CN104811882A - Stacked die type microphone - Google Patents
Stacked die type microphone Download PDFInfo
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- CN104811882A CN104811882A CN201410034154.2A CN201410034154A CN104811882A CN 104811882 A CN104811882 A CN 104811882A CN 201410034154 A CN201410034154 A CN 201410034154A CN 104811882 A CN104811882 A CN 104811882A
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- integrated circuit
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Abstract
The invention discloses a stacked die type microphone. The stacked die type microphone comprises a substrate, a specific application integrated circuit chip, a sound wave sensor module and a cover body, wherein the specific application integrated circuit chip is arranged on the substrate and is electrically connected with the substrate, the sound wave sensor module is arranged on the specific application integrated circuit chip and is electrically connected with the specific application integrated circuit chip by means of a ball grid array package mode to enable sound waves to pass through a gap between the sound wave sensor module and the specific application integrated circuit chip, the cover body covers the sound wave sensor module and is connected with the substrate, and the cover body is provided with a sound hole. According to the invention, the stacked die type microphone stacks the sound wave sensor module on the specific application integrated circuit chip, boring on the specific application integrated circuit chip is unnecessary, the area needing to be used by a footprint can be effectively reduced, the area of the substrate is reduced, the space between the two modules and the cover body can be fully utilized as a back cavity, and the integral performance of the microphone is maintained.
Description
Technical field
The invention belongs to microphone field, especially a kind of by the microphone of sonic sensor module stack in ASIC(Application Specific Integrated Circuit) chip, there is less volume and enough carry on the back cavity space.
Background technology
Traditional microphone 70, please refer to Fig. 1, and contain sonic sensor module 72 and an ASIC(Application Specific Integrated Circuit) chip (ASIC) 73, the two is placed on substrate 71 jointly.Substrate 71 offers a sound hole 711 in the below of the vibrating diaphragm 721 of sonic sensor module 72, and a lid 74 covers sonic sensor module 72 and ASIC(Application Specific Integrated Circuit) chip 73, make lid 74 form one with the top of aforementioned sonic sensor module 72, ASIC(Application Specific Integrated Circuit) chip 73 and carry on the back chamber 75, this back of the body chamber 75 provides part elastic restoring force by the vibrating diaphragm of sonic sensor module 72, therefore can adjust the acoustic resistance (Acoustic Impedance) of microphone and overall frequency response characteristic, affect overall performance very huge.But because sonic sensor module 72 with ASIC(Application Specific Integrated Circuit) chip 73 for being disposed adjacent, therefore must reserve the area of coverage (footprint) of enough areas as sonic sensor module 72 and ASIC(Application Specific Integrated Circuit) chip 73 pin at encapsulation upper substrate 71, cause the substrate 71 needing larger area.
In order to solve the problem, on market, the microphone of existing part is arranged on the top of ASIC(Application Specific Integrated Circuit) chip by sonic sensor module stack, and offer a through hole in the central authorities of ASIC(Application Specific Integrated Circuit) chip, and substrate is opened in a sound hole of corresponding aforementioned through-hole, allow sound wave can be passed to vibrating diaphragm via sound hole and through hole, although design so reduces the required area used of the area of coverage, but relatively ASIC(Application Specific Integrated Circuit) chip must lose space using as through hole, for the limited efficiency reducing substrate area and microphone overall volume, and the space that can be used as back of the body chamber can be sacrificed in lid, performance for microphone will have adverse influence.
Summary of the invention
Main purpose of the present invention is to provide a kind of folded brilliant formula microphone, effectively can reduce the area of substrate, and maintains or increase the space of lid portion inside as back of the body chamber, to reach small size and high performance technology effect.
In order to reach above-mentioned purpose, the invention provides a kind of folded brilliant formula microphone, it includes a substrate, an ASIC(Application Specific Integrated Circuit) chip, a sonic sensor module and a lid, and wherein ASIC(Application Specific Integrated Circuit) chip to be located on substrate and to be electrically connected substrate.Sonic sensor module to be located on ASIC(Application Specific Integrated Circuit) chip and to be electrically connected ASIC(Application Specific Integrated Circuit) chip by BGA Package mode, makes sound wave by the gap between sonic sensor module and ASIC(Application Specific Integrated Circuit) chip.Lid to cover in sonic sensor module and connection substrate, and lid offers a sound hole.
Whereby, sonic sensor module is being stacked on ASIC(Application Specific Integrated Circuit) chip by folded brilliant formula microphone of the present invention, do not need at ASIC(Application Specific Integrated Circuit) chip borehole, can effectively reduce usable floor area needed for the area of coverage and reduce the area of substrate, and above-mentioned two Zuo Bei chambeies, space between module and lid can be made full use of, maintain the overall performance of microphone.
