CN104835511A - Magnetic head assembly - Google Patents
Magnetic head assembly Download PDFInfo
- Publication number
- CN104835511A CN104835511A CN201510075880.3A CN201510075880A CN104835511A CN 104835511 A CN104835511 A CN 104835511A CN 201510075880 A CN201510075880 A CN 201510075880A CN 104835511 A CN104835511 A CN 104835511A
- Authority
- CN
- China
- Prior art keywords
- tie point
- drive unit
- magnetic head
- connecting rod
- slide block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Moving Of The Head To Find And Align With The Track (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
The invention provides a magnetic head assembly (2), which comprises a first connecting rod (39a) that is connected between a first connecting point (40a) and a second connecting point (40b), wherein the first connecting point (40a) is connected with a slide block support plate (20), and the second connecting point (40b) is connected with a first fixing part (24a); a second connecting rod (39b) that is connected between a third connecting point (40c) and a forth connecting point (40d), wherein the third connecting point (40c) is connected with the slide block support plate (20), and the forth connecting point (40d) is connected with a second fixing part (24b); a first driving apparatus (16a) that drives the first connecting rod (39a); and a second driving apparatus (16b) that drives the second connecting rod (39b). According to the magnetic head assembly (2) in the invention, to obtain the target displacement amount of the magnetic head element, effective driving can be performed without increasing volume of a film piezoelectric element.
Description
Technical field
The present invention relates to a kind of head stack, in order to make the record densification more of the disk set being used as computer memory storage, this head stack has the magnetic head rotating mechanism of mini drive etc.
Background technology
In recent years, in disk set, magnetic disc storage develops to densification day by day.In disk set, be provided with a slide block, be provided with thereon and carry out the record of data and the magnetic head of regeneration to disk, this slide block is supported by head support mechanism.Head support mechanism is arranged on Arm Actuator, Arm Actuator can be rotated by voice coil motor (VCM).By the control of this voice coil motor, the magnetic head be arranged on slide block can be positioned the optional position on disk.But on disk, if data will be recorded more to high-density, would just be necessary more accurately to determine the position of magnetic head on disk, and would rely on merely voice coil motor rotational head actuating arm to carry out positioning head, also cannot accomplish that high-precision magnetic head is located.
A kind of one-piece construction with the head stack of the magnetic head rotating mechanism of prior art is disclosed in patent document 1 (Japanese Patent Laid-Open 2011-138596 publication).The flex member of this head stack leading section is formed with film piezoelectric element, film piezoelectric element can be caused when film piezoelectric element applies voltage to stretch, movable slider is with to rotate centered by fulcrum projection thus, and trickle displacement can occur magnetic head, thus control its precision positioning in orbit.The wiring of the magnetic head element be at this moment furnished with in the periphery of film piezoelectric element can be stretched together with the displacement of film piezoelectric element.
But because film piezoelectric element spatter film forming on wafer, and its cost is determined, so how to obtain more element to become primary problem in one-pass film-forming by the number of elements that can obtain from a wafer.Therefore, in order to the displacement of expection guaranteed by the element more small with volume, just need driving method more more effective than prior art.
Summary of the invention
The present invention completes in view of the above problems, and object is to provide a kind of head stack, and it does not increase membrane piezoelectric element volume in order to the displacement obtaining desired magnetic head element can effectively drive.
In order to achieve the above object, head stack involved in the present invention, wherein there is the slider support of magnetic head element on the slider support plate being formed at flex member, this slider support plate can rotate around the fulcrum projection on the leading section being arranged at load beam, it is characterized in that, comprise: the 1st connecting rod, it is configured to connect between the 1st tie point be connected with described slider support plate and the 2nd tie point be connected with the 1st fixed part; 2nd connecting rod, it is configured to connect between the 3rd tie point be connected with described slider support plate and the 4th tie point be connected with the 2nd fixed part; 1st drive unit, it drives described 1st connecting rod; And the 2nd drive unit, it drives described 2nd connecting rod.
By forming such structure, when slide block carries out reciprocating rotary movement centered by fulcrum, in reducing effect while the driving load of film piezoelectric element, magnetic head displacement can be increased.
And, can also be configured to: make the intersection point by connection the 1st tie point is crossing afterwards with the 2nd line segment prolongation of the 4th tie point with being connected the 3rd tie point with the 1st line segment of the 2nd tie point consistent with fulcrum projection.By this structure, can further reducing effect in the driving load of film piezoelectric element.
In addition, the 1st connecting rod and the 2nd connecting rod can also comprise and pass on the wiring portion of signal and the stiffening plate in partly reinforcement wiring portion to described magnetic head element.This stiffening plate obtains by etching the stainless steel substrate forming flex member.By this structure, new processing technology need not be increased and just stiffening plate can be set simply, and the magnetic head location action stabilized can be realized.
