CN104827184A - Welding method for high-power laser chip - Google Patents
Welding method for high-power laser chip Download PDFInfo
- Publication number
- CN104827184A CN104827184A CN201510252992.1A CN201510252992A CN104827184A CN 104827184 A CN104827184 A CN 104827184A CN 201510252992 A CN201510252992 A CN 201510252992A CN 104827184 A CN104827184 A CN 104827184A
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- China
- Prior art keywords
- laser chip
- fixture
- positioning chamber
- welding method
- welding
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Semiconductor Lasers (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a welding method for a high-power laser chip. The welding method for the high-power laser chip comprises the following steps that 1, a laser chip is positioned into a fixture, a silicon wafer is placed by being closely attached onto one side wall of a positioning cavity in a fixture base, then a heat sink is placed on the bottom of the positioning cavity, the laser chip is arranged on the heat sink, the laser chip is champed into a clamping groove of a positioning piece, finally, a wedge-shaped inserting block is closely inserted from the other side wall of the positioning cavity, one side wall and the other side wall are two side walls parallel to each other, and then the fixture base is covered with a fixture top cover; 2, a gravity pressing block is inserted into the positioning cavity from a window in the fixture top cover to enable the gravity pressing block to be tightly pressed onto the laser chip; 3, the whole fixture and the gravity pressing block are placed into a vacuum back flow furnace to be heated, and the welding of the laser chip is completed. According to the welding method for the high-power laser chip, the fixture is adopted for positioning the laser chip, the production cost is low, and the production efficiency is high.
Description
Technical field
The present invention relates to semiconductor laser technique field, particularly relate to a kind of welding method of high power laser chip.
Background technology
In field of semiconductor lasers, laser chip welding is important one technique of individual laser package.Current laser chip welding is main to bind machine, binding machine is by laser chip and the heat sink device carrying out binding, complete machine is by PLC+HMI composition control core, image automatic decimal alignment system PV310 complete destination object contraposition data calculate, product complete contraposition and after precompressed by platform be transferred to originally compress into row binding crimping; Binding machine adopts PLC control system, and platform servo drive is located, reflux heating, coordinates stainless steel hot pressure head, realizes crimping.
Adopt binding machine to weld, its shortcoming is exactly apparatus expensive, inefficiency, cannot produce in batches.Such as, the binding machine for laser chip welding needs more than 100,000 dollars, and equipment cost has high input.And the operating efficiency of binding machine is lower, binding machine every operation laser chip all needs once complete heating-up temperature backflow, approximately needs 3 minutes.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of welding method of high power laser chip of efficient, stable, low input, high for solving laser chip welding cost in prior art, the problem that production efficiency is low.
For achieving the above object and other relevant objects, the invention provides a kind of welding method of high power laser chip, it comprises the following steps:
1) laser chip is positioned in fixture, concrete position fixing process is: silicon chip is close to a wherein sidewall of a positioning chamber in clamp base and places, again by the heat sink bottom being placed in described positioning chamber, described laser chip is placed in heat sink on, and laser chip is fastened in the draw-in groove of keeper, another sidewall finally wedge shape inserted block being close to positioning chamber inserts, and a described wherein sidewall and another sidewall described are two opposing parallel sidewalls, then are located in clamp base by fixture top cover lid;
2) gravity briquetting is inserted in described positioning chamber in the window described fixture top cover, make gravity briquetting be pressed on described laser chip;
3) whole fixture and gravity briquetting are put into vacuum back-flow stove together to heat, complete the welding to laser chip.
Preferably, the side of described silicon chip has step surface, and when silicon chip inserts described positioning chamber, described step surface is towards the inside of positioning chamber, and described laser chip is positioned at the top of described step surface.
Preferably, before described laser chip location, first described fixture need be cleaned.
Preferably, described clamp base is uniformly distributed multiple described positioning chamber, its specification of laser chip be positioned in each positioning chamber is identical or different.
Preferably, in described step 3) in, multiple described fixture with laser chip is placed in described vacuum back-flow stove and heats simultaneously.
As mentioned above, the welding method of high power laser chip of the present invention, has following beneficial effect: the present invention adopts fixture to carry out locating laser chip, then is placed in vacuum back-flow stove and has heated welding, it can many people operation simultaneously, and many sleeve clamps are put into vacuum back-flow stove simultaneously and heated; Based on the flexibility of jig Design, it can be the chips welding of plurality of specifications; Fixture input cost is low, and well below the input of binding machine, and its production efficiency is higher than binding machine.