Preferably, ASIC(Application Specific Integrated Circuit) chip is electrically connected substrate for utilizing with routing juncture or chip bonding mode.
Preferably, ASIC(Application Specific Integrated Circuit) chip internal is provided with a plurality of straight-through silicon wafer perforation, and circuit rearrangement layer technology of can arranging in pairs or groups.
Preferably, sonic sensor module has a vibrating diaphragm, and this sound hole is positioned at above this vibrating diaphragm; In addition, folded brilliant formula microphone also comprises a shielding, and shielding connects lid and covers sound hole.
Accompanying drawing explanation
Fig. 1 is the cutaway view of conventional microphone.
Fig. 2 is the cutaway view that first embodiment of the invention folds brilliant formula microphone.
Fig. 3 is the cutaway view that second embodiment of the invention folds brilliant formula microphone.
Fig. 4 is the cutaway view that third embodiment of the invention folds brilliant formula microphone.
Fig. 5 is the cutaway view that fourth embodiment of the invention folds brilliant formula microphone.
[symbol description]
1 microphone; 10 substrates; 11 conductive regions; 12 weld pads; 13 weld pads
20 ASIC(Application Specific Integrated Circuit) chips; 21 circuit layers; 22 weld pads
23 straight-through silicon wafer perforation; 24 metal couplings; 30 sonic sensor modules
31 vibrating diaphragms; 32 weld pads; 40 lids; 41 sound holes; 42 back of the body chambeies; 50 shieldings
L tin ball; W wire; S sound wave; 70 microphones; 71 substrates; 711 sound holes
72 sonic sensor modules; 721 vibrating diaphragms; 73 ASIC(Application Specific Integrated Circuit) chips
74 lids; 75 back of the body chambeies
Embodiment
In order to feature place of the present invention more can be understood, the invention provides one first embodiment and coordinate and illustrate as follows, please refer to Fig. 2.The primary clustering of the folded brilliant formula microphone 1 that the present embodiment provides includes substrate 10, ASIC(Application Specific Integrated Circuit) chip 20, sonic sensor module 30 and a lid 40, and details are as follows for the structure of each assembly and mutual relation:
The end face of substrate 10 is provided with plural conductive region 11, and these conductive regions 11 are all provided with at least one weld pad 12, and the bottom surface of substrate 10 is provided with a plurality of weld pad 13 and is electrically connected with substrate 10 and outside assembly.
ASIC(Application Specific Integrated Circuit) chip 20 to be located on substrate 10 and to be electrically connected substrate 10, and ASIC(Application Specific Integrated Circuit) chip 20 has the end face that a circuit layer 21 is located at ASIC(Application Specific Integrated Circuit) chip 20, and the end face of circuit layer 21 is provided with a plurality of weld pad 22.The inside of ASIC(Application Specific Integrated Circuit) chip 20 is provided with a plurality of straight-through silicon wafer perforation (Through Silicon Via, TSV) 23, the two ends of these straight-through silicon wafer perforation 23 are electrically connected circuit layer 21 and the metal coupling 24 being positioned at ASIC(Application Specific Integrated Circuit) chip 20 bottom surface respectively, make ASIC(Application Specific Integrated Circuit) chip 20 that weld pad 12 on the corresponding connection substrate 10 of the mode of chip bonding can be utilized to complete electric connection, for the constrained input of the driving voltage input of microphone 1 and the various signals of microphone 1.
Sonic sensor module 30 is located at the top of ASIC(Application Specific Integrated Circuit) chip 20, and it has a vibrating diaphragm 31, and is provided with a plurality of weld pad 32 near a side of vibrating diaphragm 31.Sonic sensor module 30 is by ball grid array (Ball Grid Array, BGA) packaged type, that is by a plurality of tin ball L, these weld pad 32 correspondences of sonic sensor module 30 are connected these weld pads 22, make sonic sensor module 30 can be electrically connected ASIC(Application Specific Integrated Circuit) chip 20.
Lid 40 covers in the top of sonic sensor module 30 and the local connection substrate 10 on the substrate 10 beyond these conductive regions 11.Lid 40 can be metal material and makes, and is used for preventing microphone 1 from collided by external force, and avoids microphone 1 to be subject to dust and electromagnetic impact.Lid 40 offers a sound hole 41, the corresponding vibrating diaphragm 31 of sound hole 41 and be arranged at the top of sonic sensor module 30, make sound wave S directly can be passed to vibrating diaphragm 31 via sound hole 41, and the space between the outer ancient piece of jade, round, flat and with a hole in its centre face of the internal face of lid 40 and sonic sensor module 30 and ASIC(Application Specific Integrated Circuit) chip 20 form one carries on the back chamber 42.