And can also be configured to: there is the 1st separating tank be arranged between the 1st drive unit and the 2nd tie point, and be arranged at the 2nd separating tank between the 2nd drive unit and the 4th tie point.By this structure, the deflection of driver part can be increased.
And can also be configured to: the Aspect Ratio L/W of the area of the 1st drive unit and the 2nd drive unit is more than 2.By this structure, the relation between addendum modification and the rotating stiff of slide block can be set as optimum condition.
Can provide a kind of head stack according to the present invention, it does not increase membrane piezoelectric element volume in order to the displacement of magnetic head element of reducing effect in the driving load of film piezoelectric element and desired by obtaining can effectively drive.
Accompanying drawing explanation
Fig. 1 is the schematic plan view of the disk set of the head stack be provided with involved by the preferred embodiment of the present invention.
Fig. 2 is the stereographic map of the head stack involved by the preferred embodiment of the present invention.
Fig. 3 is the exploded perspective view of the head stack involved by the preferred embodiment of the present invention.
Fig. 4 is the exploded perspective view of the flex member that the head stack involved by the preferred embodiment of the present invention has.
Fig. 5 a is the planimetric map of the 1st drive unit that the head stack involved by the preferred embodiment of the present invention has.
Fig. 5 b is the A-A sectional view in Fig. 5 a.
Fig. 5 c is the B-B sectional view in Fig. 5 a.
Fig. 6 is the planimetric map of the leading section major part of head stack viewed from upper surface side involved by the preferred embodiment of the present invention.
Fig. 7 is the planimetric map of the leading section major part of head stack viewed from lower face side involved by the preferred embodiment of the present invention.
Fig. 8 a is the C-C sectional view in Fig. 6.
Fig. 8 b is the D-D sectional view in Fig. 6.
Fig. 8 c is the F-F sectional view in Fig. 6.
Fig. 8 d is the H-H sectional view in Fig. 6.
Fig. 8 e is the G-G sectional view in Fig. 6.
Fig. 9 represents the sectional view in the head stack involved by the preferred embodiment of the present invention, the 1st drive unit being bonded in the section of the part in flex member.
Figure 10 is the illustraton of model of the rotating mechanism of slide block in the head stack involved by the preferred embodiment of the present invention.
Figure 11 is the illustraton of model of the rotational motion state representing slide block in the head stack involved by the preferred embodiment of the present invention.
Figure 12 is the illustraton of model of the rotating mechanism of slide block in prior art.
Figure 13 is the illustraton of model of the rotating mechanism of slide block in embodiment.
Figure 14 is the figure representing relation between the length breadth ratio of film piezoelectric element in embodiment and magnetic head displacement.
Figure 15 is the figure representing relation between the length breadth ratio of film piezoelectric element in embodiment and slide block rotating stiff.
Symbol description
1-disk set; 2-head stack; 3-slide block; 4-housing; The axle of 5-Spindle Motor; 6-disk; 7-magnetic head element; 8-sway brace; The horizontal rotating shaft of 9-VCM; 10-magnet part; 11-oblique mechanism; 12-fin (tab); 13-base plate; 14-load beam; 15-flex member; 16a-the 1st drive unit (film piezoelectric element); 16b-the 2nd drive unit (film piezoelectric element); 17a, 17b-beam pad; 18-leaf spring; 19-bending machining portion; 20-slider support plate; 21-fulcrum projection; 22a-the 1st outrigger; 22b-the 2nd outrigger; 23a-the 1st piezoelectrics support portion; 23b-the 2nd piezoelectrics support portion; 24-flex member substrate; 24a-first fixed part; 24b-second fixed part; 25-magnetic head element connects up; 26-film piezoelectric; 27a-upper electrode; 27b-lower electrode; 28-base; 29a-the 1st electrode pads; 29b-the 2nd electrode pads; 29c-the 3rd electrode pads; 29d-the 4th electrode pads; 30-insulating boot; 31-magnetic head electrode terminal; 32a-the 1st bend; 32b-the 2nd bend; 33-balance portion; 34-T type limiter portion; The hole portion of 35-load beam; 36a-the 1st drives rib; 36b-the 2nd drives rib; 37a-drives wiring; 37b-ground connection is connected up; 38-mechanism load; 39a-the 1st connecting rod; 39b-the 2nd connecting rod; 40a-the 1st tie point; 40b-the 2nd tie point; 40c-the 3rd tie point; 40d-the 4th tie point; 40e, 40f-tie point of the prior art; 41-insulation course; 42-connects up cap layer; 43a, 43b-stiffening plate; 44a-the 1st separating tank; 44b-the 2nd separating tank.
