CN104862736A - Impurity-removed copper electrolyte additive and preparation method thereof - Google Patents

Abstract

The invention discloses an impurity-removed copper electrolyte additive. The impurity-removed copper electrolyte additive is prepared by the following raw materials in parts by weight: 10-11 parts of gelatin, 0.3-0.4 part of nanometer tea polyphenol, 13-14 parts of thiourea, 0.8-1.1 parts of hydrated manganese dioxide, 0.2-0.3 part of active carbon powder, a proper amount of de-ionized water, and 3-4 parts of sulfuric acid of 75 wt%. The copper electrolyte additive uses the hydrated manganese dioxide and the active carbon powder to remove impurity elements harmful to electro-deposited copper; the arsenic removal rate reaches 85%; high-quality cathode copper with low content of such impurities as arsenic, antimony and bismuth can be obtained; the national standard is accorded with; and the resource utilization rate is improved; the nanometer tea polyphenol is added to improve the oxidation resistance and the bacteria resistance of the gelatin and to prolong the service life; and a production process can keep the viscosity of the gelatin stable, and generates no roughening phenomenon of mixing copper foils in the gelatin due to excessive viscosity.

Description

A kind of deimpurity copper electrolyte additive and preparation method thereof

Technical field

The present invention relates to copper electrolyte technical field, particularly relate to a kind of deimpurity copper electrolyte additive and preparation method thereof.

Background technology

In electrolytic refining course of copper, in order to obtain the poor high-quality cathode copper of compact structure, smooth surface and other detrimental impurity, surfactant-additive to be added in the electrolytic solution.The main raw material that the additive that current most of producer commonly uses relates to has gelatin, thiocarbamide and hydrochloric acid.Because gelatin is hmw protein, badly to dissolve, most of producer just adopt normal-temperature water soak 12 ~ 24 hours dissolve method.This method is long due to soak time, there is easy contaminated rotten, viscosity B coefficent and greatly, is easily adsorbed on negative electrode, suppress the shortcomings such as copper particle growth.

In cathode copper production process, complicated for thick assorted positive plate impurity component content, under peracid, high current density electrolysis manufacturing condition, there is following defect in the A level copper that the additive types, proportioning and the dissolving method that adopt above-mentioned most of producer to use are produced:

(1) A level copper content of impurities is produced higher

The A level copper content of impurities produced due to former additive types, proportioning and dissolving method is 45ppm, and the precipitation quality of cathode copper is stable not, and crystallization is not fine and close, and the foreign matter contents such as arsenic, antimony, bismuth are high.

(2) in electrolytic solution, the flocculating effect of the floating anode sludge is bad, very easily sticks to cathode surface and forms knot grain.

Therefore, need to improve electrolysis additive, improve electrolytic copper technique, improve seed output and quality.

Summary of the invention

The object of the present invention is to provide a kind of deimpurity copper electrolyte additive, this additive can remove the impurity element being harmful to electro deposited copper, and the clearance of arsenic reaches 85%.

Technical scheme of the present invention is as follows:

A kind of deimpurity copper electrolyte additive, is characterized in that being made up of the raw material of following weight part: gelatin 10-11, nanometer tea-polyphenol 0.3-0.4, thiocarbamide 13-14, hydrated manganese dioxide 0.8-1.1, activity charcoal powder 0.2-0.3, deionized water are appropriate, 75wt% sulfuric acid 3-4.

The production method of described deimpurity copper electrolyte additive, is characterized in that:

(1) by thiocarbamide, hydrated manganese dioxide, activity charcoal powder mixing, grinding evenly, obtains mixture;

(2) get the deionized water of 60-70 weight part, add 75wt% sulfuric acid, then add gelatin, be heated to boiling, add other remaining components, under 3000-4000 rev/min, stir 1.5-2 hour, ultrasonic disperse 4-5 minute, leaves standstill 17-19 hour at 50-53 DEG C;

(3) by the mixing of materials that (1) step and (2) step obtain, be heated to 60-70 DEG C, under 5000-7000 rev/min, stir 40-60 minute, be the filter screen filtration of 1 μm with aperture, obtain final product.

During use by gelatine content for 25mg/L calculates consumption, join in electrolytic solution continuous uniform, stir.

Beneficial effect of the present invention

Copper electrolyte additive of the present invention is by using hydrated manganese dioxide, activity charcoal powder, can remove the impurity element being harmful to electro deposited copper, the clearance of arsenic reaches 85%, can obtain the high-quality cathode copper that the foreign matter contents such as arsenic, antimony, bismuth are few, meet national standard, improve resource utilization; By adding nanometer tea-polyphenol, improve the anti-oxidant of gelatin and anti-microbial property, extending duration of service; Production technique of the present invention can make the viscosity of gelatin keep stable, Copper Foil will be caused to be mingled with gelatin because viscosity is excessive, the phenomenon of roughen.

Embodiment

A kind of deimpurity copper electrolyte additive, is made up of the raw material of following weight part (kilogram): gelatin 10.5, nanometer tea-polyphenol 0.3, thiocarbamide 13.5, hydrated manganese dioxide 1, activity charcoal powder 0.2, deionized water are appropriate, 75wt% sulfuric acid 3.5.

The production method of described deimpurity copper electrolyte additive, is characterized in that:

(1) by thiocarbamide, hydrated manganese dioxide, activity charcoal powder mixing, grinding evenly, obtains mixture;

(2) get the deionized water of 65 weight parts, add 75wt% sulfuric acid, then add gelatin, be heated to boiling, add other remaining components, stir 1.8 hours under 3500 revs/min, ultrasonic disperse 4 minutes, at 52 DEG C, leave standstill 18 hours;

(3) by the mixing of materials that (1) step and (2) step obtain, be heated to 65 DEG C, stir 50 minutes under 6000 revs/min, be the filter screen filtration of 1 μm with aperture, obtain final product.

During use by gelatine content for 25mg/L calculates consumption, join in electrolytic solution continuous uniform, stir.

Experimental data:

To produce cathode copper foreign matter content be 36 ppm, compound country A cathode copper standard, copper coin face is fine and close, smooth, and physical appearance quality is good.

Claims (2)

1. a deimpurity copper electrolyte additive, is characterized in that being made up of the raw material of following weight part: gelatin 10-11, nanometer tea-polyphenol 0.3-0.4, thiocarbamide 13-14, hydrated manganese dioxide 0.8-1.1, activity charcoal powder 0.2-0.3, deionized water are appropriate, 75wt% sulfuric acid 3-4.

2. the production method of deimpurity copper electrolyte additive according to claim 1, is characterized in that:

(1) by thiocarbamide, hydrated manganese dioxide, activity charcoal powder mixing, grinding evenly, obtains mixture;

(2) get the deionized water of 60-70 weight part, add 75wt% sulfuric acid, then add gelatin, be heated to boiling, add other remaining components, under 3000-4000 rev/min, stir 1.5-2 hour, ultrasonic disperse 4-5 minute, leaves standstill 17-19 hour at 50-53 DEG C;

(3) by the mixing of materials that (1) step and (2) step obtain, be heated to 60-70 DEG C, under 5000-7000 rev/min, stir 40-60 minute, be the filter screen filtration of 1 μm with aperture, obtain final product.