Use, when folded brilliant formula microphone 1 receives sound wave S, sound wave S makes vibrating diaphragm 31 vibrate through sound hole 41 with sonic sensor module 30, sound wave S can be passed through because the gap made between aforementioned modules 20,30 is formed a back of the body chamber passage to the tin ball L between sonic sensor module 30 and ASIC(Application Specific Integrated Circuit) chip 20 and be passed to back of the body chamber 42, make sound wave S can form acoustic resonance in back of the body chamber 42, and then the back of the body promoting folded brilliant formula microphone 1 enter the performance of sound aspect.And in space utilization, sonic sensor module 30 is for being arranged on the top of ASIC(Application Specific Integrated Circuit) chip 20, and ASIC(Application Specific Integrated Circuit) chip 20 is electrically connected substrate 10 by straight-through silicon wafer perforation structure 23, the area of the required area of coverage used of ASIC(Application Specific Integrated Circuit) chip 20 is reduced.
Should be noted that, the present invention is by ball grid array (Ball Grid Array, BGA) packaged type makes sonic sensor module 30 be electrically connected ASIC(Application Specific Integrated Circuit) chip 20, but the present invention only should not be confined to traditional BGA Package mode, those skilled in the art can change into according to actual needs and use plastic spherical grid array (Plastic Ball Grid Array, or crystal covering type ball grid array (Flip Chip Ball Grid Array PBGA), FCBGA), also other alternative three-dimensional encapsulations (3D Package) can be utilized, such as stacked (the Package on Package of stacking-type encapsulation, or folded brilliant encapsulation (Stacked Die Package) etc. PoP), as long as allow sound wave all can by back of the body chamber passage person.
The present invention separately provides one second embodiment, please refer to Fig. 3, its primary clustering is roughly identical with the first embodiment, but its essential difference is the mode that ASIC(Application Specific Integrated Circuit) chip 20 engages for Selection utilization routing, another weld pad 12 on the weld pad 22 and substrate 10 of wire W electric connection ASIC(Application Specific Integrated Circuit) chip 20.
The present invention separately provides one the 3rd embodiment, please refer to Fig. 4, its primary clustering is roughly identical with the first embodiment, but its essential difference is that the end face of ASIC(Application Specific Integrated Circuit) chip 20 is to having a plurality of straight-through silicon wafer perforation structure 23, and utilize circuit rearrangement layer (Redistribution Layer, RDL) technology makes these straight-through silicon wafers perforation 23 can coordinate the position of tin ball L, sonic sensor module 30 can be bored a hole by tin ball L and these straight-through silicon wafers and 23 be electrically connected ASIC(Application Specific Integrated Circuit) chip 20.In addition, circuit layer 21 changes selection into and is arranged on the bottom surface of ASIC(Application Specific Integrated Circuit) chip 20 and arranges a plurality of weld pad 22, these weld pads 22 respectively connect a metal coupling 24, make ASIC(Application Specific Integrated Circuit) chip 20 can be electrically connected the weld pad 12 of substrate 10 by these weld pads 22 and these metal couplings 24.
The present invention separately provides one the 4th embodiment, please refer to Fig. 5, its primary clustering is roughly identical with the first embodiment, but its essential difference is that folded brilliant formula microphone 1 separately comprises a shielding 50 and is used for preventing dust from dropping to the vibrating diaphragm 31 of sonic sensor module 30, shielding 50 connects lid 40 and covers sound hole 41.
Finally, must again illustrate, the constituent components of the present invention disclosed by previous embodiment is only and illustrates; not be used for limiting the protection range of this case; other easy full of beard every and structural change, or with the alternate variation of other equivalent elements, all should be the protection range of this case.
Claims (11)
1. a folded brilliant formula microphone, is characterized in that, include:
One substrate;
One lid, covers at this substrate and offers a sound hole and pass through for a sound wave;
One ASIC(Application Specific Integrated Circuit) chip, is located on this substrate and is positioned at this lid, and is electrically connected this substrate; And
One sonic sensor module, to be located on this ASIC(Application Specific Integrated Circuit) chip and to be electrically connected this ASIC(Application Specific Integrated Circuit) chip by three-dimensional encapsulation mode, making this sound wave by the gap between this sonic sensor module and this ASIC(Application Specific Integrated Circuit) chip.
2. folded brilliant formula microphone as claimed in claim 1, is characterized in that: described ASIC(Application Specific Integrated Circuit) chip is electrically connected this substrate for utilizing routing juncture; Or be electrically connected this substrate for utilizing chip bonding mode.
3. as described in claim 1 or 2 folded brilliant formula microphone, is characterized in that: described ASIC(Application Specific Integrated Circuit) chip has a circuit layer, and this ASIC(Application Specific Integrated Circuit) chip internal is provided with a plurality of straight-through silicon wafer perforation and one end connects this circuit layer.
4. folded brilliant formula microphone as claimed in claim 3, it is characterized in that: described circuit layer is positioned at the end face of this ASIC(Application Specific Integrated Circuit) chip and is provided with a plurality of weld pad, respectively the another end of this straight-through silicon wafer perforation this circuit layer relative is connected with a metal coupling to be electrically connected this substrate.
5. folded brilliant formula microphone as claimed in claim 4, it is characterized in that: described circuit layer is positioned at the bottom surface of this ASIC(Application Specific Integrated Circuit) chip and is provided with a plurality of weld pad, respectively the another end of this straight-through silicon wafer perforation this circuit layer relative is connected with a weld pad, is used for being electrically connected this sonic sensor module.
6. folded brilliant formula microphone as claimed in claim 5, is characterized in that: described ASIC(Application Specific Integrated Circuit) chip utilizes circuit rearrangement layer technology to configure the position of these weld pads.
7. folded brilliant formula microphone as claimed in claim 1, is characterized in that: described sonic sensor module has a vibrating diaphragm, and this sound hole is positioned at above this vibrating diaphragm.
8. folded brilliant formula microphone as claimed in claim 1, it is characterized in that: also include a shielding, this shielding connects this lid and covers this sound hole.
9. folded brilliant formula microphone as claimed in claim 1, is characterized in that: described sonic sensor module utilizes BGA Package mode to be electrically connected this ASIC(Application Specific Integrated Circuit) chip.
10. folded brilliant formula microphone as claimed in claim 1, is characterized in that: described BGA Package mode is plastic spherical grid array or crystal covering type ball grid array.
11. fold brilliant formula microphone as claimed in claim 1, it is characterized in that: described sonic sensor module utilizes stacking-type to encapsulate overlapped way to be electrically connected this ASIC(Application Specific Integrated Circuit) chip;
Or utilize folded brilliant packaged type to be electrically connected this ASIC(Application Specific Integrated Circuit) chip;
Or be utilize a plurality of tin ball to be electrically connected this ASIC(Application Specific Integrated Circuit) chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410034154.2A CN104811882A (en) | 2014-01-24 | 2014-01-24 | Stacked die type microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410034154.2A CN104811882A (en) | 2014-01-24 | 2014-01-24 | Stacked die type microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104811882A true CN104811882A (en) | 2015-07-29 |
Family
ID=53696290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410034154.2A Pending CN104811882A (en) | 2014-01-24 | 2014-01-24 | Stacked die type microphone |
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| Country | Link |
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| CN (1) | CN104811882A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110677793A (en) * | 2019-02-19 | 2020-01-10 | 美律电子(深圳)有限公司 | Microphone packaging structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6178249B1 (en) * | 1998-06-18 | 2001-01-23 | Nokia Mobile Phones Limited | Attachment of a micromechanical microphone |
| CN101437187A (en) * | 2007-11-15 | 2009-05-20 | 财团法人工业技术研究院 | Stacked encapsulation structure for tapering (reducing) minitype sensor encapsulation volume |
| CN102730623A (en) * | 2011-04-06 | 2012-10-17 | 原相科技股份有限公司 | Micro-electro-mechanical system sensing device and method for manufacturing same |
| CN104244152A (en) * | 2013-06-13 | 2014-12-24 | 无锡芯奥微传感技术有限公司 | Micro electro mechanical system microphone package and packaging method |
-
2014
- 2014-01-24 CN CN201410034154.2A patent/CN104811882A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6178249B1 (en) * | 1998-06-18 | 2001-01-23 | Nokia Mobile Phones Limited | Attachment of a micromechanical microphone |
| CN101437187A (en) * | 2007-11-15 | 2009-05-20 | 财团法人工业技术研究院 | Stacked encapsulation structure for tapering (reducing) minitype sensor encapsulation volume |
| CN102730623A (en) * | 2011-04-06 | 2012-10-17 | 原相科技股份有限公司 | Micro-electro-mechanical system sensing device and method for manufacturing same |
| CN104244152A (en) * | 2013-06-13 | 2014-12-24 | 无锡芯奥微传感技术有限公司 | Micro electro mechanical system microphone package and packaging method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110677793A (en) * | 2019-02-19 | 2020-01-10 | 美律电子(深圳)有限公司 | Microphone packaging structure |
| TWI732228B (en) * | 2019-02-19 | 2021-07-01 | 美律實業股份有限公司 | Microphone package structure |
| CN110677793B (en) * | 2019-02-19 | 2021-09-10 | 美律电子(深圳)有限公司 | Microphone packaging structure |
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Application publication date: 20150729 |
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