Embodiment
Below in conjunction with accompanying drawing, the preferred embodiment of the present invention is described.And the present invention is not limited in following embodiment.And the constitutive requirements of the present invention hereinafter described also include the part that those skilled in the art can expect simply and the part be equal in essence.Further, the constitutive requirements of the present invention hereinafter described can also combine aptly.Further, in the scope without prejudice to aim of the present invention, various omission, replacement and correction can be carried out to its constitutive requirements.
Fig. 1 is the integrally-built key diagram of the disk set (HDD device) 1 of the load/unload mode representing the head stack be provided with involved by the preferred embodiment of the present invention briefly.According to Fig. 1, disk set 1 is by housing 4, the disk 6 be driven in rotation centered by axle 5 by Spindle Motor, the head stack 2 that its leading section is provided with the slide block 3 possessing magnetic head element 7 and consisted of the sway brace 8 that its leading section supports this head stack 2.
The rearward end of sway brace 8 is provided with the coil portion of voice coil motor (VCM), and sway brace 8 can rotate abreast with the surface of disk 6 centered by horizontal rotating shaft 9.Voice coil motor (VCM) is made up of the magnet part 10 of this coil portion (not shown) and covering coil portion.Outside from the outside of the data area of disk 6 to disk 6 is provided with oblique mechanism 11, by shelving the fin 12 being foremost located at head stack 2 on its inclined surface, makes slide block 3 leave disk 6 and be in unloaded state.
On the one hand, disk set 1 is (namely disk is in High Rotation Speed) operationally, and the surface of the relative disk 6 of slide block 3 suspends with low suspension amount and is in stress state.On the other hand, when not working (disk be in static or start and stop time low speed rotation in), the fin 12 because of the leading section of head stack 2 is positioned on oblique mechanism 11, and slide block 3 can be made to be in unloaded state.
Fig. 2 is the integrally-built stereographic map of the head stack 2 represented briefly involved by the preferred embodiment of the present invention.Below for convenience of description, the positive dirction of the Z axis of figure is called the upper surface side of head stack 2, the negative direction of this Z axis is called the rear side of head stack 2, or lower face side.Slide block 3 is (i.e. its trailing edge in its back-end, the positive dirction side of the Y-axis of Fig. 2) on the surface, possess induction write head element and read by the magnetoresistance (MR) of the playback head element based on giant magnetoresistance effect (GMR) or the playback head element based on tunnel magneto-resistance effect (TMR) etc. the magnetic head element 7 that thin-film head forms.
According to Fig. 2, the main composition element of head stack 2 comprises: base plate 13, load beam 14, flex member 15, the 1st film piezoelectric element as the 1st drive unit 16a and the 2nd film piezoelectric element as the 2nd drive unit 16b and slide block 3.And base plate 13 is arranged on the leading section of sway brace 8.
According to Fig. 2, load beam 14 is fixed on base plate 13 by multiple beam pad 17a etc.And load beam 14 is formed with leaf spring 18, certain pressing force can be produced to slide block 3.And the both sides of load beam 14 are also provided with bending machining portion 19, become reinforcement structure.In addition, flex member 15 is fixed in load beam 14 by beam pad 17b.On Fig. 2, the pitch orientation of the attitude angle of slide block 3 is expressed as Dp, and roll direction and be expressed as Dr, rotation direction is expressed as Dy.
Fig. 3 is the exploded perspective view of the head stack 2 represented briefly involved by the preferred embodiment of the present invention.Namely state when head stack 2 being resolved into load beam 14, flex member 15, base plate 13, driver part 16a and driver part 16b and slide block 3 is represented.
According to Fig. 3, slide block 3 is adhesively fixed on the slider support plate 20 that is formed in flex member 15.Center line near load beam 14 leading section is given prominence to integratedly and is formed with fulcrum projection 21, this fulcrum projection 21 is supported by the 1st outrigger 22a and the 2nd outrigger 22b, defines the pivot structure of point cantact on slider support plate 20.Thus, slide block 3 is formed as the fluctuating of corresponding disk face and the structure that the attitude that suspends can be followed sleekly.
Further, the 1st drive unit 16a and the 2nd drive unit 16b is film piezoelectric element, and it is bonded on the 1st piezoelectrics support portion 23a and the 2nd piezoelectrics support portion 23b.Further, the 1st piezoelectrics support portion 23a and the 2nd piezoelectrics support portion 23b is only made up of the insulation course forming flex member 15.
Fig. 4 is the exploded perspective view of the structure representing the flex member 15 that the head stack involved by the preferred embodiment of the present invention has.Flex member 15 be generally be used in thick about 20 μm thin stainless steel steel disc on after coating insulating layer, then the wiring base plate that the material plating Copper Foil is thereon made, its useful etch processes becomes the wire structures of the precision of arbitrary shape.In the diagram, in order to perspicuousness, will be originally that the flex member of one resolves into stainless steel flex member substrate 24 and magnetic head element wiring 25 (wiring portions) represent.
