CN104830039B - A kind of PC/ABS doped and compounded ultra-toughness chemical resistant material and in the application of communication technology - Google Patents
A kind of PC/ABS doped and compounded ultra-toughness chemical resistant material and in the application of communication technology Download PDFInfo
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- CN104830039B CN104830039B CN201510165514.7A CN201510165514A CN104830039B CN 104830039 B CN104830039 B CN 104830039B CN 201510165514 A CN201510165514 A CN 201510165514A CN 104830039 B CN104830039 B CN 104830039B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The present invention relates to PC/ABS doped and compounded ultra-toughness chemical resistant material and the application in communication technology thereof, described material includes following component: bisphenol A-type PC55～65% by weight percentage；ABS18～22%；Kynoar 9～11%；EPDM g MAH5～7%；Heat stabilizer 0.1～0.3%；Bimaleimide resin 2～4%；Organic silicone oil 0.6～1%；Described composite each weight percentages of components sum is 100%.The doped and compounded ultra-toughness chemical resistant material that the present invention provides has excellent stable magnetic field, insulating properties, cold and hot stability and radiation resistance.The doped and compounded ultra-toughness chemical resistant material that the present invention provides can be used in the housing of mobile terminal, or the internal connection position for mobile terminal；It is preferred for the housing of mobile phone or computer, or the internal connection position of mobile phone or computer.
Description
Technical field
The invention belongs to macromolecule material preparation area, be specifically related to a kind of PC/ABS composite and application thereof, be specifically related to a kind of PC/ABS doped and compounded ultra-toughness chemical resistant material and the application in communication technology thereof.
Background technology
PC/ABS (polycarbonate/acrylonitrile-butadiene-phenylethene copolymer) composite is the engineering plastics of a kind of good combination property, the advantage having PC and ABS concurrently, both there is excellent mechanical performance and hot property, there is again forming, the feature that stress crack resistant ability is good, is suitable for making housing or internal connector.
But, when PC/ABS composite is for making the housing of communication electronic equipment or internal connector, its heat stability, stable magnetic field and the anti-interference of magnetic field is had certain requirement, therefore, there is a kind of PC/ABS composite that can be used in electric terminal equipment of requirement developing this area.
Summary of the invention
For prior art, it is an object of the invention to provide a kind of PC/ABS composite, described composite includes following component by weight percentage:
Described composite each weight percentages of components sum is 100%.
The present invention is by the optimization to each constituent species and content, it is thus achieved that a kind of PC/ABS composite, and described PC/ABS composite, while having good thermal stability, resistance to stress excellent effect, has stable magnetic field, reduces the effect radiated.
The weight average molecular weight of bisphenol A-type PC of the present invention is >=28000.
Bisphenol-A is mainly for the production of multiple macromolecular materials such as Merlon, epoxy resin, ABS, AS, PVC, PMMA, polysulfone resin, polyphenylene oxide resin, unsaturated polyester resins；Can also be used for producing the fine chemical products such as plasticizer, fire retardant, antioxidant, heat stabilizer, rubber antioxidant, pesticide, coating.In the manufacture process of plastic, add bisphenol-A and can make it have the characteristic such as water white transparency, durable, light and handy and prominent protecting against shock, be widely used in: mobile phone, computer, space flight and aviation, electronic devices and components, household electrical appliance etc..
ABS (acrylonitrile-butadiene-styrene copolymer) be acrylonitrile (acrylonitrile), 1,3-butadiene (1,3-butadiene), the graft copolymer of styrene (styrene) three kinds of monomers, it is a kind of intensity height, good toughness, thermoplastics type's macromolecular material easily processed into type, can be blended with PC, PVC material, adulterate, be combined, be suitable to make common mechanical part, anti-attrition wear part, driving parts and telecommunication part.It is good that ABS has higher impact strength, chemical stability, electrical property, has high-impact, the high performance such as heat-resisting, fire-retardant.
In ABS of the present invention, acrylonitrile, butadiene and cinnamic mass ratio are 60:20:20.
