CN104876175B - Micro electromechanical system packaging structure - Google Patents
Micro electromechanical system packaging structure Download PDFInfo
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- CN104876175B CN104876175B CN201410068797.9A CN201410068797A CN104876175B CN 104876175 B CN104876175 B CN 104876175B CN 201410068797 A CN201410068797 A CN 201410068797A CN 104876175 B CN104876175 B CN 104876175B
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- packaging structure
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- electromechanical system
- adhesive body
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Abstract
The open a kind of micro electromechanical system packaging structure of the present invention, including a chip, a microcomputer electric component, a cover plate, an adhesive body and one first moisture barrier layers.Chip has an active surface.Microcomputer electric component is arranged on active surface.Cover plate is covered in chip and includes a depression, and wherein microcomputer electric component is positioned at depression.Adhesive body is arranged between chip and cover plate to seal depression, and wherein the thickness of adhesive body is less than the height of microcomputer electric component.First moisture barrier layers is coated on around chip, adhesive body and cover plate.
Description
Technical field
The present invention relates to a kind of chip-packaging structure, particularly relate to a kind of micro electromechanical system packaging structure.
Background technology
MEMS (microelectromechanical system, MEMS) is at microminiaturization
Microcomputer electric component made in encapsulating structure, its technology manufactured is sufficiently analogous to manufacture integrated circuit
Technology, but microcomputer electric component is then more than traditional integrated circuit with the mode of environment interaction about, such as
Interaction on mechanics, optics or magnetic force.
Microcomputer electric component can include that minimum electromechanical element (such as switch, minute surface, capacitor, adds
Velometer, induction apparatus, capacitance sensor or actuator etc.), and microcomputer electric component can with monolithic mode with
Integrated circuit is integrated, and significantly improves insertion loss and the electric isolating effect of whole solid-state device simultaneously.So
And, microcomputer electric component is atomic fragility in the macroscopic world of whole encapsulating structure, the most all may quilt
Small electrostatic or effect of surface tension and cause fault.Therefore, in order to avoid microcomputer electric component is by dirt
Dye or infringement, in the space being generally sealed between chip and cover plate.
Fig. 1 is the schematic diagram of existing a kind of micro electromechanical system packaging structure.Refer to figure, existing micro-
Electromechanical system package structure 10 includes that cover plate 12, chip 14, adhesive body 16 and is micro electronmechanical
Element 18.Cover plate 12 is fixed to chip 14, to be sealed in by microcomputer electric component 18 by adhesive body 16
In space between chip 14 and cover plate 12.
But, although between existing micro electromechanical system packaging structure 10 chips 14 and cover plate 12
Space sealed by adhesive body 16, but owing to having bigger gap between cover plate 12 and chip 14,
After using a period of time under existing micro electromechanical system packaging structure 10 is at high humidity environment, sealing
Body 16 is easier to be full of cracks and dampness is easily penetrated in the space between chip 14 and cover plate 12,
And then cause microcomputer electric component 18 fault.
Summary of the invention
It is an object of the invention to provide a kind of micro electromechanical system packaging structure, it has preferably anti-moisture
Ability.
For reaching above-mentioned purpose, a kind of micro electromechanical system packaging structure of the present invention, including a chip, micro-
Electromechanical compo, a cover plate, an adhesive body and one first moisture barrier layers.Chip has an active surface.
Microcomputer electric component is arranged on active surface.Cover plate is covered in chip and includes a depression, the most micro electronmechanical
Element is positioned at depression.Adhesive body is arranged between chip and cover plate to seal depression, wherein adhesive body
Thickness is less than the height of microcomputer electric component.First moisture barrier layers is coated on chip, adhesive body and cover plate
Around.
In one embodiment of this invention, also include that a first substrate, a second substrate and one second are wet
Vapour lock interlayer.First substrate has a hole, its chips, microcomputer electric component, cover plate, adhesive body and
First moisture barrier layers is arranged in hole.Second substrate is arranged on the first substrate with coverage hole.The
Two moisture barrier layers seal the junctional area between first substrate and second substrate.
In one embodiment of this invention, also include a mold compound, be arranged in hole and be sealed in
Around first moisture barrier layers.
In one embodiment of this invention, the throwing in the first moisture barrier layers of the above-mentioned mold compound
A shadow region overlay adhesive body view field in the first moisture barrier layers.