Fig. 5 a is the planimetric map of the 1st drive unit 16a that the head stack involved by the preferred embodiment of the present invention has.And Fig. 5 b represents the A-A sectional view in Fig. 5 a.Fig. 5 c represents the B-B sectional view in Fig. 5 a.The upper surface side of film piezoelectric 26 is formed with upper electrode 27a, and lower face side is formed with lower electrode 27b.Because the 1st and the 2nd drive unit 16a, 16b is very thin, and very easily damaged, so be provided with the pedestal 28 as reinforcement.
In order to protective film piezoelectrics the 26,1st and the 2nd drive unit 16a, the entirety polyimide insulating boot 30 of 16b covers.And in the C portion and D portion of Fig. 5 a, eliminate SI semi-insulation cover 30.Expose lower electrode 27b in C portion, itself and the 2nd electrode pads 29b conduct.Expose upper electrode 27a in D portion, itself and the 1st electrode pads 29a conduct.And by applying voltage to the 1st electrode pads 29a (the 3rd electrode pads 29c) and the 2nd electrode pads 29b (the 4th electrode pads 29d) thus, the film piezoelectric 26 of the 1st drive unit 16a (and the 2nd drive unit 16b) can be made to stretch.Represent point extreme direction of film piezoelectric 26 with arrow in figure.If apply negative voltage to the 2nd electrode pads 29b, apply positive voltage to the 1st electrode pads 29a, film piezoelectric 26 just shrinks to direction in the face of piezoelectric membrane by piezoelectric constant d31.
Fig. 6 is the planimetric map seeing the front main portion of the head stack 2 involved by the preferred embodiment of the present invention from upper surface side (i.e. slide block 3 side).Fig. 7 is the planimetric map seeing the front main portion of the head stack involved by the preferred embodiment of the present invention from lower face side (namely from the head stack 2 of Fig. 6 viewed from rear side).And do not indicate load beam 14 in figure.Slide block 3 is bonded on slider support plate 20, and is provided with and corresponds to the magnetic head element of magnetic head electrode terminal 31 and to connect up 25 (i.e. wiring portions) and being connected by solder ball.
In figure 6, slider support plate 20 is being configured at the 1st and the 2nd outrigger 22a of both sides, and the part in 22b forms the 1st bend 32a and the 2nd bend 32b.And be configured to the 1st and the 2nd bend 32a making left and right, the intersection point of the respective extended line of 32b is consistent with fulcrum projection 21.And slider support plate 20 is by being arranged at the 1st and the 2nd outrigger 22a, and the 1st bend 32a on the centre position of 22b and the effect of the 2nd bend 32b, rotate centered by fulcrum projection 21.
On slider support plate 20, the axes of inertia being formed with the rotation direction of the rotating part by comprising slide block 3 are set as the balance portion 33 consistent with fulcrum projection 21.And be formed when slide block 3 unloads from disk on slider support plate 20, in order to hold up the T-shaped limiter portion 34 of slide block 3, it engages with the hole portion 35 be formed in load beam 14.In addition, when working at ordinary times, usually because there being gap not contact with each other between T-shaped limiter portion 34 and hole portion 35.
Magnetic head element wiring 25 (wiring portions) configure with the form around slide block 3, and its end is connected with the magnetic head electrode terminal 31 of slide block 3.The the 1st and the 2nd outrigger 22a is being fixed in this magnetic head element wiring 25 (wiring portions), while on 22b (the C-C part see Fig. 6), be fixed on the 1st driving rib 36a and the 2nd extended from slider support plate 20 too and drive rib 36b (the F-F part see Fig. 6).
1st and the 2nd drive unit 16a, 16b apply voltage by the 1st, the 2nd, the 3rd, the 4th electrode pads 29a, 29b, 29c, 29d and are driven.Drive wiring 37a to be configured to input to the 1st electrode pads 29a of the 1st drive unit 16a and the 4th electrode pads 29d of the 2nd drive unit 16b, ground connection wiring 37b is configured to the 3rd electrode pads 29c of the 2nd electrode pads 29b of the 1st drive unit 16a and the 2nd drive unit 16b to connect.Thus, if input alternating driving signal to driving wiring 37a, the 1st drive unit 16a and the 2nd drive unit 16b can be made to do stretching motion towards mutually opposite direction.
