CN104820208A - Apparatus of four-surface flat wire-free packaging type radar transceiving assembly - Google Patents
Apparatus of four-surface flat wire-free packaging type radar transceiving assembly Download PDFInfo
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- CN104820208A CN104820208A CN201510149446.5A CN201510149446A CN104820208A CN 104820208 A CN104820208 A CN 104820208A CN 201510149446 A CN201510149446 A CN 201510149446A CN 104820208 A CN104820208 A CN 104820208A
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- substrate
- radar transmit
- circuit
- electrically connected
- flat
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/003—Transmission of data between radar, sonar or lidar systems and remote stations
- G01S7/006—Transmission of data between radar, sonar or lidar systems and remote stations using shared front-end circuitry, e.g. antennas
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/027—Constructional details of housings, e.g. form, type, material or ruggedness
- G01S7/028—Miniaturisation, e.g. surface mounted device [SMD] packaging or housings
Abstract
Disclosed is an apparatus of a four-surface flat wire-free packaging type radar transceiving assembly. The apparatus comprises a cover plate and an integrated box body composed of a ring frame and a substrate. The cover plate is welded to the top portion of the ring frame, the bottom portion of the ring frame is welded to the periphery of the front surface of the substrate, a plurality of first pads are arranged at positions, which are close to the side edge of the substrate, at the periphery of the bottom surface of the substrate, the first pads are bent and extend to the side edge of the substrate, the first pads are arranged in pairs at the periphery of the substrate, second pads connected with the bottom surfaces are arranged in the middle of the first pads, the front surface of the substrate is provided with a radar transceiving circuit, and the first pads are electrically connected with the radar transceiving circuit through plated through holes. According to the invention, by use of an advanced QFN-like packaging technology, the substrate used for device loading and circuit wiring is directly taken as one part of a package, and a base of the assembly box body is omitted. Besides, a connector-free interface technology and a cascading feed technology are employed, such that surface mounting and cascading application of the transceiving assembly are realized, the transceiving assembly is miniaturized and light in weight, and the profile height and the quality surface density of an active antenna panel can be effectively reduced.
Description
Technical field:
The present invention relates to Radar Technology field, be specifically related to one have small-sized, lightweight, without lead-in wire, surface-mount type, can cascade feature, effectively can reduce the device of the flat-four-side non-leaded package formula radar transmit-receive assembly of section height that active antenna displays and mass surface density.
Background technology:
Along with radar load is in the development gradually of the platforms such as balloon, dirigible, space-based, antenna aperture is increasing, active channel growing number is many, but be subject to platform and harsh restriction be close to radar load weight and volume, require radar system core component transmitting-receiving (T/R) assembly that especially installation amount is maximum in phased-array radar will lightweight as much as possible, miniaturization.And traditional fragment of brick formula transmitting-receiving subassembly generally adopts complete metal box as encapsulating housing to meet the requirement of impermeability and shielding, its weight is subject to the restriction at box body especially base weight; And its interface adopts high frequency, low-frequency connector, stube cable assembly or breakout box is needed to realize, with the interconnection of antenna, feeder panel, needing the weight outside occupying volume and space.Therefore, traditional transmitting-receiving subassembly form can not meet the application demand of radar load under these occasions.
Summary of the invention:
The technical problem to be solved in the present invention is, there is provided one have small-sized, lightweight, without lead-in wire, surface-mount type, can cascade feature, effectively can reduce the device of the flat-four-side non-leaded package formula radar transmit-receive assembly of section height that active antenna displays and mass surface density.
Technical solution of the present invention is, a kind of device with the flat-four-side non-leaded package formula radar transmit-receive assembly of following structure is provided, this device comprises integrated box body and cover plate, integration box body comprises ring frame and substrate, cover plate welds with ring arch, ring frame bottom is welded on substrate front side surrounding, substrate bottom surface surrounding is furnished with near substrate side place and is somely used as power supply, control signal, radio frequency inputs, first pad of the interface that radio frequency exports, first pad is bending extends to substrate side, first pad is arranged in pairs in substrate surrounding, the second pad being connected to substrate bottom surface is provided with in the middle of first pad, substrate front side is provided with radar transmit-receive circuit, pad is electrically connected with radar transmit-receive circuit by the plated through-hole be arranged on substrate.
After adopting said structure, compared with prior art, the Advantageous Effects of the device of a kind of flat-four-side of the present invention non-leaded package formula radar transmit-receive assembly is embodied in following three aspects:
1, the device of a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly, adopt advanced class QFN encapsulation technology, directly the part of substrate as encapsulation for component mounting and wiring will be used for, ring frame is adopted to be welded to box body substrate being formed integration, eliminate the base of assembly box body, the size of assembly is reduced further, integrated level is higher, weight is lighter, and use the pad of substrate bottom surface and side as the external radio frequency of assembly, power supply and control signal interface, eliminate use radio frequency, the volume and weight that low-frequency connector increases.