In one embodiment of this invention, also include a moisture absorption element, be arranged in hole.
In one embodiment of this invention, above-mentioned second substrate has the region of a covering adhesive body.
In one embodiment of this invention, above-mentioned depression has relatively at a upper surface of active surface,
This microcomputer electric component includes a mirror, and the distance between this active surface and this upper surface is more than this mirror
Inclined height.
In one embodiment of this invention, the thickness of above-mentioned adhesive body about 1 micron to 10 micron it
Between.
In one embodiment of this invention, above-mentioned microcomputer electric component includes a mirror, a switch, an electricity
Container, an accelerometer, an induction apparatus or an actuator.
In one embodiment of this invention, the material of above-mentioned adhesive body includes epoxy resin.
Based on above-mentioned, the micro electromechanical system packaging structure of the present invention has recessed by the central part of cover plate
Cave, depression is available for the design that microcomputer electric component is accommodating, reduces the clearance height around cover plate and between chip,
And it is arranged in the gap around cover plate and between chip to seal depression by adhesive body.Around cover plate
And the gap between chip is less, the size of adhesive body is not required to too big, is therefore less susceptible to be full of cracks, and makes
The micro electromechanical system packaging structure of the present invention has preferred anti-moisture ability.Additionally, the microcomputer of the present invention
Electricity system packaging structure is coated on around chip, cover plate and adhesive body by the first moisture barrier layers, with
Avoid dampness to enter depression, effectively provide second heavily to protect.It addition, the micro electro-mechanical system packaging of the present invention
Structure also by chip, microcomputer electric component, cover plate, adhesive body and the first moisture barrier layers are arranged in by
In the hole that first substrate and second substrate are surrounded, and seal first substrate by the second moisture barrier layers
With the junctional area of second substrate, to provide the triple protection of moisture-barrier.Further, the microcomputer of the present invention
Electricity system packaging structure is by being arranged on hole by mold compound and be attached on the first moisture barrier
The surrounding of layer, to provide the quadruple of moisture-barrier to protect.Furthermore, the micro electro-mechanical system packaging of the present invention
Structure, by being arranged in hole by moisture absorption element, to absorb the dampness in hole, and provides the 5th
Heavily protect.
For the features described above of the present invention and advantage can be become apparent, special embodiment below, and coordinate
Appended accompanying drawing is described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of existing a kind of micro electromechanical system packaging structure.
Fig. 2 is the schematic diagram of a kind of micro electromechanical system packaging structure according to one embodiment of the invention.
Fig. 3 is the schematic diagram of a kind of micro electromechanical system packaging structure according to another embodiment of the present invention.
Fig. 4 is the schematic diagram of a kind of micro electromechanical system packaging structure according to one more embodiment of the present invention.
Symbol description
D distance
H height
10 existing micro electromechanical system packaging structures
12 cover plates
14 chips
16 adhesive bodies
18 microcomputer electric components
100,200,300 micro electromechanical system packaging structure
110,210 chip
112 active surfaces
120,220,320 microcomputer electric component
130,230 cover plate
132,232,332 depression
132a upper surface
140,240,340 adhesive body
150,250,350 first moisture barrier layers
260,360 first substrate
262,362 hole
270,370 second substrate
272 regions
280 second moisture barrier layers
390 mold compounds
395 moisture absorption elements
Detailed description of the invention
The several preferred embodiments that accompanying drawing will be coordinated to describe the present invention in detail below.Fig. 2 is according to this
A kind of schematic diagram of the micro electromechanical system packaging structure of a bright embodiment.Refer to Fig. 2, the present embodiment
Micro electromechanical system packaging structure 100 include chip 110, microcomputer electric component 120, cover plate 130,
One adhesive body 140 and one first moisture barrier layers 150.Chip 110 has an active surface 112.Core
Sheet 110 e.g. charge coupled cell (CCD) or complementary metal oxide semiconductor (CMOS) etc
Optical sensing chip, and active surface 112 e.g. optical sensing area, but chip 110 and active surface 112
Kind be not limited system.
Microcomputer electric component 120 is arranged on active surface 112.In the present embodiment, microcomputer electric component 120
For mirror, but in other embodiments, microcomputer electric component 120 is alternatively switch, capacitor, acceleration
Meter, induction apparatus or actuator, the kind of microcomputer electric component 120 is not limited system.