Flex member 15 to be configured on the stainless steel of thick 18 μm the insulation courses 41 such as coating polyimide, then forms magnetic head element wiring 25 (wiring portions) thereon.Further, in order to the object that the insulation or protection that reach wiring are connected up, the wiring cap layer 42 such as polyimide are used to cover.The function of the necessary mechanism of flex member 15 is ensured by stainless steel flex member substrate 24 being processed into arbitrary shape with etch process.To the flex member structure shown in Fig. 6 (Fig. 7), in Fig. 8 a to Fig. 8 e, be divided into several section describe respectively.Fig. 8 a is the sectional view of the C-C section represented in Fig. 6.The sectional view that Fig. 8 b is the D-D section represented in Fig. 6, Fig. 8 c is F-F section in Fig. 6, Fig. 8 d is H-H section in Fig. 6, Fig. 8 e is the G-G section in Fig. 6.D-D section and G-G section are same section shapes, and the stainless steel of its magnetic head element wiring 25 (wiring portion) bottom is removed by etching.
Fig. 9 is the sectional view representing the section (the E-E section namely in Fig. 6) in the head stack 2 involved by the preferred embodiment of the present invention, the 1st drive unit 16a being bonded in the part in flex member 15.By leaving a part of flex member substrate 24 to form the 1st connecting rod 39a place of stiffening plate 43a, the position that the 1st drive unit 16a is overlapping with stiffening plate 43a in its leading section, be bonded on the 1st piezoelectrics support portion 23a.Equally, by leaving a part of flex member substrate 24 to form the 2nd connecting rod 39b place of stiffening plate 43b, the position that the 2nd drive unit 16b is overlapping with stiffening plate 43b in its leading section, be bonded on the 2nd piezoelectrics support portion 23b.This is to the displacement of film piezoelectric 26 be conveyed to effectively the 1st connecting rod 39a (with the 2nd connecting rod 39b).And, as shown in Figure 9, the 39a of the 1st and the 2nd connecting rod by the magnetic head element to magnetic head element 7 transmission signal connect up 25 and the stiffening plate 43a that partly strengthens this magnetic head element wiring portion 25 form.
1st connecting rod 39a is arranged between the 1st tie point 40a and the 2nd tie point 40b and connects.1st tie point 40a and the 1st drives rib 36a to be connected, and the 2nd tie point 40b is connected (see Fig. 7) with the 1st fixed part 24a of the part as flex member 15.Equally, the 2nd connecting rod 39b is arranged between the 3rd tie point 40c and the 4th tie point 40d and connects.3rd tie point 40c and the 2nd drives rib 36b to be connected, and the 4th tie point 40d supports (see Fig. 7) by the 2nd fixed part 24b of the part as flex member 15.3rd and the 4th tie point 40c, the structure of 40d and the 1st and the 2nd tie point 40a, 40b is identical.As shown in Fig. 8 e, the 1st tie point 40a is formed by magnetic head element 25 (the wiring portions) that connect up of the flex member substrate 24 by etching removing flex member 15.Equally, as shown in Fig. 8 d, the 2nd tie point 40b is formed by magnetic head element 25 (the wiring portions) that connect up of the flex member substrate 24 by etching removing flex member 15.Because the 1st tie point and the 2nd tie point 40a, 40b are compared with in the more soft structure of the 1st connecting rod 39a, so when the 1st drive unit 16a stretching motion, the 1st connecting rod 39a can carry out trickle rotational motion centered by the 2nd tie point 40b.Equally, during the 2nd drive unit 16b stretching motion, the 2nd connecting rod 39b can carry out trickle rotational motion centered by the 4th tie point 40d.
In addition, in each relevant drawings, the base plate 13 of head stack 2 and the load beam 14 all relatively central shaft parallel with Y direction are that line is symmetrical.And, the structure of the 1st connecting rod 39a and the 2nd connecting rod 39b, the 1st tie point 40a and the 2nd tie point 40b, the 3rd tie point 40c and the 4th tie point 40d and the part such as the 1st drive unit 16a and the 2nd drive unit 16b is also in the accompanying drawing that each is relevant, and the central shaft parallel with Y direction is that line is symmetrical all relatively.
In figure 6 and figure 7, be provided with the 1st separating tank 44a the 1st drive unit 16a and the 2nd tie point 40b and flex member substrate 24 separated, and the 1st separating tank 44a is formed in the scope suitable with the length of the length direction (X-direction) along film piezoelectric 26.The displacement of film piezoelectric 26 can be freed from the constraint of the 2nd tie point 40b and flex member substrate 24 that comprise magnetic head element wiring portion 25 (wiring portion) by the 1st separating tank 44a, thus displacement is maximized.In addition, head stack 2 is that relatively the central shaft parallel with Y direction is the shape of line symmetry, is also therefore like this according to Fig. 6 the 2nd separating tank 44b.
Figure 10 is that 16b slide block 3 carries out the simplified model figure of the mechanism of rotational motion centered by fulcrum projection 21 by the 1st in Fig. 6 and the 2nd drive unit 16a, is the situation seen from the side, the back side of head stack 2.One end of 1st drive unit 16a is fixed on the 1st L-shaped connecting rod 39a, and its other end is fixed on flex member substrate 24.On two ends of the 1st connecting rod 39a, be formed with the 1st tie point 40a and the 2nd tie point 40b.
