CN104861652A - Thermosetting resin composition, and prepreg and laminated board made from thermosetting resin composition - Google Patents
Thermosetting resin composition, and prepreg and laminated board made from thermosetting resin composition Download PDFInfo
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5399—Phosphorus bound to nitrogen
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
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- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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Abstract
The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises the following solids by weight: (a) a modified bismaleimide prepolymer, (b) a curing accelerator, (c) a fire retardant, and (d) inorganic fillers. A preparation method of the modified bismaleimide prepolymer comprises the following step: heating bismaleimide and a composite allyl compound in a reaction bottle, wherein the composite allyl compound is composed of a first-class allyl compound and a second-class allyl compound, the first-class allyl compound is selected from one or more of diallyl bisphenol A, diallyl bisphenol S, allyl phenoxy resin and diallyl diphenyl ether, and the second-class allyl compound is selected from one or more of diallyl bisphenol A diglycidyl ether, diallyl bisphenol S diglycidyl ether and diallyl diphenyl ether diglycidyl ether. A laminated board integrates high heat resistance, high toughness, low water absorption, excellent dielectric property and good fire resistance.
Description
Technical field
The invention belongs to technical field of electronic materials, relate to a kind of compositions of thermosetting resin and the prepreg using it to make and veneer sheet.
Background technology
Along with the development in electronic unit multifunction, high performance, high reliability and environmental protection direction, must improve the thermotolerance of sheet material, to meet the harsh complete processing of Pb-free coating and repeatedly pressing, the thermotolerance of traditional FR-4 material can not meet the demands far away.
Bimaleimide resin is the compound that a class has double activated end group, can crosslinking curing under the effect of heating or catalyzer, there is excellent thermotolerance, humidity resistance, dielectric properties, good mechanical property and dimensional stability, be therefore widely used in numerous high-technology fields such as aerospace, electronic apparatus, communications and transportation as High-performance adhesive, resin matrix for advanced composite materials body, insullac etc.But the shortcoming such as there is monomer solubility difference due to bimaleimide resin and cured article fragility is large, when being applied to copper-clad plate field, needs to carry out modification to it.
At present, conventional method of modifying adopts aromatic diamine compounds or allylic compound to carry out modification to it, destroys crystalline texture, improve solvability and toughness etc. by chain extension.Aromatic diamine compounds realizes the modification to bismaleimides by Michael reaction, and modified product all has improvement to a certain degree in solvability, toughness; But aromatic diamine toxicity is comparatively large, and the product of modification can only be dissolved in high bp polar solvent (as DMF, NMP etc.), and it still exists larger room for promotion in toughness, cohesiveness simultaneously.And the modified product of allylic cpd (is soluble in low boiling point solvent in toughness, cohesiveness, solvability, as PM, butanone, acetone etc.) all comparatively aromatic diamine compounds have further improvement, be one of method of current bi-maleimide modified main employing.
At present, conventional allylic compound, as allyl group dihydroxyphenyl propane, allyl group bisphenol S, phenol type allyl group phenolic aldehyde, allyl phenol oxygen, aryl allyl alkylphenol etc., but, often attend to one thing and lose sight of another in thermotolerance, water-intake rate, dielectric properties, incendivity, toughness with the bimaleimide resin of these allylic cpd modifications.
Therefore, how obtaining the copper-clad plate material of thermotolerance, high tenacity, low water absorption, superior dielectric performance and the flame retardant resistance integrating excellent, is one of this area technical problem urgently to be resolved hurrily.
Summary of the invention
Goal of the invention of the present invention is to provide a kind of compositions of thermosetting resin and the prepreg using it to make and veneer sheet.
To achieve the above object of the invention, the technical solution used in the present invention is: a kind of compositions of thermosetting resin, with solid weight meter, comprising:
(a) modified bismaleimide prepolymer: 100 parts;
(b) curing catalyst: 0 ~ 5 part;
(c) fire retardant: 0 ~ 50 part;
(d) mineral filler: 0 ~ 200 part;
The preparation method of described modified bismaleimide prepolymer is as follows: according to mass ratio 100:40 ~ 200, gets bismaleimides, compound allylic cpd respectively in reaction flask, reacting by heating, can obtain described modified bismaleimide prepolymer; Wherein, described compound allylic cpd is made up of first kind allylic cpd and Equations of The Second Kind allylic cpd, and the mass ratio of first kind allylic cpd and Equations of The Second Kind allylic cpd is 0 ~ 99:1 ~ 100;
Described first kind allylic cpd is selected from one or more in diallyl bisphenol, diallyl bisphenol S, allyl phenoxy resin, diallyl phenyl ether;
Described Equations of The Second Kind allylic cpd is selected from one or more in diallyl bisphenol diglycidylether, diallyl bisphenol-S diglycidyl ether, diallyl phenyl ether diglycidylether.