2, the device of a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly adopts the interfacing of connectorless, the pad of direct use substrate bottom surface and side is as the external input of radio frequency, power supply and control signal, output interface, eliminate and use connector, cable assembly to carry out transferring and additionally bring the increase of weight and volume, thus transmitting-receiving subassembly has similar device, surface-pasted feature.
3, the device of a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly adopt advanced can cascade feeding technique, transmitting-receiving subassembly is provided with the input and output interface of power supply and control signal simultaneously, thus multiple transmitting-receiving subassembly can be used in cascade, greatly simplify wire laying mode and the difficulty of power supply and control signal when array uses, effectively can reduce section height and the mass surface density of active antenna array.
As optimal way, the device of a kind of flat-four-side non-leaded package formula radar transmit-receive assembly of the present invention, wherein, radar transmit-receive circuit comprises multifunction chip, final power amplifier, low noise amplifier, limiter, preselection filter, radio-frequency (RF) switch, Drive and Control Circuit, for controlling the power supply modulator circuit of each chip operation sequential and the electric power management circuit for various voltage transitions, the Tx end of multifunction chip is electrically connected with final power amplifier, the Rx end of multifunction chip is electrically connected with low noise amplifier, Drive and Control Circuit is electrically connected with multifunction chip, power supply modulator circuit simultaneously and electric power management circuit, final power amplifier and low noise amplifier electrical connection, preselection filter two ends are electrically connected with low noise amplifier and limiter respectively, the J1 end of radio-frequency (RF) switch is electrically connected with final power amplifier, the J2 end of radio-frequency (RF) switch is electrically connected with limiter, the RFC end of radio-frequency (RF) switch is used for being connected with antenna electric.The advantage that the device of a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly adds electric power management circuit in radar transmit-receive circuit to reduce the externally required power supply kind quantity of assembly, and can be reduced in when multiple transmitting-receiving subassembly cascade uses different assembly because pressure drop on line is on the impact of the indexs such as transmitting-receiving subassembly power, gain and consistance.
As optimal way, the cover plate in the present invention adopts cellular structure form.Adopt cellular structure effectively can alleviate the weight of cover plate, thus reach the object of weight reduction further under the prerequisite ensureing structural strength.
As optimal way, the ring frame in the present invention adopts titanium alloy material.
As optimal way, the substrate in the present invention adopts eight layers of circuit substrate.
As optimal way, the substrate in the present invention is provided with heat radiating metal hole.The intensive heat radiating metal hole of the zone design concentrated in hear rates such as power amplifiers is to form efficient heat passage, ensureing that the hear rate of transmitting-receiving subassembly can be transmitted to substrate metal bottom surface fast, by carrying out heat interchange with the aerial panel installing transmitting-receiving subassembly, heat being taken away.
As optimal way, the substrate in the present invention adopts the aluminium nitride material of high thermal conductivity.
Accompanying drawing illustrates:
Fig. 1 is the structural representation of the device of a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly;
Fig. 2 is the structural representation of the device cover plate of a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly;
Fig. 3 is the sectional structure schematic diagram along " A-A " line in Fig. 2;
Fig. 4 is the functional schematic of the first pad and the second pad in the device of a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly;
Fig. 5 is the left view of Fig. 4;
Fig. 6 is the vertical view of Fig. 4;
Fig. 7 is the application mode schematic diagram of the device of four flat-four-side non-leaded package formula radar transmit-receive assemblies of the present invention when linking together;
Fig. 8 is the circuit connection structure schematic diagram of radar transmit-receive circuit in the device of a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly.
Embodiment:
Be described further below in conjunction with the device of the drawings and specific embodiments to a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly:
As Fig. 1, shown in Fig. 2 and Fig. 3, in this embodiment, the device of a kind of flat-four-side of the present invention non-leaded package formula radar transmit-receive assembly comprises integrated box body and cover plate 1, the sole arrangement that integration box body comprises ring frame 2 and substrate 3. substrate 3 has 30 to be used as power supply, control signal, radio frequency inputs, first pad 5 of the interface that radio frequency exports, each first pad 5 is all bending extends to substrate 3 side, first pad 5 is arranged in pairs in substrate 3 surrounding, the second pad 9 that one is connected to substrate 3 bottom surface is provided with in the middle of 30 the first pads 5, substrate 3 front is provided with radar transmit-receive circuit 4, first pad 5 is electrically connected with radar transmit-receive circuit 4 by the plated through-hole 6 arranged on the substrate 3.
As shown in Figures 2 and 3, cover plate 1 adopts cellular structure form, and cellular structure here refers to cover plate 1 bottom surface and is provided with multiple hexagonal indentations 8, and this cellular structure can ensure that the prerequisite of structural strength is issued to the object of weight reduction.Ring frame 2 adopts titanium alloy material, and cover plate 1 adopts the mode of parallel soldering and sealing to weld together with ring frame 2 top, adopts the mode of golden tin or silver-bearing copper soldering to be welded on substrate 3 front surrounding bottom ring frame 2.Substrate 3 adopts the aluminium nitride material of high thermal conductivity, the number of plies of substrate 3 is eight layers, simultaneously substrate 3 at the intensive plated through-hole 7 of the zone design concentrated in hear rates such as power amplifiers to form efficient heat passage, ensureing that the hear rate of transmitting-receiving subassembly can be transmitted to the metallization bottom surface of substrate 3 fast, by carrying out heat interchange with the aerial panel installing transmitting-receiving subassembly, heat being taken away.Substrate 3, ring frame 2 form an airtight space together with cover plate 1, have both provided the hermetic seal environment required for the long-time reliably working of inner each bare chip, serve again the effect of electromagnetic screen simultaneously.In present embodiment, substrate 3 is of a size of 40mm × 25mm, and the thickness of cover plate 1 is within the scope of 0.25 ~ 0.8mm, and the body length of device is 20-50mm, and body width is 15-30mm, is highly 4-8mm.
As shown in Figure 4, Figure 5 and Figure 6,30 place first pads 5 complete the external radio frequency of transmitting-receiving subassembly, power supply and control signal interface, comprising, radio frequency interface: RF1, RF2; Control signal input interface: SCi, SDi, SEi, RYi, TRi and PTi; Power input interface is: VSi, VD1i and VD2i.For realizing the cascade feeding function between multiple transmitting-receiving subassembly, devising corresponding output interface at power supply and control signal input interface offside, being respectively: SCo, SDo, SEo, RYo, TRo, PTo and VSo, VD1o, VD2o.Fig. 7 gives the example of multiple transmitting-receiving subassembly in aerial panel cascade practicality, and this example gives the case of four transmitting-receiving subassembly cascades, but is not limited to 4 when applying.
Radar transmit-receive circuit 4 comprises multifunction chip 41, final power amplifier 42, low noise amplifier 43, limiter 44, preselection filter 45, radio-frequency (RF) switch 46, Drive and Control Circuit 47, for controlling the power supply modulator circuit 48 of each chip operation sequential and the electric power management circuit 49 for various voltage transitions, the Tx end of multifunction chip 41 is electrically connected with final power amplifier 42, the Rx end of multifunction chip 41 is electrically connected with low noise amplifier 43, Drive and Control Circuit 47 is electrically connected with multifunction chip 41, with electric power management circuit 49 while of power supply modulator circuit 48, final power amplifier 42 and low noise amplifier 43 are electrically connected, preselection filter 45 two ends are electrically connected with low noise amplifier 43 and limiter 44 respectively, the J1 of radio-frequency (RF) switch 46 holds final stage to be electrically connected with power amplifier 42, the J2 end of radio-frequency (RF) switch 46 is electrically connected with limiter 44, the RFC end of radio-frequency (RF) switch 46 is used for being connected with antenna electric.
The principle of work of radar transmit-receive circuit 4 is as follows: complete the phase adjusted of rf excitation signal by multifunction chip 41 during transmission channel state and give final power amplifier 42 after amplifying, exporting after radiofrequency signal being amplified to required power level by final power amplifier 42; During accepting state, the echoed signal that antenna receives is amplified, and ensure lower noise figure, meet amplitude, the phase control requirement of receiving cable again simultaneously, also will carry out filtering suppression to the signal outside band, this part function is completed by limiter 44, low noise amplifier 43, multifunction chip 41 and preselection filter 45 etc. respectively.Drived control refers to and serial input data is converted to parallel output signal, is used for controlling the phase place of transmitting-receiving subassembly multifunction chip 41 inside, attenuation state and switching over etc.Power modulation, for controlling the work schedule of chip on receiving cable, transmission channel, ensures to launch, receive time-sharing work.Power management mainly comprises the chip of voltage transformation, for generation of the voltage needed for each chip operation in transmitting-receiving subassembly inside, the impact that during to reduce power supply kind needed for transmitting-receiving subassembly external interface and to reduce multicompartment cascade operation, on transmission line, pressure drop is inconsistent on assembly property index.
Composition graphs 4, Fig. 5, Fig. 6 and Fig. 7, when receiving duty, radiofrequency signal enters assembly by pad RF2, hold through the RFC of radio-frequency (RF) switch 46, J2 end (during reception radio-frequency (RF) switch be switched to J2 end) enters limiter 44 input end, limiter 44 outputs to preselection filter 45, low noise amplifier 43 input end is entered after preselection filter 45, the Rx end of multifunction chip 41 is entered after low noise amplifier 43, complete the amplitude of radiofrequency signal, phase control in multifunction chip 41 inside and output to Com end after also amplifying, Com end exports through pad RF1.During emission state, rf excitation signal enters the Com end of multifunction chip 41 through pad RF1, complete the phase adjusted of radiofrequency signal in multifunction chip 41 inside and after amplifying, export Tx end to, Tx end is connected with the input end of final power amplifier 42, hold (now radio-frequency (RF) switch is switched to J1 end) to the J1 of radio-frequency (RF) switch 46 after final power amplifier 42 amplifies, output to pad RF2 by the RFC mouth of radio-frequency (RF) switch 46.
The Making programme following steps of the device of a kind of flat-four-side non-leaded package of the present invention formula radar transmit-receive assembly:
1, substrate manufacture: adopt multilayer Al N fabrication techniques circuit substrate, substrate size is 40mm × 25mm, and the substrate number of plies is 8 layers;
2, box body welding: the front surrounding ring frame adopting titanium alloy to make being welded to AlN substrate, the technique of welding can adopt the mode of golden tin or silver-bearing copper soldering;
3, component mounting: component mountings such as multifunction chip, low noise amplifier, power amplifier, limiter, preselection filters in AlN substrate, then utilizes spun gold pressure welding and ball bonding to complete electrical connection between chip and substrate.
4, top layer capping: adopt the mode of parallel soldering and sealing to weld together with the ring frame of integrated box body cover plate, complete capping.
The above is only be described the preferred embodiment of the present invention; not scope of the present invention is limited; under not departing from the present invention and designing the prerequisite of spirit; the various distortion that those of ordinary skill in the art make technical scheme of the present invention and improvement, all should fall in protection domain that claims of the present invention determines.
Claims (7)
1. the device of a flat-four-side non-leaded package formula radar transmit-receive assembly, it is characterized in that: this device comprises integrated box body and cover plate (1), described integrated box body comprises ring frame (2) and substrate (3), described cover plate (1) and ring frame (2) welded top, described ring frame (2) bottom welding is in substrate (3) front surrounding, described substrate (3) bottom surface surrounding is furnished with near substrate (3) side edge and is somely used as power supply, control signal, radio frequency inputs, first pad (5) of the interface that radio frequency exports, first pad (5) is bending extends to substrate (3) side, described first pad (5) is arranged in pairs in substrate (3) surrounding, the second pad (9) being connected to substrate (3) bottom surface is provided with in the middle of described first pad (5), described substrate (3) front is provided with radar transmit-receive circuit (4), described first pad (5) is electrically connected with radar transmit-receive circuit (4) by the plated through-hole (6) be arranged on substrate (3).
2. the device of a kind of flat-four-side non-leaded package formula radar transmit-receive assembly according to claim 1, it is characterized in that: described radar transmit-receive circuit (4) comprises multifunction chip (41), final power amplifier (42), low noise amplifier (43), limiter (44), preselection filter (45), radio-frequency (RF) switch (46), Drive and Control Circuit (47), for controlling the power supply modulator circuit (48) of each chip operation sequential and the electric power management circuit (49) for various voltage transitions, the Tx end of described multifunction chip (41) is electrically connected with final power amplifier (42), the Rx end of described multifunction chip (41) is electrically connected with low noise amplifier (43), described Drive and Control Circuit (47) is electrically connected with multifunction chip (41), with electric power management circuit (49) while of described power supply modulator circuit (48), final power amplifier (42) and low noise amplifier (43) electrical connection, described preselection filter (45) two ends are electrically connected with low noise amplifier (43) and limiter (44) respectively, the J1 end of described radio-frequency (RF) switch (46) is electrically connected with final power amplifier (42), the J2 end of radio-frequency (RF) switch (46) is electrically connected with limiter (44), the RFC end of radio-frequency (RF) switch (46) is used for being connected with antenna electric.
3. the device of a kind of flat-four-side non-leaded package formula radar transmit-receive assembly according to claim 1, is characterized in that: described cover plate (1) adopts cellular structure form.
4. the device of a kind of flat-four-side non-leaded package formula radar transmit-receive assembly according to claim 1, is characterized in that: described ring frame (2) adopts titanium alloy material.
5. the device of a kind of flat-four-side non-leaded package formula radar transmit-receive assembly according to claim 1, is characterized in that: described substrate (3) adopts eight layers of circuit substrate.
6. the device of a kind of flat-four-side non-leaded package formula radar transmit-receive assembly according to claim 1 or 5, is characterized in that: described substrate (3) is provided with heat radiating metal hole (7).
7. the device of a kind of flat-four-side non-leaded package formula radar transmit-receive assembly according to claim 1 or 6, is characterized in that: described substrate (3) adopts the aluminium nitride material of high thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510149446.5A CN104820208A (en) | 2015-03-30 | 2015-03-30 | Apparatus of four-surface flat wire-free packaging type radar transceiving assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510149446.5A CN104820208A (en) | 2015-03-30 | 2015-03-30 | Apparatus of four-surface flat wire-free packaging type radar transceiving assembly |
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| CN104820208A true CN104820208A (en) | 2015-08-05 |
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| CN201510149446.5A Pending CN104820208A (en) | 2015-03-30 | 2015-03-30 | Apparatus of four-surface flat wire-free packaging type radar transceiving assembly |
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| CN107546181A (en) * | 2017-08-18 | 2018-01-05 | 华进半导体封装先导技术研发中心有限公司 | Radar component packaging body |
| CN108615716A (en) * | 2018-04-28 | 2018-10-02 | 上海移远通信技术股份有限公司 | Wireless communication module and wireless communication apparatus comprising it |
| JP2019012059A (en) * | 2017-06-30 | 2019-01-24 | ローム株式会社 | Semiconductor device, ultrasonic sensor and moving body |
| CN110247187A (en) * | 2019-05-17 | 2019-09-17 | 成都天锐星通科技有限公司 | A kind of multichannel width phase processor encapsulation chip and phased array antenna mechanism |
| CN111048492A (en) * | 2019-12-30 | 2020-04-21 | 中国电子科技集团公司第十三研究所 | Amplitude limiting low-noise amplifier chip structure |
| CN111048500A (en) * | 2019-12-17 | 2020-04-21 | 中国电子科技集团公司第三十八研究所 | Integrally packaged radio frequency microsystem assembly |
| CN111193084A (en) * | 2020-01-07 | 2020-05-22 | 朱承风 | Filter cover plate |
| CN114325715A (en) * | 2022-03-11 | 2022-04-12 | 南京隼眼电子科技有限公司 | Radar structure and system |
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| JP2019012059A (en) * | 2017-06-30 | 2019-01-24 | ローム株式会社 | Semiconductor device, ultrasonic sensor and moving body |
| JP7164323B2 (en) | 2017-06-30 | 2022-11-01 | ローム株式会社 | Semiconductor devices, ultrasonic sensors, and mobile objects |
| CN107546181A (en) * | 2017-08-18 | 2018-01-05 | 华进半导体封装先导技术研发中心有限公司 | Radar component packaging body |
| CN108615716A (en) * | 2018-04-28 | 2018-10-02 | 上海移远通信技术股份有限公司 | Wireless communication module and wireless communication apparatus comprising it |
| CN108615716B (en) * | 2018-04-28 | 2020-08-14 | 上海移远通信技术股份有限公司 | Wireless communication module and wireless communication device comprising same |
| CN110247187A (en) * | 2019-05-17 | 2019-09-17 | 成都天锐星通科技有限公司 | A kind of multichannel width phase processor encapsulation chip and phased array antenna mechanism |
| CN111048500A (en) * | 2019-12-17 | 2020-04-21 | 中国电子科技集团公司第三十八研究所 | Integrally packaged radio frequency microsystem assembly |
| CN111048500B (en) * | 2019-12-17 | 2021-07-09 | 中国电子科技集团公司第三十八研究所 | Integrally packaged radio frequency microsystem assembly |
| CN111048492A (en) * | 2019-12-30 | 2020-04-21 | 中国电子科技集团公司第十三研究所 | Amplitude limiting low-noise amplifier chip structure |
| CN111048492B (en) * | 2019-12-30 | 2021-10-15 | 中国电子科技集团公司第十三研究所 | Amplitude limiting low-noise amplifier chip structure |
| CN111193084A (en) * | 2020-01-07 | 2020-05-22 | 朱承风 | Filter cover plate |
| CN114325715A (en) * | 2022-03-11 | 2022-04-12 | 南京隼眼电子科技有限公司 | Radar structure and system |
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Application publication date: 20150805 |