Accompanying drawing explanation
Fig. 1 is shown as described clamp base schematic diagram of the present invention.
Fig. 2 is shown as the present invention and laser chip is positioned at schematic diagram in clamp base.
Fig. 3 is shown as the profile of the line of AA shown in Fig. 2.
Fig. 4 is shown as described fixture top cover schematic diagram of the present invention.
Fig. 5 is shown as described gravity briquetting schematic diagram of the present invention.
Element numbers explanation
1 clamp base
11 positioning chambers
2 silicon chips
3 keepers
4 wedge shape inserted blocks
5 laser chips
6 is heat sink
7 fixture top covers
71 windows
8 gravity briquettings
81 insertion ends
Detailed description of the invention
By particular specific embodiment, embodiments of the present invention are described below, person skilled in the art scholar the content disclosed by this description can understand other advantages of the present invention and effect easily.
Refer to Fig. 1 to Fig. 5.Notice, structure, ratio, size etc. that this description institute accompanying drawings illustrates, content all only in order to coordinate description to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, all should still drop in scope that disclosed technology contents can contain.Simultaneously, quote in this description as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
The invention provides a kind of welding method of high power laser chip, it comprises the following steps: as shown in Figures 1 to 5,
1) laser chip 5 is positioned in fixture, before being located by laser chip 5, needs first cleaning clamp, this fixture comprises clamp base 1 and fixture top cover 7, clamp base 1 is provided with multiple equally distributed positioning chamber 11 (see figure 1) holding laser chip 5, fixture top cover 7 is provided with multiple window 71 (as shown in Figure 4) corresponding with positioning chamber 11, its concrete position fixing process for: see shown in Fig. 2 and Fig. 3, silicon chip 2 is close to a wherein sidewall of a positioning chamber 11 in clamp base 1 to place, again heat sink 6 levels are placed in the bottom of positioning chamber 11, with vacuum WAND, laser chip 5 is placed in the welding region of heat sink 6, and laser chip 5 is fastened in the draw-in groove of keeper 3, and allow the light-emitting area of laser chip (front end face) and silicon chip 2 keep being close to, another sidewall finally wedge shape inserted block 4 being close to positioning chamber 11 inserts, and wherein a sidewall and another sidewall are two opposing parallel sidewalls, then is located in clamp base 1 by fixture top cover 7 lid,
2) gravity briquetting 8 is inserted in positioning chamber 11 in the window 71 fixture top cover 7, gravity briquetting 8 is pressed on laser chip 5, makes laser chip 5 in welding process, have enough pressure, thus improve welding quality; As shown in Figure 5, the bottom of gravity briquetting 8 has the insertion end 81 can inserted from window 71, and insertion end 81 is tapering compared with the body of gravity pressure block 8.
3) whole fixture and gravity briquetting 8 are put into vacuum back-flow stove together to heat, complete the welding to laser chip 5.
Employing fixture of the present invention carrys out locating laser chip, then is placed in vacuum back-flow stove and has heated welding, and it can many people operation simultaneously, and many sleeve clamps are put into vacuum back-flow stove simultaneously and heated; Based on the flexibility of jig Design, it can be the chips welding of plurality of specifications; Fixture input cost is low, and well below the input of binding machine, and its production efficiency is higher than binding machine.Such as, adopt fixture to do laser chip encapsulation, 0.5 ten thousand dollars can complete batch jobs; And fixture adds the welding that hot reflux once can complete tens laser chips at every turn, the operation simultaneously of many sleeve clamps can complete more products, even if it is more than 20 minute that each fixture adds hot reflux required time, on average about need 0.5 minute to each product required time, therefore greatly improve the welding efficiency of laser chip.
For improving welding quality, as shown in Figure 3, the side of above-mentioned silicon chip 2 has step surface, when silicon chip 2 inserts positioning chamber 11, step surface is towards the inside of positioning chamber 11, and laser chip 5 is positioned at the top of step surface, with this, laser chip 5 is positioned on heat sink 6 and forms small overhang, effectively prevent solder in laser chip 5 welding process from overflowing and cause light-emitting zone to be kept off.Heat sink 6 bottom positioning chamber, its front end and silicon chip 2 are close to rear end and wedge shape inserted block 4 is close to, and wedge shape inserted block 4 can prevent heat sink 6 generations from moving horizontally, and need ensure that heat sink 6 lie in bottom positioning chamber, without tilting after placing, and the front end face of heat sink 6 is adjacent to the step of silicon chip.