PVDF resin is primarily referred to as the copolymer of vinylidene fluoride homopolymer or vinylidene and other a small amount of fluorine-containing vinyl monomers, is Piezoelectricity under normality, and degree of crystallinity is about 50%.Hitherto reported has 5 kinds of crystal formations such as α, β, γ, δ and ε, and the PVDF applied as piezoelectricity and pyroelectricity mainly contains beta crystal.PVDF is white powder crystalline polymer, and density is 1.75～1.78g/cm3, glass transition temperature is-39 DEG C, and brittle temperature is-62 DEG C, fusing point 170 DEG C, heat decomposition temperature about 350 DEG C, life-time service temperature-40～150 DEG C.
PVDF has outside good chemical resistance, heat-resisting quantity, oxidative resistance, weatherability, resistance to x radiation x performance, also there is the properties such as piezoelectricity, dielectricity, pyroelectricity, there is excellent wearability, pliability, the highest anti-intensity and the resistance to impact intensity of rising, PVDF hydrophilic is poor, and thermostability is good and has high dielectric strength.The mechanical strength of PVDF is high, and radioresistance is good, has good chemical stability, is not corroded by soda acid, strong oxidizer and halogen.
PVDF can process by general thermoplastics processing method, such as extrusion molding, is molded, pours into a mould, molds and Transfer molding.
The weight average molecular weight of Kynoar of the present invention is >=370000；Density is 1.75～1.78g/cm3, glass transition temperature is-39 DEG C, and catalytic temperature is-62 DEG C.
Ethylene propylene diene rubber (EPDM) is ethylene, propylene and the terpolymer of non-conjugated diene hydrocarbon.EPDM-g-MAH (maleic anhydride grafting ethylene propylene diene rubber) is to be prepared by ethylene propylene diene rubber EPDM reacted extruding graft maleic anhydride, owing to introducing highly polar side base on nonpolar molecular backbone, maleic anhydride grafting EPDM has the good compatibility with polar resin, is commonly used for toughener toughness reinforcing PC/ABS composite.
EPDM-g-MAH improves the compatibility of PC Yu EPDM, EPDM-g-MAH Yu PC/ABS obtained with the EPDM of modest viscosity is blended, and dispersed phase size is less and is uniformly dispersed, and the mechanical property of co-mixing system is improved.
EPDM good springiness, mechanical performance ozone high, corrosion-resistant, ventilative and low temperature resistant and heat-resisting, resistance to, UV resistant and water-fast, can be used for the present invention, and the EPDM-g-MAH after grafted maleic anhydride improve the compatibility of PC Yu EPDM.
In EPDM-g-MAH of the present invention, the Mooney viscosity of ethylene propylene diene rubber is 20～100Pa s；Molecular weight distribution is 2～5.Wherein, molecular weight distribution is the ratio of weight average molecular weight and number average molecular weight.The ratio of maleic anhydride and ethylene propylene diene rubber is 2～5:7, preferably 3:7；The density of maleic anhydride is 1.2～1.5g/cm3, preferably 1.3g/cm3；Fusing point is 50～55 DEG C, preferably 52.8 DEG C；Boiling point is 200～210 DEG C, preferably 208 DEG C.
Heat stabilizer of the present invention is antioxidant DSTP (distearyl thiodipropionate).
Preferably, described DSTP saponification number is 160～170mgKOH/g, and acid number is≤0.5mgKOH/g.
The outward appearance of antioxidant DSTP is white powder or granule；Fusing point 63.5 DEG C～68.5 DEG C；Nontoxic, it is soluble in alcohols, acetone, ether, insoluble in cold water, is excellent sulfuration esters auxiliary antioxidant, using effect is higher than DLTP, particularly in polypropylene and high density polyethylene (HDPE), not colored, do not pollute.
Antioxidant DSTP toxicity is relatively low, rat LD50 of passing through mouth > 2500mg/Kg, white mice LD50 of passing through mouth > 2000mg/Kg, feeds rat 2 years with the feedstuff containing antioxidant DSTP3%, the growth of animal and body tissue no abnormality seen.
Described bimaleimide resin is N, a N '-penylene BMI, its purity >=80%, and fusing point is 80～90 DEG C.
N, a N '-penylene BMI (HVA-2) is on the anti-reduction of NR and in the different cure time impacts on mechanical property of vulcanized rubber, HVA-2 has good anti-effect of reverting, at 143 DEG C after the longer cure time of 1h vulcanizes, vulcanizate still has preferable mechanical property, and especially 300% stretching strength and tearing strength improve a lot.HVA-2 Yu PC/ABS is blended, adulterates, is combined, coextrusion afterwards by the application.
The weight average molecular weight of described organic silicone oil is 20000～50000, preferably 40000.
As optimal technical scheme, PC/ABS composite of the present invention includes following component by weight percentage:
The proportioning raw materials of PC/ABS composite of the present invention is as previously mentioned, its preparation method is: by the bisphenol A-type PC of formula ratio, acrylonitrile/butadiene/styrene copolymer, Kynoar, EPDM-g-MAH, heat stabilizer, BMI, organic silicone oil mix homogeneously, melting mixing, extruding pelletization i.e. obtains PC/ABS composite.
The two of the purpose of the present invention are to provide the purposes of a kind of PC/ABS composite as described in one of purpose, and described PC/ABS composite is for the housing of mobile terminal, or the internal connection position for mobile terminal；
Preferably, described PC/ABS composite is used for mobile phone or the housing of computer, or mobile phone or computer internal connection position.
Compared with prior art, the method have the advantages that
The PC/ABS composite that the present invention provides has excellent stable magnetic field, insulating properties, cold and hot stability and radiation resistance.
Detailed description of the invention
Technical scheme is further illustrated below by detailed description of the invention.
Those skilled in the art, it will be clearly understood that the only help of described embodiment understands the present invention, are not construed as the concrete restriction to the present invention.
The preparation method of the PC/ABS composite that the present invention provides is: by the bisphenol A-type PC of formula ratio, acrylonitrile/butadiene/styrene copolymer, Kynoar, EPDM-g-MAH, heat stabilizer, BMI, organic silicone oil mix homogeneously, melting mixing, extruding pelletization i.e. obtains PC/ABS composite.Embodiment 1
A kind of PC/ABS doped and compounded ultra-toughness chemical resistant material, includes following component by weight percentage:
Embodiment 2
A kind of PC/ABS doped and compounded ultra-toughness chemical resistant material, includes following component by weight percentage:
Embodiment 3
A kind of PC/ABS doped and compounded ultra-toughness chemical resistant material, includes following component by weight percentage:
Embodiment 4
A kind of PC/ABS doped and compounded ultra-toughness chemical resistant material, includes following component by weight percentage:
Embodiment 5
A kind of PC/ABS doped and compounded ultra-toughness chemical resistant material, includes following component by weight percentage:
Performance test:
The PC/ABS composite that embodiment 1～5 provides being prepared as housing, tests it and be not less than 3000V (DC)/1min at low frequency magnetic field stability inferior, proof voltage, insulation resistance is not less than 2 × 104M Ω/500V (DC)；The housing prepared distribution is placed in high temperature and low temperature environment, tests cold and hot stability；It is 500-3000/cm that the housing prepared is placed in wave number, and temperature tests the signal of enclosure interior under conditions of being 100 DEG C-300 DEG C；Test result is as shown in table 1.
The performance test results of table 1 embodiment 1～5
As it can be seen from table 1 the PC/ABS composite that the present invention provides has stable magnetic field, cold and hot stability and the radiation resistance of excellence.
Applicant states, the present invention illustrates the process of the present invention by above-described embodiment, but the invention is not limited in above-mentioned processing step, does not i.e. mean that the present invention has to rely on above-mentioned processing step and could implement.Person of ordinary skill in the field is it will be clearly understood that any improvement in the present invention, and the equivalence to raw material selected by the present invention is replaced and the interpolation of auxiliary element, concrete way choice etc., within the scope of all falling within protection scope of the present invention and disclosure.
Claims (3)
1. the PC/ABS composite for mobile terminal, it is characterised in that described composite is pressed
Percentage by weight includes following component:
Described composite each weight percentages of components sum is 100%；
The weight average molecular weight of described bisphenol A-type PC is >=28000；
In described ABS, acrylonitrile, butadiene and cinnamic mass ratio are 60:20:20；
Weight average molecular weight >=370000 of described Kynoar；Density is 1.75～1.78g/cm3, vitrification
Transition temperature is-39 DEG C, and catalytic temperature is-62 DEG C；
In described EPDM-g-MAH, the Mooney viscosity of ethylene propylene diene rubber is 20～100Pa s；Molecular weight divides
Cloth is 2～5；The ratio of maleic anhydride and ethylene propylene diene rubber is 2～5:7；The density of maleic anhydride is
1.2～1.5g/cm3；Fusing point is 50～55 DEG C；Boiling point is 200～210 DEG C；
Described heat stabilizer is antioxidant DSTP；Described DSTP saponification number is 160～170mgKOH/g, acid
Value is≤0.5mgKOH/g；
Described bimaleimide resin is N, a N '-penylene BMI, its purity >=80%, molten
Point is 80～90 DEG C；The weight average molecular weight of described organic silicone oil is 20000～50000；
Its preparation method is: by the bisphenol A-type PC of formula ratio, acrylonitrile/butadiene/styrene copolymer,
The mixing of Kynoar, EPDM-g-MAH, heat stabilizer, BMI, organic silicone oil is all
Even, melting mixing, extruding pelletization i.e. obtains PC/ABS composite；
The described PC/ABS composite for mobile terminal is for the housing of mobile terminal, or is used for moving
The internal connection position of dynamic terminal.
2. as claimed in claim 1 for the PC/ABS composite of mobile terminal, it is characterised in that institute
The ratio of maleic anhydride and ethylene propylene diene rubber in EPDM-g-MAH of stating is 3:7；The density of maleic anhydride is
1.3g/cm3；Fusing point is 52.8 DEG C；Boiling point is 208 DEG C.
3. as claimed in claim 1 for the PC/ABS composite of mobile terminal, it is characterised in that institute
State composite and include following component by weight percentage:
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| CN201510165514.7A CN104830039B (en) | 2015-04-09 | 2015-04-09 | A kind of PC/ABS doped and compounded ultra-toughness chemical resistant material and in the application of communication technology |
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| CN201510165514.7A CN104830039B (en) | 2015-04-09 | 2015-04-09 | A kind of PC/ABS doped and compounded ultra-toughness chemical resistant material and in the application of communication technology |
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| CN104830039A CN104830039A (en) | 2015-08-12 |
| CN104830039B true CN104830039B (en) | 2016-09-14 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105542381B (en) * | 2016-01-20 | 2018-06-05 | 韩淑芹 | Portable computer housing and its preparation process |
| CN107245236A (en) * | 2017-06-29 | 2017-10-13 | 上海锦湖日丽塑料有限公司 | PC/ABS alloy materials of high resistance to chemicals moral character and preparation method thereof |
| CN111234499A (en) * | 2020-02-18 | 2020-06-05 | 东莞市高能高分子材料有限公司 | PC/ABS composite material and preparation method thereof |
Citations (2)
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| CN1922273A (en) * | 2003-12-30 | 2007-02-28 | 通用电气公司 | Resin compositions and preparation method thereof, and article prepared thereby |
| CN101759975A (en) * | 2008-11-21 | 2010-06-30 | 上海普利特复合材料股份有限公司 | Heat-resistant glass fiber-reinforced PC/ABC composite material and preparation method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1922273A (en) * | 2003-12-30 | 2007-02-28 | 通用电气公司 | Resin compositions and preparation method thereof, and article prepared thereby |
| CN101759975A (en) * | 2008-11-21 | 2010-06-30 | 上海普利特复合材料股份有限公司 | Heat-resistant glass fiber-reinforced PC/ABC composite material and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 聚碳酸酯对聚偏氟乙烯结构和结晶行为的影响;杜峰等;《南京工业大学学报（自然科学版）》;20100731;第32卷(第4期);第23-26、31页 * |
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