colloid be arranged between first substrate and second substrate.Frit colloid has a laser presintering initial/end zone, and form an enclosure space through laser sintered sealing and a first substrate and a second substrate, the laser presintering of frit colloid initial/at least side of end zone has a breach, the width of this breach is no more than 30% of the width of frit colloid, and the degree of depth of this breach is no more than 10% of the width of frit colloid.As mentioned above; the sintering ratio of frit-sealed structure of the present invention is compared to prior art and can obtains suitable improvement; the seal degree of frit colloid in oled device can be promoted, make the organic light-emitting diode element in enclosure space obtain better protection.
The above is the general introduction feature of embodiment.Have in art and usually know that the knowledgeable should to utilize based on the present invention design or adjustment to carry out identical object and/or to reach the same advantage of the embodiment introduced herein easily.Have in art and usually know that the knowledgeable also should be appreciated that identical configuration should not deviate from spirit of the present invention and scope, various change, replacement and alternately can be made not deviating under spirit of the present invention and scope them.Illustrative method only represents exemplary step, but these steps might not perform with represented order.Can add in addition, replace, change order and/or removal process optionally to adjust, and consistent with the disclosed embodiments spirit and scope.
Claims (10)
1. an oled device, comprising:
First substrate, is provided with an organic light-emitting diode element;
Second substrate, is oppositely arranged with this first substrate; And
Frit colloid, be arranged between this first substrate and this second substrate, have a laser presintering initial/end zone, an enclosure space is formed through laser sintered sealing and this first substrate and this second substrate, wherein this laser presintering initial/at least side of end zone has a breach, the width of this breach is no more than 30% of the width of this frit colloid.
2. oled device as claimed in claim 1, wherein the degree of depth of this breach is no more than 10% of the width of this frit colloid.
3. oled device as claimed in claim 1, wherein when starting to carry out this laser presintering to this frit colloid, above a mask is arranged at this laser presintering initial/end zone and apart from this frit colloid one predeterminable range.
4. oled device as claimed in claim 3, wherein this mask comprises lightproof part and pattern portion, wherein this initial/end zone of this laser beam corresponds to this lightproof part, and this pattern portion allocates in fact the energy at this laser beam center.
5. oled device as claimed in claim 4, wherein in this laser presintering, after this laser beam leaves this pattern portion, above this mask leaves this laser presintering initial/end zone, make this laser presintering initial/this frit colloid of end zone can by heating glazing.
6. oled device as claimed in claim 4, this laser presintering wherein before this laser sintered sealing and after this laser presintering is initial/and end zone comprises the first interface and second contact surface, and this first interface and this second contact surface are multi-curvature interface or larger radius of curvature interface.
7. oled device as claimed in claim 4, wherein in this laser presintering, this laser beam is advanced along this frit colloid through this pattern portion.
8. oled device as claimed in claim 4, wherein this pattern portion comprises the light tight component of an odd number comb teeth-shaped of more than three.
9. oled device as claimed in claim 7, wherein the width of the light tight component of these comb teeth-shapeds is equal, and the comb teeth-shaped light tight component far away apart from the light tight component of middle comb teeth-shaped of the light tight component of these comb teeth-shapeds and larger toward the gap between the light tight component of adjacent fingers shape on this middle comb teeth-shaped light tight component direction.
10. oled device as claimed in claim 4, wherein the mid portion of this frit colloid is less than the light transmittance of two side portions relative to this pattern portion of top of this frit colloid relative to the light transmittance of this pattern portion of top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410069506.8A CN104882557A (en) | 2014-02-27 | 2014-02-27 | Organic light-emitting diode apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410069506.8A CN104882557A (en) | 2014-02-27 | 2014-02-27 | Organic light-emitting diode apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN104882557A true CN104882557A (en) | 2015-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410069506.8A Pending CN104882557A (en) | 2014-02-27 | 2014-02-27 | Organic light-emitting diode apparatus |
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| CN (1) | CN104882557A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101095247A (en) * | 2004-10-20 | 2007-12-26 | 康宁股份有限公司 | Optimization of parameters for sealing organic emitting light diode(oled) displays |
| CN101221910A (en) * | 2007-01-12 | 2008-07-16 | 三星Sdi株式会社 | Method of manufacturing flat panel display device |
| US20090058292A1 (en) * | 2007-08-27 | 2009-03-05 | Koo Won-Hoe | Flat panel display and fabricating method thereof |
| CN102089898A (en) * | 2008-06-11 | 2011-06-08 | 康宁股份有限公司 | Mask and method for sealing a glass envelope |
| CN102690045A (en) * | 2011-03-21 | 2012-09-26 | 上海微电子装备有限公司 | Packaging device and packaging method |
-
2014
- 2014-02-27 CN CN201410069506.8A patent/CN104882557A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101095247A (en) * | 2004-10-20 | 2007-12-26 | 康宁股份有限公司 | Optimization of parameters for sealing organic emitting light diode(oled) displays |
| CN101221910A (en) * | 2007-01-12 | 2008-07-16 | 三星Sdi株式会社 | Method of manufacturing flat panel display device |
| US20090058292A1 (en) * | 2007-08-27 | 2009-03-05 | Koo Won-Hoe | Flat panel display and fabricating method thereof |
| CN102089898A (en) * | 2008-06-11 | 2011-06-08 | 康宁股份有限公司 | Mask and method for sealing a glass envelope |
| CN102690045A (en) * | 2011-03-21 | 2012-09-26 | 上海微电子装备有限公司 | Packaging device and packaging method |
Non-Patent Citations (1)
| Title |
|---|
| YUNENG LAI等: "The Process and Reliability Tests of Glass-to-glass Laser Bonding for Top-emission OLED Device", 《IEEE》 * |
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Application publication date: 20150902 |