Above-mentioned clamp base 1 is uniformly distributed multiple positioning chamber 11, and when carrying out laser chip welding, its specification of laser chip 5 be positioned in each positioning chamber 11 can be identical, also can be different.Laser chip that is identical or different size can be made so simultaneously to complete welding, enhance productivity.
For further enhancing productivity, in above-mentioned steps 3) in, multiple fixture with laser chip 5 can be placed in vacuum back-flow stove and heat simultaneously.
In sum, the welding method of high power laser chip of the present invention, it is based on the flexibility of jig Design, can be the chips welding of plurality of specifications; Fixture input cost is low, and well below the input of binding machine, and its production efficiency is higher than binding machine.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (5)
1. a welding method for high power laser chip, is characterized in that, comprises the following steps:
1) laser chip (5) is positioned in fixture, concrete position fixing process is: wherein sidewall silicon chip (2) being close to the upper positioning chamber (11) of clamp base (1) is placed, again heat sink (6) are placed in the bottom of described positioning chamber (11), described laser chip (5) is placed on heat sink (6), and laser chip (5) is fastened in the draw-in groove of keeper (3), another sidewall finally wedge shape inserted block (4) being close to positioning chamber (11) inserts, a described wherein sidewall and another sidewall described are two opposing parallel sidewalls, again fixture top cover (7) lid is located in clamp base (1),
2) gravity briquetting (8) is inserted in described positioning chamber (11) in the window (71) described fixture top cover (7), make gravity briquetting (8) be pressed on described laser chip (5);
3) whole fixture and gravity briquetting are put into vacuum back-flow stove together to heat, complete the welding to laser chip (5).
2. the welding method of high power laser chip according to claim 1, it is characterized in that: the side of described silicon chip (2) has step surface, when silicon chip (2) inserts described positioning chamber (11), described step surface is towards the inside of positioning chamber (11), and described laser chip (5) is positioned at the top of described step surface.
3. the welding method of high power laser chip according to claim 1, is characterized in that: before described laser chip (5) location, first need clean described fixture.
4. the welding method of high power laser chip according to claim 1, it is characterized in that: described clamp base (1) is uniformly distributed multiple described positioning chamber (11), laser chip (5) its specification be positioned in each positioning chamber (11) is identical or different.
5. the welding method of high power laser chip according to claim 1, is characterized in that: in described step 3) in, multiple described fixture with laser chip (5) is placed in described vacuum back-flow stove and heats simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510252992.1A CN104827184B (en) | 2015-05-18 | 2015-05-18 | Welding method for high-power laser chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510252992.1A CN104827184B (en) | 2015-05-18 | 2015-05-18 | Welding method for high-power laser chip |
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| Publication Number | Publication Date |
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| CN104827184A true CN104827184A (en) | 2015-08-12 |
| CN104827184B CN104827184B (en) | 2017-01-18 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105259623A (en) * | 2015-10-30 | 2016-01-20 | 武汉电信器件有限公司 | Laser and grating coupler packaging structure and method |
| CN111162443A (en) * | 2019-12-31 | 2020-05-15 | 芯思杰技术(深圳)股份有限公司 | Welding method and welding apparatus |
| CN115476016A (en) * | 2021-05-31 | 2022-12-16 | 山东华光光电子股份有限公司 | Semiconductor laser chip reflow soldering fixture and use method thereof |
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| CN101741011A (en) * | 2009-12-24 | 2010-06-16 | 中国科学院上海微系统与信息技术研究所 | Low-stress encapsulating device and method for semiconductor laser to reliably work in wide temperature region |
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| JP2015023201A (en) * | 2013-07-22 | 2015-02-02 | パナソニック株式会社 | Semiconductor laser module |
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2015
- 2015-05-18 CN CN201510252992.1A patent/CN104827184B/en active Active
Patent Citations (5)
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| CN1564403A (en) * | 2004-03-23 | 2005-01-12 | 中国科学院长春光学精密机械与物理研究所 | Composite heat sink semiconductor laser structure and its prepn. method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105259623A (en) * | 2015-10-30 | 2016-01-20 | 武汉电信器件有限公司 | Laser and grating coupler packaging structure and method |
| CN111162443A (en) * | 2019-12-31 | 2020-05-15 | 芯思杰技术(深圳)股份有限公司 | Welding method and welding apparatus |
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| CN115476016A (en) * | 2021-05-31 | 2022-12-16 | 山东华光光电子股份有限公司 | Semiconductor laser chip reflow soldering fixture and use method thereof |
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| CN104827184B (en) | 2017-01-18 |
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