Above, get bismaleimides, compound allylic cpd in reaction flask, be heated to 120 ~ 160 DEG C, reaction 10 ~ 150min, can obtain described modified bismaleimide prepolymer.
The chemical structural formula of described diallyl bisphenol diglycidylether is:
The chemical structural formula of described diallyl bisphenol-S diglycidyl ether is:
The chemical structural formula of described diallyl phenyl ether diglycidylether is:
One or more in epoxy resin, cyanate ester resin, benzoxazine colophony, polyphenylene oxide resin can also be comprised in above-mentioned resin combination.
The Equations of The Second Kind allylic cpd that the present invention adopts contains epoxide group, improve solvability and the stability in storage of modified bismaleimide prepolymer, allyl group in its structure can be polymerized with the double bond in bismaleimides, the epoxide group introduced as active end group occur when further heating autohemagglutination or with other resin Composition copolymerization in formula, improve the reactive behavior of resin combination and the cross-linking density of cured article; Meanwhile, due to a large amount of ehter bonds formed after epoxide group open loop, improve the toughness of cured article.
In technique scheme, described bismaleimides is selected from 4,4 '-diphenyl methane dimaleimide, 4,4 '-Diphenyl Ether Bismaleimide, 4,4 '-hexichol sec.-propyl bismaleimides, 4, one or more in 4 '-sulfobenzide bismaleimides.
Preferably, the mass ratio of described first kind allylic cpd and Equations of The Second Kind allylic cpd is 20 ~ 60:40 ~ 80.
In technique scheme, described fire retardant is bromine-containing compound, P contained compound, nitrogenous compound or silicon-containing compound.
Described bromine-containing compound can select tribromo phenyl maleimide, tetrabromo-bisphenol allyl ethers, TDE, decabrominated dipheny ether, brominated Polystyrene, brominated polycarbonate, tetrabromo-bisphenol, brominated epoxy resin.Described P contained compound can select DOPO or derivatives thereof, phosphorous epoxy resin, phosphorus containing phenolic resin, phosphazene compound, phosphate compound, phosphorous cyanate, phosphorous bismaleimides.Described nitrogenous compound can select melamine cyanurate.Described silicon-containing compound can select silsesquioxane (POSS), organic silicone powder.
Preferably, described fire retardant can select one or more in above-mentioned classes of compounds.
In technique scheme, it is one or more in silicon-dioxide, aluminium hydroxide, Bao Mushi, magnesium hydroxide, talcum, kaolin, aluminum oxide, zinc borate, polytetrafluorethylepowder powder that described mineral filler is selected from mineral filler.
Described silicon-dioxide can be spherical, crystal type or fusion.
Preferably, mineral filler is carry out surface-treated mineral filler with silane coupling agent.The preferred end group of described silane coupling agent contains double bond or epoxide group.By above-mentioned coupling agent carry out surface-treated mineral filler be added into resin combination time, because the double bond/epoxide group of coupling agent and modified bismaleimide prepolymer have excellent com-patibilising effect, the viscosity of full tree oil/fat composition is made to rise slowly, the dispersiveness of filler in resin combination is better, efficiently solve the unmanageable problem of reaction between resin Composition because viscosity is large, improve the surface smoothness of prepreg.
In technique scheme, described curing catalyst is selected from one or more in tertiary amines curing catalyst, imidazoles curing catalyst, peroxide curing catalyst, transition metal carboxylate's class curing catalyst, organic phosphates curing catalyst.
Tertiary amines curing catalyst, as triethylamine, tripropyl amine; Imidazoles curing catalyst, as glyoxal ethyline, 2-phenylimidazole, 2-ethyl-4-methylimidazole; Peroxide curing catalyst, as benzoyl peroxide, dicumyl peroxide; Transition metal carboxylate's class curing catalyst, as zinc naphthenate, zinc octoate, aluminium acetylacetonate; Organic phosphates curing catalyst, as triphenyl phosphorus, triphenyl phosphite.