1st tie point 40a is exactly the region driving rib 36a and the 1st connecting rod 39a to fold by the 1st in Fig. 7.And the 2nd tie point 40b is equally also equivalent to the region that folded by the 1st connecting rod 39a and flex member substrate 24 in Fig. 7.Equally, the 3rd tie point 40c is the region driving rib 36b to fold by the 2nd connecting rod 39b and the 2nd.And the 4th tie point 40d is equally also equivalent to the region that folded by the 2nd connecting rod 39b and flex member substrate 24.Deserve the 1st to the 4th tie point 40a ~ 40d because with etching eliminate flex member substrate 24 and can be soft bend.
As can be seen from Figure 10, the 1st line segment L1 of the 1st tie point 40a and the 2nd tie point 40b and the 2nd line segment L2 being connected the 3rd tie point 40c and the 4th tie point 40d is connected, preferably crossing in the fulcrum projection 21 of load beam 14.That be because, 1st line segment L1 rotates centered by tie point 40b, and the 2nd line segment L2 rotates centered by tie point 40d, because 21 being consistent by the moment center calcaneus branches point projection in the 1st line segment L1, the 2nd line segment L2 and the structure that slide block 3 forms in slide block rotational motion.That is, if when fulcrum projection 21 is consistent with moment center, the load loading on its rotational action can disappear, thus can obtain larger rotation displacement.
Figure 11 is that 16b slide block 3 carries out the simplified model figure of the state of rotational motion centered by fulcrum projection 21 by the 1st in Figure 10 and the 2nd drive unit 16a, is the situation seen from the side, the back side of head stack 2.Next by Figure 11, the action of rotating mechanism as constituted above is described.First, after the 2nd drive unit 16b is applied in voltage, namely in polarised direction, be applied with electric field, cause the 2nd drive unit 16b to shrink.On the other hand, the 1st drive unit 16a is also because extending with the 2nd diametical direction of drive unit 16b being applied in same voltage.The deformed shape of above-mentioned driver part individuality is represented in addition with dotted line.Thus, the 1st connecting rod 39a while moving in the direction of the clock centered by the 2nd tie point 40b, and the 2nd connecting rod 39b also presses equidirectional and rotates centered by the 4th tie point 40d.Here, because fulcrum projection 21, the 1st tie point 40a and the 2nd tie point 40b configure point-blank, the 1st tie point 40a rotates centered by fulcrum projection 21.Equally, because of fulcrum projection 21, the 3rd tie point 40c and the 4th tie point 40d also point-blank, so the 3rd tie point 40c also centered by fulcrum projection 21 rotate.But slide block 3 is but in rotating counterclockwise centered by fulcrum projection 21.
Embodiment
Below, according to the present embodiment, illustrated by embodiment and conventional example magnetic head displacement can be made to increase.Figure 12 is the illustraton of model simplified the head stack 2 of existing structure (conventional example).Figure 12 is used to represent the computing method of magnetic head displacement x.
Mathematical expression 1 is the computing formula of the magnetic head displacement x1 (nm/V) in conventional example.Wherein d31 is piezoelectric constant, V applies voltage, L is the length of piezoelectrics, E is the longitudinal modulus of elasticity of piezoelectrics, and W is the width of piezoelectrics, and K is upper electrode 27a, lower electrode 27b, the 1st and the 2nd bend 32a, mechanism load 38 on 32b and each tie point, t is the thickness of piezoelectrics, C3 be fulcrum projection 21 with the distance between magnetic head element 7, C4 be in prior art tie point 40e with the distance between fulcrum projection 21.According to mathematical expression 1, such as, substitute into effective shift length L=90 μm of membrane piezoelectric element, during the wide W=360 μm of effective displacement, the displacement x1 that can calculate the magnetic head element in prior art model is 9.15nm.
Mathematical expression 1
Figure 13 is the illustraton of model simplified the structure of the head stack 2 of the embodiment based on embodiment of the present invention.The present embodiment employs and onesize membrane piezoelectric element 16a in conventional example, 16b (i.e. the 1st and the 2nd drive unit 16a, 16b).Figure 13 is used to represent the computing method of magnetic head displacement x2.Mathematical expression 2 is the computing formula of the magnetic head displacement x2 (nm/V) in the present embodiment.Wherein a be from the 4th tie point 40d to the 2nd drive unit 16b away from slide block 3 side end distance in the X direction, C1 is the distance between the 3rd tie point 40c to the 4th tie point 40d, C2 is the distance between the 3rd tie point 40c to fulcrum projection 21, C3 is the distance between fulcrum projection 21 to magnetic head element 7, and C4 is distance in the X direction between magnetic head element 7 to the 3 tie point 40c.Calculate according to mathematical expression 2, can show that the displacement x2 of the magnetic head element in the present embodiment is 17.3nm.