In the present embodiment, cover plate 130 is transparent cover plate, so that ambient (not illustrating) can be worn
Cross cover plate 130 and be transferred to the active surface 112 of microcomputer electric component 120 and chip 110.Such as Fig. 2 institute
Showing, cover plate 130 is covered in chip 110 and includes a depression 132, and microcomputer electric component 120 is positioned at depression
In 132.Depression 132 has a upper surface 132a relative to active surface 112, in the present embodiment,
Distance D between active surface 112 and upper surface 132a is more than the height of microcomputer electric component 120 (also
It is exactly the inclined height of mirror).In the present embodiment, between active surface 112 and upper surface 132a
Distance D is about 10 microns, and the height H in the gap around cover plate 130 and between chip 110 is about
Between the scope of 1 micron to 10 micron.It is to say, around cover plate 130 and between chip 110
The height H in gap less than distance D between active surface 112 and upper surface 132a.
As in figure 2 it is shown, adhesive body 140 be arranged on gap around cover plate 130 and between chip 110 with
Seal depression 132a.The thickness of adhesive body 140 is less than the height of microcomputer electric component 120.By can on drawing
Knowing, the thickness of adhesive body 140 is limited to the height H in the gap around cover plate 130 and between chip 110,
Therefore, the thickness of adhesive body 140 can be along with the height in the gap around cover plate 130 and between chip 110
H and different.In the present embodiment, the thickness range of adhesive body 140 is about between 1 micron to 10 micron.
It is noted that in the present embodiment, the material of adhesive body 140 is organic compound, such as
It is epoxy resin.Owing to the molecular structure of organic compound having the hydrophilic radical of many, adhesive body
140 are only capable of stopping external pollution and some moisture, but cannot intercept completely hydrophilic radical therein with
Dampness effect.Therefore, in the present embodiment, micro electromechanical system packaging structure 100 is hindered by the first dampness
Interlayer 150 is coated on chip 110, adhesive body 140 and cover plate 130 around, effectively to intercept envelope
Hydrophilic radical in colloid 140 and dampness effect, improve the impenetrability of depression 132
(impermeability).Consequently, it is possible to microcomputer electric component 120 just can normally operate.
In the present embodiment, the first moisture barrier layers 150 can deposit (chemical by chemical gaseous phase
Vapor deposition, CVD) or physical vapour deposition (PVD) (physical vapor deposition,
PVD) mode is formed, but the generation type of the first moisture barrier layers 150 is not limited to this.Additionally,
The material of the first moisture barrier layers 150 is compactness higher inorganic insulating material, e.g. silicon oxide,
Silicon nitride, silicon oxynitride or other are without the nitride of hydrophilic radical, oxide and nitrogen oxides, its
Anti-moisture ability is more than the anti-moisture ability of adhesive body 140.It is to say, due to inorganic insulating material not
Containing hydrophilic radical, thus not with dampness effect, therefore can effectively block dampness.Therefore, the first dampness
Barrier layer 150 can provide the protection of the second weight, to reduce the probability that dampness penetrates into.
Compared to existing micro electromechanical system packaging structure 10, the micro electromechanical system packaging structure of the present embodiment
100 have less gap around cover plate 130 and between chip 110, are sealed in around cover plate 130
And the adhesive body 140 between chip 110 need not the biggest size, it is less susceptible to be full of cracks.Further, first
Moisture barrier layers 150 coating chip 110, adhesive body 140 and cover plate 130 around, to provide microcomputer
The electricity preferred anti-moisture ability of system packaging structure 100.
Fig. 3 is the schematic diagram of a kind of micro electromechanical system packaging structure according to another embodiment of the present invention.
Refer to Fig. 3, the micro electromechanical system packaging structure 200 of the present embodiment and the micro-electro-mechanical systems of a upper embodiment
The Main Differences of system encapsulating structure 100 is, in the present embodiment, and micro electromechanical system packaging structure 200
Also include first substrate 260, second substrate 270 and one second moisture barrier layers 280.First
Substrate 260 has a hole 262.One chip 210, microcomputer electric component 220, cover plate 230,
Adhesive body 240 and one first moisture barrier layers 250 are arranged in hole 262.Second substrate 270 is arranged
With coverage hole 262 on first substrate 260.Second moisture barrier layers 280 seals first substrate 260
And the junctional area between second substrate 270.
Therefore, in micro electromechanical system packaging structure 200, first substrate 260, second substrate 270 and
Second moisture barrier layers 280 can provide one the triple protection, leads to avoid dampness to enter depression 232
Cause microcomputer electric component 220 fault.
Additionally, in the present embodiment, the most region of second substrate 270 is transparent, so that outside one
Boundary's light (not illustrating) may pass through second substrate 270.Second substrate 270 has covering adhesive body 240
A region 272, say, that the region 272 view field on chip 210 covers at adhesive body
240 view fields on chip 210.In the present embodiment, region 272 is a black region.Cause
This, region 272 can stop that ambient exposes to adhesive body 240, and reduces adhesive body 240 light fall
The probability solved.
Fig. 4 is the schematic diagram of a kind of micro electromechanical system packaging structure according to one more embodiment of the present invention.
Refer to Fig. 4, the micro electromechanical system packaging structure 300 of the present embodiment and the micro-electro-mechanical systems of a upper embodiment
The Main Differences of system encapsulating structure 200 is, in the present embodiment, and micro electromechanical system packaging structure 300
Also include mold compound 390 and a moisture absorption element 395.Mold compound 390 is arranged on hole
Hole 362 is interior and is attached to the first moisture barrier layers 350 around.As shown in Figure 4, mold compound 390
A view field in the first moisture barrier layers 350 covers adhesive body 340 in the first moisture barrier layers
A view field on 350.It is to say, mold compound 390 can promote adhesive body 340 and
The physical arrangement of one moisture barrier layers 350, broken to reduce adhesive body 340 and the first moisture barrier layers 350
The probability split.The micro electromechanical system packaging structure 300 of the present embodiment is provided by mold compound 390
One quadruple protection.
Surrounded with second substrate 370 additionally, moisture absorption element 395 is arranged on by first substrate 360
Hole 362 in, even if consequently, it is possible to dampness penetrates in hole 362, also can be by moisture absorption unit
Part 395 is absorbed, without entering in depression 332, to guarantee that microcomputer electric component 320 can normally be transported
Make.In other words, the micro electromechanical system packaging structure 300 of the present embodiment is carried by moisture absorption element 395
One the 5th has been supplied heavily to ensure.
In sum, the micro electromechanical system packaging structure of the present invention has recessed by the central part of cover plate
Cave, depression is available for the design that microcomputer electric component is accommodating, reduces the clearance height around cover plate and between chip,
And it is arranged in the gap around cover plate and between chip to seal depression by adhesive body.Around cover plate
And the gap between chip is less, the size of adhesive body is not required to too big, is therefore less susceptible to be full of cracks, and makes
The micro electromechanical system packaging structure of the present invention has preferred anti-moisture ability.Additionally, the microcomputer of the present invention
Electricity system packaging structure is coated on around chip, cover plate and adhesive body by the first moisture barrier layers, with
Avoid dampness to enter depression, effectively provide second heavily to protect.It addition, the micro electro-mechanical system packaging of the present invention
Structure also by chip, microcomputer electric component, cover plate, adhesive body and the first moisture barrier layers are arranged in by
In the hole that first substrate and second substrate are surrounded, and seal first substrate by the second moisture barrier layers
With the junctional area of second substrate, to provide the triple protection of moisture-barrier.Further, the microcomputer of the present invention
Electricity system packaging structure is by being arranged on hole by mold compound and be attached on the first moisture barrier
The surrounding of layer, to provide the quadruple of moisture-barrier to protect.Furthermore, the micro electro-mechanical system packaging of the present invention
Structure, by being arranged in hole by moisture absorption element, to absorb the dampness in hole, and provides the 5th
Heavily protect.
Although disclosing the present invention in conjunction with above example, but it being not limited to the present invention, any
Art has usually intellectual, without departing from the spirit and scope of the present invention, can do some
The change permitted and retouching, therefore protection scope of the present invention should be with what the claim enclosed was defined
Accurate.
Claims (9)
1. a micro electromechanical system packaging structure, including:
Chip, has an active surface；
Microcomputer electric component, is arranged on this active surface；
Cover plate, is covered in this chip and includes a depression, and wherein this microcomputer electric component is positioned at this depression；
Adhesive body, is arranged between this chip and this cover plate to seal this depression, the wherein thickness of this adhesive body
Degree is less than the height of this microcomputer electric component；
First moisture barrier layers, is coated on around this chip, this adhesive body and this cover plate；
First substrate, has a hole, wherein this chip, this microcomputer electric component, this cover plate, this sealing
Body and this first moisture barrier layers are arranged in this hole；
Second substrate, is arranged on this first substrate to cover this hole；And
Second moisture barrier layers, seals the junctional area between this first substrate and this second substrate.
2. micro electromechanical system packaging structure as claimed in claim 1, also includes:
Mold compound, is arranged in this hole and is sealed in around this first moisture barrier layers.
3. micro electromechanical system packaging structure as claimed in claim 2, wherein this mold compound is at this
A view field in first moisture barrier layers covers this adhesive body one in this first moisture barrier layers
View field.
4. micro electromechanical system packaging structure as claimed in claim 1, also includes:
Moisture absorption element, is arranged in this hole.
5. micro electromechanical system packaging structure as claimed in claim 1, wherein this second substrate has one
Cover the region of this adhesive body.
6. micro electromechanical system packaging structure as claimed in claim 1, wherein this depression have relative to
One upper surface of this active surface, this microcomputer electric component includes a mirror, this active surface and this upper surface
Between distance more than the inclined height of this mirror.
7. micro electromechanical system packaging structure as claimed in claim 1, wherein the thickness of this adhesive body is 1
Micron is between 10 microns.
8. micro electromechanical system packaging structure as claimed in claim 1, wherein this microcomputer electric component includes
Mirror, switch, capacitor, accelerometer, induction apparatus or actuator.
9. micro electromechanical system packaging structure as claimed in claim 1, the wherein material bag of this adhesive body
Include epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410068797.9A CN104876175B (en) | 2014-02-27 | 2014-02-27 | Micro electromechanical system packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410068797.9A CN104876175B (en) | 2014-02-27 | 2014-02-27 | Micro electromechanical system packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN104876175A CN104876175A (en) | 2015-09-02 |
| CN104876175B true CN104876175B (en) | 2016-09-28 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2457740Y (en) * | 2001-01-09 | 2001-10-31 | 台湾沛晶股份有限公司 | Structure of IC wafer |
| CN1433067A (en) * | 2002-01-16 | 2003-07-30 | 翰立光电股份有限公司 | Package structure of display element |
| CN1536936A (en) * | 2003-04-11 | 2004-10-13 | 胜园科技股份有限公司 | Organic electro-excited light-emitting element made of nano composite colloid material and its paackaging method |
| CN102447077A (en) * | 2011-12-27 | 2012-05-09 | 福州华映视讯有限公司 | Organic light-emitting diode encapsulation structure and manufacturing method thereof |
| CN103325953A (en) * | 2012-03-19 | 2013-09-25 | 瀚宇彩晶股份有限公司 | Organic light emitting diode package and packaging method thereof |
| CN103579294A (en) * | 2013-11-21 | 2014-02-12 | 四川虹视显示技术有限公司 | OLED (organic light-emitting diode) display part packaging structure and packaging method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI349983B (en) * | 2007-11-07 | 2011-10-01 | Advanced Semiconductor Eng | Memes package structure |
| US9061887B2 (en) * | 2012-02-24 | 2015-06-23 | Spatial Photonics, Inc. | Moisture-resistant package |
-
2014
- 2014-02-27 CN CN201410068797.9A patent/CN104876175B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2457740Y (en) * | 2001-01-09 | 2001-10-31 | 台湾沛晶股份有限公司 | Structure of IC wafer |
| CN1433067A (en) * | 2002-01-16 | 2003-07-30 | 翰立光电股份有限公司 | Package structure of display element |
| CN1536936A (en) * | 2003-04-11 | 2004-10-13 | 胜园科技股份有限公司 | Organic electro-excited light-emitting element made of nano composite colloid material and its paackaging method |
| CN102447077A (en) * | 2011-12-27 | 2012-05-09 | 福州华映视讯有限公司 | Organic light-emitting diode encapsulation structure and manufacturing method thereof |
| CN103325953A (en) * | 2012-03-19 | 2013-09-25 | 瀚宇彩晶股份有限公司 | Organic light emitting diode package and packaging method thereof |
| CN103579294A (en) * | 2013-11-21 | 2014-02-12 | 四川虹视显示技术有限公司 | OLED (organic light-emitting diode) display part packaging structure and packaging method |
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| CN104876175A (en) | 2015-09-02 |
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