The present invention asks to protect a kind of prepreg adopting above-mentioned resin combination to make simultaneously, and above-mentioned resin combination dissolution with solvents is made glue, is then immersed in by strongthener in above-mentioned glue; After flooding, strongthener was through 100 ~ 200 DEG C of bakings 1 ~ 10 minute, can obtain described prepreg.
One or more in described solvent selected from acetone, butanone, mibk, N, dinethylformamide, N, N-N,N-DIMETHYLACETAMIDE, ethylene glycol monomethyl ether, propylene glycol monomethyl ether.Described strongthener can adopt natural fiber, organic synthetic fibers, organic fabric or inorganic fabric.
The present invention asks to protect a kind of veneer sheet adopting above-mentioned resin combination to make simultaneously; tinsel is covered with by the single or double of above-mentioned prepreg at one; or after at least 2 are superposed by above-mentioned prepreg; tinsel is covered with at its single or double; in 0.2 ~ 2MPa pressure and 180 ~ 250 DEG C of temperatures systems 2 ~ 4 hours, described veneer sheet can be obtained.
The quantity of described prepreg determines according to the laminate thickness of customer requirement, available one or more.Described tinsel can be Copper Foil, and can be also aluminium foil, thickness be not particularly limited.
Because technique scheme is used, the present invention compared with prior art has following advantages:
1. the present invention adopts the compound allylic cpd that is made up of first kind allylic cpd and Equations of The Second Kind allylic cpd as the properties-correcting agent of bimaleimide resin, the Bismaleimide prepolymer be obtained by reacting has higher reactive behavior, good solubility and stability in storage, good toughness after solidification, stripping strength is high, water-intake rate is low, specific inductivity is low and maintain the excellent heat resistance of bismaleimides, the thermotolerance that the veneer sheet collection obtained is excellent, high tenacity, low water absorption, superior dielectric performance and flame retardant resistance are in one, the requirement of high-precision electronic baseplate material can be met, there is realistic meaning energetically,
2. experiment proves: the prepreg that the present invention obtains and veneer sheet good toughness, and stripping strength is high, water-intake rate is low, specific inductivity is low and keep the original excellent heat resistance of bismaleimides, achieves significant effect; Can be applicable to high temperature resistant anti-aging, the field such as integrated antenna package, high-speed high frequency, have broad application prospects.
Embodiment
Below in conjunction with embodiment, the present invention is further described.
Embodiment one:
Get 4,4 '-diphenyl methane dimaleimide 100g, diallyl bisphenol diglycidylether 70g (epoxy equivalent (weight) 256g/eq) puts into 500mL reaction flask, oil bath is used slowly to be heated to 155 DEG C and to react 30min under keeping agitation condition, be cooled to room temperature after having reacted, obtain modified bismaleimide prepolymer.
Add proper amount of acetone to dissolve, be uniformly mixed the glue obtaining 62% solids content, flood above-mentioned glue with E glass-fiber-fabric, and in 160 DEG C of baking ovens, dry 5min obtain prepreg.
8 are cut out the above-mentioned semicure superposition of deflashing, enclose the Copper Foil of 35 microns up and down, be placed in vacuum hotpressing machine compacting and obtain copper-clad plate.Concrete process for pressing is at 1.5Mpa pressure, and 220 DEG C of temperatures close 4 hours.The copper clad laminate performance obtained is as shown in table 1.
Embodiment two:
Get 4,4 '-Diphenyl Ether Bismaleimide 30g, 4,4 '-diphenyl methane dimaleimide 70g, diallyl bisphenol 50g, diallyl bisphenol diglycidylether 50g (epoxy equivalent (weight) 220g/eq) puts into 500mL reaction flask, use oil bath be slowly heated to 140 DEG C and react 50min under keeping agitation condition, be cooled to room temperature after having reacted, obtain modified bismaleimide prepolymer.
Add proper amount of acetone to dissolve, be uniformly mixed the glue obtaining 62% solids content.
Prepreg, copper clad laminate preparation method are with embodiment one.
The copper clad laminate performance obtained is as shown in table 1.
Embodiment three:
Get 4,4 '-Diphenyl Ether Bismaleimide 100g, allyl phenoxy resin 40g, diallyl bisphenol-S diglycidyl ether 50g (epoxy equivalent (weight) 215g/eq) puts into 500mL reaction flask, oil bath is used slowly to be heated to 140 DEG C and to react 60min under keeping agitation condition, be cooled to room temperature after having reacted, obtain modified bismaleimide prepolymer.