Mathematical expression 2
The result of above-mentioned calculating is: the displacement x1 of the magnetic head element of prior art is 9.15nm, and the displacement x2 of the magnetic head element in the present embodiment is 17.3nm.The result of calculation of conventional example with the present embodiment is compared, can confirm that the present embodiment improves than prior art on displacement x nearly more than 2 times.
Figure 14 represents under the model of Figure 13, assuming that film piezoelectric element (i.e. the 1st and the 2nd drive unit 16a, the area (=L*W) of effective displacement portion 16b) is constant, getting transverse axis is film piezoelectric element (i.e. the 1st and the 2nd drive unit 16a, the ratio of length L 16b) and wide W, the result of calculation of the magnetic head displacement then during change length breadth ratio L/W.In addition, situation when line 1 outgoing mechanism load 38 is standard value, situation when line 2 outgoing mechanism load 38 is 2 times of standard value, result of calculation when when line 3 outgoing mechanism load 38 is 3 times of standard value.As can be seen from the figure along with the increase displacement of mechanism load 38 correspondingly reduces.And when length breadth ratio L/W becomes large and when exceeding a certain limit, although magnetic head displacement x improves, its degree improved slows down thereupon.This is because when area immobilizes, if length breadth ratio L/W improves, its width dimensions will reduce to cause bearing driving load certainly thereupon, so it is limited for improving length breadth ratio L/W.In addition, so-called magnetic head displacement x is exactly the displacement of the magnetic head element 7 of film piezoelectric element (i.e. the 1st and the 2nd drive unit 16a, 16b) when driving slide block 3 to rotate centered by fulcrum projection 21.Magnetic head displacement x is the bigger the better.
Figure 15 is the figure representing the rotating stiff of slide block 3 when getting transverse axis and being the length breadth ratio L/W of film piezoelectric element (i.e. the 1st and the 2nd drive unit 16a, 16b).As can be seen from the figure along with the increase of length breadth ratio L/W, the rotating stiff of slide block 3 reduces.Namely, in fig. 14, when length breadth ratio L/W reaches more than 2, the improvement degree of displacement can slow up.And in fig .15, when length breadth ratio L/W reaches more than 2, the rotating stiff of slide block 3 reduces degree and can become slow.Therefore exist a kind of compromise between the rotating stiff feature can saying displacement characteristic sum Figure 15 of Figure 14.Therefore, the length breadth ratio L/W of film piezoelectric element (i.e. the 1st and the 2nd drive unit 16a, 16b) preferably gets more than 2, the displacement of magnetic head can be made to stablize, and make the rotating stiff of slide block 3 be in larger state as much as possible under this length breadth ratio.And the improvement effect of the displacement of magnetic head disappears when length breadth ratio L/W reaches more than 5, the rotating stiff of slide block 3 starts to reduce simultaneously.Therefore, preferably length breadth ratio L/W is set in less than 5.
As mentioned above, according to the present embodiment, the volume that can not increase film piezoelectric element (i.e. the 1st and the 2nd drive unit 16a, 16b) can be obtained, and obtain effectively desirable magnetic head displacement, and the head stack 2 that drives expeditiously can be realized.And, different from the wire structures described in patent documentation 1, because do not adopt the structure connected up around membrane piezoelectric element, so membrane piezoelectric element (i.e. the 1st and the 2nd drive unit 16a, 16b) when being out of shape, wiring can be stretched independently, can not suppress the displacement of membrane piezoelectric element, on the contrary can efficiently displacement enlargement by utilizing this wiring portion to form connecting rod.Therefore, it is possible to realize the displacement using the membrane piezoelectric element of miniaturization more to guarantee regulation, and the cost degradation of this assembly can be realized.
Claims (5)
1. a head stack, wherein has the slider support of magnetic head element on the slider support plate being formed at flex member, and this slider support plate can rotate around the fulcrum projection on the leading section being arranged at load beam, it is characterized in that, comprising:
1st connecting rod, it is configured to connect between the 1st tie point be connected with described slider support plate and the 2nd tie point be connected with the 1st fixed part;
2nd connecting rod, it is configured to connect between the 3rd tie point be connected with described slider support plate and the 4th tie point be connected with the 2nd fixed part;
1st drive unit, it drives described 1st connecting rod; And
2nd drive unit, it drives described 2nd connecting rod.
2. head stack according to claim 1, it is characterized in that, by consistent with described fulcrum projection for the intersection point connecting described 1st tie point crossing afterwards with the 2nd line segment prolongation of described 4th tie point with being connected described 3rd tie point with the 1st line segment of described 2nd tie point.