Add proper amount of acetone to dissolve, dissolve completely and add 23 parts of ring-type phenoxy phosphazene compounds (FP-100, Fushimi Pharmaceutical Co., Ltd), be uniformly mixed the glue obtaining 62% solids content.
Prepreg, copper clad laminate preparation method are with embodiment one.
The copper clad laminate performance obtained is as shown in table 1.
Embodiment four:
Get 4,4 '-hexichol sec.-propyl bismaleimides 100g, diallyl bisphenol 30g, diallyl bisphenol diglycidylether 30g (epoxy equivalent (weight) 250g/eq) puts into 500mL reaction flask, oil bath is used slowly to be heated to 140 DEG C and to react 45min under keeping agitation condition, be cooled to room temperature after having reacted, obtain modified bismaleimide prepolymer.
Add proper amount of acetone to dissolve, dissolve completely and add 20 parts of polyfunctional epoxy resins (502H, Japanese chemical drug), 0.2 part of triphenyl phosphorus, is uniformly mixed the glue obtaining 62% solids content.
Prepreg, copper clad laminate preparation method are with embodiment one.
The copper clad laminate performance obtained is as shown in table 1.
Embodiment five:
Get 4,4 '-sulfobenzide bismaleimides 100g, diallyl bisphenol S 40g, diallyl phenyl ether diglycidylether 70g (epoxy equivalent (weight) 225g/eq) puts into 500mL reaction flask, oil bath is used slowly to be heated to 150 DEG C and to react 30min under keeping agitation condition, be cooled to room temperature after having reacted, obtain modified bismaleimide prepolymer.
Add proper amount of acetone to dissolve, dissolve completely and add 100 parts of preparing spherical SiO 2s, be uniformly mixed the glue obtaining 62% solids content.
Prepreg, copper clad laminate preparation method are with embodiment one.
The copper clad laminate performance obtained is as shown in table 1.
Comparative example one:
Get 4,4 '-diphenyl methane dimaleimide resin 100g, diallyl bisphenol 100g, put into 500mL reaction flask, uses oil bath be slowly heated to 140 DEG C and react 50min under keeping agitation condition, be cooled to room temperature after having reacted, obtain modified bismaleimide prepolymer.Add proper amount of acetone to dissolve, be uniformly mixed the glue obtaining 62% solids content.
Prepreg, copper clad laminate preparation method are with embodiment one.The copper clad laminate performance obtained is as shown in table 1.
Comparative example two:
Get 4,4 '-diphenyl methane dimaleimide resin 100g, allyl group novolac glycidyl ethers 100g, put into 500mL reaction flask, uses oil bath be slowly heated to 140 DEG C and react 50min under keeping agitation condition, be cooled to room temperature after having reacted, obtain modified bismaleimide prepolymer.
Add proper amount of acetone to dissolve, be uniformly mixed the glue obtaining 62% solids content.
Prepreg, copper clad laminate preparation method are with embodiment one.The copper clad laminate performance obtained is as shown in table 1.
Table 1 adopts the laminate properties of different embodiment and comparative example gained
Partial test method of the present invention is specific as follows:
Measurement thickness of sample is 1.6mm, and joining this structure is 8 7628 glass-fiber-fabrics.
Humidity resistance: adopt pressure cooker gluten substitute, sheet material after 180 minutes through pressure cooker (0.105MPA) 121 DEG C of continuously cookings, immerses in 288 DEG C of scolding tin and observes layering, cream time;
Impelling strength: adopt 5512 Apparatus for Impacting at low-temp, Apparatus for Impacting at low-temp height of the fall 45cm, whereabouts weight weight 1kg.If the cross pattern after sheet material impacts is clear and elongated, illustrate that the toughness of sheet material is better; On the contrary, cross pattern is fuzzy or do not have cross pattern, and the poor toughness of sheet material is described, fragility is large, be specifically divided into excellent, good, in, differ from four grades.
As can be seen from Table 1, compared with comparative example one (adopting diallyl bisphenol separately), the advantages such as sheet material obtained by the present invention has good toughness after solidification, Tg is high, stripping strength is high and water-intake rate is low.
Compared with documents two (adopting allyl group novolac glycidyl ethers separately), sheet material obtained by the present invention has the advantages such as the low and specific inductivity of good toughness, water-intake rate after solidification is low.Cause primarily of two aspects with the difference of documents two: first, because the rigid radical density in resol main framing structure is comparatively large and without rotatable group, cause its cured article toughness poor; On the other hand, allyl group phenolic aldehyde is due to steric effect in the process of etherificate, and the etherificate and not easily reacting completely of the hydroxyl in the middle of molecule, cause remaining hydroxyl groups in cured article, and hydroxyl belongs to polar group, easily causes that cured article water-intake rate is large and specific inductivity is higher.
In sum, copper-clad plate obtained by the present invention integrates excellent thermotolerance, high tenacity, low water absorption, superior dielectric performance and flame retardant resistance, can be applicable to high temperature resistant anti-aging, the field such as integrated antenna package, high-speed high frequency.
Above embodiment, not the content of composition of the present invention is imposed any restrictions, every above embodiment is done according to technical spirit of the present invention or composition composition or content any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (8)
1. a compositions of thermosetting resin, is characterized in that, with solid weight meter, comprising:
(a) modified bismaleimide prepolymer: 100 parts;
(b) curing catalyst: 0 ~ 5 part;
(c) fire retardant: 0 ~ 50 part;
(d) mineral filler: 0 ~ 200 part;
The preparation method of described modified bismaleimide prepolymer is as follows: according to mass ratio 100:40 ~ 200, gets bismaleimides, compound allylic cpd respectively in reaction flask, reacting by heating, can obtain described modified bismaleimide prepolymer;
Wherein, described compound allylic cpd is made up of first kind allylic cpd and Equations of The Second Kind allylic cpd, and the mass ratio of first kind allylic cpd and Equations of The Second Kind allylic cpd is 0 ~ 99:1 ~ 100;
Described first kind allylic cpd is selected from one or more in diallyl bisphenol, diallyl bisphenol S, allyl phenoxy resin, diallyl phenyl ether;
Described Equations of The Second Kind allylic cpd is selected from one or more in diallyl bisphenol diglycidylether, diallyl bisphenol-S diglycidyl ether, diallyl phenyl ether diglycidylether.
2. resin combination according to claim 1, it is characterized in that: described bismaleimides is selected from 4,4 '-diphenyl methane dimaleimide, 4,4 '-Diphenyl Ether Bismaleimide, 4,4 '-hexichol sec.-propyl bismaleimides, 4, one or more in 4 '-sulfobenzide bismaleimides.
3. resin combination according to claim 1, is characterized in that: the mass ratio of described first kind allylic cpd and Equations of The Second Kind allylic cpd is 20 ~ 60:40 ~ 80.
4. resin combination according to claim 1, is characterized in that: described fire retardant is bromine-containing compound, P contained compound, nitrogenous compound or silicon-containing compound.
5. resin combination according to claim 1, is characterized in that: it is one or more in silicon-dioxide, aluminium hydroxide, Bao Mushi, magnesium hydroxide, talcum, kaolin, aluminum oxide, zinc borate, polytetrafluorethylepowder powder that described mineral filler is selected from mineral filler.
6. resin combination according to claim 1, is characterized in that: described curing catalyst is selected from one or more in tertiary amines curing catalyst, imidazoles curing catalyst, peroxide curing catalyst, transition metal carboxylate's class curing catalyst, organic phosphates curing catalyst.
7. the prepreg adopting resin combination as claimed in claim 1 to make, is characterized in that: resin combination dissolution with solvents according to claim 1 is made glue, is then immersed in by strongthener in above-mentioned glue; After flooding, strongthener was through 100 ~ 200 DEG C of bakings 1 ~ 10 minute, can obtain described prepreg.
8. the veneer sheet adopting resin combination as claimed in claim 1 to make, it is characterized in that: be covered with tinsel at one by the single or double of prepreg according to claim 7, or after at least 2 are superposed by prepreg according to claim 7, tinsel is covered with at its single or double, in 0.2 ~ 2MPa pressure and 180 ~ 250 DEG C of temperatures systems 2 ~ 4 hours, described veneer sheet can be obtained.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510282806.9A CN104861652B (en) | 2015-05-28 | 2015-05-28 | Thermosetting resin composition, and prepreg and laminated board made from thermosetting resin composition |
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| CN110643321A (en) * | 2019-09-24 | 2020-01-03 | 苏州益可泰电子材料有限公司 | Electronic material glue solution and application thereof |
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