3. head stack according to claim 1 and 2, is characterized in that, described 1st connecting rod and the 2nd connecting rod comprise to be passed on the wiring portion of signal to described magnetic head element and partly strengthen the stiffening plate in described wiring portion.
4. head stack according to any one of claim 1 to 3, it is characterized in that, there is the 1st separating tank be arranged between described 1st drive unit and described 2nd tie point, and be arranged at the 2nd separating tank between described 2nd drive unit and described 4th tie point.
5. head stack according to any one of claim 1 to 4, is characterized in that, the Aspect Ratio L/W of the area of described 1st drive unit and described 2nd drive unit is more than 2.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014024289A JP5983649B2 (en) | 2014-02-12 | 2014-02-12 | Head assembly |
| JP2014-024289 | 2014-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104835511A true CN104835511A (en) | 2015-08-12 |
| CN104835511B CN104835511B (en) | 2018-05-04 |
Family
ID=53813347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510075880.3A Expired - Fee Related CN104835511B (en) | 2014-02-12 | 2015-02-12 | Head stack |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5983649B2 (en) |
| CN (1) | CN104835511B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473572A (en) * | 2019-08-23 | 2019-11-19 | 杭州勤语智能科技有限公司 | A kind of induction magnetic-head apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102087856A (en) * | 2009-12-03 | 2011-06-08 | Tdk株式会社 | Magnetic head assembly, magnetic disk and rotary mechanism |
| JP2012238350A (en) * | 2011-05-11 | 2012-12-06 | Tdk Corp | Head support mechanism |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3785329B2 (en) * | 2001-03-21 | 2006-06-14 | 松下電器産業株式会社 | Head support mechanism |
| JP2003274676A (en) * | 2002-03-12 | 2003-09-26 | Matsushita Electric Ind Co Ltd | Piezoelectric actuator, head actuator, and disk type information recording/reproducing apparatus |
-
2014
- 2014-02-12 JP JP2014024289A patent/JP5983649B2/en not_active Expired - Fee Related
-
2015
- 2015-02-12 CN CN201510075880.3A patent/CN104835511B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102087856A (en) * | 2009-12-03 | 2011-06-08 | Tdk株式会社 | Magnetic head assembly, magnetic disk and rotary mechanism |
| JP2012238350A (en) * | 2011-05-11 | 2012-12-06 | Tdk Corp | Head support mechanism |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473572A (en) * | 2019-08-23 | 2019-11-19 | 杭州勤语智能科技有限公司 | A kind of induction magnetic-head apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015153433A (en) | 2015-08-24 |
| JP5983649B2 (en) | 2016-09-06 |
| CN104835511B (en) | 2018-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8289654B2 (en) | Head assembly, magnetic disk drive apparatus and rotation mechanism | |
| US8295012B1 (en) | Disk drive suspension assembly with rotary fine actuator at flexure tongue | |
| US7417831B2 (en) | Micro-actuator and head gimbal assembly for a disk drive device | |
| US20110019310A1 (en) | Head gimbal assembly, suspension for the head gimbal assembly, and disk drive unit with the same | |
| JP2009080915A (en) | Head suspension and piezoelectric actuator | |
| US20020126420A1 (en) | Method and apparatus for improved attachment of a micro-actuator to a slider device | |
| US9607637B2 (en) | Head assembly and magnetic disk device | |
| CN104867501A (en) | Head Gimbal Assembly And Disk Device With The Same | |
| US8810971B1 (en) | Single sheet differential-poled piezoelectric microactuator for a hard disk drive | |
| US8035924B2 (en) | Suspension for disc drive | |
| KR100960771B1 (en) | Piezoelectric actuator and disc device | |
| US20180005654A1 (en) | Head assembly and magnetic disk device | |
| JP2005078753A (en) | Flexure, suspension, and head gimbals assembly | |
| CN102087856B (en) | Magnetic head assembly, magnetic disk and rotary mechanism | |
| CN104835511A (en) | Magnetic head assembly | |
| US7826178B2 (en) | Microactuator, head gimbal assembly and hard disk drive using the same, and manufacturing method thereof | |
| CN105390147A (en) | Dynamic vibration absorber, flexure, and head support mechanism | |
| US9076469B1 (en) | Head assembly | |
| US20040130830A1 (en) | Suspension for magnetic head | |
| US6052259A (en) | Head support arm having conductive wires of a disk drive device | |
| US20100097728A1 (en) | Head suspension assembly and storage medium drive apparatus | |
| US20090067096A1 (en) | Gimbal assembly | |
| JP6146462B2 (en) | Head assembly and magnetic disk drive | |
| CN111148599B (en) | Abrasive tool assembly, method of using same, and abrasive tool actuator insert | |
| JP2000113615A (en) | Magnetic disk drive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180504 Termination date: 20210212 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |